Chip protection ring structure and chip thereof

Abstract

The utility model provides a chip protection ring structure and a chip thereof. The chip protection ring structure comprises a sealing ring and a buffer structure which is located in a corner area of the sealing ring and is arranged at an interval with the sealing ring. The buffer structure comprises a composite metal block and an elliptical metal block; the composite metal block comprises a rectangular part and arc-shaped parts which are positioned on two opposite surfaces of the rectangular part and are convex outwards; in the first direction, the composite metal blocks and the oval metal blocks are arranged at intervals, in the second direction, the composite metal blocks and the oval metal blocks are alternately arranged, and the projections of the oval metal blocks in the second direction are located between the two adjacent arc-shaped parts. Through the arrangement of the buffer structure with the composite metal block and the elliptical metal block, the transmission path of force can extend in an approximate S shape, maximum consumption is obtained in extension, and good buffering of the force is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing and relates to a chip protection ring structure and a chip thereof. Background Art

[0002] With the development of semiconductor technology, a seal ring structure is usually set in the chip. The seal ring is composed of metal layers stacked from bottom to top. It is set between the chip device area and the cutting path. It is a sealing ring set between the chip device area. It can prevent the cutting cracks from damaging the chip device area when the wafer is cut. At the same time, it can play a role in moisture-proof and electromagnetic damage.

[0003] Most existing seal rings are octagonal in shape, but when cutting, the top corners of the octagonal seal ring are most susceptible to cutting stress, making the corners of the seal ring more fragile and easy to break or damage. In order to guide the cracks to avoid entering the corners of the seal ring as much as possible, a seal ring with a buffer structure is set in the existing structure to obtain a better buffering effect, that is, by making multiple layers of regular metal blocks with the device area in the direction parallel or perpendicular to the wafer, so as to buffer the destructive stress or guide the stress direction when the wafer is cut.

[0004] Most of the existing seal rings with buffer structures only consider how to best guide the direction of the destructive stress. However, since the destructive stress is guided, it will spread rapidly in the guiding direction, resulting in less resistance to the stress during rupture, making it easier to cause greater damage. Therefore, the existing seal ring lacks the function of weakening or slowing down the destructive stress other than guiding the direction.

[0005] Therefore, it is necessary to provide a chip protection ring structure and a chip thereof. Utility Model Content

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a chip protection ring structure and a chip thereof, so as to solve the problem that the chip protection ring structure in the prior art is difficult to weaken or slow down the destructive stress.

[0007] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a chip protection ring structure, the chip protection ring structure comprising:

[0008] A sealing ring, the sealing ring comprising a horizontal side, a vertical side and an inclined side connecting the horizontal side and the vertical side, wherein an area enclosed by an extension line of the horizontal side, an extension line of the vertical side and an extension line of the inclined side is defined as a corner area, an extension direction of the inclined side is defined as a first direction, and a direction perpendicular to the inclined side is defined as a second direction;

[0009] A buffer structure is provided, wherein the buffer structure is located in the corner area and is spaced apart from the sealing ring. The buffer structure comprises a composite metal block and an elliptical metal block. The composite metal block comprises a rectangular portion and an arc-shaped portion which is located on two opposite sides of the rectangular portion and is convex outward. In the first direction, the composite metal block and the elliptical metal block are spaced apart from each other. In the second direction, the composite metal block and the elliptical metal block are alternately arranged, and the projection of the elliptical metal block along the second direction is located between two adjacent arc-shaped portions.

[0010] Optionally, the composite metal block is an axisymmetric shape.

[0011] Optionally, the major axis of the elliptical metal block is arranged along the first direction.

[0012] Optionally, the composite metal blocks are arranged at equal intervals; and the elliptical metal blocks are arranged at equal intervals.

[0013] Optionally, along the first direction, there is a spacing area between a line connecting edges of the arc-shaped portion and a line connecting edges of the elliptical metal block.

[0014] Optionally, edge lines of the buffer structure form a triangular shape, and an angle away from the inclined edge is greater than an angle formed by an extension line of the horizontal edge and an extension line of the vertical edge.

[0015] Optionally, the inclination angle of the inclined edge is 30° to 60°.

[0016] Optionally, the composite metal block and the elliptical metal block are combined to form a buffer metal layer, and the buffer metal layers are stacked from bottom to top in a direction perpendicular to the plane formed by the first direction and the second direction, and each buffer metal layer is connected by metal contact; the metal blocks in adjacent buffer metal layers are overlapped up and down, and the overlapping method includes overlapping of one or a combination of the composite metal block and the elliptical metal blocks.

[0017] Optionally, the sealing ring includes a single ring or a double ring; the sealing ring includes an open ring or a closed ring.

[0018] The present invention also provides a chip, wherein the chip comprises any of the above chip protection ring structures.

[0019] As described above, the chip protection ring structure and chip thereof of the utility model include a sealing ring and a buffer structure located in a corner area of ​​the sealing ring and spaced apart from the sealing ring, the sealing ring includes a horizontal side, a vertical side and an inclined side connecting the horizontal side and the vertical side, wherein an area enclosed by an extension line of the horizontal side, an extension line of the vertical side and an extension line of the inclined side is defined as a corner area, an extension direction of the inclined side is defined as a first direction, and a direction perpendicular to the inclined side is defined as a second direction; the buffer structure includes a composite metal block and an elliptical metal block, the composite metal block includes a rectangular portion and an arc-shaped portion located on two opposite sides of the rectangular portion and convex outwardly; in the first direction, the composite metal block and the elliptical metal block are spaced apart from each other, and in the second direction, the composite metal block and the elliptical metal block are alternately arranged, and the projection of the elliptical metal block along the second direction is located between two adjacent arc-shaped portions.

[0020] The chip protection ring structure and chip thereof of the present application, the rectangular portion of the composite metal block can guide the crack shear force to be transmitted along the first direction, and the arc portion can further guide the shear force to deviate from the first direction to have a component in the second direction, and be buffered again on the elliptical metal block; further, the composite metal block and the elliptical metal block having a spacing area along the first direction can make the buffered shear force advance along the first direction again, so that the force transmission path extends in an approximately S-shaped shape, and during the extension, it is consumed to the maximum extent, thereby reducing the degree of splitting; further, the edge connection line of the buffer structure is set to a triangular morphology, and the angle away from the inclined side is greater than the angle formed by the extension line of the horizontal side and the extension line of the vertical side, so that the buffer structure can be away from the cutting path, reducing the probability of damage, so as to better buffer the force while ensuring integrity as much as possible, including bearing the cracking force transmitted from the cutting path during the cutting process, so as to ensure the optimal buffering effect on the crack. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Shown is a schematic structural diagram of a chip protection ring structure in an embodiment of the present utility model.

[0022] Figure 2 Display as Figure 1 Schematic diagram of the local enlarged structure of area B in the middle.

[0023] Figure 3 Display as Figure 1 Schematic diagram of the partially enlarged structure of the buffer structure.

[0024] Component number description

[0025] 101 Horizontal Edge

[0026] 102 vertical edge

[0027] 103 Slanted Edge

[0028] 201 Composite Metal Block

[0029] 211 Rectangular part

[0030] 221 arc

[0031] 202 Oval Metal Block

[0032] 300 Metal Contact

[0033] A Corner Area

[0034] C spacer DETAILED DESCRIPTION

[0035] The following is an explanation of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0036] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] like Figure 1 to Figure 3, this embodiment provides a chip protection ring structure, the chip protection ring structure includes a sealing ring and a buffer structure, the sealing ring includes a horizontal side 101, a vertical side 102 and an inclined side 103 connecting the horizontal side 101 and the vertical side 102, wherein the area enclosed by the extension line of the horizontal side 101, the extension line of the vertical side 102 and the extension line of the inclined side 103 is defined as a corner area A, the extension direction of the inclined side 103 is defined as a first direction X, and the direction perpendicular to the inclined side 103 is defined as a second direction Y; the buffer structure is located in the corner area A, and The sealing rings are arranged at intervals, and the buffer structure includes a composite metal block 201 and an elliptical metal block 202. The composite metal block 201 includes a rectangular portion 211 and an arc-shaped portion 221 located on two opposite sides of the rectangular portion 211 and convex outwardly; in the first direction X, the composite metal block 201 and the elliptical metal block 202 are arranged at intervals respectively, and in the second direction Y, the composite metal block 201 and the elliptical metal block 202 are arranged alternately, and the projection of the elliptical metal block 202 along the second direction Y is located between two adjacent arc-shaped portions 221.

[0039] It should be noted that the rectangular portion 211 described in the present application includes a square, and for the convenience of description, the extension direction of the inclined edge 103 is defined as the first direction X, the extension direction perpendicular to the inclined edge 103 from the corner area A is defined as the second direction Y, and the direction perpendicular to the plane formed by the first direction X and the second direction Y is defined as Z. Among them, the horizontal edge 101 can be a horizontal edge, and of course it can also be a horizontal edge with a certain angle to the horizontal edge, and the vertical edge 102 can be a vertical edge perpendicular to the horizontal edge, and of course it can also be a vertical edge with a certain angle to the vertical edge, and no excessive restrictions are made here.

[0040] As an example, the inclination angle of the inclined edge 103 can be 30° to 60°, that is, the angle between the inclined edge 103 and the horizontal edge can be 30° to 60°, such as 30°, 45°, 60°, etc., and no excessive restrictions are made here.

[0041] Specifically, Figure 1 and Figure 2 In this embodiment, a plurality of the composite metal blocks 201 are arranged at intervals along the first direction X, a plurality of the elliptical metal blocks 202 are arranged at intervals along the first direction X, and in the second direction Y, the composite metal blocks 201 and the elliptical metal blocks 202 are arranged alternately, and the projection of the elliptical metal block 202 along the second direction Y is located between two adjacent arc-shaped portions 221, so as to form the buffer structure distributed in an array.

[0042] Among them, see Figure 3The rectangular portion 211 of the composite metal block 201 can guide the crack shear force to be transmitted along the first direction X, and the arc portion 221 can further guide the shear force to deviate from the first direction X to have a component force in the second direction Y. The component force can be buffered again when it is transmitted to the elliptical metal block 202. Therefore, the buffer structure of the composite metal block 201 and the elliptical metal block 202 can reduce the direct impact of the damage stress on the sealing ring, so as to weaken and slow down the damage stress and protect the sealing ring.

[0043] Further, as an example, see Figure 3 Preferably, along the first direction X, there is a spacing area C between the edge line of the arc-shaped portion 221 and the edge line of the elliptical metal block 202.

[0044] Specifically, in the first direction X, when there is a preset interval between the edge line of the arc portion 221 and the edge line of the elliptical metal block 202, that is, there is the interval area C, when the structural defect is initiated from the first direction X, there will be a barrier-free channel in the buffer structure, wherein the arc-shaped composite metal block 201 and the elliptical metal block 202 on both sides of the barrier-free channel can well buffer the shear force of crack occurrence, so the degree and energy of crack extension can be greatly reduced, and when cracks occur, there are interference reflections of the rectangular portion 211 (straight segment) and interference reflections of the arc portion 221 and the elliptical metal block 202 (curved segment) on both sides of the barrier-free channel, and the two work together to consume the shear force in the most advantageous way, so that the structural defect will not only extend along the first direction X, but extend in a roughly S-shaped direction under the guidance of the arc and partially straight side walls, and during the extension, the force is consumed to the maximum extent, reducing the degree of splitting. The size of the spacing area C is not particularly limited and can be selected according to specific needs.

[0045] As an example, the composite metal block 201 may be an axisymmetric shape.

[0046] Specifically, Figure 1 to Figure 3 As shown, in this embodiment, the composite metal block 201 is a biaxially symmetrical figure with two symmetry axes, that is, the arc-shaped portions 221 are correspondingly arranged on both sides of the central position of the rectangular portion 211, but the shape of the composite metal block 201 is not limited thereto. If necessary, the two arc-shaped portions 221 located on two opposite sides of the rectangular portion 211 can also be staggered along the first direction X, and no excessive restrictions are made here. The specific size of the composite metal block 201 is not limited here.

[0047] As an example, the major axis of the elliptical metal block 202 is arranged along the first direction X.

[0048] Specifically, Figure 1 to Figure 3 As shown, in this embodiment, the long axis of the elliptical metal block 202 is arranged along the first direction X, so that the composite metal block 201 and the elliptical metal block 202 are arranged more densely in the limited corner area A, thereby further improving the buffering effect of the buffer structure. Of course, in another embodiment, the elliptical metal block 202 can also be arranged with its short axis arranged along the first direction X, and no excessive restriction is made here. The specific size of the elliptical metal block 202 is not limited here.

[0049] As an example, the composite metal blocks 201 are arranged at equal intervals; and the elliptical metal blocks 202 are arranged at equal intervals.

[0050] Specifically, Figure 1 to Figure 3 As shown, in this embodiment, the composite metal block 201 and the elliptical metal block 202 are arranged at equal intervals, but it is not limited to this. In another embodiment, the composite metal block 201 and / or the elliptical metal block 202 may also be arranged at non-equal intervals, and no excessive restriction is made here.

[0051] As an example, the edge lines of the buffer structure form a triangular shape, and the angle θ1 away from the inclined edge 103 is greater than the angle θ2 formed by the extension line of the horizontal edge 101 and the extension line of the vertical edge 102 .

[0052] For details, see Figure 1 In this embodiment, the buffer structure is located in the corner area A, and the edge lines of the buffer structure form a triangular shape, and the angle θ1 away from the inclined edge 103 is greater than the angle θ2 formed by the extension line of the horizontal edge 101 and the extension line of the vertical edge 102, so that the buffer structure can be kept away from the cutting path, reducing the probability of the buffer structure being damaged, so as to better buffer the force while ensuring the integrity of the buffer structure as much as possible, including bearing the cracking force transmitted by the cutting path during the cutting process, so as to ensure the optimal buffering effect on the crack. Among them, the value of θ1 may include 90°<θ1<180°, such as θ1 can be 120°, 135°, 150°, etc.

[0053] For example, see Figure 2 The composite metal block 201 and the elliptical metal block 202 are combined to form a buffer metal layer, and the buffer metal layers are stacked from bottom to top in a direction Z perpendicular to the plane formed by the first direction X and the second direction Y, and each buffer metal layer is connected by a metal contact 300.

[0054] Furthermore, it is preferred that the metal blocks in the adjacent buffer metal layers are arranged to overlap each other up and down, wherein the overlapping manner may include overlapping of one or a combination of the composite metal block 201 and the elliptical metal block 202 .

[0055] For details, see Figure 2 Along the direction Z, the composite metal block 201 and the elliptical metal block 202 form a plurality of buffer metal layers that are interconnected and stacked from bottom to top through the metal contact 300, and the metal blocks in the upper and lower adjacent buffer metal layers are arranged in an overlapping manner, that is, the projections of the metal block in the upper layer and the metal block in the lower layer along the direction Z have an overlapping area, so as to further enhance the buffer structure's barrier effect against damage stress.

[0056] Of course, as required, the composite metal block 201 and / or the elliptical metal block 202 can also be configured to extend directly from bottom to top along the direction Z, which is not limited here.

[0057] The material of the composite metal block 201 and the elliptical metal block 202 and the material of the metal contact 300 can be selected according to needs, such as copper metal, etc., which is not limited here.

[0058] The connection positions of the composite metal block 201, the elliptical metal block 202 and the metal contact 300 can be set as needed. In this embodiment, the overlapping mode of the buffer metal layers adjacent to each other is preferably the overlapping mode of the composite metal block 201 and the elliptical metal block 202, but the overlapping mode of the buffer metal layers adjacent to each other is not limited thereto, and may also be the overlapping mode of only the composite metal block 201 or the overlapping mode of only the elliptical metal block 202, which is not excessively limited here.

[0059] As an example, the sealing ring may include a single ring or a double ring. In this embodiment, Figure 1 and Figure 2 The sealing ring shown in the figure is a single-ring sealing ring, but it is not limited to this. The sealing ring can also be a double-ring sealing ring. There is no excessive limitation here and it can be set according to needs.

[0060] As an example, the sealing ring may include an open ring or a closed ring, that is, the sealing ring may be an open-ring sealing ring with an opening, or a closed-ring sealing ring. There is no excessive limitation here and it can be set as needed.

[0061] This embodiment further provides a chip, which includes the chip protection ring structure. The type of the chip is not overly limited herein.

[0062] In summary, the chip protection ring structure and chip thereof of the utility model include a sealing ring and a buffer structure located in a corner area of ​​the sealing ring and spaced apart from the sealing ring, the sealing ring includes a horizontal side, a vertical side and an inclined side connecting the horizontal side and the vertical side, wherein an area enclosed by an extension line of the horizontal side, an extension line of the vertical side and an extension line of the inclined side is defined as a corner area, an extension direction of the inclined side is defined as a first direction, and a direction perpendicular to the inclined side is defined as a second direction; the buffer structure includes a composite metal block and an elliptical metal block, the composite metal block includes a rectangular portion and an arc-shaped portion located on two opposite sides of the rectangular portion and convex outwardly; in the first direction, the composite metal block and the elliptical metal block are spaced apart from each other, and in the second direction, the composite metal block and the elliptical metal block are alternately arranged, and the projection of the elliptical metal block along the second direction is located between two adjacent arc-shaped portions.

[0063] The chip protection ring structure and chip of the present application, the rectangular part of the composite metal block can guide the crack shear force to be transmitted along the first direction, and the arc part can further guide the shear force to deviate from the first direction to have a component in the second direction, and be buffered again on the elliptical metal block; further, the composite metal block and the elliptical metal block with a spacing area along the first direction can make the buffered shear force advance along the first direction again, so that the force transmission path is approximately S-shaped and extends, and in the extension, it is consumed to the maximum extent, reducing the degree of splitting; further, the edge connection line of the buffer structure is set to a triangular shape, and the angle away from the inclined side is greater than the angle formed by the extension line of the horizontal side and the extension line of the vertical side, so that the buffer structure can be away from the cutting path, reduce the probability of damage, and better play a buffering role on the force while ensuring integrity as much as possible, including bearing the cracking force transmitted by the cutting path during the cutting process, so as to ensure the optimal buffering effect on the crack. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0064] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A chip protection ring structure, characterized in that: The chip protection ring structure comprises: A sealing ring, the sealing ring comprising a horizontal side, a vertical side and an inclined side connecting the horizontal side and the vertical side, wherein an area enclosed by an extension line of the horizontal side, an extension line of the vertical side and an extension line of the inclined side is defined as a corner area, an extension direction of the inclined side is defined as a first direction, and a direction perpendicular to the inclined side is defined as a second direction; A buffer structure is provided, wherein the buffer structure is located in the corner area and is spaced apart from the sealing ring. The buffer structure comprises a composite metal block and an elliptical metal block. The composite metal block comprises a rectangular portion and an arc-shaped portion which is located on two opposite sides of the rectangular portion and is convex outward. In the first direction, the composite metal block and the elliptical metal block are spaced apart from each other. In the second direction, the composite metal block and the elliptical metal block are alternately arranged, and the projection of the elliptical metal block along the second direction is located between two adjacent arc-shaped portions.

2. The chip protection ring structure according to claim 1, characterized in that: The composite metal block is an axisymmetric shape.

3. The chip protection ring structure according to claim 1, characterized in that: The major axis of the elliptical metal block is arranged along the first direction.

4. The chip protection ring structure according to claim 1, characterized in that: The composite metal blocks are arranged at equal intervals; the elliptical metal blocks are arranged at equal intervals.

5. The chip protection ring structure according to claim 1, characterized in that: Along the first direction, there is a spacing area between a line connecting edges of the arc-shaped portion and a line connecting edges of the elliptical metal block.

6. The chip protection ring structure according to claim 1, characterized in that: The edge connection lines of the buffer structure form a triangular shape, and the included angle away from the inclined edge is greater than the included angle formed by the extension line of the horizontal edge and the extension line of the vertical edge.

7. The chip protection ring structure according to claim 1, characterized in that: The inclination angle of the inclined edge is 30° to 60°.

8. The chip protection ring structure according to claim 1, characterized in that: The composite metal block and the elliptical metal block are combined to form a buffer metal layer, and the buffer metal layers are stacked from bottom to top in a direction perpendicular to the plane formed by the first direction and the second direction, and each buffer metal layer is connected by metal contact; the metal blocks in adjacent buffer metal layers are arranged to overlap up and down, and the overlapping method includes overlapping of one or a combination of the composite metal block and the elliptical metal blocks.

9. The chip protection ring structure according to claim 1, characterized in that: The sealing ring includes a single ring or a double ring; the sealing ring includes an open ring or a closed ring.

10. A chip, characterized in that: The chip includes the chip protection ring structure as claimed in any one of claims 1 to 9.

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