Wireless earphone mainboard integrated device

Abstract

The utility model relates to the technical field of main boards, and discloses a wireless earphone main board integrated device, an upper shell is symmetrically arranged on the top surface of a lower shell, a clamping plate is fixedly arranged on the inner walls of the lower shell and the upper shell, a clamping groove is formed in one surface of the clamping plate, a main board is fixedly clamped in the clamping groove, and a wireless earphone is arranged in the main board. The waterproof and sand-proof functions of the structure are achieved by arranging the lower shell, the upper shell, the mainboard and other structures, the upper shell is aligned to the top of the lower shell, the circular plates can be perfectly clamped into the circular grooves formed in the two ends of the upper shell, the clamping plates in the upper shell correspond to the clamping plates in the lower shell in position, the upper shell and the lower shell are perfectly combined, and the waterproof and sand-proof functions of the structure are achieved. After the lower shell and the upper shell are attached, no matter in sand and dust weather or falling into water, due to the fact that the circular groove and the circular plate are relatively sealed, and the arc groove and the arc strip are relatively sealed, external sand and dust or water cannot enter the device, and the effect of safety protection on the mainboard is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of mainboards, in particular to a wireless earphone mainboard integrated device. Background Art

[0002] Wireless headphones have the wire in the middle replaced by radio waves. They are connected from the audio port of the computer to the transmitter, which then sends the radio waves to the headphones at the receiving end. The receiving end is equivalent to a radio. There are three known types of wireless headphones. One is Bluetooth headphones, the second is infrared headphones, and the third is 2.4G.

[0003] Existing Bluetooth headsets only have a single heat dissipation hole for mainboard heat dissipation, so that the headset mainboard is in contact with the outside air to achieve heat exchange. Since there is no device at the heat dissipation hole to promote air circulation, the heat emitted by the mainboard cannot be quickly dissipated. Over a long period of time, the mainboard temperature will be too high and the components on the mainboard will be damaged to varying degrees.

[0004] In the prior art, the Bluetooth headset mainboard is fixed inside the headset, receives signals for the Bluetooth headset, and transmits the signals to the speaker to achieve sound propagation. However, the mainboard is located inside the headset and is not well protected. Although the outer shell is closely connected, there is still a gap. Once an accident occurs, the headset as a whole falls into the water, and the mainboard is damaged after contacting the water, resulting in damage to the entire headset. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a wireless headset motherboard integrated device, which has the advantages of being waterproof, dustproof, and heat-dissipating, and solves the problems raised by the above-mentioned background technology.

[0006] The utility model provides the following technical solutions: a wireless headset motherboard integrated device, comprising a lower shell, an upper shell is symmetrically mounted on the top surface of the lower shell, circular grooves are provided at the openings at both ends of the lower shell and the upper shell, two arc grooves are provided on the top surface of the lower shell and the bottom surface of the upper shell, a circular plate is fixedly sleeved on the inner ring of the circular groove, an arc strip is fixedly mounted inside the arc groove, a card plate is fixedly mounted on the inner wall of the lower shell and the upper shell, a card slot is provided on one side of the card plate, a mainboard is fixedly mounted inside the card slot, a heat sink is fixedly mounted on the bottom of the mainboard located inside the lower shell, and a micro fan is fixedly mounted on the heat sink.

[0007] Preferably, there are eight card plates, four of which are installed on the inner walls of the lower shell and the upper shell respectively, the main board is in an H shape, four raised corners are provided on both sides of the main board, and the four raised corners are respectively located inside the card slots.

[0008] Preferably, two power columns are fixedly installed at the bottom of the mainboard between the raised corners, a sliding ring is fixedly sleeved on the outer ring of the power column, a connecting wire is fixedly installed on one side of the sliding ring inside the circular plate, and the connecting wire and the circular plate are sealed.

[0009] Preferably, an air outlet is provided through the middle of the bottom of the lower shell, a hole block is fixedly installed at the opening of the air outlet, and an air vent is provided through the inside of the hole block.

[0010] Preferably, an air suction pipe is fixedly installed at one end of the micro fan, an expansion port is fixedly installed at the end of the air suction pipe away from the micro fan, an air outlet pipe is fixedly connected between the other end of the micro fan and the air outlet, a one-way valve is fixedly installed inside the air outlet pipe, the one-way valve is set to be open between the micro fan and the air outlet and closed between the air outlet and the micro fan, a heat dissipation pipe is fixedly connected between the air suction pipe and the air outlet pipe, and a capillary is evenly fixedly installed in the middle of the heat dissipation pipe in a circular shape.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] 1. The wireless headset motherboard integrated device realizes the waterproof and sandproof function of the structure by setting the lower shell, the upper shell, the motherboard and other structures. The upper shell is aligned with the top of the lower shell so that the circular plate can be perfectly inserted into the circular grooves opened at both ends of the upper shell, so that the card plate inside the upper shell corresponds to the card plate position inside the lower shell, so that the upper shell and the lower shell are perfectly combined. After the lower shell and the upper shell are fitted, no matter encountering sandstorm weather or falling into water, due to the relative sealing between the circular groove and the circular plate, and the relative sealing between the arc groove and the arc bar, external sand or water cannot enter the interior of the device, which has the effect of safety protection of the motherboard.

[0013] 2. The wireless headset motherboard integrated device realizes rapid cooling of the motherboard by arranging micro-fans, air vents and other structures. When the motherboard is working, heat is generated. A heat sink is installed at the bottom of the motherboard. The heat is concentrated on the heat sink and dissipated. The air outlet pipe is located below the heat sink. When the heat is dissipated from the heat sink, the micro-fan is started to generate suction at one end of the air intake pipe to absorb the dissipated heat into the interior of the micro-fan. Then the micro-fan dissipates the internal heat through the air outlet pipe. The hot air is blown into the heat pipe through the hole block. After the hot air dissipates the heat through the capillary, it returns to the air intake pipe from the heat pipe to achieve cooling, which has the effect of rapid cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 This is a cross-sectional view of the overall structure of the utility model;

[0016] Figure 3 It is a cross-sectional view from another perspective of the overall structure of the utility model;

[0017] Figure 4 It is an exploded view of the overall structure of the utility model.

[0018] In the figure: 1, lower shell; 11, air outlet; 12, hole block; 2, upper shell; 3, circular groove; 4, arc groove; 5, round plate; 51, connecting line; 6, arc strip; 7, card plate; 71, card slot; 8, main board; 9, micro fan; 91, air intake pipe; 92, air outlet pipe; 93, one-way valve; 94, heat dissipation pipe. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-Figure 4 A wireless headset motherboard integrated device comprises a lower shell 1, an upper shell 2 is symmetrically mounted on the top surface of the lower shell 1, circular grooves 3 are provided at the openings at both ends of the lower shell 1 and the upper shell 2, two arc grooves 4 are provided on the top surface of the lower shell 1 and the bottom surface of the upper shell 2, a circular plate 5 is fixedly sleeved on the inner ring of the circular groove 3, an arc strip 6 is fixedly mounted inside the arc groove 4, a card board 7 is fixedly mounted on the inner wall of the lower shell 1 and the upper shell 2, and the card board 7 has 8 motherboards, and 4 card boards are respectively installed on the inner wall of the lower shell 1 and the upper shell 2 7. A card slot 71 is provided on one side of the card plate 7, and a main board 8 is fixedly connected inside the card slot 71. The shape of the main board 8 is H-shaped. Four protruding corners are provided on both sides of the main board 8, and the four protruding corners are respectively located inside the card slot 71, so that the card slot 71 fixes the position of the main board 8. When the lower shell 1 and the upper shell 2 are combined, the main board 8 is firmly connected by the card plate 7 to prevent the main board 8 from shaking when the device shakes. The bottom of the main board 8 is located inside the lower shell 1 and a heat sink is fixedly installed, and a micro fan 9 is fixedly installed on the heat sink.

[0021] See also Figure 1-Figure 4, press the arc strip 6 into the arc groove 4 on the top surface of the lower shell 1, so that the arc strip 6 perfectly enters the arc groove 4, put the main board 8 and the structure connected thereto into the lower shell 1, so that the four raised corners of the main board 8 are perfectly stuck in the card groove 71, and the circular plates 5 connected on both sides of the bottom of the main board 8 are placed in the circular grooves 3 opened at the openings on both sides of the lower shell 1, so that the circular plates 5 are perfectly stuck in the inside of the circular grooves 3, align the upper shell 2 with the top of the lower shell 1, so that the circular plates 5 can be perfectly stuck in the circular grooves 3 opened at both ends of the upper shell 2, so that the card plate 7 inside the upper shell 2 corresponds to the position of the card plate 7 inside the lower shell 1, so that the upper shell 2 and the lower shell 1 are perfectly combined. After the lower shell 1 and the upper shell 2 are fitted together, no matter encountering sandstorm weather or falling into water, due to the relative sealing between the circular groove 3 and the circular plate 5, and the relative sealing between the arc groove 4 and the arc strip 6, external sand or water cannot enter the interior of the device, thereby achieving safety protection of the mainboard.

[0022] See also Figure 1-Figure 4 Two power columns are fixedly installed at the bottom of the main board 8 between the raised corners, and a sliding ring is fixedly sleeved on the outer ring of the power column. A connecting wire 51 is fixedly installed on one side of the sliding ring inside the circular plate 5, and the connecting wire 51 and the circular plate 5 are in a sealed state.

[0023] See also Figure 1-Figure 3 An air vent 11 is provided in the middle of the bottom of the lower shell 1 and penetrates through the lower shell 1 . A hole block 12 is fixedly installed at the opening of the air vent 11 . An air vent is provided inside the hole block 12 .

[0024] See also Figure 1-Figure 4 The micro fan 9 is driven by a built-in micro motor, and an air suction pipe 91 is fixedly installed at one end of the micro fan 9, and an expansion port is fixedly installed at the end of the air suction pipe 91 away from the micro fan 9, so that more hot air can enter the air suction pipe 91 through the expansion port and be extracted by the micro fan 9, and an air outlet pipe 92 is fixedly connected between the other end of the micro fan 9 and the air outlet 11, and a one-way valve 93 is fixedly installed inside the air outlet pipe 92. The one-way valve 93 is set to be open between the micro fan 9 and the air outlet 11, and closed between the air outlet 11 and the micro fan 9, and a heat dissipation pipe 94 is fixedly connected between the air suction pipe 91 and the air outlet pipe 92. The middle part of the heat dissipation pipe 94 is annular and evenly fixed with capillaries to realize air circulation and heat dissipation, so as to prevent the device from falling into water or encountering sandstorms, which will cause damage to the mainboard of the device.

[0025] See also Figure 1-Figure 4When the main board 8 is working, heat will be generated. In order to prevent the temperature of the main board 8 from being too high, a micro fan 9 is arranged at the bottom. A heat sink is installed at the bottom of the main board 8. The heat will be concentrated on the heat sink and dissipated, and the position of the air outlet pipe 92 is located below the heat sink. When the heat is dissipated from the heat sink, the micro fan 9 is started to generate suction at one end of the air suction pipe 91 to absorb the dissipated heat into the interior of the micro fan 9, and then the micro fan 9 dissipates the internal heat through the air outlet pipe 92. The one-way valve 93 allows the air inside the micro fan 9 to pass through the air outlet 11, which will block the air outlet 11 from entering the air or water into the micro fan 9. The hot air is blown into the heat pipe 94 through the hole block 12. After the hot air is dissipated through the capillary, it returns to the air suction pipe 91 from the heat pipe 94 to achieve cooling.

[0026] Working principle: press the arc strip 6 into the arc groove 4 on the top surface of the lower shell 1, so that the arc strip 6 enters the arc groove 4 perfectly, put the main board 8 and the structure connected thereto into the lower shell 1, so that the four raised corners of the main board 8 are perfectly stuck in the card groove 71, and the circular plates 5 connected on both sides of the bottom of the main board 8 are placed in the circular grooves 3 opened at the openings on both sides of the lower shell 1, so that the circular plates 5 are perfectly stuck in the circular grooves 3, align the upper shell 2 with the top of the lower shell 1, so that the circular plates 5 can be perfectly stuck in the circular grooves 3 opened at both ends of the upper shell 2, so that the card plate 7 inside the upper shell 2 corresponds to the position of the card plate 7 inside the lower shell 1, so that the upper shell 2 and the lower shell 1 are perfectly combined. After the lower shell 1 and the upper shell 2 are fitted together, no matter encountering sandstorm weather or falling into water, due to the relative sealing between the circular groove 3 and the circular plate 5, the arc groove 4 and the arc strip 6 are relatively sealed, and the one-way valve 93 makes the micro The internal air of the micro fan 9 can pass through the air outlet 11, which will block the air outlet 11 from entering the air or water into the micro fan 9. External dust or water cannot enter the device, thereby realizing the safety protection of the mainboard. When the mainboard 8 is working, heat will be generated. In order to prevent the temperature of the mainboard 8 from being too high, a micro fan 9 is arranged at the bottom, and a heat sink is installed at the bottom of the mainboard 8. The heat will be concentrated on the heat sink and dissipated, and the position of the air outlet pipe 92 is located below the heat sink. When the heat is dissipated from the heat sink, the micro fan 9 is started to generate suction at one end of the air suction pipe 91 to absorb the dissipated heat into the interior of the micro fan 9, and then the micro fan 9 dissipates the internal heat through the air outlet pipe 92, and the hot air is blown into the heat dissipation pipe 94 through the hole block 12. After the hot air is dissipated through the capillary, it returns to the air suction pipe 91 from the heat dissipation pipe 94 to realize cooling.

Claims

1. A wireless headset motherboard integrated device, comprising a lower housing (1), characterized in that: The upper shell (2) is symmetrically mounted on the top surface of the lower shell (1), circular grooves (3) are provided at the openings at both ends of the lower shell (1) and the upper shell (2), two arc grooves (4) are provided on the top surface of the lower shell (1) and the bottom surface of the upper shell (2), a circular plate (5) is fixedly sleeved on the inner ring of the circular groove (3), an arc strip (6) is fixedly mounted inside the arc groove (4), a clamping plate (7) is fixedly mounted on the inner wall of the lower shell (1) and the upper shell (2), a clamping groove (71) is provided on one side of the clamping plate (7), a main board (8) is fixedly clamped inside the clamping groove (71), a heat dissipation plate is fixedly mounted on the bottom of the main board (8) located inside the lower shell (1), a micro fan (9) is fixedly mounted on the heat dissipation plate, and the micro fan (9) is driven by a built-in micro motor.

2. A wireless headset motherboard integration device according to claim 1, characterized in that: There are eight card plates (7), four of which are mounted on the inner walls of the lower shell (1) and the upper shell (2), respectively; the main board (8) is in an H shape, and four raised corners are arranged on both sides of the main board (8), and the four raised corners are respectively located inside the card slots (71).

3. A wireless headset motherboard integration device according to claim 2, characterized in that: Two power columns are fixedly installed at the bottom of the main board (8) between the raised corners, a sliding ring is fixedly sleeved on the outer ring of the power column, a connecting wire (51) is fixedly installed on one side of the sliding ring inside the circular plate (5), and a sealing state is formed between the connecting wire (51) and the circular plate (5).

4. A wireless headset motherboard integration device according to claim 3, characterized in that: An air outlet (11) is provided in the middle of the bottom of the lower shell (1) and penetrates through the lower shell (1). A hole block (12) is fixedly installed at the opening of the air outlet (11), and an air vent is provided through the inside of the hole block (12).

5. A wireless headset motherboard integration device according to claim 4, characterized in that: An air suction pipe (91) is fixedly mounted on one end of the micro fan (9), and an expansion port is fixedly mounted on one end of the air suction pipe (91) away from the micro fan (9). An air outlet pipe (92) is fixedly connected between the other end of the micro fan (9) and the air outlet (11), and a one-way valve (93) is fixedly mounted inside the air outlet pipe (92). The one-way valve (93) is set to be open between the micro fan (9) and the air outlet (11) and closed between the air outlet (11) and the micro fan (9). A heat dissipation pipe (94) is fixedly connected between the air suction pipe (91) and the air outlet pipe (92), and a capillary tube is evenly fixedly mounted in a circular ring shape in the middle of the heat dissipation pipe (94).

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