Display substrate and display panel

Abstract

The utility model discloses a display substrate and a display panel. The display substrate is provided with a display area and a binding area, the binding area is located on the periphery of at least one side of the display area, and the display substrate comprises a substrate located on the display area and the binding area; the first binding electrode and the second binding electrode are located in the binding area and located on the same side of the substrate, the first binding electrode is located on the side, close to the display area, of the second binding electrode, and the first binding electrode is configured to be connected with a display driving circuit in a binding mode; the second binding electrode is configured to be in binding connection with a peripheral circuit board; the first binding electrode is electrically connected with the second binding electrode; the peripheral circuit board is configured to provide a display signal and a power supply signal to the display driving circuit; the display driving circuit is configured to provide a display driving signal to the display area; the distance between the surface of the side, away from the substrate, of the first binding electrode and the substrate is larger than the distance between the surface of the side, away from the substrate, of the second binding electrode and the substrate.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the field of display technology, and specifically relate to a display substrate and a display panel. Background Art

[0002] OLED (Organic Light-Emitting Diode) display screens have attracted widespread attention due to their advantages such as self-luminescence, low power consumption, lightness, flexibility, bright colors, high contrast, and fast response rate. Utility Model Content

[0003] In a first aspect, an embodiment of the present disclosure provides a display substrate having a display area and a binding area, wherein the binding area is located at a periphery of at least one side of the display area.

[0004] Wherein, the display substrate comprises a base located in the display area and the binding area;

[0005] The first binding electrode and the second binding electrode are located in the binding area and on the same side of the substrate, and the first binding electrode is located on a side of the second binding electrode close to the display area.

[0006] The first binding electrode is configured to be bound and connected to a display driving circuit; the second binding electrode is configured to be bound and connected to a peripheral circuit board; the first binding electrode is electrically connected to the second binding electrode;

[0007] The peripheral circuit board is configured to provide a display signal and a power signal to the display driving circuit; the display driving circuit is configured to provide a display driving signal to the display area;

[0008] A distance between a surface of the first binding electrode facing away from the substrate and the substrate is greater than a distance between a surface of the second binding electrode facing away from the substrate and the substrate.

[0009] In some embodiments, a difference between a distance between a surface of the first binding electrode facing away from the substrate and the substrate and a distance between a surface of the second binding electrode facing away from the substrate and the substrate is ≥5 μm.

[0010] In some embodiments, a distance between an orthographic projection of the first binding electrode on the substrate and an orthographic projection of the second binding electrode on the substrate is ≥0 and <500 μm.

[0011] In some embodiments, the first binding electrode includes four sub-film layers, the four sub-film layers are stacked in sequence, and along the direction away from the substrate, the materials of the four sub-film layers are titanium, aluminum, titanium, and indium tin oxide in sequence;

[0012] The material of the second binding electrode includes aluminum.

[0013] In some embodiments, the first binding electrode and the second binding electrode are located in different layers, and a first insulating layer is further disposed between the first binding electrode and the second binding electrode.

[0014] The display substrate further includes a first connecting line and a second connecting line.

[0015] The first connecting line and the second binding electrode are formed in the same layer and made of the same material, the first connecting line and the first binding electrode's orthographic projection on the substrate at least partially overlap, and the first connecting line is electrically connected to the first binding electrode through a plurality of first via holes provided in the first insulating layer;

[0016] The second connecting line is located at a side of the second binding electrode close to the substrate, and a second insulating layer is further provided between the second connecting line, the second binding electrode and the first connecting line;

[0017] The second connecting line at least partially overlaps with the orthographic projections of the second binding electrode and the first connecting line on the substrate;

[0018] The second connection wires are electrically connected to the second binding electrodes and the first connection wires respectively through a plurality of second via holes opened in the second insulating layer.

[0019] In some embodiments, the first binding electrode and the second binding electrode are located in different layers, and a first insulating layer is further disposed between the first binding electrode and the second binding electrode.

[0020] The second binding electrode also extends to the orthographic projection area of ​​the first binding electrode on the substrate, and the orthographic projection of the second binding electrode and the first binding electrode on the substrate at least partially overlap,

[0021] The second binding electrode is electrically connected to the first binding electrode through a plurality of first via holes opened in the first insulating layer.

[0022] In some embodiments, a first opening is formed in the first insulating layer, and the first opening at least partially overlaps with an orthographic projection of the second binding electrode on the substrate.

[0023] The second binding electrode is exposed at the first opening.

[0024] In some embodiments, the number of the first binding electrodes is multiple, and the number of the second binding electrodes is multiple; the multiple first binding electrodes and the multiple second binding electrodes are electrically connected in a one-to-one correspondence;

[0025] A plurality of the first binding electrodes are arranged along a first direction;

[0026] A plurality of the second binding electrodes are arranged along the first direction;

[0027] Along the first direction, odd-numbered and even-numbered first binding electrodes are staggered with each other;

[0028] Along the first direction, odd-numbered and even-numbered second binding electrodes are staggered with each other;

[0029] An odd number of the first binding electrodes and an odd number of the second binding electrodes are arranged in a first straight line along the first direction;

[0030] An even number of the first binding electrodes and an even number of the second binding electrodes are arranged in a second straight line along the first direction;

[0031] The first straight line and the second straight line are parallel to each other.

[0032] In some embodiments, the first via hole is filled with tungsten.

[0033] In some embodiments, a third binding electrode is further included, which is located in the binding area and is located on the same side of the substrate as the first binding electrode and the second binding electrode, and the third binding electrode is located on a side of the first binding electrode close to the display area;

[0034] The third binding electrode does not overlap with the orthographic projections of the first binding electrode and the second binding electrode on the substrate;

[0035] The third binding electrode is configured to be bound and connected to the display driving circuit;

[0036] The third binding electrode is made of the same layer and material as the first binding electrode, and a surface of the third binding electrode facing away from the substrate is flush with a surface of the first binding electrode facing away from the substrate.

[0037] In some embodiments, it further includes an anode and a pixel circuit, wherein the anode is located in the display area; the pixel circuit is located in the display area and the binding area;

[0038] The anode is in the same layer and made of the same material as the first binding electrode and the third binding electrode;

[0039] The pixel circuit is located between the anode and the substrate; the pixel circuit is electrically connected to the anode;

[0040] The display substrate further includes a third connection line located between the third binding electrode and the substrate, and the third connection line extends from the binding area to the display area;

[0041] The third binding electrode is electrically connected to the third connection line, and the third connection line is electrically connected to the pixel circuit.

[0042] In some embodiments, the number of the third binding electrodes is multiple, and the multiple third binding electrodes are arranged in an array.

[0043] Along the arrangement direction of the display area and the binding area, positions of the third binding electrodes in any two adjacent rows in the array of the third binding electrodes are staggered.

[0044] In some embodiments, an electrostatic ring is further included, surrounding the periphery of the display area.

[0045] Part of the electrostatic ring is located in the binding area, and part of the electrostatic ring located in the binding area is located on a side of the second binding electrode away from the display area.

[0046] The electrostatic ring includes a first electrode line and a second electrode line, the first electrode line and the second binding electrode are in the same layer and made of the same material,

[0047] The second electrode line is located on a side of the first electrode line close to the substrate, the second electrode line is electrically connected to the first electrode line, and the second electrode line is grounded.

[0048] In some embodiments, along the arrangement direction of the display area and the binding area, the distance between the third binding electrode and the display area is ≥ 2 mm;

[0049] The distance between a side boundary of the third binding electrode close to the display area and a side boundary of the first binding electrode away from the display area is ≥ 2 mm;

[0050] The distance between a side boundary of the second binding electrode close to the display area and a side boundary of the second binding electrode away from the display area is ≥ 100 μm;

[0051] A distance between a side boundary of the second binding electrode away from the display area and a side boundary of the electrostatic ring away from the display area is ≥40 μm.

[0052] In a second aspect, an embodiment of the present disclosure further provides a display panel, which includes the above-mentioned display substrate.

[0053] In some embodiments, a third insulating layer, a pixel defining layer and an encapsulation layer are also included.

[0054] The third insulating layer, the pixel defining layer and the encapsulation layer extend from the display area to the binding area respectively, and the third insulating layer, the pixel defining layer and the encapsulation layer are sequentially stacked on a side of the first binding electrode in the display substrate away from the base;

[0055] The third insulating layer, the pixel defining layer and the encapsulation layer are provided with second openings in regions corresponding to the first binding electrode and the third binding electrode, and the first binding electrode and the third binding electrode are exposed at the second openings;

[0056] The third insulating layer, the pixel defining layer and the encapsulation layer have a third opening in an area corresponding to the second binding electrode, the third opening overlaps with the orthographic projection of the first opening in the display substrate on the base, and the second binding electrode is exposed in the overlapping area of ​​the orthographic projection of the third opening and the first opening.

[0057] In some embodiments, along the arrangement direction of the display area and the binding area, the opening width of the second opening is the distance between a side boundary of the third binding electrode close to the display area and a side boundary of the first binding electrode away from the display area.

[0058] In some embodiments, a display driving circuit is also included.

[0059] The display driving circuit is located on a side of the packaging layer away from the display substrate, and the display driving circuit is located at the second opening.

[0060] The input electrode of the display driving circuit is bound and electrically connected to the first binding electrode through anisotropic conductive adhesive; and the output electrode of the display driving circuit is bound and electrically connected to the third binding electrode through the anisotropic conductive adhesive.

[0061] In some embodiments, a peripheral circuit board is further included, which is located outside the display substrate.

[0062] The second binding electrode is welded to one end of a binding connection wire at a position where the orthographic projections of the third opening and the first opening overlap, and the other end of the binding connection wire is welded to a binding electrode of the peripheral circuit board.

[0063] In some embodiments, the number of the binding connection wires is multiple.

[0064] Each of the binding connection wires electrically connects one of the second binding electrodes and one of the binding electrodes on the peripheral circuit board;

[0065] The outer peripheries of the plurality of binding connection wires are wrapped with protective glue, and the protective glue can insulate adjacent binding connection wires from each other.

[0066] In some embodiments, the material of the binding connection wires includes aluminum.

[0067] The display substrate provided by the embodiment of the present disclosure makes the distance between the side surface of the first binding electrode away from the substrate and the substrate greater than the distance between the side surface of the second binding electrode away from the substrate and the substrate, so that there is a step height difference between the side surface of the first binding electrode away from the substrate and the side surface of the second binding electrode away from the substrate. When the first binding electrode is connected to the display driving circuit by hot-pressing anisotropic conductive adhesive, even if the anisotropic conductive adhesive overflows onto the hot-pressing welding surface of the second binding electrode and the binding connection wire when squeezed, it will not cause a short circuit between adjacent second binding electrodes or binding connection wires. Because the gold ball particles in the anisotropic conductive glue will not be flattened during the hot-pressing welding of the second binding electrode and the binding connection wire, the anisotropic conductive glue overflowing onto the hot-pressing welding surface of the second binding electrode and the binding connection wire will not conduct electricity, so the anisotropic conductive glue overflowing onto the hot-pressing welding surface of the second binding electrode and the binding connection wire will not cause a short circuit between adjacent second binding electrodes or adjacent binding connection wires, thereby shortening or eliminating the reserved spacing between the first binding electrode and the second binding electrode for tolerating the overflow of glue, thereby reducing the width of the binding area in the direction away from the display area and improving the wafer cutting efficiency. In addition, since there is a step height difference between the side surface of the first binding electrode away from the substrate and the side surface of the second binding electrode away from the substrate, when the hot-pressing bonding connection wire is bonded to the second binding electrode, no secondary damage will be caused to the already bound display driving circuit.

[0068] The display panel provided by the embodiment of the present disclosure adopts the display substrate in the above embodiment. On the one hand, it is possible to shorten or eliminate the reserved spacing between the first binding electrode and the second binding electrode for tolerating glue overflow, thereby reducing the width of the binding area in the direction away from the display area and improving the wafer cutting efficiency; on the other hand, when the hot-pressing binding connection wire is bonded to the second binding electrode, no secondary damage will be caused to the already bound display driving circuit; on the other hand, the second binding electrode and the binding connection wire can be easily bonded by hot pressing, and the binding impedance between the second binding electrode and the binding connection wire can be reduced, ensuring stable reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] The accompanying drawings are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. The above and other features and advantages will become more apparent to those skilled in the art by describing detailed example embodiments with reference to the accompanying drawings, in which:

[0070] Figure 1a It is a cross-sectional schematic diagram of a display panel binding area in the related art.

[0071] Figure 1b The figure is a top view schematic diagram showing the arrangement of output connection terminals, input connection terminals and wire connection terminals in a display panel of the related art.

[0072] Figure 2a It is a schematic top view of the structure of the display substrate in the embodiment of the present disclosure.

[0073] Figure 2b The display substrate in the embodiment of the present disclosure is Figure 2a A structural cross-sectional diagram of the AA' section line.

[0074] Figure 2c The display substrate in the embodiment of the present disclosure is Figure 2a Another structural section diagram of the AA' section line.

[0075] Figure 3a FIG. 4 is a schematic top view of the arrangement of the first binding electrode and the second binding electrode in an embodiment of the present disclosure.

[0076] Figure 3b Schematic diagram of the top view of the arrangement of the third binding electrode in the embodiment of the present disclosure.

[0077] Figure 4a It is a schematic cross-sectional view of a local structure of a display panel in an embodiment of the present disclosure.

[0078] Figure 4b It is a schematic cross-sectional view of a local structure of another display panel in an embodiment of the present disclosure.

[0079] Figure 4c It is a schematic cross-sectional view of a local structure of a display area of ​​a display panel in an embodiment of the present disclosure.

[0080] Figure 5a It is a schematic cross-sectional view of the structure after the display panel is prepared in step S101 in the embodiment of the present disclosure.

[0081] Figure 5b It is a schematic cross-sectional view of the structure after the display panel is prepared in step S102 in the embodiment of the present disclosure.

[0082] Figure 5c It is a schematic cross-sectional view of the structure after the display panel is prepared in step S103 in the embodiment of the present disclosure.

[0083] Figure 5d It is a schematic cross-sectional view of the structure after the display panel is prepared in step S104 in the embodiment of the present disclosure.

[0084] Figure 5eIt is a schematic cross-sectional view of the structure after the display panel is prepared in step S105 in the embodiment of the present disclosure. DETAILED DESCRIPTION

[0085] In order to enable those skilled in the art to better understand the technical solution of the embodiments of the present disclosure, a display substrate and a display panel provided by the embodiments of the present disclosure are further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0086] The embodiments of the present disclosure will be described more fully below with reference to the accompanying drawings, but the embodiments shown may be embodied in different forms and should not be construed as being limited to the embodiments set forth in the present disclosure. On the contrary, the purpose of providing these embodiments is to make the present disclosure thorough and complete and to enable those skilled in the art to fully understand the scope of the present disclosure.

[0087] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings have schematic properties, and the shapes of the regions shown in the drawings illustrate the specific shapes of the regions, but are not intended to be limiting.

[0088] In the related technologies, with the continuous iteration of silicon-based OLED products, the silicon-based MDL (module) form of Two chip (dual chip, that is, the display driver chip (DDIC) and the display panel (panel) are independently set, and the display driver chip needs to be bound and connected with the display panel) has a higher product yield, which is different from the One Chip (single chip, that is, the display driver chip (DDIC) is directly integrated on the display panel (panel), and the display panel can be regarded as a single chip). In the Two chip silicon-based MDL (module), the binding forms of the display driver chip (DDIC) include COC (chip on chip, that is, the display driver chip is bound to the display panel through anisotropic conductive adhesive) and COF (that is, the display panel and the display driver chip are bound and connected through a flexible circuit board (FPC), such as binding the display panel at one end of the flexible circuit board and binding the display driver chip at the other end). The binding forms of the display panel and the peripheral circuit board (such as PCB circuit board) that complete the binding of the display driver chip include FPC (i.e. flexible circuit board, i.e. the display panel and the peripheral circuit board are bound and connected by the flexible circuit board) and Wire (i.e. the display panel and the peripheral circuit board are bound and connected by wires, and then the wires are coated with insulating glue for protection). Compared with the COC form and the FPC form, the binding form of the display driver chip and the display panel adopts the COC form + the display panel and the peripheral circuit board adopts the Wire form, which theoretically has better binding impedance stability.

[0089] Figure 1a 2 is a cross-sectional schematic diagram of the display panel binding area in the related art, in which the display driver chip 24 is bound to the display panel in the form of COC and the display panel is bound to the peripheral circuit board in the form of Wire. Figure 1a As shown, the display panel includes a display area 100 and a binding area 101. The output connection terminal (Output Pad) 25 and the input connection terminal (Input Pad) 26 required for binding the display driver chip 24 on the display panel, and the wire connection terminal (Wire Pad) 27 required for binding the peripheral circuit board on the display panel are located in the binding area 101 and are located on the same layer and the same horizontal plane. The output connection terminal 25, the input connection terminal 26 and the wire connection terminal 27 are arranged in sequence in a direction away from the display area 100. These three connection terminals (Pads) all adopt a film layer structure in which TATI (titanium, aluminum, titanium, indium tin oxide) are stacked in sequence, and the indium tin oxide film layer is located on the surface layer of the connection terminal.

[0090] Figure 1b The top view of the arrangement of the output connection terminal, the input connection terminal and the wire connection terminal in the display panel of the related art is shown, wherein the output connection terminal 25 and the input connection terminal 26 are bonded to the corresponding binding connection terminal (Pad Bump) on the display driver chip 24, and in order to increase the binding integration, the output connection terminal 25 and the input connection terminal 26 are arranged in a staggered manner. The wire connection terminal 27 is arranged in a straight line.

[0091] Figure 1a and Figure 1bThe structural setting of the display panel is that, on the one hand, the display driver chip 24 uses anisotropic conductive glue (i.e., ACF conductive glue) 22 to bind and connect with the output connection terminal 25 and the input connection terminal 26 on the display panel. During binding, the anisotropic conductive glue 22 will be squeezed to flatten the gold ball particles therein to achieve conductive connection. Glue overflow will occur during the squeezing process. The anisotropic conductive glue 22 is easy to overflow to the hot pressing welding surface between the wire 28 and the wire connection terminal 27. The gold ball particles on the hot pressing welding surface will be flattened and conductive, causing a short circuit between adjacent wires 28 or wire connection terminals 27. Therefore, a spacing L of 500μm needs to be reserved between the input connection terminal (Input Pad) 26 and the wire connection terminal (Wire Pad) 27 in the current display panel to tolerate the glue overflow problem. During the mass production of silicon-based OLED display panels, multiple silicon-based OLED display panels are prepared on the same wafer, and each silicon-based OLED display panel is cut from the same wafer. The 500μm spacing L reserved between the input connection terminal (Input Pad) and the wire connection terminal (Wire Pad) in each of the above display panels seriously affects the wafer cutting efficiency (that is, the number of display panels that can be cut from a wafer is small). On the other hand, since the output connection terminal, the input connection terminal and the wire connection terminal are located on the same horizontal plane, the binding of the display driver chip has been completed before the wire binding, so when the aluminum wire is subsequently hot-pressed to bond it with the wire connection terminal, secondary damage will be caused to the already bound display driver chip. On the other hand, since the wire that binds the display panel to the peripheral circuit board is made of aluminum, the wire connection terminal is connected to the wire by hot pressing welding, and the indium tin oxide (ITO) on the surface of the wire connection terminal is difficult to bond with the aluminum wire during the hot pressing process, the binding impedance between the wire connection terminal and the wire is large, and the reliability is unstable.

[0092] In order to solve the above three problems existing in the related art, in the first aspect, the embodiment of the present disclosure provides a display substrate, referring to Figure 2a , is a schematic top view of the structure of the display substrate in an embodiment of the present disclosure; Figure 2b The display substrate in the embodiment of the present disclosure is Figure 2aA structural cross-sectional schematic diagram along the AA' section line; wherein the display substrate has a display area 100 and a binding area 101, the binding area 101 is located on at least one side of the display area 100, and the display substrate includes a substrate 1, which is located in the display area 100 and the binding area 101; a first binding electrode 2 and a second binding electrode 3 are located in the binding area 101 and on the same side of the substrate 1, the first binding electrode 2 is located on the side of the second binding electrode 3 close to the display area 100, and the first binding electrode 2 is configured to be bound and connected with a display driving circuit; the second binding electrode 3 is configured to be bound and connected with a peripheral circuit board; the first binding electrode 2 is electrically connected to the second binding electrode 3; the peripheral circuit board is configured to provide a display signal and a power signal to the display driving circuit; the display driving circuit is configured to provide a display driving signal to the display area 100; a distance h1 between a surface of the first binding electrode 2 on a side away from the substrate 1 and the substrate 1 is greater than a distance h2 between a surface of the second binding electrode 3 on a side away from the substrate 1 and the substrate 1.

[0093] The display driving circuit is a display driving chip (DDIC). The first binding electrode 2 is bound and connected to the display driving circuit through hot pressing anisotropic conductive adhesive (ACF conductive adhesive), and the second binding electrode 3 is bound and connected to the peripheral circuit board through hot pressing welding binding wires.

[0094] In some embodiments, the substrate 1 is made of single crystal silicon, that is, the display substrate is a silicon-based display substrate, which is cut from a wafer, and a wafer can be cut into multiple display substrates. The display substrate can be an AR (Augmented Reality) or VR (Virtual Reality) display substrate. The display substrate can be applied to portable display devices (such as helmets).

[0095] In this embodiment, by making the distance h1 between the side surface of the first binding electrode 2 away from the substrate 1 and the substrate 1 greater than the distance h2 between the side surface of the second binding electrode 3 away from the substrate 1 and the substrate 1, a step height difference is formed between the side surface of the first binding electrode 2 away from the substrate 1 and the side surface of the second binding electrode 3 away from the substrate 1. When the first binding electrode 2 is connected to the display driving circuit by hot-pressing anisotropic conductive adhesive, even if the anisotropic conductive adhesive overflows onto the hot-pressing welding surface of the second binding electrode 3 and the binding connection wire when squeezed, it will not cause a short circuit between adjacent second binding electrodes 3 or binding connection wires, because When the second binding electrode 3 and the binding connection wire are hot-pressed and welded, the gold ball particles in the anisotropic conductive glue will not be flattened, so the anisotropic conductive glue overflowing to the hot-pressed welding surface of the second binding electrode 3 and the binding connection wire will not conduct electricity, so the anisotropic conductive glue overflowing to the hot-pressed welding surface of the second binding electrode 3 and the binding connection wire will not cause a short circuit between adjacent second binding electrodes 3 or adjacent binding connection wires, thereby shortening or eliminating the reserved spacing between the first binding electrode 2 and the second binding electrode 3 for tolerant of overflow glue, thereby reducing the width of the binding area 101 in the direction away from the display area 100, and improving the wafer cutting efficiency. In addition, since there is a step height difference between the side surface of the first binding electrode 2 away from the substrate 1 and the side surface of the second binding electrode 3 away from the substrate 1, when the hot-pressed binding connection wire is bonded to the second binding electrode 3, no secondary damage will be caused to the already bound display driving circuit.

[0096] In some embodiments, the difference between the distance h1 between the side surface of the first binding electrode 2 facing away from the substrate 1 and the substrate 1 and the distance h2 between the side surface of the second binding electrode 3 facing away from the substrate 1 and the substrate 1 is ≥5μm. This distance difference can ensure that the anisotropic conductive glue overflowing onto the hot-pressing welding surface of the second binding electrode 3 and the binding connection wire will not cause a short circuit between adjacent second binding electrodes 3 or adjacent binding connection wires, thereby shortening or eliminating the reserved spacing between the first binding electrode 2 and the second binding electrode 3 for tolerating the overflow of glue, thereby improving the wafer cutting efficiency.

[0097] In some embodiments, the distance L3 between the orthographic projection of the first binding electrode 2 on the substrate 1 and the orthographic projection of the second binding electrode 3 on the substrate 1 is ≥0 and <500 μm. Thus, the reserved spacing between the first binding electrode 2 and the second binding electrode 3 for tolerant of glue overflow can be shortened or eliminated, thereby improving the wafer cutting efficiency.

[0098] In some embodiments, the first binding electrode 2 includes four sub-film layers, which are stacked in sequence. In the direction away from the substrate 1, the materials of the four sub-film layers are titanium, aluminum, titanium, and indium tin oxide in sequence; the material of the second binding electrode 3 includes aluminum. The binding connection wire is an aluminum wire. Since the second binding electrode 3 made of aluminum is soft and has good conductivity, the second binding electrode 3 and the binding connection wire can be easily bonded through hot pressing, and the binding impedance between the second binding electrode 3 and the binding connection wire can be reduced, ensuring stable reliability; at the same time, the second binding electrode 3 made of aluminum can also absorb the stress generated during the hot pressing of the aluminum wire, reducing secondary damage to the display driving circuit during the hot pressing process.

[0099] In some embodiments, reference Figure 2b The first binding electrode 2 and the second binding electrode 3 are located in different layers, and a first insulating layer 4 is further provided between the first binding electrode 2 and the second binding electrode 3. The display substrate further includes a first connecting line 5 and a second connecting line 6. The first connecting line 5 and the second binding electrode 3 are in the same layer and material, and the first connecting line 5 and the orthographic projection of the first binding electrode 2 on the substrate 1 at least partially overlap, and the first connecting line 5 is electrically connected to the first binding electrode 2 through a plurality of first via holes 40 provided in the first insulating layer 4; the second connecting line 6 is located on a side of the second binding electrode 3 close to the substrate 1, and a second insulating layer 7 is further provided between the second connecting line 6, the second binding electrode 3 and the first connecting line 5; the second connecting line 6 and the orthographic projections of the second binding electrode 3 and the first connecting line 5 on the substrate 1 at least partially overlap; the second connecting line 6 is electrically connected to the second binding electrode 3 and the first connecting line 5 respectively through a plurality of second via holes 70 provided in the second insulating layer 7.

[0100] The provision of the plurality of first vias 40 can reduce the connection impedance between the first connection line 5 and the first binding electrode 2. The provision of the plurality of second vias 70 can reduce the connection impedance between the second connection line 6 and the second binding electrode 3 and the connection impedance between the second connection line 6 and the first connection line 5. The provision of the second connection line 6 can realize the electrical connection between the second binding electrode 3 and the first binding electrode 2, so that the display signal and the power supply signal provided by the peripheral circuit board are transmitted to the display driving circuit through the second binding electrode 3 and the first binding electrode 2; at the same time, the provision of the second connection line 6 can also reduce the connection impedance between the second binding electrode 3 and the first binding electrode 2.

[0101] In some embodiments, reference Figure 2c , which is a display substrate along the embodiment of the present disclosure Figure 2aAnother structural cross-sectional schematic diagram of the AA' section line; the first binding electrode 2 and the second binding electrode 3 are located in different layers, and a first insulating layer 4 is further provided between the first binding electrode 2 and the second binding electrode 3, the second binding electrode 3 also extends to the orthographic projection area of ​​the first binding electrode 2 on the substrate 1, and the second binding electrode 3 at least partially overlaps with the orthographic projection of the first binding electrode 2 on the substrate 1, and the second binding electrode 3 is electrically connected to the first binding electrode 2 through a plurality of first vias 40 provided in the first insulating layer 4.

[0102] Among them, the arrangement of the plurality of first vias 40 can reduce the connection impedance between the second binding electrode 3 and the first binding electrode 2. The extended arrangement of the second binding electrode 3 can realize the electrical connection between it and the first binding electrode 2, so that the display signal and the power signal provided by the peripheral circuit board are transmitted to the display driving circuit through the second binding electrode 3 and the first binding electrode 2; at the same time, the extended arrangement of the second binding electrode 3 can also reduce the connection impedance between the second binding electrode 3 and the first binding electrode 2. Furthermore, the extended arrangement of the second binding electrode 3 can further shorten or eliminate the reserved spacing between the first binding electrode 2 and the second binding electrode 3 for tolerating the overflow of glue, thereby improving the wafer cutting efficiency.

[0103] In some embodiments, reference Figure 2c The display substrate also includes a fourth connecting line 8, which is located on a side of the second binding electrode 3 close to the substrate 1, and a second insulating layer 7 is also provided between the fourth connecting line 8 and the second binding electrode 3, and the fourth connecting line 8 and the orthographic projection of the second binding electrode 3 on the substrate 1 at least partially overlap; the fourth connecting line 8 is electrically connected to the second binding electrode 3 through a plurality of third via holes 71 provided in the second insulating layer 7.

[0104] The provision of the plurality of third vias 71 can reduce the connection impedance between the fourth connection line 8 and the second binding electrode 3. The provision of the fourth connection line 8 can reduce the impedance of the second binding electrode 3, thereby further reducing the connection impedance between the fourth connection line 8 and the second binding electrode 3.

[0105] In some embodiments, the first insulating layer 4 and the second insulating layer 7 are both made of inorganic insulating materials, such as silicon nitride, silicon oxide, or silicon oxynitride.

[0106] In some embodiments, reference Figure 2b and Figure 2c The first insulating layer 4 has a first opening 41, which at least partially overlaps with the orthographic projection of the second binding electrode 3 on the substrate 1, and the second binding electrode 3 is exposed at the first opening 41. This facilitates the second binding electrode 3 to be bound and connected to the binding connection wire.

[0107] In some embodiments, reference Figure 3a , is a top view schematic diagram of the arrangement of the first binding electrode and the second binding electrode in the embodiment of the present disclosure, the number of the first binding electrodes 2 is multiple, the number of the second binding electrodes 3 is multiple; the multiple first binding electrodes 2 and the multiple second binding electrodes 3 are electrically connected one by one; the multiple first binding electrodes 2 are arranged along the first direction X; the multiple second binding electrodes 3 are arranged along the first direction X; along the first direction X, the odd-numbered and even-numbered first binding electrodes 2 are staggered; along the first direction X, the odd-numbered and even-numbered second binding electrodes 3 are staggered; the odd-numbered first binding electrodes 2 and the odd-numbered second binding electrodes 3 are arranged along the first direction X to form a first straight line P1; the even-numbered first binding electrodes 2 and the even-numbered second binding electrodes 3 are arranged along the first direction X to form a second straight line P2; the first straight line P1 and the second straight line P2 are parallel to each other.

[0108] Among them, along the first direction X, the odd-numbered and even-numbered first binding electrodes 2 are staggered with each other, which can increase the binding integration of the first binding electrodes 2 on the one hand, and avoid short circuits between adjacent first binding electrodes 2 on the other hand. Along the first direction X, the odd-numbered and even-numbered second binding electrodes 3 are staggered with each other, which can increase the binding integration of the second binding electrodes 3 on the one hand, and avoid short circuits between adjacent second binding electrodes 2 on the other hand.

[0109] In some embodiments, tungsten is filled in the first via hole 40. The tungsten via hole can reduce the connection impedance of the first via hole 40, and can also facilitate subsequent observation and detection of the binding connection between the first binding electrode 2 and the second binding electrode 3.

[0110] In some embodiments, reference Figure 2b and Figure 2c The display substrate further includes a third binding electrode 9, which is located in the binding area 101 and is located on the same side of the substrate 1 as the first binding electrode 2 and the second binding electrode 3. The third binding electrode 9 is located on a side of the first binding electrode 2 close to the display area 100; the third binding electrode 9 does not overlap with the orthographic projections of the first binding electrode 2 and the second binding electrode 3 on the substrate 1; the third binding electrode 9 is configured to be bound and connected to the display driving circuit; the third binding electrode 9 and the first binding electrode 2 are in the same layer and material, and a surface of the third binding electrode 9 facing away from the substrate 1 is flush with a surface of the first binding electrode 2 facing away from the substrate 1.

[0111] The first binding electrode 2 is bound and connected to the input electrode of the display driving circuit, and the third binding electrode 9 is bound and connected to the output electrode of the display driving circuit by hot pressing anisotropic conductive adhesive.

[0112] In some embodiments, reference Figure 2b and Figure 2cThe display substrate also includes an anode 10 and a pixel circuit 11, which are located in the display area 100. The anode 10 is in the same layer and material as the first binding electrode 2 and the third binding electrode 9; the anode 10 is located in the display area 100; the pixel circuit 11 is located in the display area 100 and the binding area 101; the pixel circuit 11 is located between the anode 10 and the substrate 1; the pixel circuit 11 is electrically connected to the anode 10; the display substrate also includes a third connecting line 12, which is located between the third binding electrode 9 and the substrate 1, and the third connecting line 12 extends from the binding area 101 to the display area 100; the third binding electrode 9 is electrically connected to the third connecting line 12, and the third connecting line 12 is electrically connected to the pixel circuit 11.

[0113] The pixel circuit 11 adopts a traditional OLED pixel circuit, and the specific circuit of the pixel circuit 11 is not described in detail here. Figure 2b and Figure 2c The pixel circuit 11 is only schematically represented, and the specific circuit is not drawn. The third connecting line 12 is electrically connected to the third binding electrode 9 through a plurality of tungsten holes. By electrically connecting the third connecting line 12 to the pixel circuit 11, the display driving signal provided by the display driving circuit and the power supply signal provided by the peripheral circuit board can be transmitted to the pixel circuit 11, thereby realizing the driving of the OLED light-emitting element by the pixel circuit 11. The pixel circuit 11 also includes a cathode ring 110 surrounding the display area 100, and the cathode ring 110 is made of the same layer and material as the anode 10. Figure 2b and Figure 2c FIG. 4 shows that the third connecting line 12 is electrically connected to the cathode ring 110 .

[0114] In some embodiments, reference Figure 3b , is a top view schematic diagram of the arrangement of the third binding electrodes in the embodiment of the present disclosure; there are multiple third binding electrodes 9, and the multiple third binding electrodes 9 are arranged in an array, along the arrangement direction Y of the display area 100 and the binding area 101, the positions of any two adjacent rows of third binding electrodes 9 in the array of the third binding electrodes 9 are staggered. Such an arrangement can increase the binding integration of the third binding electrodes 9, and at the same time can improve or avoid short circuits between adjacent third binding electrodes 9.

[0115] In some embodiments, reference Figure 2b and Figure 2c, the display substrate also includes an electrostatic ring 13, which surrounds the periphery of the display area 100, part of the electrostatic ring 13 is located in the binding area 101, and part of the electrostatic ring 13 located in the binding area 101 is located on the side of the second binding electrode 3 away from the display area 100, and the electrostatic ring 13 includes a first electrode line 131 and a second electrode line 132, the first electrode line 131 and the second binding electrode 3 are in the same layer and material, the second electrode line 132 is located on the side of the first electrode line 131 close to the substrate 1, the second electrode line 132 is electrically connected to the first electrode line 131, and the second electrode line 132 is grounded. The first electrode line 131 and the second electrode line 132 together constitute the electrostatic ring 13, which can reduce the grounding impedance of the electrostatic ring 13, so that the electrostatic ring can conduct static electricity well and protect the display substrate from being damaged by static electricity. In addition, the electrostatic ring can also prevent cracks from entering the interior of the display substrate when cutting the wafer to form the display substrate, thereby protecting the display substrate. When the wafer is cut to form the display substrate, the cutting is performed from the side of the electrostatic ring 13 away from the display area 100.

[0116] In some embodiments, reference Figure 2b , along the arrangement direction Y of the display area 100 and the binding area 101, the distance L1 between the third binding electrode 9 and the display area 100 is ≥2mm; this distance can ensure the safety of the anisotropic conductive adhesive during hot pressing, and will not affect and damage the display area 100; the distance L2 between the side boundary of the third binding electrode 9 close to the display area 100 and the side boundary of the first binding electrode 2 away from the display area 100 is ≥2mm; the distance L4 between the side boundary of the second binding electrode 3 close to the display area 100 and the side boundary thereof away from the display area 100 is ≥100μm; the distance L5 between the side boundary of the second binding electrode 3 away from the display area 100 and the side boundary of the electrostatic ring 13 away from the display area 100 is ≥40μm.

[0117] The display substrate provided by the embodiment of the present disclosure makes the distance between the side surface of the first binding electrode away from the substrate and the substrate greater than the distance between the side surface of the second binding electrode away from the substrate and the substrate, so that there is a step height difference between the side surface of the first binding electrode away from the substrate and the side surface of the second binding electrode away from the substrate. When the first binding electrode is connected to the display driving circuit by hot-pressing anisotropic conductive adhesive, even if the anisotropic conductive adhesive overflows onto the hot-pressing welding surface of the second binding electrode and the binding connection wire when squeezed, it will not cause a short circuit between adjacent second binding electrodes or binding connection wires. Because the gold ball particles in the anisotropic conductive glue will not be flattened during the hot-pressing welding of the second binding electrode and the binding connection wire, the anisotropic conductive glue overflowing onto the hot-pressing welding surface of the second binding electrode and the binding connection wire will not conduct electricity, so the anisotropic conductive glue overflowing onto the hot-pressing welding surface of the second binding electrode and the binding connection wire will not cause a short circuit between adjacent second binding electrodes or adjacent binding connection wires, thereby shortening or eliminating the reserved spacing between the first binding electrode and the second binding electrode for tolerating the overflow of glue, thereby reducing the width of the binding area in the direction away from the display area and improving the wafer cutting efficiency. In addition, since there is a step height difference between the side surface of the first binding electrode away from the substrate and the side surface of the second binding electrode away from the substrate, when the hot-pressing bonding connection wire is bonded to the second binding electrode, no secondary damage will be caused to the already bound display driving circuit.

[0118] In a second aspect, an embodiment of the present disclosure further provides a display panel, comprising the display substrate in the above embodiment.

[0119] In some embodiments, reference Figure 4a , is a schematic cross-sectional view of a local structure of a display panel in an embodiment of the present disclosure; Figure 4b It is a schematic cross-sectional view of a local structure of another display panel in an embodiment of the present disclosure; wherein, the display panel further comprises a third insulating layer 14, a pixel defining layer 15 and an encapsulation layer 16, the third insulating layer 14, the pixel defining layer 15 and the encapsulation layer 16 respectively extend from the display area 100 to the binding area 101, and the third insulating layer 14, the pixel defining layer 15 and the encapsulation layer 16 are sequentially stacked on the side of the first binding electrode 2 in the display substrate away from the substrate 1; the third insulating layer 14, the pixel defining layer 15 and the encapsulation layer 16 are provided with a second opening 17 in the area corresponding to the first binding electrode 2 and the third binding electrode 9, and the first binding electrode 2 and the third binding electrode 9 are exposed at the second opening 17; the third insulating layer 14, the pixel defining layer 15 and the encapsulation layer 16 are provided with a third opening 18 in the area corresponding to the second binding electrode 3, the third opening 18 overlaps with the orthographic projection of the first opening 41 in the display substrate on the substrate 1, and the second binding electrode 3 is exposed in the overlapping area of ​​the orthographic projection of the third opening 18 and the first opening 41.

[0120] In some embodiments, reference Figure 4a , Figure 4b and Figure 4c , Figure 4c It is a schematic cross-sectional view of the local structure of the display area of ​​the display panel in the embodiment of the present disclosure; a fourth opening is opened in the portion of the third insulating layer 14 and the pixel defining layer 15 located in the display area 100, and the anode 10 in the display substrate is exposed at the fourth opening; the display panel also includes a light-emitting functional layer 19 and a cathode layer 20, which are sequentially stacked on the side of the anode 10 in the display substrate away from the substrate 1, and the light-emitting functional layer 19 and the cathode layer 20 are located between the anode 10 and the encapsulation layer 16; the light-emitting functional layer 19 is located in the fourth opening, and the cathode layer 20 covers the entire display area 100, and extends from the display area 100 to the binding area 101, and contacts and is electrically connected to the cathode ring 110 located in the binding area 101. The anode 10, the light-emitting functional layer 19 and the cathode layer 20 at the fourth opening are sequentially stacked to form an OLED light-emitting element, which emits light under the drive of the pixel circuit 11, and the encapsulation layer 16 encapsulates the OLED light-emitting element.

[0121] In some embodiments, reference Figure 4a and Figure 4b , along the arrangement direction Y of the display area 100 and the binding area 101, the opening width of the second opening 17 is the distance L2 between the side boundary of the third binding electrode 9 close to the display area 100 and the side boundary of the first binding electrode 2 away from the display area 100. That is, the orthographic projections of the first binding electrode 2 and the third binding electrode 9 on the display substrate are both located in the orthographic projection area of ​​the second opening 17 on the display substrate, and the second opening 17 is used for binding the display driving circuit.

[0122] In some embodiments, reference Figure 4a and Figure 4b The display panel also includes a display driving circuit 21, which is located on a side of the encapsulation layer 16 away from the display substrate, and the display driving circuit 21 is located at the second opening 17, and the input electrode of the display driving circuit 21 is bound and electrically connected to the first binding electrode 2 through an anisotropic conductive adhesive 22; the output electrode of the display driving circuit 21 is bound and electrically connected to the third binding electrode 9 through the anisotropic conductive adhesive 22.

[0123] In some embodiments, reference Figure 4a and Figure 4bThe display panel further includes a peripheral circuit board (not shown in the figure), which is located outside the display substrate. The second binding electrode 3 is welded to one end of the binding connection wire 23 at the overlapping position of the orthographic projection of the third opening 18 and the first opening 41, and the other end of the binding connection wire 23 is welded to the binding electrode of the peripheral circuit board. That is, the second binding electrode 3 is bound and connected to the peripheral circuit board through the binding connection wire 23.

[0124] In some embodiments, there are multiple binding connection wires 23, each binding connection wire 23 electrically connects a second binding electrode 3 and a binding electrode of the peripheral circuit board; the multiple binding connection wires 23 are wrapped with protective glue (not shown in the figure), and the protective glue can insulate adjacent binding connection wires 23 from each other.

[0125] In some embodiments, the material of the binding connection wire 23 includes aluminum. Since the second binding electrode 3 made of aluminum is soft and has good conductivity, the second binding electrode 3 and the binding connection wire 23 can be easily bonded by hot pressing, and the binding impedance between the second binding electrode 3 and the binding connection wire 23 can be reduced to ensure stable reliability.

[0126] The display panel provided by the embodiment of the present disclosure adopts the display substrate in the above embodiment. On the one hand, it is possible to shorten or eliminate the reserved spacing between the first binding electrode and the second binding electrode for tolerating glue overflow, thereby reducing the width of the binding area in the direction away from the display area and improving the wafer cutting efficiency; on the other hand, when the hot-pressing binding connection wire is bonded to the second binding electrode, no secondary damage will be caused to the already bound display driving circuit; on the other hand, the second binding electrode and the binding connection wire can be easily bonded by hot pressing, and the binding impedance between the second binding electrode and the binding connection wire can be reduced, ensuring stable reliability.

[0127] The display panel provided in the embodiments of the present disclosure may be an OLED panel, a Micro OLED panel, an OLED TV, an OLED billboard, a display, a mobile phone, a navigator, or any other product or component with a display function.

[0128] In a third aspect, the present disclosure also provides a method for preparing the above-mentioned display panel, referring to Figure 5a , Figure 5b , Figure 5c , Figure 5d and Figure 5e , Figure 5a It is a schematic cross-sectional view of the structure after the display panel is prepared in step S101 in the embodiment of the present disclosure; Figure 5b It is a schematic cross-sectional view of the structure after the display panel is prepared in step S102 in the embodiment of the present disclosure; Figure 5cIt is a schematic cross-sectional view of the structure after the display panel is prepared in step S103 in the embodiment of the present disclosure; Figure 5d It is a schematic cross-sectional view of the structure after the display panel is prepared in step S104 in the embodiment of the present disclosure; Figure 5e It is a schematic cross-sectional view of the structure after the display panel is prepared in step S105 in the embodiment of the present disclosure; wherein, the method for preparing the display panel includes: step S101: preparing a display substrate.

[0129] In this step, the preparation of each film layer in the display substrate adopts a conventional process, which will not be described here. It should be noted that after the display substrate is prepared, the first opening 41 can be opened in the first insulating layer 4, or after the display substrate is prepared, the first opening 41 can also be not opened in the first insulating layer 4, and the first opening 41 is opened in the first insulating layer 4 in the subsequent step S103.

[0130] Step S102: Prepare a third insulating layer 14, a pixel defining layer 15 and an encapsulation layer 16 in sequence on one side of the display substrate, form a second opening 17 in the third insulating layer 14, the pixel defining layer 15 and the encapsulation layer 16 through a single etching process, and expose the first binding electrode 2 and the third binding electrode 3 in the display substrate at the second opening 17.

[0131] In this step, the second opening 17 is formed in the third insulating layer 14 , the pixel defining layer 15 and the encapsulation layer 16 by a single dry etching process.

[0132] Step S103: forming the third opening 18 in the third insulating layer 14, the pixel defining layer 15 and the encapsulation layer 16 and the first opening 41 in the first insulating layer of the display substrate through another etching process, and the second binding electrode 3 in the display substrate is exposed in the overlapping area of ​​the orthographic projection of the third opening 18 and the first opening 41.

[0133] In this step, the third opening 18 in the third insulating layer 14 , the pixel defining layer 15 and the encapsulation layer 16 and the first opening 41 in the first insulating layer of the display substrate are formed by a single dry etching process.

[0134] Step S104 : the input electrode of the display driving circuit 21 is electrically connected to the first binding electrode 2 by means of the hot pressing anisotropic conductive adhesive 22 , and the output electrode of the display driving circuit 21 is electrically connected to the third binding electrode 9 by means of the hot pressing anisotropic conductive adhesive 22 .

[0135] In this step, the gold sphere particles in the anisotropic conductive adhesive 22 on the bonding electrode pressing surface are flattened to conduct electricity, while the gold sphere particles in the anisotropic conductive adhesive 22 outside the bonding electrode pressing surface are not flattened and thus do not conduct electricity.

[0136] Step S105: connecting the other end of the binding connection wire 23 , one end of which is welded to the binding electrode of the peripheral circuit board, to the second binding electrode 3 by thermal compression welding.

[0137] In this step, the anisotropic conductive adhesive 22 may overflow onto the hot-press welding surface between the second binding electrode 3 and the binding connecting wire 23, but the gold ball particles in the anisotropic conductive adhesive 22 will not be flattened during the hot-press welding, so that the anisotropic conductive adhesive 22 will not conduct electricity, thereby avoiding the overflow of the adhesive causing a short circuit between the adjacent binding connecting wire 23 and the adjacent second binding electrode 3.

[0138] In this embodiment, other structures and film layers of the display panel are prepared using traditional processes, which will not be described in detail here.

[0139] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display substrate, comprising a display area and a binding area, wherein the binding area is located at least on one side of the periphery of the display area. It is characterized in that The display substrate comprises a base located in the display area and the binding area; The first binding electrode and the second binding electrode are located in the binding area and on the same side of the substrate, and the first binding electrode is located on a side of the second binding electrode close to the display area. The first binding electrode is configured to be bound and connected to a display driving circuit; the second binding electrode is configured to be bound and connected to a peripheral circuit board; the first binding electrode is electrically connected to the second binding electrode; The peripheral circuit board is configured to provide a display signal and a power signal to the display driving circuit; the display driving circuit is configured to provide a display driving signal to the display area; A distance between a surface of the first binding electrode facing away from the substrate and the substrate is greater than a distance between a surface of the second binding electrode facing away from the substrate and the substrate.

2. The display substrate according to claim 1, characterized in that: A difference between a distance between a surface of the first binding electrode facing away from the substrate and the substrate and a distance between a surface of the second binding electrode facing away from the substrate and the substrate is ≥5 μm.

3. The display substrate according to claim 1, characterized in that: A distance between an orthographic projection of the first binding electrode on the substrate and an orthographic projection of the second binding electrode on the substrate is ≥0 and <500 μm.

4. The display substrate according to any one of claims 1 to 3, characterized in that: The first binding electrode comprises four sub-film layers, the four sub-film layers are stacked in sequence, and along a direction away from the substrate, the materials of the four sub-film layers are titanium, aluminum, titanium, and indium tin oxide in sequence; The material of the second binding electrode includes aluminum.

5. The display substrate according to claim 4, characterized in that: The first binding electrode and the second binding electrode are located in different layers, and a first insulating layer is further provided between the first binding electrode and the second binding electrode. The display substrate further includes a first connecting line and a second connecting line. The first connecting line and the second binding electrode are formed in the same layer and made of the same material, the first connecting line and the first binding electrode's orthographic projection on the substrate at least partially overlap, and the first connecting line is electrically connected to the first binding electrode through a plurality of first via holes provided in the first insulating layer; The second connecting line is located at a side of the second binding electrode close to the substrate, and a second insulating layer is further provided between the second connecting line, the second binding electrode and the first connecting line; The second connecting line at least partially overlaps with the orthographic projections of the second binding electrode and the first connecting line on the substrate; The second connection wires are electrically connected to the second binding electrodes and the first connection wires respectively through a plurality of second via holes opened in the second insulating layer.

6. The display substrate according to claim 4, characterized in that: The first binding electrode and the second binding electrode are located in different layers, and a first insulating layer is further provided between the first binding electrode and the second binding electrode. The second binding electrode also extends to the orthographic projection area of ​​the first binding electrode on the substrate, and the orthographic projection of the second binding electrode and the first binding electrode on the substrate at least partially overlap, The second binding electrode is electrically connected to the first binding electrode through a plurality of first via holes opened in the first insulating layer.

7. The display substrate according to claim 5 or 6, characterized in that: A first opening is formed in the first insulating layer, and the first opening at least partially overlaps with an orthographic projection of the second binding electrode on the substrate. The second binding electrode is exposed at the first opening.

8. The display substrate according to claim 5 or 6, characterized in that: The number of the first binding electrodes is multiple, and the number of the second binding electrodes is multiple; the multiple first binding electrodes and the multiple second binding electrodes are electrically connected in a one-to-one correspondence; A plurality of the first binding electrodes are arranged along a first direction; A plurality of the second binding electrodes are arranged along the first direction; Along the first direction, odd-numbered and even-numbered first binding electrodes are staggered with each other; Along the first direction, odd-numbered and even-numbered second binding electrodes are staggered with each other; An odd number of the first binding electrodes and an odd number of the second binding electrodes are arranged in a first straight line along the first direction; An even number of the first binding electrodes and an even number of the second binding electrodes are arranged in a second straight line along the first direction; The first straight line and the second straight line are parallel to each other.

9. The display substrate according to claim 5 or 6, characterized in that: The first via hole is filled with tungsten.

10. The display substrate according to claim 1, characterized in that: It also includes a third binding electrode, which is located in the binding area and is located on the same side of the substrate as the first binding electrode and the second binding electrode, and the third binding electrode is located on a side of the first binding electrode close to the display area; The third binding electrode does not overlap with the orthographic projections of the first binding electrode and the second binding electrode on the substrate; The third binding electrode is configured to be bound and connected to the display driving circuit; The third binding electrode is made of the same layer and material as the first binding electrode, and a surface of the third binding electrode facing away from the substrate is flush with a surface of the first binding electrode facing away from the substrate.

11. The display substrate according to claim 10, characterized in that: It also includes an anode and a pixel circuit, wherein the anode is located in the display area; the pixel circuit is located in the display area and the binding area; The anode is in the same layer and made of the same material as the first binding electrode and the third binding electrode; The pixel circuit is located between the anode and the substrate; the pixel circuit is electrically connected to the anode; The display substrate further includes a third connection line located between the third binding electrode and the substrate, and the third connection line extends from the binding area to the display area; The third binding electrode is electrically connected to the third connection line, and the third connection line is electrically connected to the pixel circuit.

12. The display substrate according to claim 11, characterized in that: The number of the third binding electrodes is multiple, and the multiple third binding electrodes are arranged in an array. Along the arrangement direction of the display area and the binding area, positions of the third binding electrodes in any two adjacent rows in the array of the third binding electrodes are staggered.

13. The display substrate according to claim 12, characterized in that: It also includes an electrostatic ring surrounding the periphery of the display area, Part of the electrostatic ring is located in the binding area, and part of the electrostatic ring located in the binding area is located on a side of the second binding electrode away from the display area. The electrostatic ring includes a first electrode line and a second electrode line, the first electrode line and the second binding electrode are in the same layer and made of the same material, The second electrode line is located on a side of the first electrode line close to the substrate, the second electrode line is electrically connected to the first electrode line, and the second electrode line is grounded.

14. The display substrate according to claim 13, characterized in that: Along the arrangement direction of the display area and the binding area, the distance between the third binding electrode and the display area is ≥2 mm; The distance between a side boundary of the third binding electrode close to the display area and a side boundary of the first binding electrode away from the display area is ≥ 2 mm; The distance between a side boundary of the second binding electrode close to the display area and a side boundary of the second binding electrode away from the display area is ≥ 100 μm; A distance between a side boundary of the second binding electrode away from the display area and a side boundary of the electrostatic ring away from the display area is ≥40 μm.

15. A display panel, characterized in that: A display substrate comprising any one of claims 1-14.

16. The display panel according to claim 15, characterized in that: It also includes a third insulating layer, a pixel defining layer and an encapsulation layer, The third insulating layer, the pixel defining layer and the encapsulation layer extend from the display area to the binding area respectively, and the third insulating layer, the pixel defining layer and the encapsulation layer are sequentially stacked on a side of the first binding electrode in the display substrate away from the base; The third insulating layer, the pixel defining layer and the encapsulation layer are provided with second openings in regions corresponding to the first binding electrode and the third binding electrode, and the first binding electrode and the third binding electrode are exposed at the second openings; The third insulating layer, the pixel defining layer and the encapsulation layer have a third opening in an area corresponding to the second binding electrode, the third opening overlaps with the orthographic projection of the first opening in the display substrate on the base, and the second binding electrode is exposed in the overlapping area of ​​the orthographic projection of the third opening and the first opening.

17. The display panel according to claim 16, characterized in that: Along the arrangement direction of the display area and the binding area, the opening width of the second opening is the distance between a side boundary of the third binding electrode close to the display area and a side boundary of the first binding electrode away from the display area.

18. The display panel according to claim 17, characterized in that: Also includes a display driver circuit, The display driving circuit is located on a side of the packaging layer away from the display substrate, and the display driving circuit is located at the second opening. The input electrode of the display driving circuit is bound and electrically connected to the first binding electrode through anisotropic conductive adhesive; and the output electrode of the display driving circuit is bound and electrically connected to the third binding electrode through the anisotropic conductive adhesive.

19. The display panel according to claim 18, characterized in that: It also includes a peripheral circuit board, which is located outside the display substrate. The second binding electrode is welded to one end of a binding connection wire at a position where the orthographic projections of the third opening and the first opening overlap, and the other end of the binding connection wire is welded to a binding electrode of the peripheral circuit board.

20. The display panel according to claim 19, characterized in that: The number of the binding connection wires is multiple, Each of the binding connection wires electrically connects one of the second binding electrodes and one of the binding electrodes on the peripheral circuit board; The outer peripheries of the plurality of binding connection wires are wrapped with protective glue, and the protective glue can insulate adjacent binding connection wires from each other.

21. The display panel according to claim 20, characterized in that: The material of the binding connection wires includes aluminum.

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