Stable-grabbing scratch-proof wafer carrying arm

By designing a wafer handling arm including cantilever, handling disc, pneumatic rod and clamping ring, the problem of scratches and drops in the prior art is solved, stable fixation and protection of the wafer is achieved, and processing efficiency and use efficiency are improved.

CN222570815UActive Publication Date: 2025-03-07SUZHOU YIJIA NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202420602133.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-27
Publication Date
2025-03-07
Estimated Expiration
2034-03-27

AI Technical Summary

Technical Problem

During use, existing wafer handling arms are likely to cause greater friction between wafers, resulting in scratches on the wafer surface, affecting subsequent processing, and lacking effective protective structures, which leads to wafers falling off and reducing usage efficiency.

Method used

A wafer handling arm that is stable and scratch-proof is designed, adopts mounting cantilever and grabbing components, including handling discs, movable connecting plates, air pumps, suction nozzles, wedge mesh, pneumatic rods, clamping rings and limit slots. The suction force is generated by the pump and the pneumatic rods drive the clamping ring limit clamping to ensure stable fixation and protection of the wafer.

Benefits of technology

It effectively avoids scratches on the wafer surface, improves the subsequent processing efficiency of the wafer, ensures the stability and safety of the wafer during the handling process, and improves the practicality and use efficiency of the handling arm.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a stable gripping scratch-proof wafer handling arm, relates to wafer processing technical field, including mounting cantilever and gripping subassembly, mounting cantilever rear end middle part is equipped with mounting through-hole, mounting cantilever front end is equipped with protection disc, protection disc upper end is equipped with gripping subassembly, and mounting cantilever rear end middle part is equipped with the mounting through-hole through-hole, and the gripping subassembly is equipped with the mounting through-hole through-hole through-hole through-hole through-hole through-hole through-hole through-hole through-hole through-hole through-hole through-hole. The grabbing assembly comprises a carrying disc, a movable connecting plate, an air extracting pump, an air suction nozzle, a wedge-shaped net, a pneumatic rod, a clamping ring and a limiting groove, the movable connecting plate is installed at the lower end of the carrying disc, the air extracting pump is installed at the upper end of the carrying disc, the air suction nozzle is connected to the front end of the air extracting pump, and meanwhile the wedge-shaped net is additionally arranged at the front end of the air suction nozzle. According to the stable-grabbing scratch-proof wafer carrying arm, through the arrangement of the grabbing assembly, the problem that follow-up machining of wafers is affected due to the fact that the surfaces of the wafers are prone to being scratched due to the fact that large friction force is easily generated between the wafers in most carrying arms is solved, and the overall practicability of the carrying arm is conveniently improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer transport arm capable of stably grasping and preventing scratches. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. In the production line of automated wafer processing, it is necessary to move the wafer from one processing equipment to another, or move the wafer from the tray to the processing equipment. Therefore, it is necessary to set up a wafer handling robot arm in the assembly line. In order to improve the efficiency of wafer processing, a handling arm is needed, but the existing handling arm still has the following shortcomings:

[0003] For example, the utility model with application number 202221093012.X discloses the technical field of robotic arms for semiconductor wafer processing. The suction force on the upper part of the wafer of the utility model and the auxiliary upward blowing and lifting force on the lower part cooperate to avoid the influence of the swaying force generated during the swing of the main arm on the transportation of the wafer to the greatest extent, eliminate the occurrence of accidental falling of the wafer, and ensure the stability and reliability of the wafer during transportation using the robotic arm. However, similar to the prior art of the above-mentioned application, when the existing handling arms are used, most of the handling arms are prone to generate large friction between the wafers, which makes the surface of the wafer prone to scratches, thereby affecting the subsequent processing of the wafer, resulting in reduced practicality of the handling arms and reduced utilization efficiency.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a wafer handling arm with stable grasping and scratch resistance is proposed. Utility Model Content

[0005] The utility model aims to provide a wafer handling arm that can stably grasp and prevent scratches, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a stable grasping and scratch-resistant wafer transport arm, comprising a mounting cantilever and a gripping assembly, a mounting through hole is opened in the middle of the rear end of the mounting cantilever, and a protective plate is arranged at the front end of the mounting cantilever, a gripping assembly is arranged at the upper end of the protective plate, and the gripping assembly comprises a transport plate, a movable connecting plate, an air pump, an air suction nozzle, a wedge-shaped net, a pneumatic rod, a clamping ring and a limit groove, a movable connecting plate is installed at the lower end of the transport plate, and an air pump is installed at the upper end of the transport plate, and the front end of the air pump is connected to the air suction nozzle, and a wedge-shaped net is additionally provided at the front end of the air suction nozzle, a pneumatic rod is installed inside the transport plate, and a clamping ring is installed below the front end of the pneumatic rod, a limit groove is opened at the front end of the transport plate, and a transport assembly is arranged at the upper end of the mounting cantilever.

[0007] Furthermore, the transport plate and the movable connecting plate are vertically distributed, and the transport plate and the movable connecting plate are threadedly connected.

[0008] Furthermore, the pneumatic rods are evenly distributed at the four corners inside the transport plate, and the pneumatic rods are threadedly connected to the transport plate.

[0009] Furthermore, the clamping ring is embedded in the limiting groove, and the clamping ring is slidably connected to the limiting groove via a pneumatic rod.

[0010] Furthermore, the transport assembly includes a servo motor, a screw rod and a movable block. The front end of the servo motor is connected to the screw rod, and the outside of the screw rod is connected to the movable block.

[0011] Furthermore, the transport assembly also includes a limiting through hole, a first limiting rod and a second limiting rod, and limiting through holes are opened on both sides of the movable block. At the same time, the first limiting rod is connected to the left side of the movable block, and the second limiting rod is connected to the right side of the movable block.

[0012] Furthermore, the limiting through holes are cylindrical in shape, and are symmetrically arranged on both sides of the movable block.

[0013] Furthermore, the outer dimension of the first limiting rod matches the inner dimension of the limiting through hole, and the first limiting rod is embeddedly connected with the movable block through the limiting through hole.

[0014] The utility model provides a wafer handling arm that can stably grasp and prevent scratches, and has the following beneficial effects:

[0015] 1. The utility model can stably grasp the anti-scratch wafer handling arm by setting the grabbing component, and use the grabbing component set on the upper end of the protective plate to avoid the problem that most handling arms are prone to generate large friction between wafers, which causes scratches on the wafer surface, thereby affecting the subsequent processing of the wafer and causing the practicality of the handling arm to decrease. The vacuum pump is fixedly installed in the middle of the upper end of the handling plate through fasteners. The vacuum pump generates suction at the suction nozzle to suck up the wafer to be transported, and cooperates with the wedge-shaped net added at the front end of the suction nozzle to avoid Dust in the air enters the vacuum pump, thereby further extending the service life of the vacuum pump. The pneumatic rod is fixedly installed at the four corners of the inside of the conveying plate using fasteners, and the clamping ring is fixedly installed at the bottom of the front end of the pneumatic rod with the help of fasteners. The operation of the pneumatic rod drives the clamping ring to move forward, so that the clamping ring limits the outside of the wafer, and the limiting groove opened at the lower end of the conveying plate limits the outside of the clamping ring, thereby increasing the stability of the clamping ring during movement. At the same time, the clamping rings at the four corners facilitate better fixation of the wafer, further increasing the efficiency of subsequent wafer processing.

[0016] 2. The utility model can stably grasp the anti-scratch wafer handling arm when using it through the setting of the handling component. By installing the handling component set on the upper end of the cantilever, it can avoid the situation that most handling arms do not have a certain protective structure, which makes it easy for the wafer to fall from the handling arm during the handling process, resulting in a decrease in the use efficiency of the handling arm. The servo motor is fixedly installed on the rear side of the upper end of the cantilever. The output shaft of the servo motor is connected to the lead screw through a coupling. The operation of the servo motor drives the lead screw to rotate, so that the movable block connected to the outside of the lead screw rotates accordingly, and the limit through holes opened on both sides of the movable block The internal dimensions of the first limit rod and the second limit rod on both sides of the outside of the screw rod match the external dimensions of the first limit rod and the second limit rod on both sides of the outside of the screw rod, and then the first limit rod cooperates with the second limit rod to make the movable block slide along with it on the upper end of the mounting cantilever when the screw rod rotates, and the movable connecting plate and the movable block are fixedly installed by tightening bolts, and then the movable connecting plate is driven to move when the movable block moves, thereby changing the use position of the transport plate, so that the transport plate is moved above the protective plate, and the transport plate is supported and protected by the protective plate, so as to prevent the wafer from falling and being damaged from the inside of the transport plate during the transport process, and further increase the use efficiency of the transport arm. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall top view structure of a wafer handling arm that can stably grasp and prevent scratches according to the utility model;

[0018] Figure 2 It is a front cross-sectional structural schematic diagram of a transport plate of a wafer transport arm that stably grasps and prevents scratches according to the utility model;

[0019] Figure 3It is a schematic diagram of the three-dimensional structure of a clamping ring of a wafer handling arm for stably grasping and scratch-resistant wafers according to the utility model.

[0020] In the figure: 1. Mounting cantilever; 2. Mounting through hole; 3. Protective plate; 4. Grabbing assembly; 401. Transport plate; 402. Active connecting plate; 403. Vacuum pump; 404. Suction nozzle; 405. Wedge net; 406. Pneumatic rod; 407. Clamping ring; 408. Limiting groove; 5. Transport assembly; 501. Servo motor; 502. Screw rod; 503. Movable block; 504. Limiting through hole; 505. First limiting rod; 506. Second limiting rod. DETAILED DESCRIPTION

[0021] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0022] like Figures 1 to 3As shown, a wafer handling arm with stable grasping and scratch resistance includes a mounting cantilever 1 and a grasping assembly 4, a mounting through hole 2 is opened in the middle of the rear end of the mounting cantilever 1, and a protective plate 3 is arranged at the front end of the mounting cantilever 1, and a grasping assembly 4 is arranged at the upper end of the protective plate 3, and the grasping assembly 4 includes a handling plate 401, an active connecting plate 402, an air pump 403, an air suction nozzle 404, a wedge-shaped net 405, a pneumatic rod 406, a clamping ring 407 and a limiting groove 408, a movable connecting plate 402 is installed at the lower end of the handling plate 401, and a protective plate 306 is arranged at the upper end of the handling plate 401. An air pump 403 is installed, and an air suction nozzle 404 is connected to the front end of the air suction nozzle 404. At the same time, a wedge-shaped net 405 is added to the front end of the air suction nozzle 404. A pneumatic rod 406 is installed inside the handling plate 401, and a clamping ring 407 is installed below the front end of the pneumatic rod 406. A limiting groove 408 is provided at the front end of the handling plate 401. The handling plate 401 and the movable connecting plate 402 are distributed vertically, and the handling plate 401 and the movable connecting plate 402 are threadedly connected. The pneumatic rods 406 are equidistantly distributed at the four corners of the handling plate 401, and the pneumatic rods 406 are connected to the handling plate 401. The transport plate 401 is threadedly connected, the clamping ring 407 is embeddedly connected with the limiting groove 408, and the clamping ring 407 is slidably connected with the limiting groove 408 through the pneumatic rod 406. The vacuum pump 403 is fixedly installed in the middle of the upper end of the transport plate 401 through fasteners. The vacuum pump 403 is operated to generate suction at the suction nozzle 404 to suck up the wafer to be transported, and cooperate with the wedge-shaped net 405 added at the front end of the suction nozzle 404 to prevent dust in the air from entering the interior of the vacuum pump 403, thereby further extending the service life of the vacuum pump 403. The pneumatic rod 406 is fastened with fasteners. Rod 406 is fixedly installed at the four corners of the inside of the transport plate 401, and the clamping ring 407 is fixedly installed at the bottom of the front end of the pneumatic rod 406 with the fasteners. The operation of the pneumatic rod 406 drives the clamping ring 407 to move forward, so that the clamping ring 407 limits the outer side of the wafer, and the limiting groove 408 opened at the lower end of the transport plate 401 limits the outer side of the clamping ring 407, thereby increasing the stability of the clamping ring 407 during movement. At the same time, the clamping rings 407 at the four corners are convenient for better fixing the wafer, further increasing the efficiency of subsequent wafer processing;

[0023] like Figure 1As shown, a transport assembly 5 is provided at the upper end of the mounting cantilever 1, and the transport assembly 5 includes a servo motor 501, a screw rod 502 and a movable block 503. The front end of the servo motor 501 is connected to the screw rod 502, and the outer part of the screw rod 502 is connected to the movable block 503. The transport assembly 5 also includes a limiting through hole 504, a first limiting rod 505 and a second limiting rod 506, and the limiting through holes 504 are provided on both sides of the movable block 503, and the left side of the movable block 503 is connected to the first limiting rod 506. The second limiting rod 506 is connected to the right side of the movable block 503, the limiting through hole 504 is cylindrical, and the limiting through holes 504 are symmetrically arranged on both sides of the movable block 503, the outer size of the first limiting rod 505 matches the inner size of the limiting through hole 504, and the first limiting rod 505 is embedded with the movable block 503 through the limiting through hole 504, the servo motor 501 is fixedly mounted on the rear side of the upper end of the mounting cantilever 1, and the output shaft of the servo motor 501 The screw rod 502 is connected through a coupling, and the servo motor 501 drives the screw rod 502 to rotate, so that the movable block 503 connected to the outside of the screw rod 502 rotates accordingly, and the internal dimensions of the limiting through holes 504 opened on both sides of the movable block 503 match the external dimensions of the first limiting rod 505 and the second limiting rod 506 on both sides of the outside of the screw rod 502, and then the first limiting rod 505 cooperates with the second limiting rod 506 to make the movable block 503 slide on the upper end of the mounting cantilever 1 when the screw rod 502 rotates, and the movable connecting plate 402 and the movable block 503 are fixedly installed by tightening bolts, and then the movable connecting plate 402 is driven to move when the movable block 503 moves, thereby changing the use position of the transport plate 401, so that the transport plate 401 moves above the protective plate 3, and the transport plate 401 is supported and protected by the protective plate 3, so as to prevent the wafer from falling and being damaged from the inside of the transport plate 401 during the transport process, thereby further increasing the use efficiency of the transport arm.

[0024] In summary, the wafer handling arm for stable grasping and scratch-resistant wafer handling, when in use, is installed with the handling arm and the equipment through the installation through hole 2 opened in the middle part of the rear end of the mounting cantilever 1, and the servo motor 501 is fixedly installed on the rear side of the upper end of the mounting cantilever 1, and the operation of the servo motor 501 drives the screw rod 502 to rotate, so that the movable block 503 connected to the outside of the screw rod 502 rotates accordingly, and the internal dimensions of the limiting through holes 504 opened on both sides of the movable block 503 match the external dimensions of the first limiting rod 505 and the second limiting rod 506 on both sides of the outside of the screw rod 502, and then, through the first limiting rod 505 and the second limiting rod 506, when the screw rod 502 rotates, the movable block 503 slides on the upper end of the mounting cantilever 1, and the movable connecting plate 402 and the movable block 503 are fixedly installed by tightening bolts, and then, when the movable block 503 moves, the movable connecting plate 402 is driven to move, thereby changing the use position of the handling plate 401, so that the handling plate 401 moves to the top of the protective plate 3, and the protective plate 3 is used to The transport tray 401 is supported and protected to prevent the wafer from falling and being damaged from the inside of the transport tray 401 during transport. Then, the vacuum pump 403 is fixedly installed in the middle of the upper end of the transport tray 401 through fasteners. The vacuum pump 403 is operated to generate suction at the suction nozzle 404 to suck up the wafer to be transported, and the wedge-shaped net 405 added at the front end of the suction nozzle 404 is used to prevent dust in the air from entering the inside of the vacuum pump 403. The pneumatic rod 406 is fixedly installed in the transport tray 401 by fasteners. The pneumatic rod 406 is operated to drive the clamping ring 407 to move forward, so that the clamping ring 407 can limit the outer side of the wafer, and the limiting groove 408 opened at the lower end of the conveying plate 401 limits the outer side of the clamping ring 407, thereby increasing the stability of the clamping ring 407 during movement. At the same time, the clamping rings 407 at the four corners are convenient for better fixation of the wafer, thereby further increasing the efficiency of subsequent processing of the wafer.

[0025] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A wafer handling arm with stable gripping and scratch resistance, comprising a mounting cantilever (1) and a gripping assembly (4), characterized in that: A mounting through hole (2) is provided in the middle of the rear end of the mounting cantilever (1), and a protective plate (3) is provided at the front end of the mounting cantilever (1). A grab assembly (4) is provided at the upper end of the protective plate (3), and the grab assembly (4) comprises a transport plate (401), a movable connecting plate (402), an air pump (403), an air suction nozzle (404), a wedge-shaped net (405), a pneumatic rod (406), a clamping ring (407) and a limiting groove (408). The lower end of the transport plate (401) is provided with a movable connecting plate ( 402), and an air pump (403) is installed at the upper end of the transport plate (401), and the front end of the air pump (403) is connected to an air suction nozzle (404), and a wedge-shaped net (405) is additionally provided at the front end of the air suction nozzle (404), a pneumatic rod (406) is installed inside the transport plate (401), and a clamping ring (407) is installed below the front end of the pneumatic rod (406), a limiting groove (408) is provided at the front end of the transport plate (401), and a transport component (5) is provided at the upper end of the mounting cantilever (1).

2. The wafer handling arm with stable grasping and scratch resistance according to claim 1, characterized in that: The transport plate (401) and the movable connecting plate (402) are vertically distributed, and the transport plate (401) and the movable connecting plate (402) are threadedly connected.

3. The wafer handling arm with stable grasping and scratch resistance according to claim 1, characterized in that: The pneumatic rods (406) are evenly distributed at the four corners inside the transport plate (401), and the pneumatic rods (406) are threadedly connected to the transport plate (401).

4. The wafer handling arm with stable grasping and scratch resistance according to claim 1, characterized in that: The clamping ring (407) is embeddedly connected to the limiting groove (408), and the clamping ring (407) is slidably connected to the limiting groove (408) via the pneumatic rod (406).

5. The wafer handling arm with stable grasping and scratch resistance according to claim 1, characterized in that: The transport assembly (5) comprises a servo motor (501), a screw rod (502) and a movable block (503); the front end of the servo motor (501) is connected to the screw rod (502), and the outside of the screw rod (502) is connected to the movable block (503).

6. The wafer handling arm with stable grasping and scratch resistance according to claim 5, characterized in that: The transport assembly (5) further comprises a limiting through hole (504), a first limiting rod (505) and a second limiting rod (506), and the limiting through holes (504) are provided on both sides of the movable block (503), and the first limiting rod (505) is connected to the left side of the movable block (503), and the second limiting rod (506) is connected to the right side of the movable block (503).

7. The wafer handling arm capable of stable grasping and scratch resistance according to claim 6, characterized in that: The limiting through hole (504) is cylindrical in shape, and the limiting through hole (504) is symmetrically arranged on both sides inside the movable block (503).

8. The wafer handling arm capable of stable grasping and scratch resistance according to claim 6, characterized in that: The external dimensions of the first limiting rod (505) match the internal dimensions of the limiting through hole (504), and the first limiting rod (505) is embeddedly connected to the movable block (503) via the limiting through hole (504).

Citation Information

Patent Citations

  • Non-contact type mechanical arm for carrying semiconductor wafers

    CN217345508U