Ceramic metallization sintering cooling device

Abstract

The utility model discloses a ceramic metallization sintering cooling device, which belongs to the technical field of ceramic metallization, aims at solving the problems that the protection effect of a chip is poor and the cooling effect is poor when the chip works, and comprises a protection plate, a lead support plate and a chip, and a protection groove is formed in the center of the bottom end of the protection plate. Heat dissipation openings distributed in parallel are formed in the four walls of the protection plate correspondingly, protection mechanisms are arranged at the four corners of the inner wall of the protection plate correspondingly, each protection mechanism comprises a plurality of movable grooves, stress springs are fixed to the top ends of the inner walls of the multiple movable grooves correspondingly, movable blocks are fixed to the bottom ends of the stress springs correspondingly, and a plurality of air cushions distributed in a four-corner mode are fixed to the bottom ends of the protection grooves correspondingly. The top end of the chip is attached to the air cushion; according to the utility model, the protection plate, the air cushion, the protection mechanism, the connecting rod, the movable groove, the stress spring and the movable block cooperate with each other for operation, so that the chip can be protected when the chip is pressed, and the chip is prevented from being damaged when the chip is pressed.

Description

Technical Field

[0001] The utility model belongs to the technical field of ceramic metallization, and in particular relates to a ceramic metallization sintering temperature reduction device. Background Art

[0002] Ceramic-Metal Sintering is an important material processing technology used to prepare composite materials or components that combine ceramics and metals. During the ceramic-metal sintering process, ceramic and metal particles or layers are combined together through pressure and heat treatment at high temperatures to form a composite material with excellent properties. This technology is widely used in the preparation of various engineering materials, electronic devices, thermal management materials and other fields.

[0003] The existing ceramic metal shell has certain disadvantages when assembling the chip. First, the protection effect of the chip is poor. When subjected to greater pressure, the chip is easily damaged. Second, the cooling effect of the chip is poor when it is working, resulting in a shorter chip life.

[0004] Therefore, a ceramic metallization sintering cooling device is needed to solve the problems of poor chip protection effect and poor chip cooling effect when the chip is working in the prior art. Utility Model Content

[0005] The purpose of the utility model is to provide a ceramic metallization sintering temperature reduction device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a ceramic metallization sintering cooling device, comprising a protective plate, a wire carrier plate, and a chip. A protective groove is opened at the center of the bottom end of the protective plate, and the four walls of the protective plate are opened with heat dissipation ports distributed in parallel. The four corners of the inner wall of the protective plate are provided with protective mechanisms.

[0007] The protective mechanism mainly cooperates with the protective plate so that when the chip is squeezed, it can be stressed through the connecting rod, thereby driving the movable block to be stressed, thereby driving the stressed spring to be squeezed, thereby achieving a protective effect.

[0008] It should be noted in the solution that the protection mechanism includes a plurality of movable grooves, the top ends of the inner walls of the plurality of movable grooves are all fixed with force springs, and the bottom ends of the force springs are all fixed with movable blocks.

[0009] The force spring can mainly drive the connecting rod to be stressed when the protective plate 1 is stressed, thereby driving the movable block to be stressed, and further driving the force spring to be stressed, thereby driving the protective plate to maintain a certain buffering effect, thereby improving the protection effect of the chip.

[0010] It is further worth mentioning that a plurality of air cushions distributed at four corners are fixed to the bottom end of the protection groove, and the top end of the chip fits with the air cushions.

[0011] The air cushion can fit the chip, and the protective mechanism can further protect the chip.

[0012] It should be further explained that a plurality of bumps are disposed at the bottom end of the chip.

[0013] As a preferred embodiment, a plurality of metal balls are arranged at the bottom end of the wire carrier, a mounting groove is opened at the top end of the wire carrier, and the chip is movably mounted on the inner wall of the mounting groove.

[0014] As a preferred embodiment, connecting rods are fixed to the four corners of the bottom end of the wire carrier plate, and a plurality of the connecting rods respectively penetrate the corresponding movable grooves and fit with the bottom of the movable block.

[0015] As a preferred implementation, the heat dissipation port is communicated with the protection groove.

[0016] The protective mechanism mainly cooperates with the protective plate. When the chip is squeezed, it can be stressed through the connecting rod, thereby driving the movable block to be stressed, thereby driving the force-bearing spring to be squeezed, thereby achieving a protective effect. A bump is provided at the bottom of the chip, and a metal ball is provided at the bottom of the wire carrier board, so that the chip does not need to be connected by pins, thereby further reducing the volume of the chip and improving the flexibility of the chip.

[0017] Compared with the prior art, the ceramic metallization sintering cooling device provided by the utility model has at least the following beneficial effects:

[0018] (1) Through the cooperation between the protective plate, the air cushion, the protective mechanism, the connecting rod, the movable groove, the force spring, and the movable block, the chip can be protected when it is under pressure, thereby avoiding damage to the chip when it is under pressure.

[0019] (2) Through the cooperation between the wire carrier, chip, bumps, and metal balls, the volume of the chip after assembly can be reduced without the need for pins, thereby improving the flexibility of the chip. At the same time, the top of the chip is assembled on the inner wall of the protective groove, and the heat dissipation of the chip can be achieved through the effect of the heat dissipation port. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a front perspective view of the utility model;

[0021] Figure 2 It is an exploded view of the utility model;

[0022] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of the middle A area;

[0023] Figure 4 It is a bottom-up stereogram of the present invention.

[0024] In the figure: 1. protective plate; 2. wire carrier board; 3. chip; 4. mounting slot; 5. connecting rod; 6. metal ball; 7. bump; 8. protective slot; 9. air cushion; 10. heat dissipation port; 11. protective mechanism; 111. movable slot; 112. force spring; 113. movable block. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with the embodiments.

[0026] See also Figure 1-4 The utility model provides a ceramic metallization sintering cooling device, including a protection plate 1, a wire carrier plate 2, and a chip 3. A protection groove 8 is opened at the center of the bottom end of the protection plate 1, and heat dissipation ports 10 distributed in parallel are opened on the four walls of the protection plate 1. Protection mechanisms 11 are set at the four corners of the inner wall of the protection plate 1.

[0027] The protection mechanism 11 mainly cooperates with the protection plate 1. When the chip 3 is squeezed, it can be stressed through the connecting rod 5, thereby driving the movable block 113 to be stressed, thereby driving the force-bearing spring 112 to be squeezed, thereby achieving a protective effect.

[0028] Further as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, it is worth explaining in detail that the protection mechanism 11 includes a plurality of movable grooves 111 , the top ends of the inner walls of the plurality of movable grooves 111 are all fixed with force springs 112 , and the bottom ends of the force springs 112 are all fixed with movable blocks 113 .

[0029] The force spring 112 can mainly drive the connecting rod 5 to be stressed when the protective plate 1 is stressed, thereby driving the movable block 113 to be stressed, and further driving the force spring 112 to be stressed, thereby driving the protective plate 1 to maintain a certain buffering effect, thereby improving the protection effect of the chip 3.

[0030] Further as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, it is worth to explain in detail that a plurality of air cushions 9 distributed in four corners are fixed to the bottom end of the protection groove 8, and the top end of the chip 3 is in contact with the air cushion 9.

[0031] The air cushion 9 can fit the chip 3 , and the protection mechanism 11 can further protect the chip 3 .

[0032] This solution has the following working process: by installing the chip 3 on the inner wall of the mounting groove 4, and the bump 7 corresponds to the wire carrier 2, and then providing a metal ball 6 at the bottom of the wire carrier 2, the chip 3 can be made thinner, thereby improving the flexibility of the chip 3, and through the action of the protective mechanism 11 and the air cushion 9, the chip 3 can be further protected.

[0033] According to the above working process, it can be known that: by setting the bump 7 at the bottom of the chip 3 and the metal ball 6 at the bottom of the wire carrier 2, the chip 3 can be connected without using pins, thereby further reducing the volume of the chip 3 and improving the flexibility of the chip 3.

[0034] Further as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, it is worth to explain in detail that a plurality of bumps 7 are arranged at the bottom end of the chip 3 .

[0035] Further as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, it is worth to explain in detail that a plurality of metal balls 6 are arranged at the bottom of the wire carrier 2 , a mounting groove 4 is opened at the top of the wire carrier 2 , and the chip 3 is movably mounted on the inner wall of the mounting groove 4 .

[0036] Further as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, it is worth to explain in detail that the four corners of the bottom end of the wire carrier 2 are fixed with connecting rods 5, and the multiple connecting rods 5 respectively pass through the corresponding movable grooves 111 and fit with the bottom of the movable block 113.

[0037] Further as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, it is worth to explain in detail that the heat dissipation port 10 is connected with the protection groove 8.

[0038] The heat dissipation opening 10 is mainly connected to the protection groove 8 , and the top of the chip 3 is located on one side of the heat dissipation opening 10 , so that the chip 3 can be cooled, thereby increasing the service life of the chip 3 .

[0039] In summary: the protection mechanism 11 mainly cooperates with the protection plate 1, so that when the chip 3 is squeezed, it can be subjected to force through the connecting rod 5, thereby driving the movable block 113 to be subjected to force, thereby driving the force-bearing spring 112 to be subjected to force and squeezed, thereby achieving a protective effect. The bump 7 is provided at the bottom of the chip 3, and the metal ball 6 is provided at the bottom of the wire carrier 2, so that the chip 3 does not need to be connected by pins, thereby further reducing the volume of the chip 3, thereby improving the flexibility of the chip 3.

Claims

1. A ceramic metallization sintering cooling device, comprising a protective plate (1), a wire carrier plate (2), and a chip (3), characterized in that: A protective groove (8) is provided at the center of the bottom end of the protective plate (1), heat dissipation openings (10) distributed in parallel are provided on the four walls of the protective plate (1), and protective mechanisms (11) are provided at the four corners of the inner wall of the protective plate (1).

2. A ceramic metallization sintering cooling device according to claim 1, characterized in that: The protection mechanism (11) comprises a plurality of movable grooves (111), the top ends of the inner walls of the plurality of movable grooves (111) are all fixed with force springs (112), and the bottom ends of the force springs (112) are all fixed with movable blocks (113).

3. The ceramic metallization sintering cooling device according to claim 1, characterized in that: A plurality of air cushions (9) distributed at four corners are fixed to the bottom end of the protection groove (8), and the top end of the chip (3) is in contact with the air cushions (9).

4. The ceramic metallization sintering cooling device according to claim 1, characterized in that: A plurality of bumps (7) are arranged at the bottom end of the chip (3).

5. The ceramic metallization sintering cooling device according to claim 1, characterized in that: A plurality of metal balls (6) are arranged at the bottom end of the wire carrier (2), a mounting groove (4) is provided at the top end of the wire carrier (2), and the chip (3) is movably mounted on the inner wall of the mounting groove (4).

6. The ceramic metallization sintering cooling device according to claim 1, characterized in that: Connecting rods (5) are fixed at the four corners of the bottom end of the wire carrier plate (2), and a plurality of the connecting rods (5) respectively penetrate the corresponding movable grooves (111) and fit with the bottom of the movable block (113).

7. The ceramic metallization sintering cooling device according to claim 1, characterized in that: The heat dissipation port (10) is communicated with the protection groove (8).

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