Heating unit mold

Abstract

The utility model discloses a heating unit mould, which relates to the technical field of semiconductors, and comprises a base I, a base II, an upper cover plate, a heat conduction track and a heating component, the upper cover plate is arranged at the upper part of the base I, the heat conduction track is arranged at the upper part of the base II, and the heat conduction track is connected with the upper cover plate; a rail groove capable of containing a heated object is reserved in the heat conduction rail, the heating component is installed in the heat conduction rail, and heat generated by the heating component can be transmitted to the heat conduction rail. According to the heating unit mold, the core structure is the heat conduction track and the heating component, a chip needing heat preservation is located in the heat conduction track, the heating component can heat the heat conduction track, under the heat conduction effect, heat can be finally transmitted to the environment where the chip is located, and therefore the heat preservation effect on the chip in the chip conveying process is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a heating unit mold. Background Art

[0002] During the production and processing of semiconductors (mainly chips), the chips need to be heated at high temperatures to allow the chips to be fully heated, so as to detect whether the performance of the chips meets the requirements under high temperature conditions.

[0003] The above process, like the technical solution disclosed in the existing patent of a high-temperature turntable storage device and method (CN115180400A), is to place the chip in the high-temperature storage turntable. However, after the chip is taken out from the high-temperature storage turntable, it needs to be transported to the next process. During the chip transportation process, the temperature of the chip will drop sharply and cannot meet the requirements of the next process. Therefore, we propose a heating unit mold, which is located between the high-temperature storage turntable and the equipment of the next process, and can keep the chip warm during the transportation process. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a heating unit mold, which solves the problems raised by the above background technology.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a heating unit mold, including a base 1 and a base 2, and also including:

[0006] An upper cover plate, the upper cover plate being mounted on the upper portion of the base 1;

[0007] A heat-conducting track, which is installed on the upper part of the second base and connected to the upper cover plate, and a track groove capable of accommodating a heated object is reserved inside the heat-conducting track;

[0008] The heating component is installed inside the heat-conducting track, and the heat generated by the heating component can be transferred to the heat-conducting track.

[0009] Furthermore, the heating unit mold further comprises:

[0010] The detection component is installed inside the heat-conducting track, and the detection component is a temperature sensor.

[0011] Furthermore, the upper cover plate and the second base are both made of materials with low thermal conductivity, the thermal conductive track is made of materials with high thermal conductivity, and the first base is not in contact with the thermal conductive track.

[0012] Furthermore, the heating component is an electric heating structure, and the heating component is in contact with the heat-conducting track.

[0013] Furthermore, a heat-conducting initial protrusion is integrally connected to the side of the heat-conducting track, a reserved groove is provided inside the base 2, and the heat-conducting initial protrusion is fixed in the reserved groove.

[0014] Furthermore, a side cover plate is installed at the end of the base 2, and the inside of the heat-conducting initial protrusion and the side cover plate are both reserved with mounting hole 1 and mounting hole 2.

[0015] The utility model provides a heating unit mold. Compared with the prior art, it has the following beneficial effects:

[0016] The heating unit mold mainly includes a heat-conducting track and a heating component. The chip that needs to be kept warm is located in the heat-conducting track. The heating component can heat the heat-conducting track. Under the effect of heat conduction, the heat will eventually be transferred to the chip, thereby achieving the effect of keeping the chip warm during the chip transportation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the disassembly of the utility model;

[0018] Figure 2 It is a schematic diagram of the first viewing angle of the utility model after assembly;

[0019] Figure 3 It is a schematic diagram of the second viewing angle of the utility model after assembly;

[0020] Figure 4 It is a schematic diagram of the third viewing angle of the utility model after assembly;

[0021] Figure 5 This is a schematic diagram of the structure of the heat conduction track in the utility model;

[0022] Figure 6 It is a schematic diagram showing that the heat-conducting initial protrusion in the present invention is located inside the second base.

[0023] In the figure: 1, base 1; 2, upper cover; 3, heat conduction track; 31, track groove; 32, heat conduction initial protrusion; 33, mounting hole 1; 34, mounting hole 2; 4, heating component; 5, detection component; 6, base 2; 61, reserved groove; 7, side cover. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-6 The utility model provides a technical solution: a heating unit mold, which is composed of a base 1, an upper cover 2, a heat-conducting track 3, a heating component 4, a detection component 5, a base 2 6 and a side cover 7, wherein the upper cover 2 and the heat-conducting track 3 are respectively installed on the base 1 and the base 2 6, and the heat-conducting track 3 is an integrally formed structure. During molding, a track groove 31 is automatically formed inside the heat-conducting track 3, and a heat-conducting initial protrusion 32 is automatically formed on the edge, and a mounting hole 1 33 and a mounting hole 2 34 are automatically formed inside the heat-conducting initial protrusion 32. The semiconductor (mainly a chip) will be located in the track groove 31 during the process of conveying and heat preservation;

[0026] In addition, in order to prevent the heat on the heat-conducting track 3 from being transferred outward (except for semiconductors), the upper cover plate 2 and the base 2 6 are both made of materials with low thermal conductivity, such as ceramics, plastics, etc., and the base 1 is not in contact with the heat-conducting track 3. Similarly, in order to achieve the best heat conduction effect, the heat-conducting track 3 as a whole is made of a material with high thermal conductivity, preferably copper. A reserved groove 61 is opened inside the base 2 6, and the heat-conducting initial protrusion 32 is fixed inside the reserved groove 61. The side cover plate 7 is installed at the end of the base 2 6. The heat-conducting initial protrusion 32 and the side cover plate 7 are both reserved with mounting holes 1 33 and 2 34. The heating component 4 and the detection component 5 are respectively fixed inside the mounting holes 1 33 and 2 34. The heating component 4 is an electric heating structure, preferably an electric heating tube. The detection component 5 is a temperature sensor. The electric heating tube and the temperature sensor are both in contact with the heat-conducting initial protrusion 32.

[0027] During the operation of the heating unit mold, the electric heating tube first emits heat, which is then quickly transferred to the heat-conducting initial protrusion 32 and then quickly transferred to other areas of the heat-conducting track 3, so that the temperature of the entire heat-conducting track 3 rises rapidly. During the heating process of the electric heating tube, the temperature sensor monitors the heating temperature. When the temperature of the heat-conducting track 3 reaches the set temperature, the chip is transported in the track groove 31 through an external air nozzle (not shown in the figure). The heat-conducting track 3 transfers the heat to the environment where the chip is located, so that the ambient temperature is higher than the normal temperature, so that the chip can be kept warm during the transportation process.

Claims

1. A heating unit mold, comprising a base 1 (1) and a base 2 (6), characterized in that: Also includes: An upper cover plate (2), the upper cover plate (2) being mounted on an upper portion of the base 1 (1); A heat-conducting track (3), the heat-conducting track (3) being mounted on the upper portion of the second base (6), the heat-conducting track (3) being connected to the upper cover plate (2), and a track groove (31) capable of accommodating a heated object being reserved inside the heat-conducting track (3); A heating component (4) is installed inside the heat-conducting track (3), and the heat generated by the heating component (4) can be transferred to the heat-conducting track (3).

2. A heating unit mold according to claim 1, characterized in that: Also includes: A detection component (5), wherein the detection component (5) is installed inside the heat-conducting track (3), and the detection component (5) is a temperature sensor.

3. A heating unit mold according to claim 1, characterized in that: The base 1 (1) is not in contact with the heat-conducting track (3).

4. A heating unit mold according to claim 1, characterized in that: The heating component (4) is an electric heating structure, and the heating component (4) is in contact with the heat-conducting track (3).

5. A heating unit mold according to claim 4, characterized in that: The side of the heat-conducting track (3) is integrally connected with a heat-conducting initial protrusion (32), a reserved groove (61) is provided inside the second base (6), and the heat-conducting initial protrusion (32) is fixed in the reserved groove (61).

6. A heating unit mold according to claim 5, characterized in that: A side cover plate (7) is installed at the end of the second base (6), and a first mounting hole (33) and a second mounting hole (34) are reserved inside the heat-conducting initial protrusion (32) and the side cover plate (7).

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