Integrated processing device of power buffer diode structure chip

By setting up support columns, cylinders and positioning blocks in the integrated processing device, the chip is quickly fixed, and the rotation function of the chip is realized through the coordination of the motor and the rotation shaft, the problems of low machining efficiency and inconvenient machining in the prior art are solved, and processing efficiency and convenience are improved.

CN222581140UActive Publication Date: 2025-03-07RUGAO DACHANG ELECTRONICS
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Patent Information

Application Number
CN202420300124.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-19
Publication Date
2025-03-07
Estimated Expiration
2034-02-19

AI Technical Summary

Technical Problem

The existing integrated processing device of power buffer diode structure chip cannot quickly fix the two sides of the chip, resulting in low processing efficiency and the inability to rotate the chip on the machining table to change the processing position, resulting in inconvenience in processing.

Method used

An integrated processing device including support columns, cylinders and positioning blocks is designed. Through the mutual cooperation of these components, it is possible to quickly fix the limits on both sides of the chip. At the same time, by providing a first motor, a rotating shaft, a first coupling, a support table and an isolation frame, the rotation of the chip on the processing table is realized.

Benefits of technology

It realizes fast limit fixation, improves processing efficiency, and makes the chip processing position flexible through rotation function, improving the convenience of processing.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222581140U_ABST
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Abstract

The utility model relates to the technical field of integrated processing devices, and discloses an integrated processing device of a power buffer diode structure chip, which comprises a device cabinet body, supporting legs are arranged on two sides of the bottom of the device cabinet body, and box doors are connected to two sides of the front end of the device cabinet body through hinges. An electric telescopic rod is arranged at the top of the interior of the device cabinet body, a connecting block is connected to the bottom of the electric telescopic rod, an isolation frame body is arranged at the bottom of the interior of the device cabinet body, and a first motor is arranged in the isolation frame body. By arranging the supporting column, the air cylinder and the positioning block, the two sides of a chip can be rapidly limited and fixed through the mutual cooperation effect of the supporting column, the air cylinder and the positioning block, the machining efficiency is improved, in addition, by arranging the first motor, the rotating shaft, the first coupler, the supporting table and the isolation frame body, the chip on the machining table can be rotated, and the machining efficiency is improved. And the machining position is changed, so that machining is convenient.
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Description

Technical Field

[0001] The utility model relates to the technical field of integrated processing devices, in particular to an integrated processing device for a power buffer diode structure chip. Background Art

[0002] As the most basic power electronic device, power diodes are widely used in power electronic systems. Their main structure, PN junction, is the basis of other power semiconductor devices. Power diodes provide uncontrolled power rectification and are used in applications such as battery charging and DC power supplies as well as AC rectifiers and inverters. Due to their high current and voltage characteristics, they can also be used as freewheeling diodes and snubber networks. There are power snubber diodes in the chip, and integrated processing devices are used when processing structural chips containing power snubber diodes.

[0003] The existing integrated processing device for power buffer diode structure chips cannot quickly limit and fix the two sides of the chip during use, resulting in low processing efficiency. Secondly, the chip on the processing table cannot be rotated to change the processing position, making processing inconvenient. Therefore, there is an urgent need for an integrated processing device for power buffer diode structure chips to solve the above technical problems. Utility Model Content

[0004] The purpose of the utility model is to provide an integrated processing device for a power buffer diode structure chip, so as to solve the problem that the existing integrated processing device for a power buffer diode structure chip proposed in the above background technology cannot quickly limit and fix the two sides of the chip during use, resulting in low processing efficiency, and secondly, the chip on the processing table cannot be rotated to change the processing position, making the processing inconvenient.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] An integrated processing device for a power buffer diode structure chip, comprising a device cabinet, support feet are arranged on both sides of the bottom of the device cabinet, doors are connected to the front sides of the device cabinet through hinges, an electric telescopic rod is arranged on the top of the device cabinet, a connecting block is connected to the bottom of the electric telescopic rod, an isolation frame is arranged on the bottom of the device cabinet, a first motor is arranged inside the isolation frame, an output shaft of the first motor is connected to a rotating shaft through a first coupling, a support table is arranged at the middle of the top of the isolation frame, a processing table is arranged on the top of the support table, and the upper end of the rotating shaft passes through the top of the isolation frame in sequence and a support table and connected to the bottom of the processing table, a support column is arranged on the side of the isolation frame, a cylinder is arranged on one side of the support column, a positioning block is connected to the piston rod of the cylinder, a support bottom frame is arranged at the bottom of the connecting block, two support seats are symmetrically arranged inside the support bottom frame, a screw is connected between the two support seats, the screw is connected to a nut seat through a screw nut, a guide rod is provided at the bottom of the support bottom frame, the lower end of the nut seat is connected to the welding head mounting seat through the guide rod, a welding head is installed at the bottom of the welding head mounting seat, and the right end of the screw passes through the support seat on the right and is connected to the second motor through a second coupling.

[0007] As a preferred technical solution of the utility model, heat dissipation openings are provided on both the left and right side walls of the isolation frame.

[0008] As a preferred technical solution of the utility model, the number of the support columns, the cylinders and the positioning blocks are all set to two, and they are all arranged symmetrically with respect to the left and right axes of the processing table.

[0009] As a preferred technical solution of the utility model, the number of the electric telescopic rods is set to two, and the two electric telescopic rods are symmetrically arranged about the connecting block.

[0010] As a preferred technical solution of the utility model, a guide rod is arranged between the two support seats and directly below the screw rod, and the guide rod passes through the nut seat horizontally, and the guide rod is not connected to the nut seat.

[0011] As a preferred technical solution of the present utility model, the number of the hinges is set to four.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] The utility model provides support columns, cylinders and positioning blocks, and utilizes the cooperation between them, so that both sides of the chip can be quickly limited and fixed, thereby improving processing efficiency.

[0014] The utility model arranges a first motor, a rotating shaft, a first coupling, a supporting platform and an isolation frame, and utilizes the mutual cooperation between them, so that the chip on the processing platform can be rotated to change the processing position, making the processing convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic cross-sectional view of the overall structure of the utility model;

[0018] Figure 3 For this utility model Figure 2 The middle part is an enlarged structural diagram;

[0019] In the figure: 1. device cabinet; 2. support foot; 3. hinge; 4. cabinet door; 5. isolation frame; 6. heat dissipation port; 7. first motor; 8. first coupling; 9. rotating shaft; 10. support table; 12. processing table; 13. support column; 14. cylinder; 15. positioning block; 16. electric telescopic rod; 17. connecting block; 18. supporting bottom frame; 19. screw; 20. support seat; 21. guide rod; 22. nut seat; 23. welding head mounting seat; 24. welding head; 25. second coupling; 26. second motor. DETAILED DESCRIPTION

[0020] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are only used to explain the relevant utility model, rather than to limit the utility model. It should also be noted that, for ease of description, only the parts related to the utility model are shown in the accompanying drawings. The different types of section lines in the drawings in the embodiments of the utility model are not marked according to the national standard, nor are there any requirements for the materials of the components, but are used to distinguish the cross-sectional views of the components in the drawings.

[0021] See also Figure 1-3, an integrated processing device for a power buffer diode structure chip, comprising a device cabinet 1, support feet 2 are arranged on both sides of the bottom of the device cabinet 1, both sides of the front end of the device cabinet 1 are connected with a box door 4 through hinges 3, an electric telescopic rod 16 is arranged on the top of the device cabinet 1, and a connecting block 17 is connected to the bottom of the electric telescopic rod 16, an isolation frame 5 is arranged on the bottom of the device cabinet 1, a first motor 7 is arranged inside the isolation frame 5, and the output shaft of the first motor 7 is connected to a rotating shaft 9 through a first coupling 8, a support table 10 is arranged in the middle of the top of the isolation frame 5, a processing table 12 is arranged on the top of the support table 10, and the upper end of the rotating shaft 9 passes through the top of the isolation frame 5 and the support table 10 in sequence and is connected to the processing table 12 is connected to the bottom, a support column 13 is arranged on the side of the isolation frame 5, a cylinder 14 is arranged on one side of the support column 13, a positioning block 15 is connected to the piston rod of the cylinder 14, a support bottom frame 18 is arranged at the bottom of the connecting block 17, two support seats 20 are symmetrically arranged inside the support bottom frame 18, a screw 19 is connected between the two support seats 20, the screw 19 is connected to a nut seat 22 through a screw nut, a guide rod 21 is provided at the bottom of the support bottom frame 18, the lower end of the nut seat 22 passes through the guide rod 21 and is connected to a welding head mounting seat 23, a welding head 24 is installed at the bottom of the welding head mounting seat 23, and the right end of the screw 19 passes through the support seat 20 on the right and is connected to the second motor 26 through a second coupling 25.

[0022] Wherein, heat dissipation openings 6 are provided on both the left and right side walls of the isolation frame 5 .

[0023] The number of the supporting columns 13 , the cylinder 14 and the positioning block 15 are all two, and they are all arranged symmetrically with respect to the left and right axes of the processing table 12 .

[0024] The number of the electric telescopic rods 16 is set to two, and the two electric telescopic rods 16 are symmetrically arranged about the connecting block 17 in a left-right axis.

[0025] A guide rod 21 is disposed between the two support seats 20 and directly below the screw rod 19 . The guide rod 21 passes through the nut seat 22 horizontally, and the guide rod 21 and the nut seat 22 are not connected.

[0026] The number of hinges 3 is four.

[0027] The working principle and use process of the utility model are as follows: first, the chip to be processed is placed on the processing table 12, and the two positioning blocks 15 are driven to move toward each other by starting the cylinders 14 on both sides, so that the two positioning blocks 15 can quickly limit and fix the two sides of the chip, thereby improving the processing efficiency, and then the two electric telescopic rods 16 are started to drive the entire connection block 17 to move downward, so that the welding head 24 reaches the specified position to weld the chip;

[0028] When the chip on the processing table 12 needs to be rotated, the first motor 7 is started and the processing table 12 on the rotating shaft 9 is driven to rotate through the first coupling 8, so that the chip on the processing table 12 changes its orientation, and then the cylinders 14 on both sides are started to drive the two positioning blocks 15 to move towards each other, so that the two sides of the chip are quickly limited and fixed by the two positioning blocks 15;

[0029] When the welding head 24 needs to be moved horizontally, the second motor 26 is started to drive the screw 19 to rotate through the second coupling 25, so that the nut seat 22 on the screw 19 moves horizontally along the guide rod 21 at the bottom of the supporting bottom frame 18, thereby driving the welding head 24 to move horizontally;

[0030] The contents not described in detail in this specification belong to the prior art known to professionals in this field.

[0031] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the utility model involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the concept of the utility model. For example, the above features are replaced with the technical features with similar functions disclosed in the present application (but not limited to) by each other to form a technical solution.

Claims

1. An integrated processing device for a power buffer diode structure chip, comprising a device cabinet (1), characterized in that: Support feet (2) are provided on both sides of the bottom of the device cabinet (1); both sides of the front end of the device cabinet (1) are connected to a box door (4) via hinges (3); an electric telescopic rod (16) is provided at the top of the device cabinet (1); a connecting block (17) is connected to the bottom of the electric telescopic rod (16); an isolation frame (5) is provided at the bottom of the device cabinet (1); a first motor (7) is provided inside the isolation frame (5); an output shaft of the first motor (7) is connected to a rotating shaft (9) via a first coupling (8); a support table (10) is provided at the middle of the top of the isolation frame (5); a processing table (12) is provided at the top of the support table (10); the upper end of the rotating shaft (9) passes through the top of the isolation frame (5) and the support table (10) in sequence and is connected to the bottom of the processing table (12); the isolation frame (5) ) is provided with a support column (13) on the side thereof, a cylinder (14) is provided on one side of the support column (13), a positioning block (15) is connected to the piston rod of the cylinder (14), a support bottom frame (18) is provided at the bottom of the connection block (17), two support seats (20) are symmetrically provided inside the support bottom frame (18), a screw rod (19) is connected between the two support seats (20), the screw rod (19) is connected to a nut seat (22) via a screw nut, a guide rod (21) is provided at the bottom of the support bottom frame (18), the lower end of the nut seat (22) passes through the guide rod (21) and is connected to a welding head mounting seat (23), a welding head (24) is installed at the bottom of the welding head mounting seat (23), and the right end of the screw rod (19) passes through the right support seat (20) and is connected to a second motor (26) via a second coupling (25).

2. The integrated processing device for a power buffer diode structure chip according to claim 1, characterized in that: The left and right side walls of the isolation frame (5) are both provided with heat dissipation openings (6).

3. The integrated processing device for a power buffer diode structure chip according to claim 1, characterized in that: The number of the support column (13), the cylinder (14) and the positioning block (15) is set to two, and they are all arranged in a left-right symmetrical manner with respect to the processing table (12).

4. The integrated processing device for a power buffer diode structure chip according to claim 1, characterized in that: The number of the electric telescopic rods (16) is set to two, and the two electric telescopic rods (16) are arranged symmetrically about the connecting block (17) with respect to the left and right axes.

5. The integrated processing device for a power buffer diode structure chip according to claim 1, characterized in that: A guide rod (21) is provided between the two support seats (20) and directly below the screw rod (19); the guide rod (21) passes through the nut seat (22) horizontally; the guide rod (21) and the nut seat (22) are not connected.

6. The integrated processing device for a power buffer diode structure chip according to claim 1, characterized in that: The number of the hinges (3) is set to four.