Wafer bonding jig and bonding equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides a wafer bonding jig and bonding equipment, and the wafer bonding jig comprises a jig body and an isolation unit. The jig body is provided with a bearing area; the isolation unit comprises an isolation base and an isolation piece; the isolation piece is arranged on the isolation base, the isolation base is movably arranged on the isolation base in the direction parallel to the bearing area, the isolation base is provided with a matching face, and the matching face faces the bearing area in the direction parallel to the bearing area. According to the utility model, the structure of the isolation unit is improved, so that the pressing head is linked with the isolation piece in the downward pressing process, and the downward pressing process of the pressing head and the pulling-out process of the isolation piece are kept synchronous.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer bonding jig and bonding equipment. Background Art

[0002] Wafer bonding technology can combine wafers of different materials together. Wafer bonding is an important process for three-dimensional processing of semiconductor devices. The main process steps of wafer bonding include wafer surface treatment, wafer alignment and final wafer bonding. Bonding is not only a packaging technology in microsystem technology, but also an organic part of three-dimensional device manufacturing. It is used in both the front-end and back-end processes of device manufacturing. The most important bonding applications are the bonding of silicon wafers and silicon wafers and the bonding of silicon wafers and glass substrates.

[0003] The main components of the semi-automatic bonding device in the prior art include a bonding chamber for providing a bonding environment, a vacuum unit for evacuating a vacuum, a device for applying bonding pressure, a pressure head, and the like.

[0004] The main process of wafer bonding is: placing the aligned wafer into the bonding chamber of the bonding equipment; closing the bonding chamber and turning on the vacuum unit to evacuate the bonding chamber into a vacuum state; performing pressurization, heating, and cooling processes according to specific bonding process requirements; after the bonding process is completed, releasing the vacuum in the bonding chamber, opening the bonding chamber, and taking out the wafer.

[0005] The aligned wafer needs to be clamped and positioned by a clamping structure. The existing clamping structure is usually equipped with an isolation piece. When the bonding equipment presses down the wafer through the pressure head, the isolation piece needs to be pulled out of the wafer. The existing isolation piece is usually driven independently by a third-party driver, that is, there is a possibility that the isolation piece withdrawal process and the pressure head pressing process of the bonding equipment are not synchronized. If the isolation piece is not pulled out of the wafer during the pressure head pressing process, the wafer will be crushed during the pressure head pressing process.

[0006] In order to solve the above problems, the utility model provides a wafer bonding jig and a bonding device, which improve the phenomenon that the above isolation member and the pressing process of the pressure head are not synchronized by improving the isolation member unit. Utility Model Content

[0007] The utility model aims to provide a wafer bonding jig and bonding equipment. In the wafer bonding jig, the isolation unit structure is improved so that the pressing head and the isolation member are linked during the pressing process to ensure that the pressing head pressing process and the isolation member withdrawal process are synchronized.

[0008] The utility model provides a wafer bonding jig, comprising: a jig body and an isolation unit;

[0009] The fixture body has a bearing area;

[0010] The isolation unit includes an isolation base and an isolation member;

[0011] The isolation member is arranged on the isolation base, and the isolation base is arranged on the isolation base to move along a direction parallel to the bearing area. The isolation base has a matching surface, and the matching surface faces the bearing area along a direction parallel to the bearing area.

[0012] Optionally, a driving hole is opened on the isolation base along a direction perpendicular to the bearing area, and a surface of a side wall of the driving hole serves as the matching surface.

[0013] Optionally, a mounting hole is formed on the fixture body in a direction perpendicular to the bearing area, the isolation base is arranged in the mounting hole, and the driving hole is formed in the isolation base.

[0014] Optionally, the wafer bonding jig further includes a clamping unit;

[0015] The clamping unit comprises a clamping member, the clamping member is rotatably disposed on the fixture body, and the clamping member is disposed on the fixture body to move along a direction perpendicular to the bearing area, and the rotation axis of the clamping member is perpendicular to the bearing area;

[0016] When the isolation base moves in a direction parallel to the bearing area, the isolation member has at least an isolation position, and when the isolation member is located at the isolation position, the isolation member faces the bearing area in a direction perpendicular to the bearing area;

[0017] The clamping member has at least a clamping position when rotating; when the clamping member is at the clamping position, the clamping member faces the bearing area along a direction perpendicular to the bearing area and faces the isolation member at the isolation position, and the isolation member is located between the clamping member and the bearing area.

[0018] Optionally, the wafer bonding jig further includes a position detection unit, the clamping member has a detection portion, the position detection unit is arranged on the jig body, and when the clamping member rotates, the detection portion passes through the position detection unit.

[0019] Optionally, the wafer bonding jig further comprises a stabilizing unit;

[0020] The stabilizing unit is arranged on the fixture body and moves in a direction parallel to the bearing area. The stabilizing unit is pressed against the isolation base along one side of its movement direction, and the movement direction of the stabilizing unit is perpendicular to the movement direction of the isolation base.

[0021] Optionally, the stabilizing unit includes a stabilizing member, and the isolating unit further includes an elastic member;

[0022] The stabilizing member is disposed on the fixture body so as to move in a direction parallel to the bearing area;

[0023] The elastic member is arranged on the isolation base or the stabilizing member, and the elastic member is located between the isolation base and the stabilizing member along the moving direction of the stabilizing member.

[0024] Optionally, the fixture body comprises a carrying plate and an outer plate, the outer plate is arranged around the carrying plate, and the carrying plate is flexibly connected to the outer plate;

[0025] The bearing area is located on one axial side of the bearing plate;

[0026] The isolation unit is disposed on the outer disk;

[0027] When the wafer bonding jig includes a clamping unit, the clamping unit is arranged on the outer plate.

[0028] Optionally, the wafer bonding jig further comprises a flexible connector, a gap is provided between the outer circumference of the carrier plate and the inner circumference of the outer plate, a first end of the flexible connector is connected to the carrier plate, a second end of the flexible connector is connected to the outer plate, and a hollow area is provided on the flexible connector between the first end and the second end.

[0029] A bonding device, comprising a bonding chamber, a pressure head, a follower and the wafer bonding jig described above;

[0030] The wafer bonding jig is disposed in the bonding chamber, and the pressure head is disposed in the bonding chamber and moves in a direction perpendicular to the bearing area;

[0031] The follower is arranged on the pressure head and has a driving surface. When the follower moves with the pressure head toward the wafer bonding fixture, the driving surface contacts the mating surface and exerts a force to move the isolation base away from the bearing area.

[0032] To summarize, the wafer bonding jig includes: a jig body and an isolation unit; the jig body has a carrying area; the isolation unit includes an isolation base and an isolation member; the isolation member is arranged on the isolation base, the isolation base is arranged on the isolation base for movement along a direction parallel to the carrying area, the isolation base has a mating surface, and the mating surface faces the carrying area along a direction parallel to the carrying area.

[0033] With such configuration, the wafer bonding fixture can realize linkage with the pressing process of the pressing head of the bonding equipment by adding a mating surface on the isolation base, so that the pressing head can simultaneously apply force to the mating surface during the pressing process to drive the isolation base to move away from the bearing area, thereby pulling out the isolation member. This setting method can completely avoid the phenomenon of the wafer being crushed due to the isolation member not being pulled out in time, and on the other hand, it is also conducive to simplifying the driving method of the isolation member and further simplifying the structure of the entire wafer bonding fixture.

[0034] In the above-mentioned wafer bonding fixture, when the clamping member is in the clamping position, the clamping member is just above the isolation member. Therefore, when the clamping member applies pressure downward to the wafer, the position where the clamping member applies pressure coincides with the position of the isolation member. On the one hand, a better clamping effect is ensured, and on the other hand, the clamping member can be prevented from crushing the upper wafer.

[0035] The wafer bonding jig has a simple structure and a small hollow area below the outer disk, which is conducive to large-area adsorption of the platform below the outer disk and the bonding chamber to effectively fix the wafer bonding jig and improve alignment accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a bottom view structural schematic diagram of a wafer bonding fixture according to an embodiment of the utility model;

[0037] Figure 2 This is a schematic structural diagram of a flexible connector according to an embodiment of the utility model;

[0038] Figure 3 This is a schematic diagram of a top view of a wafer bonding fixture according to an embodiment of the utility model;

[0039] Figure 4 This is a schematic diagram of the relative positions of the follower and the isolation base of the flexible connector according to an embodiment of the utility model;

[0040] Figure 5 for Figure 3 Schematic diagram of the local structure at point A;

[0041] Figure 6 A schematic diagram of a partial structure of a wafer bonding fixture according to an embodiment of the utility model;

[0042] Figure 7 It is a schematic diagram of the side structure of a wafer bonding fixture according to an embodiment of the utility model;

[0043] Figure 8 It is a schematic diagram of the matching structure of the isolation unit and the stabilization unit according to one embodiment of the utility model.

[0044] The reference numerals are as follows:

[0045] 10- fixture body; 101- bearing area; 102- mounting hole; 103- mounting slot; 11- bearing plate; 12- outer plate;

[0046] 20-isolation unit; 21-isolation base; 211-matching surface; 212-driving hole; 22-isolator; 23-elastic member; 24-guide rod; 25-cylindrical pin;

[0047] 30-clamping unit; 31-clamping member; 311-detection part; 312-clamping body; 32-rotating shaft;

[0048] 40-stabilizing unit; 41-stabilizing member;

[0049] 50-detection unit; 51-first detection sensor; 52-second detection sensor;

[0050] 60-flexible connector; 61-first end; 62-second end; 63-hollow area;

[0051] 70- follower; 71- driving surface;

[0052] a-first direction; b-second direction. DETAILED DESCRIPTION

[0053] The wafer bonding fixture proposed by the present invention is further described in detail below in combination with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer according to the following description. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0054] As used in the present invention, the singular forms "one", "an", and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the terms "at least two" or "a plurality" are usually used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features. In addition, as used in the present invention, "installed", "connected", "connected", and one element "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0055] Bonding needs to be done in a vacuum and high temperature environment, and the isolation piece needs to be pulled out before hot pressing. The current practice on the market is to use an external mechanism to drive the isolation piece to be pulled out, which is difficult to achieve due to environmental issues and is prone to the isolation piece not being pulled out in time. In addition, the internal vacuum and high temperature are difficult to detect. If the isolation piece is not pulled out in time, the two wafers will be crushed when the pressure head is pressed down.

[0056] The utility model provides a wafer bonding fixture, please refer to Figure 1 and Figure 2 As shown, the wafer bonding fixture includes: a fixture body 10, an isolation unit 20 and a clamping unit 30;

[0057] Please refer to Figures 1 to 3 As shown, the fixture body 10 includes a carrying plate 11 and an outer plate 12, the outer plate 12 is arranged around the carrying plate 11, and the carrying plate 11 is flexibly connected to the outer plate 12;

[0058] The fixture body 10 has a carrying area 101, which is located on one axial side of the carrying plate 11. The carrying area 101 is used to carry the wafer to be bonded, and a vacuum adsorption channel can be provided on the carrying area 101 to fix the wafer.

[0059] In this embodiment, the carrier plate 11 is in the shape of a disk, the outer plate 12 is in the shape of a ring, and the outer plate 12 is coaxially arranged with the carrier plate 11. The shapes of the carrier plate 11 and the outer plate 12 are both adapted to the shapes of existing wafers.

[0060] In other alternative embodiments, the shapes of the carrier plate 11 and the outer plate 12 can be adaptively adjusted based on actual usage requirements.

[0061] In this embodiment, the fixture body 10 is configured as a split structure formed by the carrier plate 11 and the outer plate 12, which can improve the thermal stress caused by heating during the bonding process and help protect the fixture body 10 from damage due to thermal stress.

[0062] Please continue to refer to Figure 1 and Figure 2 As shown, in this embodiment, the carrier disc 11 and the outer disc 12 are connected by a flexible connector 60. The carrier disc 11 will be subjected to high temperature and high pressure during bonding, and the purpose of the flexible connection between the carrier disc 11 and the outer disc 12 is to release the deformation stress of the carrier disc 11 during bonding. This connection method can improve the mutual squeezing phenomenon of the carrier disc 11 and the outer disc 12 caused by thermal expansion during the heating process. It is beneficial to protect the carrier disc 11 and the outer disc 12 from damage.

[0063] There is a gap between the outer circumference of the carrier plate 11 and the inner circumference of the outer plate 12 , and the setting of the gap is determined based on the deformation of the two to ensure that the two will not be squeezed against each other when heated and pressed.

[0064] like Figure 1 and Figure 2 As shown, in this embodiment, six flexible connectors 60 are provided and evenly distributed along the circumference of the carrying plate 11 .

[0065] The flexible connector 60 is in a rectangular shape as a whole, with one end along the length direction thereof being a first end 61 and the other end along the length direction thereof being a second end 62; two connection holes are provided on the first end 61, and two connection holes are provided on the second end 62. The first end 61 of the flexible connector 60 is connected to the carrier plate 11, and the second end 62 of the flexible connector 60 is connected to the outer plate 12.

[0066] To prevent the flexible connector 60 from interfering with the carrying area 101 , the flexible connector 60 is connected to a side of the carrying plate 11 opposite to the carrying area 101 .

[0067] The flexible connector 60 has a hollow area 63 between the first end and the second end. Figure 2 As shown, the middle part of the flexible connector 60 is fleshed out to form a diamond structure, and the middle part of the diamond structure serves as a hollow area 63. The short diagonal line of the diamond structure extends along the length direction of the flexible connector 60, that is, the first end 61 and the second end 62 are located on both sides of the obtuse angle of the diamond structure. This arrangement is conducive to better deformation of the diamond structure to release the radial outward deformation stress of the supporting disk 11 during thermal expansion and the radial inward deformation stress of the outer disk 12 during thermal expansion.

[0068] In other alternative embodiments, the number of flexible connectors 60 can be adaptively adjusted based on actual usage requirements, for example, it can be set to three, four, etc.

[0069] In other alternative embodiments, the overall structure of the flexible connector 60 can be adaptively adjusted based on actual usage requirements.

[0070] In other alternative embodiments, the hollow area 63 may also be adaptively adjusted based on actual usage requirements, for example, it may be set to an elliptical structure.

[0071] like Figure 3 As shown, annular vacuum channels are evenly distributed on the surface of the carrier plate 11 in the carrier area 101 thereof to absorb the wafers.

[0072] The isolation unit 20 is disposed on the outer plate 12; the isolation unit 20 is used to isolate between the upper wafer and the lower wafer to be bonded. During bonding, the lower wafer is first placed on the carrier plate 11, and then the isolation unit 20 is moved above the lower wafer, and finally the upper wafer is aligned and placed on the lower wafer. The upper and lower wafers are partially isolated by the isolation unit 20 so that the upper and lower wafers cannot be completely bonded, so as to prevent gas from remaining between the upper and lower wafers to form bubbles during the vacuuming process.

[0073] The clamping unit 30 is disposed on the outer plate 12. When the upper wafer and the lower wafer are placed, the clamping unit 30 moves to the upper wafer and applies pressure thereto to fix the upper wafer and the lower wafer to prevent relative displacement between the upper wafer and the lower wafer, so as to maintain the alignment posture of the upper wafer and the lower wafer.

[0074] In this embodiment, three clamping units 30 and three isolating units 20 are provided. The three clamping units 30 and the three isolating units 20 are evenly arranged around the carrier plate 11, and one clamping unit 30 and one isolating unit 20 are arranged in pairs.

[0075] In other alternative embodiments, the number of clamping units 30 and isolation units 20 can be adaptively adjusted based on actual needs, for example, two, four or more clamping units can be provided.

[0076] Please refer to Figures 3 to 5 As shown, the isolation unit 20 includes an isolation base 21 and an isolation member 22 .

[0077] The isolation member 22 is disposed on the isolation base 21. The isolation base 21 is parallel to the direction of the carrying area 101 (along Figure 3 and Figure 4 The intermediate carrier plate 11 is arranged on the isolation base 21 to move in the radial direction.

[0078] In this embodiment, the isolation member 22 is a thin sheet structure, one end of the isolation member 22 is connected to the isolation base 21 by screws, and the other end is suspended outside the isolation base 21 in a cantilever structure. Figure 4 As shown, when the isolation base 21 moves, it will bring the isolation member 22 closer to or away from the carrying area 101. When the isolation member 22 moves above the carrying area, it can be isolated between the upper wafer and the lower wafer.

[0079] In other alternative embodiments, the isolation member 22 may also be integrally formed with the isolation base 21 , or connected with the isolation base 21 by other connection methods.

[0080] In addition, the isolation base 21 has a matching surface 211 , and the matching surface 211 faces the supporting area 101 along a direction parallel to the supporting area 101 .

[0081] Please refer to Figure 3 and Figure 4 As shown, in this embodiment, the matching surface 211 is parallel to the axial direction of the carrier plate 11 and faces the carrier area 101 along the radial direction of the carrier plate 11 .

[0082] Specifically, Figure 4 and Figure 5 As shown, a driving hole 212 is provided on the isolation base 21 in a direction perpendicular to the bearing area, and a surface of a side wall of the driving hole 212 serves as the mating surface 211. The driving hole 212 is provided through the isolation base 21.

[0083] The matching surface 211 is provided to ensure that during the pressing process of the pressing head of the bonding device, the pressing head movement and the withdrawing movement of the isolation member 22 are synchronized.

[0084] Please combine the action principle Figure 4As shown, a follower 70 is added to the bonding device, and the follower 70 has a driving surface 71, which is an inclined surface, and the head of the follower 70 is a wedge-shaped structure as a whole. When the follower 70 moves downward with the pressure head of the bonding device, the follower 70 moves downward, and the driving surface 71 contacts the mating surface 211, and exerts a force to move the isolation base 21 away from the bearing area 101. Figure 4 As shown, the follower 70 drives the isolation base 21 to move rightward during the downward movement, and the isolation base 21 drives the isolation member 22 away from the bearing area 101 to perform a withdrawal action.

[0085] Recombination Figure 5 As shown, during the downward movement of the follower 70 , the isolation base 21 is driven to move radially outwardly along the carrier plate 11 , so that the isolation member 22 is away from the carrier area 101 , and then the wafer is pulled out.

[0086] In this embodiment, the mating surface 211 is a plane and a vertical surface, and the driving surface 71 is a plane and a wedge-shaped surface. The linkage between the follower 70 and the isolation base 21 is achieved through the coordination of the vertical surface and the wedge-shaped surface, thereby achieving the linkage between the pressing process of the bonding device's pressure head and the isolation member 22.

[0087] In other alternative embodiments, the mating surface 211 and the driving surface 71 may be configured as curved surfaces, or one may be configured as a curved surface and the other may be configured as a flat surface, or both may be configured as wedge-shaped surfaces.

[0088] In other alternative embodiments, the mating surface 211 may also be a side surface of a protruding structure on the isolation base 21, for example, a protrusion is provided on the side or top of the isolation base 21, and a vertical surface or inclined surface on the protrusion serves as the mating surface 211. The formation method of the mating surface 211 can be adjusted based on the structural adaptability of the isolation base 21.

[0089] The above-mentioned wafer bonding jig can realize linkage with the pressing process of the pressing head of the bonding equipment by adding a mating surface 211 on the isolation base 21, so that the pressing head can simultaneously apply a force to the mating surface 211 during the pressing process to drive the isolation base 21 to move away from the bearing area 101, thereby withdrawing the isolation member 22. This setting method can completely avoid the phenomenon of the wafer being crushed due to the failure to withdraw the isolation member 22 in time, and on the other hand, it is also conducive to simplifying the driving method of the isolation member 22, and further simplifying the structure of the entire wafer bonding jig.

[0090] Please continue to refer to Figure 5 As shown, the fixture body 10 is along a direction perpendicular to the bearing area 101 (along Figure 5The mounting hole 102 is provided through the mounting hole 102 (in the direction perpendicular to the paper surface, which is also the axial direction of the carrier plate 11), and the isolation base 21 is arranged in the mounting hole 102, so that the driving hole 212 is connected with the mounting hole 102. The mounting hole 102 is a square hole as a whole, and the isolation base 21 is also a rectangular parallelepiped slider as a whole, and the width dimension of the isolation base 21 (the dimension in the circumferential direction of the carrier plate 11) is adapted to the width dimension of the mounting hole 102 (the dimension in the circumferential direction of the carrier plate 11); the length dimension of the isolation base 21 (the dimension in the radial direction of the carrier plate 11) is smaller than the length dimension of the mounting hole 102 (the dimension in the radial direction of the carrier plate 11); so that the isolation base 21 can slide in the mounting hole 102 in the radial direction.

[0091] The installation hole 102 is provided, on the one hand, to isolate the installation of the base 21, and on the other hand, to provide avoidance. When the follower 70 passes into the driving hole 212, the through structure of the driving hole 212 and the through structure of the installation hole 102 are used to avoid the follower 70 to prevent contact with the follower 70.

[0092] In other alternative embodiments, the driving hole 212 may not be configured as a through-hole structure. In this case, it should be ensured that when the pressing head presses down the wafer, the follower 70 does not contact the bottom of the driving hole 212 .

[0093] Please continue to refer to Figure 5 and Figure 6 As shown, the clamping unit 30 includes a clamping member 31, which is rotatably arranged on the jig body 10, and the clamping member 31 is moved on the jig body 10 in a direction perpendicular to the bearing area 101, and the rotation axis of the clamping member 31 is perpendicular to the bearing area 101 (that is, the rotation axis of the clamping member 31 extends along the axial direction of the bearing plate 11), so that the clamping member 31 rotates in a direction parallel to the bearing area 101.

[0094] When the isolation base 21 moves in a direction parallel to the supporting area 101, the isolation member 22 has at least an isolation position, which is the position corresponding to when the isolation member 22 is inserted between the upper wafer and the lower wafer. When the isolation member 22 is located at the isolation position, the isolation member 22 faces the supporting area 101 in a direction perpendicular to the supporting area 101. Corresponding to the isolation position, the isolation member 22 also has a non-isolation position, which is the position corresponding to when the isolation member 22 is pulled away from the upper wafer and the lower wafer. When the isolation member 22 is located at the non-isolation position, the isolation member 22 is misaligned with the supporting area 101 in a direction perpendicular to the supporting area 101. Corresponding to Figure 5 As shown, Figure 5The middle isolating member 22 has not moved to the top of the bearing area 101 , so the corresponding position of the isolating member at this time is the non-isolating position. When the isolating member 22 moves radially inward to the top of the bearing area 101 , it corresponds to the isolating position.

[0095] The clamping member 31 has at least a clamping position when rotating; the clamping position is the position where the clamping member 31 rotates to clamp the wafer above the upper wafer. Corresponding to the clamping position, the clamping member 31 also has a release position when rotating, and the release position is the position where the clamping member 31 rotates to the outside of the carrying area 101 and does not clamp the wafer. Figure 5 As shown, Figure 5 The middle clamping member 31 rotates to the outside of the carrying area 101 and is located above the outer plate 12. Therefore, the clamping member 31 does not cooperate with the wafer at this time. Figure 5 The position of the clamping member 31 is in the release position. Figure 6 As shown in FIG. 1 , when the clamping member 31 rotates counterclockwise so that a part of it rotates above the carrying area 101, the clamping member 31 is used to clamp the wafer. Figure 6 The position corresponding to the middle clamping member 31 is the clamping position.

[0096] In this embodiment, the position of the clamping position is further limited, such as Figure 6 As shown, when the clamping member 31 is in the clamping position, the clamping member 31 is facing the bearing area 101 and the isolation member 22 in the isolation position along a direction perpendicular to the bearing area 101, and the isolation member 22 is located between the clamping member 31 and the bearing area 101 in the isolation position.

[0097] like Figure 6 As shown, when the isolation member 22 is in the isolation position, the isolation member 22 is inserted between the two wafers. At this time, when the clamping member 31 is in the clamping position, the clamping member 31 is just located above the isolation member 22. Therefore, when the clamping member applies pressure downward to the wafer, the position where the clamping member applies pressure coincides with the position of the isolation member 22. On the one hand, a better clamping effect is guaranteed, and on the other hand, it can also prevent the clamping member from crushing the upper wafer.

[0098] Please continue to refer to Figure 6 and Figure 7 As shown, the clamping unit 30 also includes a rotating shaft 32, wherein the rotating shaft 32 is installed on the outer disk 12 in a manner that it can be raised and lowered and rotatable in a direction perpendicular to the bearing area 101, wherein one end of the rotating shaft 32 is connected to the clamping member 31, and the other end of the rotating shaft 32 passes through the outer disk 12, and the end is used to cooperate with an external device to drive the rotating shaft 32 to be raised, lowered and rotated.

[0099] In order to ensure reliable downward pressure of the clamping member 31, an elastic member can be added to the clamping member 31. The elastic member is connected to the outer plate 12 and provides elastic force for the clamping member 31 to move downward, thereby providing power for the clamping member 31 to press down the upper wafer.

[0100] Furthermore, the wafer bonding jig also includes a position detection unit 50 . The clamping member 31 has a detection portion 311 . The position detection unit 50 is disposed on the jig body 10 . When the clamping member 31 rotates, the detection portion 311 passes through the position detection unit 50 .

[0101] like Figure 5 and Figure 6 As shown, the detection portion 311 and the clamping body 312 of the clamping member 31 are arranged at an angle, so that the clamping member 31 is an irregularly bent structure as a whole. The position detection unit 50 includes a first detection sensor 51 and a second detection sensor 52; the first detection sensor 51 and the second detection sensor 52 can be distance sensors. When the clamping member 31 is in the clamping position, the first detection sensor 51 corresponds to the position of the detection portion 311 at this time; when the clamping member 31 is in the releasing position, the second detection sensor 52 corresponds to the position of the detection portion 311 at this time. The first detection sensor 51 and the second detection sensor 52 are used to detect the position of the clamping member 31.

[0102] In other alternative embodiments, the position detection unit 50 may also be configured as a mechanical limiting structure. For example, the position detection unit 50 may be two protrusions arranged on the outer disk 12. Both protrusions are located on the rotation path of the detection part 311. Therefore, the detection part 311 can only rotate between the two protrusions, thereby realizing the detection and limitation of the position of the clamping member 31 by means of mechanical limiting.

[0103] Please continue to refer to Figure 6 and Figure 8 As shown, the wafer bonding fixture further includes a stabilizing unit 40;

[0104] The stabilizing unit 40 is disposed on the fixture body 10 and moves in a direction parallel to the bearing area 101 . The stabilizing unit 40 is pressed against the isolation base 21 along one side of its movement direction. The movement direction of the stabilizing unit 40 is perpendicular to the movement direction of the isolation base 21 .

[0105] like Figure 8 As shown, the movement direction of the isolation base 21 is the first direction a, which corresponds to the radial direction of the carrier plate 11, and the movement direction of the stabilizing unit 40 is the second direction b, which is perpendicular to the first direction a. The stabilizing unit 40 is pressed laterally on the isolation base 21 and generates friction, which is used to stabilize the isolation base 21 through friction.

[0106] Please continue to refer to Figure 6 and Figure 8 As shown, the stabilizing unit 40 includes a stabilizing member 41, and the isolating unit 20 also includes an elastic member 23;

[0107] The stabilizing member 41 is in a rectangular block structure, and the stabilizing member 41 is parallel to the direction of the bearing area 101 ( Figure 8 The second direction b) is arranged on the fixture body 10. Specifically, the fixture body 10 is provided with a mounting groove 103 (see Figure 6 As shown), the stabilizing member 41 is installed in the installation groove 103, and the stabilizing member 41 is installed in the installation groove 103 and can be slidably arranged along the second direction b. A waist-shaped hole extending along the second direction b is opened on the stabilizing member 41, and the stabilizing member 41 is connected to the bottom of the installation groove 103 by a screw passing through the waist-shaped hole to achieve the adjustment of the position of the stabilizing member 41 along the second direction b.

[0108] The mounting groove 103 is connected to the mounting hole 102 along the first direction b, and the elastic member 23 is located in the connecting passage between the two (see Figure 6 The elastic member 23 is an arc-shaped spring leaf, and the elastic member 23 is located between the isolation base 21 and the stabilizing member 41 along the movement direction (second direction b) of the stabilizing member 41. Both ends of the elastic member 23 are connected to the isolation base 21, and the protruding position of the elastic member 23 abuts against the stabilizing member 41. The elastic force of the elastic member 23 is adjusted by adjusting the position of the stabilizing member 41, thereby adjusting the friction between the stabilizing member 41 and the elastic member 23.

[0109] In other alternative embodiments, the elastic member 23 may be connected to the stabilizing member 41 and pressed onto the isolation base 21 .

[0110] In other alternative embodiments, the elastic member 23 may adopt other forms of elastic structures, such as a disc spring or an elastic sleeve.

[0111] In other alternative embodiments, the structure of the stabilizer 41 can be adjusted based on the adaptability of the mounting structure. For example, the stabilizer can be a screw structure, which can be threadedly connected to the outer disk 12 and abut against the isolation base 21.

[0112] Please continue to refer to Figure 7 and Figure 8 As shown, the isolation base 21 is slidably mounted on the guide rod 24, which is mounted in the mounting hole 102. The guide rod 24 is used to guide the isolation base 21 to improve its sliding accuracy. A cylindrical pin 25 is provided on the isolation base 21, and one end of the cylindrical pin 25 radially passes through the inner wall of the mounting hole 12 and passes to the outside of the outer disk 12. The cylindrical pin 25 can be driven by an external driving device to make the isolation base 21 move radially.

[0113] The above-mentioned wafer bonding jig can realize linkage with the pressing process of the pressing head of the bonding equipment by adding a mating surface 211 on the isolation base 21, so that the pressing head can simultaneously apply a force to the mating surface 211 during the pressing process to drive the isolation base 21 to move away from the bearing area 101, thereby withdrawing the isolation member 22. This setting method can completely avoid the phenomenon of the wafer being crushed due to the failure to withdraw the isolation member 22 in time, and on the other hand, it is also conducive to simplifying the driving method of the isolation member 22, and further simplifying the structure of the entire wafer bonding jig.

[0114] In the above-mentioned wafer bonding fixture, when the clamping member 31 is in the clamping position, the clamping member 31 is just located above the isolation member 22. Therefore, when the clamping member applies pressure downward to the wafer, the position where the clamping member applies pressure coincides with the position of the isolation member 22. On the one hand, a better clamping effect is ensured, and on the other hand, the clamping member can be prevented from crushing the upper wafer.

[0115] The wafer bonding jig has a simple structure and a small hollow area below the outer disk, which is conducive to large-area adsorption of the platform below the outer disk and the bonding chamber to effectively fix the wafer bonding jig and improve alignment accuracy.

[0116] In addition, when the wafer bonding jig is aligned with the wafer, the rotating shaft 32 of the clamping unit 30 needs to be driven by the lifting shaft to lift and rotate. If the lifting shaft and the rotating shaft 32 are not coaxial, it is easy to generate a large torque, causing the wafer bonding jig to shift. The hollow area below the outer disk of the wafer bonding jig in this embodiment is small. When the wafer bonding jig is aligned on the alignment machine, it is beneficial to increase the adsorption area of ​​the alignment machine on the wafer bonding jig, thereby ensuring a large adsorption force to effectively fix the wafer bonding jig and improve the deviation of the wafer bonding jig caused by the lifting and rotating of the clamping unit 30.

[0117] This embodiment further provides a bonding device, including the wafer bonding jig and bonding chamber, pressure head and follower 70 as described above;

[0118] The wafer bonding jig is arranged in the bonding chamber; here it means that the wafer bonding jig is located in the bonding chamber when the wafers are bonded, and when the wafers are aligned, the wafer bonding jig may be located outside the bonding chamber.

[0119] The pressure head is arranged in the bonding chamber, and a platform (or a lower pressure head) is also arranged in the bonding chamber. The wafer bonding jig is placed on the platform, and the pressure head is located on one side of the wafer bonding jig along a direction perpendicular to the supporting area 101; in other words, the pressure head is located above the wafer bonding jig, the platform is located below the wafer bonding jig, and the bottom of the wafer bonding jig is adsorbed and fixed by the platform.

[0120] The follower 70 is disposed on the pressure head, and has a driving surface 71. When the follower 70 moves with the pressure head toward the wafer bonding jig, the driving surface 71 contacts the mating surface 211 and exerts a force to move the isolation base 21 away from the supporting area 101. The mating manner of the driving surface 71 and the mating surface 211 has been described in detail in the above content, and will not be repeated here.

[0121] Therefore, when the pressure head is pressed downward, the isolation base 21 can be synchronously driven to move, so that the isolation member 22 is withdrawn from between the upper wafer and the lower wafer.

[0122] In this embodiment, the bonding chamber, the pressure head and the platform are all shown in the figure, and the bonding equipment is consistent with the existing structure. The difference lies in the different structure of the wafer bonding fixture and the addition of a follower.

[0123] The above-mentioned wafer bonding jig, when placing the wafer, first places the lower wafer on the bearing area 101 on the carrier plate 11, and then vacuum adsorbs through the bearing area 101. Then, the isolation base 21 is pushed up by external force, so that the isolation base 21 drives the isolation member 22 to move above the lower wafer. The upper wafer and the lower wafer on the alignment machine are aligned, and after the alignment is completed, the clamping member 31 is raised and rotated to the clamping position and then lowered, and the clamping member 31 presses the upper wafer to prevent the upper wafer and the lower wafer from moving relative to each other. Then, the wafer bonding jig is placed in the bonding chamber of the bonding equipment, the wafer bonding jig is adsorbed on the platform, the pressure head moves downward, the follower 70 is inserted into the driving hole 212, and the isolation base 21 is driven to drive the isolation member 22 to move synchronously, so that the isolation member is pulled out from between the upper wafer and the lower wafer.

[0124] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0125] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of the utility model. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A wafer bonding jig, characterized in that: include: The fixture body and the isolation unit; The fixture body has a bearing area; The isolation unit includes an isolation base and an isolation member; The isolation member is arranged on the isolation base, and the isolation base is arranged on the isolation base to move along a direction parallel to the bearing area. The isolation base has a matching surface, and the matching surface faces the bearing area along a direction parallel to the bearing area.

2. The wafer bonding jig according to claim 1, characterized in that: A driving hole is opened on the isolation base in a direction perpendicular to the bearing area, and a surface of a side wall of the driving hole serves as the matching surface.

3. The wafer bonding jig according to claim 2, characterized in that: The fixture body is provided with a mounting hole extending therethrough in a direction perpendicular to the bearing area, the isolation base is arranged in the mounting hole, and the driving hole is arranged therethrough in the isolation base.

4. The wafer bonding jig according to claim 1, characterized in that: The wafer bonding jig also includes a clamping unit; The clamping unit comprises a clamping member, the clamping member is rotatably disposed on the fixture body, and the clamping member is disposed on the fixture body to move along a direction perpendicular to the bearing area, and the rotation axis of the clamping member is perpendicular to the bearing area; When the isolation base moves in a direction parallel to the bearing area, the isolation member has at least an isolation position, and when the isolation member is located at the isolation position, the isolation member faces the bearing area in a direction perpendicular to the bearing area; The clamping member has at least a clamping position when rotating; when the clamping member is at the clamping position, the clamping member faces the bearing area along a direction perpendicular to the bearing area and faces the isolation member at the isolation position, and the isolation member is located between the clamping member and the bearing area.

5. The wafer bonding jig according to claim 4, characterized in that: The wafer bonding jig further includes a position detection unit. The clamping member has a detection portion. The position detection unit is arranged on the jig body. When the clamping member rotates, the detection portion passes through the position detection unit.

6. The wafer bonding jig according to claim 1, characterized in that: The wafer bonding jig also includes a stabilizing unit; The stabilizing unit is arranged on the fixture body and moves in a direction parallel to the bearing area. The stabilizing unit is pressed against the isolation base along one side of its movement direction, and the movement direction of the stabilizing unit is perpendicular to the movement direction of the isolation base.

7. The wafer bonding jig according to claim 6, characterized in that: The stabilizing unit includes a stabilizing member, and the isolating unit also includes an elastic member; The stabilizing member is disposed on the fixture body so as to move in a direction parallel to the bearing area; The elastic member is arranged on the isolation base or the stabilizing member, and the elastic member is located between the isolation base and the stabilizing member along the moving direction of the stabilizing member.

8. The wafer bonding jig according to any one of claims 1 to 7, characterized in that: The fixture body comprises a carrying plate and an outer plate, wherein the outer plate is arranged around the carrying plate, and the carrying plate is flexibly connected to the outer plate; The bearing area is located on one axial side of the bearing plate; The isolation unit is disposed on the outer disk; When the wafer bonding jig includes a clamping unit, the clamping unit is arranged on the outer plate.

9. The wafer bonding jig according to claim 8, characterized in that: The wafer bonding jig also includes a flexible connector, a gap is provided between the outer circumference of the carrier plate and the inner circumference of the outer plate, a first end of the flexible connector is connected to the carrier plate, a second end of the flexible connector is connected to the outer plate, and a hollow area is provided on the flexible connector between the first end and the second end.

10. A bonding device, characterized in that: A wafer bonding jig comprising a bonding chamber, a pressing head, a follower, and the wafer bonding jig according to any one of claims 1 to 9; The wafer bonding jig is disposed in the bonding chamber, and the pressure head is disposed in the bonding chamber and moves in a direction perpendicular to the bearing area; The follower is arranged on the pressure head and has a driving surface. When the follower moves with the pressure head toward the wafer bonding fixture, the driving surface contacts the mating surface and exerts a force to move the isolation base away from the bearing area.

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