Packaging device for semiconductor cleaning agent

Abstract

The embodiment of the utility model discloses a packaging device for a semiconductor cleaning agent. The device comprises a rack, a conveying assembly, a gun barrel assembly, an adjusting assembly and a wiping assembly. According to the embodiment of the utility model, when the semiconductor cleaning agent is packaged, the packaging material is conveyed to a corresponding position through the conveying assembly, and before the packaging material enters an area corresponding to the gun barrel assembly, the packaging material is clamped through the adjusting assembly and the space position of the packaging material is adjusted, so that the packaging material is separated from the rack and the conveying assembly; the packing material is far away from a packing area below the gun barrel assembly when the packing material is opposite to the gun barrel assembly, so that the packing material is prevented from being in contact with residual liquid dripped in the packing area; an inlet of the packing material and a discharge port of the gun barrel assembly are aligned, so that the semiconductor cleaning agent is loaded into the packing material; and after packaging is completed, the adjusting assembly continues to be used for conveying the packaging material to the wiping assembly to be wiped, cleanliness of the outer surface of the packaging material is further guaranteed, and subsequent packaging of the packaging material and use of a semiconductor cleaning agent are prevented from being affected.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical packaging equipment, in particular to a packaging device for semiconductor cleaning agents. Background Art

[0002] Semiconductor cleaning agents are key chemicals used to remove contaminants, organic matter, metal ions, etc. from the wafer surface during the semiconductor manufacturing process.

[0003] At present, the industry generally uses a special filling machine to package semiconductor cleaning agents. The filling machine generally includes a frame, a barrel mounted on the frame, and a conveyor belt. During packaging, the packaging material is transported to the barrel through the conveyor belt, and then the semiconductor cleaning agent is poured into the packaging material through the barrel to complete the packaging of the semiconductor cleaning agent. During the filling process, since there will still be residual liquid in the barrel after one filling, it is inevitable that the semiconductor cleaning agent will drip onto the packaging area of ​​the packaging material, which will cause the outer surface of the packaging material, especially the bottom, to be stained with residual liquid, affecting the subsequent packaging of the packaging material and the use of the semiconductor cleaning agent. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a packaging device for semiconductor cleaning agent to solve the problem that the packaging material is easily contaminated by residual liquid when packaging semiconductor cleaning agent.

[0005] The utility model provides a packaging device for semiconductor cleaning agent, comprising a frame, a conveying assembly, a barrel assembly, an adjusting assembly and a wiping assembly, wherein the wiping assembly is arranged at the rear of the barrel assembly according to the process flow sequence, wherein:

[0006] The conveying assembly is arranged on the frame and is used to convey packaging materials;

[0007] The gun barrel assembly is arranged on the frame and is used to load the semiconductor cleaning agent into the packaging material;

[0008] The adjustment assembly includes a mounting frame and a first clamping member connected to each other, wherein the mounting frame is slidably disposed on the frame, and the first clamping member is used to clamp the packaging material and is slidably disposed on the mounting frame, so that the packaging material is driven to approach or move away from the barrel assembly through the sliding of the mounting frame and the first clamping member;

[0009] A wiping assembly is arranged on the frame and is used for wiping the packaging material.

[0010] Based on the above-mentioned packaging device for semiconductor cleaning agent, when packaging the semiconductor cleaning agent, firstly, the empty packaging material is transported to the adjusting component by using the conveying component, and then the packaging material is clamped by the first clamping member, and the mounting frame slides relative to the frame so that the first clamping member drives the packaging material close to the barrel assembly. Before entering the packaging area of ​​the barrel assembly, the first clamping member slides relative to the mounting frame, thereby driving the packaging material away from the conveying component and the frame, so that the packaging material is away from the packaging area below the barrel assembly when it is relative to the barrel assembly, thereby avoiding the packaging material from contacting with the residual liquid dripping in the packaging area; after the packaging is completed, the mounting frame continues to slide a certain distance in the original direction, so that the first clamping member drives the packaging material away from the barrel assembly, and then the first clamping member slides relative to the mounting frame to put the packaging material back to the conveying component, so that the packaging material is away from the packaging area below the barrel assembly when it returns to the conveying component, and then the packaging material is transported to the wiping component to wipe the packaging material, further ensuring the cleanliness of the outer surface of the packaging material to avoid affecting the subsequent packaging of the packaging material and the use of the semiconductor cleaning agent.

[0011] In one embodiment of the above-mentioned packaging device for semiconductor cleaning agent, the wiping assembly includes a bracket, a second clamping member, a wiping member and a driving member, the bracket is arranged on the frame, the second clamping member is used to clamp the packaging material and is slidably arranged on the bracket to lift the packaging material away from or put it back to the conveying assembly, and the driving member is used to drive the wiping member to approach or move away from the packaging material clamped by the second clamping member, and drive the wiping member to rotate to wipe the packaging material.

[0012] In one embodiment of the above-mentioned packaging device for semiconductor cleaning agent, a receiving groove for receiving the wiping member is provided on the frame, and the driving member can drive the wiping member to move into or out of the receiving groove.

[0013] In one embodiment of the above-mentioned packaging device for semiconductor cleaning agent, the wiping member includes a base plate and a brush body detachably connected to the base plate.

[0014] In one embodiment of the above-mentioned packaging device for semiconductor cleaning agent, the packaging device also includes a guide assembly arranged on the frame, and the guide assembly is arranged in front of the barrel assembly according to the process flow sequence and is used to change the travel path of the packaging material so that the packaging material enters the clamping space of the first clamping member.

[0015] In one embodiment of the above-mentioned packaging device for semiconductor cleaning agent, the guiding component includes at least two guide plates arranged opposite to each other, and a drainage space is defined between the two opposite guide plates. Along the conveying direction of the conveying component, the cross-section of the drainage space gradually becomes smaller, so that the outlet of the drainage space is adapted for the packaging material to pass through.

[0016] In one embodiment of the above-mentioned packaging device for semiconductor cleaning agent, the guiding assembly also includes a partition and a diverter structure, the partition is arranged in the drainage space, and the diverter structure is rotatably connected to one end of the partition close to the barrel assembly, so that two flow limiting channels with variable cross-sections are defined between the diverter structure and the guide plate adjacent thereto, and when one of the packaging materials passes through one of the two flow limiting channels, the remaining packaging materials in the drainage space cannot pass through the other of the two flow limiting channels.

[0017] In one embodiment of the above-mentioned packaging device for semiconductor cleaning agent, the frame is further provided with a mounting column, the mounting column is provided with an elastic member, and is connected to the diversion structure through the elastic member.

[0018] In one embodiment of the above-mentioned packaging device for semiconductor cleaning agent, the diversion structure includes a connecting part and two guiding parts connected to the connecting part, the connecting part is rotatably connected to the partition, the two guiding parts are V-shaped, and their V-shaped openings face the adjusting component.

[0019] In one embodiment of the above-mentioned packaging device for semiconductor cleaning agent, a receiving groove is provided on the frame, and the receiving groove is opposite to the discharge port of the barrel assembly to receive the residual liquid of the semiconductor cleaning agent.

[0020] One or more of the above embodiments of the present invention have at least one or more of the following beneficial effects:

[0021] When packaging the semiconductor cleaning agent, firstly, the empty packaging material is transported to the adjusting component by using the conveying component, and then the packaging material is clamped by the first clamping member, and the mounting frame slides relative to the frame so that the first clamping member drives the packaging material close to the barrel assembly. Before entering the packaging area of ​​the barrel assembly, the first clamping member slides relative to the mounting frame, thereby driving the packaging material away from the conveying component and the frame, so that the packaging material is away from the packaging area below the barrel assembly when it is relative to the barrel assembly, thereby avoiding the packaging material from contacting the residual liquid dripping in the packaging area; after the packaging is completed, the mounting frame continues to slide a certain distance in the original direction, so that the first clamping member drives the packaging material away from the barrel assembly, and then the first clamping member slides relative to the mounting frame to put the packaging material back to the conveying component, so that the packaging material is away from the packaging area below the barrel assembly when it returns to the conveying component, and then the packaging material is transported to the wiping component to wipe the packaging material, further ensuring the cleanliness of the outer surface of the packaging material to avoid affecting the subsequent packaging of the packaging material and the use of the semiconductor cleaning agent.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The disclosure of the present invention will become easier to understand with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In addition, similar numbers in the drawings are used to represent similar components, among which:

[0024] Figure 1 It is a structural schematic diagram of a packaging device provided in an embodiment of the present application;

[0025] Figure 2 It is a front view for displaying a part of a packaging device provided in an embodiment of the present application;

[0026] Figure 3 yes Figure 1 The enlarged view of point A in the middle;

[0027] Figure 4 yes Figure 1 The enlarged view of point B in the middle;

[0028] Figure 5 yes Figure 1 Enlarged view of point C in the middle.

[0029] Description of Reference Numerals

[0030] 1. Frame; 11. Receiving groove; 12. Receiving groove; 2. Conveying assembly; 3. Barrel assembly; 31. Barrel; 4. Packing material; 5. Adjusting assembly; 51. Mounting frame; 52. First clamping member; 6. Wiping assembly; 61. Bracket; 62. Second clamping member; 63. Wiping member; 64. Driving member; 7. Guiding assembly; 71. Guide plate; 711. Drainage space; 712. First section; 713. Second section; 714. Third section; 715. Fourth section; 72. Partition; 73. Diversion structure; 731. Connecting part; 732. Guide part; 74. Mounting column; 75. Elastic member. DETAILED DESCRIPTION

[0031] Some embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0032] At present, when semiconductor cleaning agents are packaged, the residual liquid in the barrel will inevitably drip onto the packaging area of ​​the packaging material, causing the outer surface of the packaging material to be stained with the residual liquid, affecting the subsequent packaging of the packaging material and the use of the semiconductor cleaning agent.

[0033] Therefore, the present application creatively proposes a packaging device for semiconductor cleaning agent, which includes a frame, a conveying assembly, a barrel assembly, an adjusting assembly and a wiping assembly. When packaging the semiconductor cleaning agent, the conveying assembly is first used to convey the empty packaging material to the adjusting assembly, and then the packaging material is clamped by the first clamping member, and the mounting frame slides relative to the frame so that the first clamping member drives the packaging material close to the barrel assembly. Before entering the packaging area of ​​the barrel assembly, the first clamping member slides relative to the mounting frame, thereby driving the packaging material away from the conveying assembly and the frame, so that the packaging material is in contact with the barrel assembly. When aligning, the packaging material is far away from the packaging area below the barrel assembly, thereby preventing the packaging material from contacting the residual liquid dripping in the packaging area; after packaging is completed, the mounting frame continues to slide a certain distance in the original direction, so that the first clamping member drives the packaging material away from the barrel assembly, and then the first clamping member slides relative to the mounting frame to put the packaging material back to the conveying assembly, so that the packaging material is far away from the packaging area below the barrel assembly when it returns to the conveying assembly, and then the packaging material is conveyed to the wiping assembly to wipe the packaging material, thereby further ensuring the cleanliness of the outer surface of the packaging material and avoiding affecting the subsequent packaging of the packaging material and the use of semiconductor cleaning agent.

[0034] The present invention will be described in detail below through specific embodiments.

[0035] Reference Figures 1 to 5 As shown, the embodiment of the present application provides a packaging device for semiconductor cleaning agent, which includes a frame 1, a conveying assembly 2, a barrel assembly 3, an adjustment assembly 5 and a wiping assembly 6. The wiping assembly 6 is arranged at the rear of the barrel assembly 3 according to the process flow sequence. The conveying assembly 2 is arranged on the frame 1 and is used to convey the packaging material 4; the barrel assembly 3 is arranged on the frame 1 and is used to load the semiconductor cleaning agent into the packaging material 4; the adjustment assembly 5 includes a mounting frame 51 and a first clamping member 52 connected to each other, the mounting frame 51 is slidably arranged on the frame 1, and the first clamping member 52 is used to clamp the packaging material 4 and is slidably arranged on the mounting frame 51, so as to drive the packaging material 4 to approach or move away from the barrel assembly 3 through the sliding of the mounting frame 51 and the first clamping member 52;

[0036] The wiping assembly 6 is disposed on the frame 1 and is used for wiping the packaging material 4 .

[0037] It should be noted that the packaging material 4 generally refers to a container used to package solid, liquid, gas and other materials; in this embodiment, the packaging material 4 refers to a filling bottle used to package a semiconductor cleaning agent.

[0038] In some examples, the rack 1 includes legs and a support plate, and the support plate is in the shape of a rectangular parallelepiped as a whole; of course, the rack 1 can also be a frame composed of multiple rectangular channel steels, and the overall frame is in the shape of a rectangular parallelepiped; it can be understood that the support plate or frame or other similar structures can also be triangular prisms, pentagonal prisms, and other multi-prisms, as well as other irregular shapes, as long as the requirements for smoothly conveying the packaging material 4 and the packaging of the semiconductor cleaning agent are met.

[0039] In some examples, the conveying assembly 2 can be a conveying device such as a belt conveyor, a roller conveyor, or a chain conveyor, which only needs to meet the requirement of smoothly conveying the packaging material 4.

[0040] In some examples, the barrel assembly 3 may include one, two, or three or more barrels 31, so that a corresponding number of packaging materials 4 can be filled simultaneously; in this embodiment, the barrel assembly 3 includes a barrel 31, and the barrel 31 is connected to the corresponding semiconductor cleaning agent storage container through a pipeline and a valve so as to load the semiconductor cleaning agent into the packaging material 4.

[0041] It should be noted that the mounting frame 51 can directly slide with the rack 1, such as by setting a slide groove on the rack 1 and inserting the end of the mounting frame 51 into the slide groove; or the mounting frame 51 can be slidingly connected to the rack 1 through a sliding device such as a slider rail assembly, such as by fixing the rail on the rack 1 and then fixing the mounting frame 51 to the slider.

[0042] Similarly, the sliding cooperation between the first clamping member 52 and the mounting frame 51 can also be achieved through modules such as sliders and slide rails, such as using a slider and slide rail directly as the mounting frame 51.

[0043] It should be noted that, in order to improve the clamping effect and packaging efficiency, the number of the adjustment components 5 can be one group, two groups, or three groups or more, as an example rather than a limitation, refer to Figure 1 As shown, there are two groups of adjustment components 5, and the two groups of adjustment components 5 are arranged opposite to each other, so as to better clamp and transfer the packaging material 4. Of course, the two oppositely arranged first clamping members 52 can be close to or away from each other, so as to better cooperate in clamping the packaging material 4. For example, a linear drive member such as a cylinder or an electric cylinder is installed between the first clamping member 52 and the mounting frame 51. Among them, the sliding direction of the mounting frame 51 is parallel to the conveying direction of the conveying component 2, and the first clamping member 52 slides in a direction perpendicular to the conveying surface of the conveying component 2 (i.e., the vertical direction).

[0044] In some examples, the first clamping member 52 may be a component such as a robot arm or a cylinder clamp that can realize the clamping and releasing functions.

[0045] Specifically, when packaging the semiconductor cleaning agent, firstly, the empty packaging material 4 is placed on the conveying component 2 (i.e., the end of the frame 1 away from the wiping component 6), and the conveying component 2 conveys the empty packaging material 4 to the adjusting component 5, and then the two oppositely arranged first clamping members 52 clamp the packaging material 4 together and move in a direction perpendicular to the conveying surface to separate the packaging material 4 from the frame 1 or the conveying component 2, and then the mounting frame 51 slides relative to the frame 1 and approaches the barrel component 3 until the inlet of the packaging material 4 is directly opposite to the outlet of the barrel component 3. At this time, the packaging material 4 has already been separated from the packaging area below the barrel component 3 and will not be stained by the leaked liquid. Then the packaging material 4 can be adjusted according to the packaging requirements. The distance between the entrance and the discharge port of the barrel assembly 3 in the vertical direction is adjusted, so as to facilitate the loading of the semiconductor cleaning agent into the packaging material 4; after the packaging is completed, the mounting frame 51 continues to move in the original direction to bring the packaging material 4 away from the packaging area of ​​the barrel assembly 3 through the first clamping member 52, and then the first clamping member 52 slides relative to the mounting frame 51 in the direction close to the conveying assembly 2, so as to put the packaging material 4 back to the conveying surface of the conveying assembly 2; then the conveying assembly 2 conveys the packaging material 4 to the wiping assembly 6, and the wiping assembly 6 wipes the packaging material 4 to further prevent the outer surface of the packaging material 4 from being contaminated by the leaked liquid; finally, the packaging material 4 is conveyed to the next process through the conveying assembly 2.

[0046] In some examples, reference Figure 1 and Figure 4 As shown, the wiping component 6 includes a bracket 61, a second clamping member 62, a wiping member 63 and a driving member 64. The bracket 61 is arranged on the frame 1. The second clamping member 62 is used to clamp the packaging material 4 and is slidably arranged on the bracket 61 to lift the packaging material 4 away from or put it back to the conveying component 2. The driving member 64 is used to drive the wiping member 63 to approach or move away from the packaging material 4 clamped by the second clamping member 62, and drive the wiping member 63 to rotate to wipe the packaging material 4.

[0047] It should be noted that the shape and installation position of the wiping piece 63 can be set according to actual needs, such as being set based on the wiping position and wiping area of ​​the packaging material 4. For example, the wiping piece 63 can be set to be round or square, and the number of wiping pieces 63 can be set to one, two, or three or more.

[0048] In some examples, the second clamping member 62 can be a component such as a robot or a pneumatic clamp that can achieve grasping and releasing; in order to better achieve the clamping and wiping of the packaging material 4, the bracket 61 and the second clamping member 62 can be set in two, and the two second clamping members 62 are arranged opposite to each other, wherein the two oppositely arranged first clamping members 52 can be close to or away from each other; the bracket 61 can be a sliding device such as a slider rail assembly that is convenient for sliding connection with the second clamping member 62.

[0049] In some examples, the driving member 64 is an angle cylinder, and the wiper 63 is connected to the driving shaft of the driving member 64, so that the wiper 63 can move in a linear direction and rotate axially. Of course, the driving member 64 can also be a combination of two driving elements, such as a ball screw that can realize linear drive and a motor that can realize rotational drive, and the motor is installed on the nut of the ball screw, and the wiper 63 is installed on the driving shaft of the motor.

[0050] Specifically, when wiping the packaging material 4, the second clamping member 62 is first used to clamp the packaging material 4 to ensure the stability of the packaging material 4 during the wiping process, and the second clamping member 62 can be moved relative to the bracket 61 to make the packaging material 4 separate from the frame 1 and the conveying assembly 2, so that the wiping member 63 can wipe the bottom of the packaging material 4.

[0051] As an example and not limitation, refer to Figure 4 As shown, the wiping member 63 has one disc-shaped structure, and a receiving groove 11 for receiving the wiping member 63 is provided on the frame 1, and the driving member 64 can drive the wiping member 63 to move in or out of the receiving groove 11. Specifically, the wiping member 63 is located in the receiving groove 11 when not in operation. When the packaging material 4 moves to the wiping assembly 6, the second clamping member 62 clamps the packaging material 4, and adjusts the vertical distance between the bottom of the packaging material 4 and the wiping member 63 according to actual conditions, so that the driving member 64 drives the wiping member 63 to rotate to wipe the bottom of the packaging material 4; after wiping, the packaging material 4 is put back on the conveying assembly 2 through the second clamping member 62 so as to be conveyed to the next process; wherein, in order to facilitate the packaging material 4 to be put back on the conveying assembly 2, the bracket 61 can be slidably arranged on the frame 1.

[0052] In some examples, the wiper 63 includes a substrate and a brush body detachably connected to the substrate, so that the brush body can be replaced with one that matches the specifications of the packaging material 4, or the brush body can be replaced after its service life expires.

[0053] The brush body and the base plate can be connected by bolt connection, plug connection, clamp connection, etc. The brush body includes structures such as a water-absorbing cotton pad and bristles.

[0054] In some examples, a receiving groove 12 is provided on the frame 1, and the receiving groove 12 is opposite to the discharge port of the barrel assembly 3 to receive the residual liquid of the semiconductor cleaning agent.

[0055] The receiving groove 12 is in the shape of an elongated strip, which can receive more residual liquid while reducing the impact on the packaging material 4 .

[0056] In some examples, reference Figure 1 and Figure 5As shown, the packaging device also includes a guide assembly 7 arranged on the frame 1. The guide assembly 7 is arranged in front of the barrel assembly 3 according to the process flow sequence and is used to change the travel path of the packaging material 4 so that the packaging material 4 enters the clamping space of the first clamping member 52.

[0057] Specifically, after the packaging material 4 is placed on the conveying component 2, the packaging material 4 is conveyed by the conveying component 2 to the guiding component 7. The guiding component 7 will change the travel path of the packaging material 4 so that the packaging material 4 can be opposite to the clamping space of the first clamping member 52 after being conveyed out of the guiding component 7 and before entering the adjusting component 5, thereby allowing the packaging material 4 to enter the clamping space of the first clamping member 52.

[0058] In some examples, the guiding component 7 includes at least two oppositely arranged guide plates 71, and a drainage space 711 is defined between the two opposite guide plates 71. Along the conveying direction of the conveying component 2, the cross-section of the drainage space 711 gradually decreases, so that the outlet of the drainage space 711 can be adapted for the packaging material 4 to pass through.

[0059] In this embodiment, the guide plate 71 includes a first section 712, a second section 713, a third section 714 and a fourth section 715 which are integrally formed and arranged in sequence along the conveying direction. The two opposite first sections 712 and the two opposite third sections 714 are both fishtail-shaped, and the two opposite second sections 713 and the two opposite fourth sections 715 are both arranged in parallel, thereby realizing gradual adjustment of the position of the packaging material 4.

[0060] Specifically, at the first section 712, multiple packaging materials 4 can be accommodated at the same time, at the second section 713, the number of packaging materials 4 accommodated at the same time becomes less, and at the third section 714, the number of packaging materials 4 accommodated at the same time further decreases, until at the fourth section 715, only a certain number of packaging materials 4 can be accommodated and arranged individually in sequence along the conveying direction, to ensure that the packaging materials 4 can be opposite to the clamping space of the first clamping member 52 before entering the adjustment assembly 5, so that the first clamping member 52 clamps the packaging materials 4.

[0061] In some examples, in order to reduce congestion in the guiding assembly 7 during the transportation of the packaging material 4, the guiding assembly 7 also has a partition 72 and a diverter structure 73. The partition 72 is arranged in the drainage space 711, and the diverter structure 73 is rotatably connected to one end of the partition 72 close to the barrel assembly 3, so that two variable flow limiting channels are defined between the diverter structure 73 and the guide plate 71 adjacent thereto. When a packaging material 4 passes through one of the two flow limiting channels, the remaining packaging material 4 in the drainage space 711 cannot pass through either of the two flow limiting channels.

[0062] In this embodiment, the partition 72 is in the shape of a rectangular plate and is arranged along the conveying direction, and the main body of the partition 72 is located in the space defined by the two second sections 713, one end of the partition 72 extends into the space defined by the two third sections 714, and the diversion structure 73 is located in the space defined by the two third sections 714; the diversion structure 73 includes a connecting portion 731 and two guide portions 732 connected to the connecting portion 731, the connecting portion 731 is rotatably connected to the partition 72, the two guide portions 732 are V-shaped, and their V-shaped openings face the adjustment component 5.

[0063] Specifically, the initial cross-sections of the two flow limiting channels are the same size. When the packaging material 4 enters one of the two flow limiting channels, since the outer dimensions of the packaging material 4 are larger than the initial cross-section of the flow limiting channel, the diverter structure 73 will be pushed to rotate around the partition 72, thereby increasing the cross-section of the flow limiting channel through which the packaging material 4 is passing and decreasing the cross-section of the other flow limiting channel, thereby ensuring that the packaging material 4 can only pass through one flow limiting channel at the same time.

[0064] Furthermore, in some examples, a mounting post 74 is further provided on the frame 1 , and an elastic member 75 is provided on the mounting post 74 , and is connected to the diversion structure 73 via the elastic member 75 .

[0065] Specifically, when the packaging material 4 passes through a flow limiting channel, the elastic member 75 corresponding to the flow limiting channel will be compressed, while the other elastic member 75 will be stretched. After the packaging material 4 passes through the flow limiting channel, the compressed elastic member 75 and the stretched elastic member 75 will both return to their original state, thereby driving the diversion structure 73 back to its original position, so that subsequent packaging materials 4 can pass through in sequence.

[0066] In some examples, the elastic member 75 may be a cylindrical spring or other component.

[0067] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0068] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0069] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A packaging device for semiconductor cleaning agent, characterized in that: The packaging device comprises a frame, a conveying assembly, a barrel assembly, an adjusting assembly and a wiping assembly, wherein the wiping assembly is arranged at the rear of the barrel assembly according to the process sequence, wherein: The conveying assembly is arranged on the frame and is used to convey packaging materials; The gun barrel assembly is arranged on the frame and is used to load the semiconductor cleaning agent into the packaging material; The adjustment assembly includes a mounting frame and a first clamping member connected to each other, wherein the mounting frame is slidably disposed on the frame, and the first clamping member is used to clamp the packaging material and is slidably disposed on the mounting frame, so that the packaging material is driven to approach or move away from the barrel assembly through the sliding of the mounting frame and the first clamping member; The wiping assembly is arranged on the frame and is used for wiping the packaging material.

2. A packaging device for semiconductor cleaning agent according to claim 1, characterized in that: The wiping assembly includes a bracket, a second clamping member, a wiping member and a driving member. The bracket is arranged on the frame. The second clamping member is used to clamp the packaging material and is slidably arranged on the bracket to lift the packaging material away from or put it back to the conveying assembly. The driving member is used to drive the wiping member to approach or move away from the packaging material clamped by the second clamping member, and drive the wiping member to rotate to wipe the packaging material.

3. A packaging device for semiconductor cleaning agent according to claim 2, characterized in that: The frame is provided with a receiving groove for receiving the wiping member, and the driving member can drive the wiping member to move into or out of the receiving groove.

4. A packaging device for semiconductor cleaning agent according to claim 2, characterized in that: The wiping member comprises a base plate and a brush body detachably connected to the base plate.

5. The packaging device for semiconductor cleaning agent according to claim 1, characterized in that: The packaging device also includes a guide assembly arranged on the frame, which is arranged in front of the barrel assembly according to the process flow sequence and is used to change the travel path of the packaging material so that the packaging material enters the clamping space of the first clamping member.

6. A packaging device for semiconductor cleaning agent according to claim 5, characterized in that: The guiding assembly includes at least two guide plates arranged opposite to each other, and a drainage space is defined between the two opposite guide plates. Along the conveying direction of the conveying assembly, the cross-section of the drainage space gradually decreases, so that the outlet of the drainage space is adapted for the packaging material to pass through.

7. A packaging device for semiconductor cleaning agent according to claim 6, characterized in that: The guiding assembly also includes a partition and a diverter structure, wherein the partition is arranged in the drainage space, and the diverter structure is rotatably connected to one end of the partition close to the barrel assembly, so that two flow limiting channels with variable cross-sections are defined between the diverter structure and the guide plate adjacent thereto, and when one of the packaging materials passes through one of the two flow limiting channels, the remaining packaging materials in the drainage space cannot pass through either of the two flow limiting channels.

8. A packaging device for semiconductor cleaning agent according to claim 7, characterized in that: The frame is also provided with a mounting column, and the mounting column is provided with an elastic member, and is connected to the diversion structure through the elastic member.

9. A packaging device for semiconductor cleaning agent according to claim 7, characterized in that: The diversion structure comprises a connecting portion and two guiding portions connected to the connecting portion, the connecting portion is rotatably connected to the partition, the two guiding portions are V-shaped, and the V-shaped openings thereof face the regulating assembly.

10. A packaging device for semiconductor cleaning agent according to any one of claims 1 to 9, characterized in that: The frame is provided with a receiving groove, which is opposite to the discharge port of the gun barrel assembly to receive the residual liquid of the semiconductor cleaning agent.

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