Integrated circuit chip turret type pressing rod material taking and placing device

Abstract

The utility model relates to an integrated circuit chip turret type pressing rod material taking and placing device which comprises a turret system, a plurality of function stations are distributed on the outer side of the turret system, a plurality of chip adsorption assemblies are evenly arranged on the peripheral side of the rotating end of the turret system, and the chip adsorption assemblies correspond to the function stations in position. Each chip adsorption assembly can move up and down in the vertical direction, a plurality of downward pressing mechanisms are arranged above the chip adsorption assemblies, the downward pressing mechanisms correspond to the functional stations in position, and each downward pressing mechanism is used for driving one chip adsorption assembly to downwards press and adsorb the chips. The chip adsorption device is reasonable in structure, the chip adsorption assembly is driven to move downwards and adsorb the chip in a downward pressing mode, control is simple, and the chip taking and placing stability is effectively improved.

Description

Technical field:

[0002] The utility model relates to a turret-type pressure rod material taking and placing device for integrated circuit chips. Background technology:

[0004] Integrated circuit chips need to be tested and sorted (such as high-temperature test sorting or normal temperature test sorting) before leaving the factory to screen out defective products. At present, when testing and sorting integrated circuit chips, turret-type test sorting equipment is mostly used. This equipment uses a turret to drive the chips to move between different test stations. However, in the existing turret-type test sorting equipment, when moving integrated circuit chips between different test stations, vacuum adsorption chips are used, and then high-speed rotation is driven by a motor to achieve station switching, but when taking and placing chips at the station, solenoid valve switching control is still relied on. This solenoid valve switching control method of taking and placing materials has high control costs and system instability. For this reason, it is necessary to make improvements to this technical problem, and this case is born from this. Utility model content:

[0006] The utility model makes improvements on the problems existing in the above-mentioned prior art, that is, the technical problem to be solved by the utility model is to provide an integrated circuit chip turret pressure rod material taking and placing device, which has reasonable structural design and stable chip taking and placing.

[0007] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an integrated circuit chip turret pressure rod picking and unloading device, including a turret system with a plurality of functional stations distributed on the outside, a plurality of chip adsorption components are evenly arranged on the outer peripheral side of the rotating end of the turret system, the plurality of chip adsorption components correspond to the positions of the plurality of functional stations, each chip adsorption component can move up and down vertically, and a plurality of pressing mechanisms are arranged above the plurality of chip adsorption components, the plurality of pressing mechanisms correspond to the positions of the plurality of functional stations, and each pressing mechanism is used to drive a chip adsorption component to press down and adsorb the chip.

[0008] Furthermore, the chip adsorption assembly includes a moving rod and a vacuum suction pen which are distributed in sequence from top to bottom and are both vertically arranged. An upper limit block is arranged at the upper end of the moving rod, and a lower limit block is arranged between the lower end of the moving rod and the upper end of the vacuum suction pen; a plurality of moving guide blocks are evenly arranged on the outer peripheral side of the rotating end of the turret system, and the plurality of moving guide blocks correspond to the positions of the plurality of chip adsorption assemblies. A vertical through hole is provided on the moving guide block, and the moving rod slides through the vertical through hole. A first return spring arranged on the outside of the moving rod is abutted between the top of the moving guide block and the bottom of the upper limit block.

[0009] Furthermore, the pressing mechanism includes a pressing motor, a cylindrical cam, a cam follower column, a pressing moving block and a pressing support seat which are arranged in sequence from top to bottom, the pressing motor is vertically installed on the top of a fixed seat, the output shaft of the pressing motor is connected to the cylindrical cam, and the pressing motor drives the cylindrical cam to rotate; the cam follower column is horizontally installed on the upper end of the pressing moving block, and the outer circumferential surface of the cam follower column abuts against the bottom surface of the cylindrical cam; the pressing support seat is fixedly connected to the lower end of the fixed seat; the left and right ends of the pressing moving block are respectively equipped with a vertically arranged pressing rod and a lifting guide rod, and the pressing rod and the lifting guide rod both slide vertically through the pressing support seat, and a second return spring sleeved on the outside of the pressing rod abuts against the bottom of the pressing support seat and the pressing moving block.

[0010] Furthermore, a pressing head for contacting the top of the moving rod is provided at the lower end of the pressing rod, and the pressing head is made of a plastic part.

[0011] Furthermore, the fixing seat is installed on a fixing platform above the turret system.

[0012] Furthermore, the rotating end of the turret system is also connected to a vacuum distribution chamber, and the vacuum suction pen of each chip adsorption assembly is connected to the vacuum distribution chamber through an air pipe.

[0013] Furthermore, the downward pressure support seat is L-shaped, and a detection block is installed at the bottom of the horizontal side of the downward pressure support seat. The detection block is provided with a detection port to facilitate the passage of the lifting guide rod. The detection block is provided with a detection sensor corresponding to the position of the detection port and used to detect the lifting guide rod.

[0014] Compared with the prior art, the utility model has the following effects: the utility model has a reasonable structure, uses a downward pressure method to drive the chip adsorption component to move downward and adsorb the chip, the control is relatively simple, and the stability of chip placement is effectively improved. Description of the drawings:

[0016] Figure 1 It is a three-dimensional structural schematic diagram of an embodiment of the utility model;

[0017] Figure 2 It is a partial structural schematic diagram of an embodiment of the utility model;

[0018] Figure 3 It is a schematic diagram of the structure of the turret system in the embodiment of the utility model;

[0019] Figure 4 yes Figure 3 Schematic diagram of the coordination structure of a single chip adsorption component and a turret system;

[0020] Figure 5 It is a schematic diagram of the structure of the chip adsorption component in the embodiment of the utility model;

[0021] Figure 6 It is a three-dimensional structural schematic diagram of the pressing mechanism in the embodiment of the utility model;

[0022] Figure 7 This is a schematic diagram of the main structure of the pressing mechanism in the embodiment of the utility model;

[0023] Figure 8 yes Figure 7 A schematic diagram of a local section in FIG.

[0024] Fig. 9 It is a three-dimensional structural schematic diagram of a cylindrical cam in an embodiment of the utility model. Specific implementation method:

[0026] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0027] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] like Figures 1 to 9 As shown, the utility model is an integrated circuit chip turret pressure rod material taking and placing device, comprising a turret system 1 with a plurality of functional stations 2 distributed on the outside, a plurality of chip adsorption components 3 are evenly arranged on the outer peripheral side of the rotating end of the turret system 1, the plurality of chip adsorption components 3 correspond to the positions of the plurality of functional stations 2, each chip adsorption component 3 can move vertically up and down, and a plurality of pressing mechanisms 4 are arranged above the plurality of chip adsorption components 3, the plurality of pressing mechanisms 4 correspond to the positions of the plurality of functional stations 2, and each pressing mechanism 4 is used to drive a chip adsorption component 3 to press down and adsorb a chip 5. When working, the turret system 1 drives the plurality of chip adsorption components 3 to rotate, so as to switch between the plurality of functional stations 2, while the pressing mechanism 4 keeps the position unchanged and does not rotate with the turret system; when the chip adsorption component 3 rotates to the right above the functional station 2, the pressing mechanism 4 drives the chip adsorption component 3 located right below it to press down, and the chip adsorption component 3 can adsorb the chip; if the chip adsorption component stops supplying gas, the chip can be lowered. The chip adsorption component is driven to move downward and adsorb the chip by pressing down, which is relatively simple to control and effectively improves the stability of chip placement.

[0029] In this embodiment, the chip adsorption assembly 3 includes a moving rod 6 and a vacuum pen 7 which are sequentially distributed from top to bottom and are both vertically arranged. The bottom surface of the moving rod 6 contacts the top surface of the vacuum pen 7. An upper limit block 8 is fixedly arranged at the upper end of the moving rod 6. A lower limit block 9 is fixedly arranged between the lower end of the moving rod 6 and the upper end of the vacuum pen 7, that is, the upper limit block 8, the moving rod 6, the lower limit block 9 and the vacuum pen 7 are connected to form a whole. Further, the upper end of the moving rod 6 passes through the upper limit block 8 and is used to contact the pressing mechanism 4.

[0030] In this embodiment, a plurality of movable guide blocks 10 are evenly arranged on the outer peripheral side of the rotating end of the turret system 1. The plurality of movable guide blocks 10 correspond to the positions of the plurality of chip adsorption components 3. A vertical through hole 11 is arranged on the movable guide block 10. The movable rod 6 slides through the vertical through hole 11. A first return spring 12 sleeved on the outer side of the movable rod 6 is abutted between the top of the movable guide block 10 and the bottom of the upper limit block 8. When the movable rod 6 moves downward under the drive of the pressing mechanism 4, the first return spring 12 is in a compressed state. After the pressing mechanism 4 is separated from the movable rod 6, the first return spring 12 drives the movable rod 6 to move upward by elastic force, so that the entire chip adsorption component is reset upward.

[0031] In this embodiment, the pressing mechanism 4 includes a pressing motor 13, a cylindrical cam 14, a cam follower column 15, a pressing moving block 16 and a pressing support seat 17 which are arranged in sequence from top to bottom. The pressing motor 13 is vertically installed on the top of a fixed seat 18, and the output shaft of the pressing motor 13 is connected to the cylindrical cam 14, and the pressing motor 13 drives the cylindrical cam 14 to rotate; the cam follower column 15 is horizontally installed on the upper end of the pressing moving block 16, and the outer circumferential surface of the cam follower column 15 is in contact with the bottom surface of the cylindrical cam 14. The cylindrical cam 14 converts the rotational motion of the pressing motor 13 into the vertical linear motion of the cam follower column 15, and the cam follower column 15 drives the pressing moving block 16 to move synchronously. The pressing support seat 17 is fixedly connected to the lower end of the fixed seat 18; the left and right ends of the pressing moving block 16 are respectively installed with a vertical pressing rod 19 and a lifting guide rod 20, and the pressing rod 19 and the lifting guide rod 20 are both vertically slid through the pressing support seat 17, and a second return spring 21 sleeved on the outer side of the pressing rod 19 is abutted between the pressing support seat 17 and the bottom of the pressing moving block 16. When working, the pressing rod 19 moves vertically synchronously with the pressing moving block 16, the pressing rod 19 is used to press the moving rod 6, and the lifting guide rod 20 plays a role of moving guide to improve the stability of pressing; and when the pressing rod 19 is pressed down, the second return spring 21 is in a compressed state, and after the pressing is completed, the second return spring 21 uses elastic force to drive the pressing rod 19 and the pressing moving block 16 to reset upward.

[0032] In this embodiment, a pressing head 22 for contacting the top of the moving rod 6 is provided at the lower end of the pressing rod 19. The pressing head 22 is made of plastic to reduce the wear on the top of the moving rod when pressing down.

[0033] In this embodiment, the fixing seat 18 is installed on a fixing platform 23 above the turret system 1 .

[0034] In this embodiment, the rotating end of the turret system 1 is also connected to a vacuum distribution chamber 24 , and the vacuum suction pen 7 of each chip adsorption assembly is connected to the vacuum distribution chamber 24 via an air pipe 25 .

[0035] In another embodiment, the pressing support seat 17 is L-shaped, and a detection block 26 is installed at the bottom of the horizontal side of the pressing support seat 17. The detection block 26 is provided with a detection port 27 for the lifting guide rod to pass through, and the detection block 26 is provided with a detection sensor 28 corresponding to the position of the detection port 27 and used to detect the lifting guide rod 19. The detection sensor detects whether the lifting guide rod moves downward to the detection port, so as to determine whether the entire pressing mechanism is working normally.

[0036] Specific implementation process: the cylindrical cam 14 converts the rotational motion of the downward pressure motor 13 into the vertical linear motion of the cam follower column 15, and the cam follower column 15 drives the downward pressure moving block 16 to move synchronously, and the downward pressure rod 19 moves vertically synchronously with the downward pressure moving block 16, the downward pressure rod 19 presses the moving rod 6 and pushes the moving rod 6 to move downward, and the moving rod 6 drives the vacuum suction pen 7 to move and adsorb or release the chip; then the second return spring 21 uses the elastic force to drive the downward pressure rod 19 and the downward pressure moving block 16 to reset upward, and the first return spring 12 uses the elastic force to drive the moving rod 6 to move upward, so as to realize the upward reset of the vacuum suction pen 7.

[0037] If the present invention discloses or involves components or structures that are fixedly connected to each other, then, unless otherwise stated, the fixed connection can be understood as: a detachable fixed connection (for example, connection using bolts or screws), and can also be understood as: a non-detachable fixed connection (for example, riveting, welding). Of course, the mutual fixed connection can also be replaced by an integrated structure (for example, manufactured by one-piece molding using a casting process) (except where it is obviously impossible to use an one-piece molding process).

[0038] In addition, unless otherwise stated, the terms used to indicate positional relationships or shapes in any of the technical solutions disclosed in the above utility model include states or shapes that are approximate, similar or close thereto.

[0039] Any component provided by the utility model can be assembled from multiple separate components, or can be a separate component manufactured by an integrated molding process.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the utility model can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the utility model, which should be included in the scope of the technical solution for protection of the utility model.

Claims

1. An integrated circuit chip turret pressure rod loading and unloading device, comprising a turret system with a plurality of functional stations distributed on the outside, a plurality of chip adsorption components are evenly arranged on the outer peripheral side of the rotating end of the turret system, and the plurality of chip adsorption components correspond to the positions of the plurality of functional stations, characterized in that: Each chip adsorption component can move vertically up and down. A plurality of pressing mechanisms are arranged above the plurality of chip adsorption components. The plurality of pressing mechanisms correspond to the positions of a plurality of functional stations. Each pressing mechanism is used to drive a chip adsorption component to press down and adsorb the chip.

2. The integrated circuit chip turret pressure rod loading and unloading device according to claim 1, characterized in that: The chip adsorption assembly includes a moving rod and a vacuum suction pen which are distributed in sequence from top to bottom and are both vertically arranged. An upper limit block is arranged at the upper end of the moving rod, and a lower limit block is arranged between the lower end of the moving rod and the upper end of the vacuum suction pen; a plurality of moving guide blocks are evenly arranged on the outer peripheral side of the rotating end of the turret system, and the plurality of moving guide blocks correspond to the positions of the plurality of chip adsorption assemblies, a vertical through hole is arranged on the moving guide block, and the moving rod slides through the vertical through hole, and a first return spring which is sleeved on the outside of the moving rod is abutted between the top of the moving guide block and the bottom of the upper limit block.

3. The integrated circuit chip turret pressure rod loading and unloading device according to claim 2, characterized in that: The pressing mechanism includes a pressing motor, a cylindrical cam, a cam follower column, a pressing moving block and a pressing support seat which are arranged in sequence from top to bottom, the pressing motor is vertically installed on the top of a fixed seat, the output shaft of the pressing motor is connected to the cylindrical cam, and the pressing motor drives the cylindrical cam to rotate; the cam follower column is horizontally installed on the upper end of the pressing moving block, and the outer circumferential surface of the cam follower column abuts against the bottom surface of the cylindrical cam; the pressing support seat is fixedly connected to the lower end of the fixed seat; the left and right ends of the pressing moving block are respectively provided with a vertically arranged pressing rod and a lifting guide rod, and the pressing rod and the lifting guide rod both slide vertically through the pressing support seat, and a second return spring sleeved on the outside of the pressing rod abuts against the bottom of the pressing support seat and the pressing moving block.

4. The integrated circuit chip turret pressure rod loading and unloading device according to claim 3, characterized in that: The lower end of the pressing rod is provided with a pressing head for contacting the top of the moving rod, and the pressing head is made of plastic.

5. The integrated circuit chip turret pressure rod loading and unloading device according to claim 3, characterized in that: The fixing seat is installed on a fixing platform above the turret system.

6. The integrated circuit chip turret pressure rod loading and unloading device according to claim 2, characterized in that: The rotating end of the turret system is also connected to a vacuum distribution chamber, and the vacuum suction pen of each chip adsorption assembly is connected to the vacuum distribution chamber through an air pipe.

7. The integrated circuit chip turret pressure rod loading and unloading device according to claim 3, characterized in that: The downward pressure support seat is L-shaped, and a detection block is installed at the bottom of the horizontal side of the downward pressure support seat. The detection block is provided with a detection port for facilitating the passage of the lifting guide rod. The detection block is provided with a detection sensor corresponding to the position of the detection port and used to detect the lifting guide rod.

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