Semiconductor refrigeration structure for forced convection heat dissipation

Abstract

The utility model discloses a semiconductor refrigeration structure for forced convection heat dissipation, which is characterized in that an axial flow fan and a radiator are sequentially arranged in an outer shell from top to bottom, and the air outlet end of the axial flow fan works vertically towards the direction of the radiator; a plurality of air guide ports for realizing air inlet work are formed in the upper end surface of the outer shell; a heat dissipation window communicated with the outside is formed in the lower side of the side end face of the outer shell. The side end face, corresponding to the mounting position of the axial fan, of the upper side of the outer shell is of a closed structure, the semiconductor chilling plate is mounted at the lower end of the radiator, and the radiating face of the semiconductor chilling plate is attached to the lower end of the radiator. A forced convection heat dissipation air channel is formed between an air guide opening and each heat dissipation window through an outer shell structure with a closed upper part and a hollow lower part, so that all airflow is forced to enter from the upper part of the shell and is vertically blown into heat dissipation teeth of a heat dissipation device, the heat dissipation efficiency of the refrigeration structure is maximized, the whole refrigeration structure is simple, the heat dissipation performance is reliable, and the service life is prolonged. The practicability is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor refrigeration and heat dissipation structures, and relates to a semiconductor refrigeration structure for forced convection heat dissipation. Background Art

[0002] In the prior art, there is a built-in heat dissipation system for semiconductor refrigeration plates. However, the existing heat dissipation structure of semiconductor refrigeration plates mainly performs heat dissipation through the structure of a radiator and a fan. During the heat dissipation process, the heat in the semiconductor refrigeration plate is transferred to the radiator, and then the radiator is cooled by the fan, thereby achieving the heat dissipation effect of the semiconductor refrigeration plate. However, the overall heat dissipation efficiency of the heat dissipation structure of semiconductor refrigeration plates currently on the market is low, and the actual heat dissipation effect that can be achieved is poor, which cannot meet the use requirements. Utility Model Content

[0003] In order to solve the implementation technical problems, the utility model adopts the following technical solutions:

[0004] A semiconductor refrigeration structure for forced convection heat dissipation, comprising an outer shell, an axial flow fan, a radiator, and a semiconductor refrigeration sheet;

[0005] The outer shell is a hollow structure, and the axial flow fan and the radiator are installed in the outer shell from top to bottom, and the air outlet end of the axial flow fan works vertically toward the radiator;

[0006] The upper end surface of the outer shell is formed with a plurality of air guide ports for realizing air intake, and the air inlet end of the axial flow fan is connected to the air guide ports;

[0007] A heat dissipation window communicating with the outside is formed on the lower side of the side end surface of the outer shell, and a forced convection heat dissipation air duct is formed between the air guide port and each heat dissipation window;

[0008] The upper side of the outer shell, corresponding to the side end surface of the installation position of the axial flow fan, is a closed structure.

[0009] The semiconductor cooling sheet is installed at the lower end of the radiator, and the heat dissipation surface of the semiconductor cooling sheet is attached to the lower end of the radiator to realize heat conduction from the semiconductor cooling sheet to the radiator.

[0010] As a further solution of the utility model: the upper end surface of the radiator is formed with a plurality of groups of heat dissipation teeth extending upward;

[0011] In order to improve the heat dissipation efficiency of each heat dissipation tooth, each heat dissipation tooth is distributed in a rectangular array, and the gaps between heat dissipation teeth in the same row are connected to form a heat dissipation duct; and each heat dissipation duct is connected and coordinated with the heat dissipation window on the outer shell.

[0012] As a further solution of the utility model: the radiator is made of one of aluminum or copper materials.

[0013] As a further solution of the utility model: thermal conductive silicone grease sheets are attached to the heat dissipation surface and the heat absorption surface of the semiconductor refrigeration sheet.

[0014] As a further solution of the utility model: it also includes: a heat-conducting aluminum plate, which is installed at the lower end of the outer shell and is attached to the heat-absorbing surface of the semiconductor refrigeration plate.

[0015] The beneficial effects of the utility model are as follows: through the outer shell structure with a sealed upper part and a hollow lower part, a forced convection heat dissipation duct is formed between the air guide port and each heat dissipation window, ensuring that all airflow is forced to enter from the upper part of the shell and blown vertically into the heat dissipation teeth of the radiator, ensuring the maximization of the heat dissipation efficiency of the refrigeration structure, the overall refrigeration structure is simple, the heat dissipation performance is reliable, and the practicability is strong. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model.

[0017] Figure 2 It is a structural schematic diagram of the outer shell in the utility model.

[0018] Figure 3 It is a structural schematic diagram of the radiator in the utility model. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. It should be understood that the present application is not limited to the example embodiments disclosed herein. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] The utility model provides Figures 1 to 3 In the embodiment of the utility model, a semiconductor refrigeration structure for forced convection heat dissipation is composed of an outer shell 1, an axial flow fan 2, a radiator 3, and a semiconductor refrigeration sheet 4;

[0024] The outer shell 1 is a hollow structure, and the axial flow fan 2 and the radiator 3 are installed in the outer shell 1 from top to bottom, and the air outlet end of the axial flow fan 2 is vertically facing the radiator 3 to work;

[0025] The upper end surface of the outer shell 1 is formed with a plurality of air guide ports 11 for realizing air intake, and the air intake end of the axial flow fan 2 is connected to the air guide port 11; when the axial flow fan 2 is working, external air enters from the air guide port 11 and blows toward the radiator 3;

[0026] A heat dissipation window 13 communicating with the outside is formed on the lower side of the side end surface of the outer shell 1, and a forced convection heat dissipation air duct is formed between the air guide port 11 and each heat dissipation window 13. When the axial flow fan 2 is working, the external air enters from the air guide port 11 and blows toward the radiator 3, and then is discharged from each heat dissipation window 13, thereby achieving the heat dissipation effect of the radiator 3;

[0027] The upper side of the outer shell 1, corresponding to the side end face of the installation position of the axial flow fan 2, is a closed structure 12. During the heat dissipation process, it can effectively prevent the air introduced from the axial flow fan 2 from leaking from places other than the heat dissipation window 13, ensuring the maximization of the heat dissipation efficiency.

[0028] The semiconductor cooling sheet 4 is installed at the lower end of the radiator 3 , and the heat dissipation surface of the semiconductor cooling sheet 4 is attached to the lower end of the radiator 3 , so as to realize the heat conduction work from the semiconductor cooling sheet 4 to the radiator 3 .

[0029] Furthermore, the upper end surface of the heat sink 3 is formed with a plurality of groups of heat dissipation teeth 31 extending upward, and the heat dissipation area of ​​the heat sink 3 can be effectively expanded through the structure of each heat dissipation tooth 31;

[0030] In order to improve the heat dissipation efficiency of each heat dissipation tooth 31, each heat dissipation tooth 31 is distributed in a rectangular array, and the gap positions between the heat dissipation teeth 31 in the same column and the heat dissipation teeth 31 in the same row are connected to form a heat dissipation duct; and each heat dissipation duct is connected and coordinated with the heat dissipation window 13 on the outer shell 1; during the heat dissipation processing, the air introduced by the axial flow fan 2 will enter each heat dissipation duct, and then be discharged through the heat dissipation window 13, so as to achieve the effect of efficient heat dissipation of each heat dissipation tooth 31.

[0031] Preferably, the heat sink 3 is made of aluminum or copper, which has good thermal conductivity.

[0032] Furthermore, thermally conductive silicone grease sheets are attached to both the heat dissipation surface and the heat absorption surface of the semiconductor refrigeration sheet 4. The thermally conductive silicone grease sheets improve the overall thermal conductivity, so that the semiconductor refrigeration sheet 4 can absorb and dissipate heat more efficiently.

[0033] Furthermore, the structure of the radiator 3 also includes: a heat-conducting aluminum plate 5, which is installed at the lower end of the outer shell 1 and is in contact with the heat-absorbing surface of the semiconductor refrigeration plate 4; it is used as the heat-absorbing working surface of the radiator 3 and is in contact with the heating unit, which can achieve the effect of increasing the heat-absorbing surface of the semiconductor refrigeration plate 4 and improve the heat absorption efficiency.

[0034] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "including a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0035] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor refrigeration structure for forced convection heat dissipation, characterized in that: It consists of an outer shell, an axial flow fan, a radiator, and a semiconductor cooling sheet; The outer shell is a hollow structure, and the axial flow fan and the radiator are installed in the outer shell from top to bottom, and the air outlet end of the axial flow fan works vertically toward the radiator; The upper end surface of the outer shell is formed with a plurality of air guide ports for realizing air intake, and the air inlet end of the axial flow fan is connected to the air guide ports; A heat dissipation window communicating with the outside is formed on the lower side of the side end surface of the outer shell, and a forced convection heat dissipation air duct is formed between the air guide port and each heat dissipation window; The upper side of the outer shell, corresponding to the side end surface of the installation position of the axial flow fan, is a closed structure; The semiconductor cooling sheet is installed at the lower end of the radiator, and the heat dissipation surface of the semiconductor cooling sheet is attached to the lower end of the radiator to realize heat conduction from the semiconductor cooling sheet to the radiator.

2. A semiconductor refrigeration structure for forced convection heat dissipation according to claim 1, characterized in that: The upper end surface of the radiator is formed with a plurality of groups of heat dissipation teeth extending upward; In order to improve the heat dissipation efficiency of each heat dissipation tooth, each heat dissipation tooth is distributed in a rectangular array, and the gaps between heat dissipation teeth in the same row are connected to form a heat dissipation duct; and each heat dissipation duct is connected and coordinated with the heat dissipation window on the outer shell.

3. A semiconductor refrigeration structure for forced convection heat dissipation according to any one of claims 1 or 2, characterized in that: The heat sink is made of aluminum or copper.

4. The semiconductor refrigeration structure for forced convection heat dissipation according to claim 1, characterized in that: Thermally conductive silicone grease sheets are attached to the heat dissipation surface and the heat absorption surface of the semiconductor refrigeration chip.

5. The semiconductor refrigeration structure for forced convection heat dissipation according to claim 1, characterized in that: Also includes: The heat-conducting aluminum plate is installed at the lower end of the outer shell and is attached to the heat-absorbing surface of the semiconductor refrigeration sheet.

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