Automatic adhesive tape adhesive force measuring tool

Abstract

The utility model discloses an automatic adhesive tape adhesive force measuring tool, which comprises a wafer frame and a workbench used for moving the wafer frame, an adhesive tape and a wafer are arranged on the wafer frame, and the wafer is adhered to the top surface of the adhesive tape; the device further comprises a movable weighing sensor support, the free end of the weighing sensor support is provided with a pickup part, the pickup part is used for stripping the wafer from the adhesive tape, and the pickup part is connected with a weighing sensor used for measuring the force needed for stripping the wafer from the adhesive tape. The force required for stripping the wafer / crystal grain from the adhesive tape is quantified through the weighing sensor, so that a process engineer can be assisted to set the setting parameters of the UV curing equipment more quickly and more accurately, and the crystal grain pickup efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, and more specifically, to an automatic tape adhesion force measuring tool. Background Art

[0002] During the processing of semiconductor wafers, the wafers are usually adhered to tape, which is usually UV curing tape. After the wafers are cut, the tape can be used to fix the die. The wafers and the tape are placed in the wafer frame together. To ensure that the machine can smoothly pick up and transfer the die, the wafer frame needs to use UV curing equipment to cure the UV glue applied on the tape. Specifically, the parameters of the UV curing equipment (such as UV light intensity, curing time, etc.) are set according to the actual situation to reduce the adhesion effect of the UV curing tape on the die.

[0003] How to control the force of the die picking device according to the adhesion of UV glue to the die has a great impact on the processing efficiency and yield rate of the die. If the UV glue is too sticky, it is difficult for the pick-up device to pick up the die. If the adhesion between the tape and the wafer / die is too poor, it cannot fix the wafer / die, which will cause the die to fly out when the wafer frame is transferred.

[0004] When a new UV tape or a different size of wafer / die is applied, the adhesion effect of the tape on the die will also change. It is difficult for process engineers to accurately set parameters on the UV curing equipment to keep the adhesion effect of the tape on the die at the optimal value, which affects production efficiency. Therefore, a tool that can accurately measure the adhesion effect of the tape on the die is urgently needed. Utility Model Content

[0005] The purpose of the utility model is to overcome the defect that there is no tool on the existing semiconductor production line that can accurately measure the adhesion effect of the tape on the grain, and to provide an automatic tape adhesion measurement tool that can measure the size of the force required to peel the grain from the tape during the process of picking up the grain, thereby quantifying the adhesion effect of the tape on the grain.

[0006] The technical solution adopted by the utility model is: it includes a wafer frame support, and a workbench for moving the wafer frame support, the top surface of the wafer frame support is abutted against a wafer frame, the wafer frame is provided with tape and a wafer, and the wafer is bonded to the top surface of the tape. Of course, the wafer frame support may not be provided, and the movement effect can also be achieved by directly connecting the wafer frame to the workbench. In addition, the utility model also includes a movable weighing sensor support, a pick-up portion is provided at one end of the weighing sensor, the pick-up portion is used to peel the wafer from the tape, and the pick-up portion is connected to a weighing sensor for measuring the force required to peel the wafer from the tape.

[0007] Furthermore, a side of the pickup portion in contact with the wafer is connected to a second vacuum source for adsorbing the wafer.

[0008] Furthermore, it also includes a porous plate, which is arranged on the side of the tape away from the wafer, and retractable ejector pins are arranged in the holes of the porous plate, and the ejector pins can push the tape when extending out of the porous plate.

[0009] Furthermore, the ejector pin is coaxially arranged with the picking portion.

[0010] Furthermore, it also includes a base, the workbench is movably arranged on the top surface of the base, and the weighing sensor bracket is rotatably arranged on the top surface of the base.

[0011] Furthermore, an ionizing fan is provided on the base, and the ionizing fan faces the wafer.

[0012] Furthermore, it also includes a controller and a power supply, wherein the power supply is electrically connected to the workbench, and the controller is communicatively connected to the workbench for controlling the workbench to move along the top surface of the base.

[0013] Furthermore, it also includes a data storage device, which is communicatively connected to the weighing sensor and is used to receive and store data measured by the weighing sensor.

[0014] Furthermore, it also includes a waste box for receiving the grains picked up by the picking part.

[0015] Compared with the prior art, the beneficial effect of the present invention is that the force required to peel the wafer / die from the tape is quantified by the weighing sensor, and the force data can be fed back to the process engineer, thereby assisting the process engineer to set the setting parameters of the UV curing equipment more quickly and accurately, thereby helping to improve the efficiency of die picking. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the utility model from another angle;

[0018] Figure 3 This is a reference diagram for the workflow of this utility model.

[0019] In the attached figure:

[0020] 1-wafer frame support; 2-workbench; 3-wafer frame; 4-tape; 5-wafer; 6-sensor support; 7-pick-up part; 8-weighing sensor; 9-porous plate; 10-thrust pin; 11-base; 12-ionization fan; 13-data storage device; 15-wafer box. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with specific implementation methods. The drawings are only used for illustrative purposes and cannot be understood as limiting the present invention. In order to better illustrate the present embodiment, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product. For those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0022] The same or similar reference numerals in the drawings of the embodiments of the present utility model correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "front", "rear", "left", "right" and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for exemplary explanations and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances. In addition, in the present utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features.

[0023] Embodiment 1

[0024] In the process of preparing semiconductor chips, a grid-shaped predetermined division line is generally formed on the surface of the wafer, and the semiconductor wafer is divided into multiple regions. Each region is divided along the predetermined division line to produce individual semiconductor grains. During the division and transfer process, the wafer or grain is adhered by tape. Figure 1 or Figure 2As shown, this embodiment provides an automatic tape adhesion force measurement tool, which is suitable for measuring the force of peeling the die from the tape, quantifying the adhesion effect of the tape on the die, and providing corresponding parameter basis for process engineers. The tool described in this embodiment includes: a workbench 2 and a wafer frame 3, the wafer frame 3 is installed on the workbench 2, and the position of the wafer frame 3 is controlled by moving the workbench 2. The wafer frame 3 is provided with a tape 4 and a wafer 5 to be picked up, and the wafer 5 is adhered to the top surface of the tape 4.

[0025] In some other embodiments, in order to adapt to and fix wafer frames 3 of various shapes and sizes, a wafer frame holder 1 may be provided for assembling the wafer frame 3. The wafer frame holder 1 replaces the wafer frame 3 and is connected to the workbench, and the wafer frame 3 is fixed on the wafer frame holder 1.

[0026] It should be noted that the wafer 5 described in this embodiment may be an undivided wafer 5 body, or may be a divided small-sized wafer 5 (ie, a die).

[0027] The tool further includes a movable load cell support 6, one end of which is provided with a pick-up portion 7, and the pick-up portion 7 can move along the surface of the wafer 5 under the control of the load cell support 6. The pick-up portion 7 is used to peel and pick up the wafer 5 from the top surface of the tape 4, and the pick-up portion 7 is connected to a load cell 8 for measuring the force required to peel the wafer 5 from the tape 4.

[0028] See also Figure 3 , by moving the workbench 2 or the load cell bracket 6, or both at the same time, so that the pick-up part 7 and the picked-up wafer 5 are kept on the same vertical line, and then the load cell bracket 6 controls the pick-up part 7 to move downward and pick up the wafer 5, so that the wafer 5 is peeled off from the tape 4. When the wafer 5 is completely separated from the tape 4, the pick-up part 7 transports the wafer 5 to other designated locations. During the picking process, the load cell 8 will measure the force required for the pick-up part 7 to pick up the wafer 5 from the tape 4 and record the data.

[0029] Repeat the above actions and move the picking portion 7 to the top surface of the wafer 5 at different positions to measure the picking force of the wafer 5 at different positions. In some other embodiments, the tool further includes a data storage device 13, which is communicatively connected to the weighing sensor 8 and is used to receive and store the data measured by the weighing sensor 8.

[0030] Once the pickup force measurement of the wafer 5 at all positions is completed, the process engineer will evaluate whether the recorded pickup force is suitable for picking up the wafer 5. For example, if the weighing sensor 8 shows that the pickup part 7 needs to provide a force of 100g to pick up the wafer 5, and normally only 40g of force can be used to pick it up, then the wafer 5 needs to be sent back to the UV curing machine together with the tape 4 and the wafer frame 3, and the process engineer will adjust the parameters of the UV curing machine to reduce the adhesion effect of the UV curing tape 4 on the wafer 5 and reduce the pickup force to 40g.

[0031] When a new tape 4 or a wafer 5 of a different size is applied, the adhesion effect of the tape 4 on the wafer 5 will also change. Through the weighing sensor 8, the process engineer can quickly determine the adhesion effect of the tape 4, so as to conveniently adjust the parameters of the UV curing machine so that the adhesion effect of the tape 4 on the wafer 5 is always maintained at the optimal value, thereby improving the UPH (units per hour) on the assembly line. If further curing is required to reduce the adhesion of the tape 4 to the wafer 5, the wafer frame 3 or the wafer frame holder 1 is moved back to the UV curing machine. If the picking force of the pick-up unit 7 on the wafer 5 is sufficient, the wafer frame 3 or the wafer frame holder 1 can be moved to the die picking device to pick up, transfer, place, etc. the wafer 5.

[0032] Embodiment 2

[0033] like Figure 2 As shown, this embodiment is improved on the basis of the first embodiment. Specifically, a porous plate 9 is added, and the porous plate 9 is arranged on the side of the tape 4 away from the wafer 5. A retractable ejector pin 10 is arranged in the hole of the porous plate 9, and the ejector pin 10 can push the tape 4 upward when extended. The ejector pin 10 is coaxially arranged with the pick-up portion 7 so as to accurately eject the wafer 5.

[0034] The porous plate 9 can provide a stable base for the adhesive tape 4. The porous plate 9 is connected to a first vacuum source (not shown in the figure), which is used to enable the porous plate 9 to generate a vacuum when it contacts the adhesive tape 4, thereby tightly fitting the adhesive tape 4 to the end surface of the porous plate 9, in order to avoid the entire adhesive tape 4 from being pushed up into a convex arc shape when the ejector pin 10 is extended. In this process, the adhesion between the adhesive tape 4 and the wafer 5 causes the edge of the wafer 5 to be subjected to a downward force, causing the edge of the wafer 5 to be easily broken.

[0035] The ejector pin 10 may be one or more. This embodiment is illustratively described by taking one ejector pin 10 as an example. The porous plate 9 has a certain thickness, and the thickness is greater than or equal to the length of the ejector pin 10, so that the ejector pin 10 can be completely hidden in the porous plate 9 when it is not extended. The wafer 5 to be picked up (i.e., the grain to be ejected) is positioned on the tape 4 on the small hole on the end face of the porous plate 9, and the ejector pin 10 can contact the side of the tape 4 away from the wafer 5 when it is extended. During the wafer 5 picking process, the ejector pin 10 pushes the wafer 5 to be picked up upward (away from the small hole), so that the wafer 5 to be picked up is gradually separated from the tape 4 from the edge. Further, the wafer 5 to be picked up is held by the picking portion 7, and the wafer 5 is completely separated from the tape 4, and then the wafer 5 is transported to be attached to the substrate or transported to other locations.

[0036] Embodiment 3

[0037] like Figure 1 As shown, this embodiment provides another automatic tape adhesion force measurement tool, including: a wafer frame holder 1, a workbench 2 and a wafer frame 3, wherein the wafer frame 3 is mounted on the wafer frame holder 1, and the wafer frame holder 1 is mounted on the workbench 2, and the position of the wafer frame 3 is controlled by the movement of the workbench 2. The wafer frame 3 is provided with a tape 4 and a wafer 5 to be picked up, and the wafer 5 is adhered to the top surface of the tape 4. A movable weighing sensor holder 6 is provided with a picking portion 7 at the free end of the weighing sensor holder 6, and the picking portion 7 can move along the surface of the wafer 5 under the control of the weighing sensor holder 6. The picking portion 7 is used to peel and pick up the wafer 5 from the top surface of the tape 4, and the picking portion 7 is connected to a weighing sensor 8 for measuring the force required to peel the wafer 5 from the tape 4. In addition, a base 11 is provided, the workbench 2 is provided on the top surface of the base 11, and the workbench 2 is electrically connected to a power source (not shown in the figure), and the workbench 2 is communicatively connected to a controller (not shown in the figure). Under the drive of the power source and the control of the controller, the workbench 2 can move along the top surface of the base 11 to adjust the position of the wafer frame 3.

[0038] The weighing sensor bracket 6 is rotatably arranged on the top surface of the base 11. One end of the weighing sensor bracket 6 is rotatably connected to the top surface of the base 11, and the other end is connected to the pick-up portion 7 through the weighing sensor 8. The end surface of the pick-up portion 7 that abuts against the wafer 5 is the pick-up surface. In this embodiment, the pick-up portion 7 also includes a plurality of through holes (not shown in the figure) extending to the pick-up surface, and a second vacuum source (not shown in the figure), and the second vacuum source is transmitted to the pick-up surface through the plurality of through holes to generate an adsorption force on the pick-up surface to hold the wafer 5 to be picked up.

[0039] The base 11 is also provided with an ionizing fan 12, which faces the wafer 5 and is used to ionize the wafer 5 area. The purpose of providing the ionizing fan 12 is to meet the electrostatic discharge (ESD) requirement. The pick-up portion 7 intermittently contacts the wafer 5, which may generate static electricity, and the ionizing fan 12 can prevent the static electricity from damaging the wafer 5.

[0040] Since the weighing sensor bracket 6 is rotatable, the area it sweeps on the top surface of the base 11 is circular or sector-shaped, and the radius length of the circle or sector is the length of the weighing sensor bracket 6 .

[0041] In some other embodiments, a waste box 15 is further provided, and the waste box 15 is used to receive the wafers 5 or crystal grains picked up by the picking portion 7, so as to realize the recovery and reuse of the tested wafers 5 or crystal grains.

[0042] In the specific contents of the above-mentioned specific implementation methods, the various technical features can be combined in any non-contradictory manner. In order to make the description concise, not all possible combinations of the above-mentioned technical features are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] Obviously, the above embodiments of the utility model are only examples for clearly explaining the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. Automatic tape adhesion measurement tool, characterized in that, The invention comprises a wafer frame (3) and a workbench (2) for moving the wafer frame (3), wherein an adhesive tape (4) and a wafer (5) are arranged on the wafer frame (3), and the wafer (5) is bonded to the top surface of the adhesive tape (4); and further comprises a movable weighing sensor bracket (6), wherein one end of the weighing sensor bracket (6) is provided with a pick-up portion (7), wherein the pick-up portion (7) is used to peel the wafer (5) from the adhesive tape (4), and the pick-up portion (7) is connected to a weighing sensor (8) for measuring the force required to peel the wafer (5) from the adhesive tape (4).

2. The automatic tape adhesion measurement tool according to claim 1, characterized in that: The side of the pickup portion (7) in contact with the wafer (5) is connected to a second vacuum source for adsorbing the wafer (5).

3. The automatic tape adhesion measurement tool according to claim 1, characterized in that: It also comprises a porous plate (9), the porous plate (9) being arranged on the side of the adhesive tape (4) facing away from the wafer (5), and a retractable ejector pin (10) being arranged in the holes of the porous plate (9), and the ejector pin (10) being able to push the adhesive tape (4) when extending out of the porous plate (9).

4. The automatic tape adhesion measurement tool according to claim 3, characterized in that: The ejector pin (10) is coaxially arranged with the picking portion (7).

5. The automatic tape adhesion measurement tool according to claim 1, characterized in that: It also includes a base (11), the workbench (2) is movably arranged on the top surface of the base (11), and the weighing sensor bracket (6) is rotatably arranged on the top surface of the base (11).

6. The automatic tape adhesion measurement tool according to claim 5, characterized in that: An ionizing fan (12) is also provided on the base (11), and the ionizing fan (12) faces the wafer (5).

7. The automatic tape adhesion measurement tool according to claim 5, characterized in that: It also comprises a controller and a power supply, wherein the power supply is electrically connected to the workbench (2), and the controller is communicatively connected to the workbench (2) and is used to control the workbench (2) to move along the top surface of the base (11).

8. The automatic tape adhesion measurement tool according to claim 1, characterized in that: It also includes a data storage device (13), which is communicatively connected to the weighing sensor (8) and is used to receive and store data measured by the weighing sensor (8).

9. The automatic tape adhesion measurement tool according to claim 1, characterized in that: It also includes a waste box (15) for receiving the grains picked up by the picking portion (7).

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