LED packaging structure, LED module and LED light-emitting device

Abstract

The embodiment of the utility model provides an LED packaging structure, an LED module and an LED light-emitting device, and the LED packaging structure comprises a substrate which is provided with an LED chip; a support frame, wherein the support frame is arranged on the substrate; a voltage stabilizing diode; wherein the substrate is provided with a functional area enclosed by the support frame; and at least part of the voltage stabilizing diode is located outside the functional area. According to the embodiment of the invention, at least part of the voltage stabilizing diode is arranged outside the functional area enclosed by the support frame, so that the occupation of the functional area can be reduced while electrostatic protection is provided for the LED chip.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of LED technology, and more particularly to an LED packaging structure, an LED module and an LED light-emitting device. Background Art

[0002] ESD (Electro-Static Discharge) protection capability is an important indicator of LED (Light Emitting Diode) device performance. As the ESD requirements of LEDs continue to increase, the existing LED packaging structure usually adopts the method of adding a voltage regulator diode to prevent static electricity from damaging the LED chip.

[0003] However, in the related art, since the Zener diode and the LED chip are usually arranged in the functional area of ​​the LED, the occupancy rate of the functional area is relatively high. Utility Model Content

[0004] In view of this, multiple embodiments of this specification are dedicated to providing an LED packaging structure, an LED module and an LED light-emitting device, which can provide electrostatic protection for the LED chip while reducing the occupancy of the functional area.

[0005] One embodiment of the present specification provides an LED packaging structure, comprising: a substrate, on which an LED chip is mounted; a bracket frame, which is arranged on the substrate; and a Zener diode; wherein the substrate has a functional area surrounded by the bracket frame; and the Zener diode is at least partially located outside the functional area.

[0006] Optionally, the support frame covers a portion of the substrate to form a frame area; and the voltage regulator diode is located in the frame area.

[0007] Optionally, at least a portion of the surface of the voltage regulator diode is covered with white glue.

[0008] Optionally, the voltage-stabilizing diode is a Zener diode.

[0009] Optionally, the substrate includes a base material and an LED electrode arranged on the base material; wherein the LED electrode includes a positive electrode and a negative electrode, and the Zener diode is soldered between the positive electrode and the negative electrode by a solder paste eutectic process.

[0010] Optionally, an isolation channel is provided between the positive electrode and the negative electrode; the positive electrode and the negative electrode respectively have a concave area at an edge close to one side of the isolation channel; and both ends of the voltage regulator diode are respectively welded to the concave areas of the positive electrode and the negative electrode.

[0011] Optionally, the surface of the concave area is a rough surface.

[0012] Optionally, the concave area has a concave surface facing away from the substrate; and the concave surface has an opening for filling solder paste.

[0013] Optionally, the bracket frame has an outer edge in the arrangement direction of the positive electrode and the negative electrode; the distance between the side of the voltage regulator diode facing the outer edge and the outer edge ranges from 0 to 0.785 mm.

[0014] An embodiment of the present specification further provides an LED module, comprising the LED packaging structure described in any of the aforementioned embodiments.

[0015] One embodiment of the present specification further provides an LED light-emitting device, comprising the LED packaging structure or LED module described in any of the aforementioned embodiments.

[0016] The multiple implementations provided in this specification can reduce the occupation of the functional area while providing electrostatic protection for the LED chip by disposing at least a portion of the voltage-stabilizing diode outside the functional area surrounded by the frame of the bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a top view of an LED packaging structure with electrostatic protection function in the related technology provided in this specification.

[0018] Figure 2 A top view of an LED packaging structure provided in accordance with an embodiment of the present disclosure.

[0019] Figure 3 A cross-sectional view of an LED packaging structure provided in accordance with an embodiment of the present disclosure.

[0020] Figure 4 A cross-sectional view of an LED packaging structure provided in accordance with an embodiment of the present disclosure.

[0021] Figure 5 A cross-sectional view of an LED packaging structure provided in accordance with an embodiment of the present disclosure.

[0022] Figure 6 A cross-sectional view of an LED packaging structure provided in accordance with an embodiment of the present disclosure.

[0023] Figure 7 A top view of an LED packaging structure provided in accordance with an embodiment of the present disclosure.

[0024] Figure 8 The LED packaging structure provided in this specification is suitable for the example diagram of 3030 size LED design.

[0025] Fig. 9 The LED packaging structure provided for this specification is suitable for example diagrams of 5730 size LED designs.

[0026] Fig.10 The LED packaging structure provided for this specification is suitable for example diagrams of 5050 size LED designs.

[0027] Fig.11 A schematic diagram of a method for preparing an LED packaging structure provided in one embodiment of the present specification. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0029] In the description of the embodiments of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0030] See also Figure 1 In the related art, in order to meet the requirements of LED devices for ESD protection performance, an LED packaging structure with electrostatic protection function is usually designed. For example, Figure 1 The LED packaging structure shown. The LED packaging structure includes an LED chip 2a, a bracket frame 3a, and a voltage-stabilizing diode 4a arranged on a substrate 1a. The LED chip 2a is arranged in a functional area surrounded by the LED bracket frame 3a on the substrate 1a. One end of the voltage-stabilizing diode 4a is electrically connected to the positive electrode 101a of the substrate 1a by using a solid crystal method, and the other end is electrically connected to the negative electrode 102a by a wire bonding process. It can be understood that based on the reverse breakdown characteristics of the voltage-stabilizing diode, Figure 1 By connecting it in parallel with the LED chip 2a in the circuit, it can effectively prevent static electricity from damaging the LED chip 2a.

[0031] However, since the voltage-stabilizing diode 4a is also arranged in the functional area enclosed by the LED bracket frame 3a on the substrate 1a, a certain space of the functional area is occupied by the voltage-stabilizing diode 4a. The functional area of ​​the LED packaging structure has limited space, and if the occupancy rate is too high, the overall performance of the LED packaging structure will be reduced.

[0032] Therefore, it is necessary to provide an LED packaging structure that can provide electrostatic protection for the LED chip while reducing the occupancy of the functional area, so as to effectively solve the problems existing in the related technology.

[0033] See also Figure 2 and Figure 3 An embodiment of the present specification provides an LED packaging structure, including a substrate 11 , an LED chip 12 , a bracket frame 13 , a voltage regulator diode 14 and an LED electrode 15 .

[0034] The substrate 11 may include a base material and an LED electrode 15 disposed on the base material. The base material may be made of ceramic, silicon, etc., and the LED electrode may be made of metal, such as copper or iron. The LED electrode 15 may include an anode 151 and a cathode 152, and an isolation channel 16 for insulation is provided between the anode 151 and the cathode 152.

[0035] The LED chip 12 can be used as a core semiconductor element for generating light in the LED packaging structure, and is used to convert electrical energy into light energy. When the LED packaging structure is working, when current passes through the LED chip 12, electrons and holes recombine in the PN junction area, releasing energy and emitting in the form of photons, thereby achieving luminescence. The LED chip 12 can be mounted on the substrate 11 and electrically connected to the LED electrode 15. Specifically, the LED chip 12 can be fixedly bonded to the substrate 11 by a solid crystal method, and the electrodes at both ends of the LED chip 12 can be electrically connected to the positive electrode 151 and the negative electrode 152 according to polarity by a wire bonding process. The electrical connection between the LED chip 12 and the LED electrode 15 can also be achieved by other processes, and this specification does not make specific restrictions on this.

[0036] In addition to the LED chip 12, the LED packaging structure may also include an LED bracket. The LED bracket may serve as a base of the LED packaging structure, not only providing mechanical support for the LED chip 12, but also having functions such as heat dissipation, isolation, and optimization of optical performance.

[0037] Generally, the LED bracket can be a bowl-cup structure, and the bracket frame 13 can be used as a component of the LED bracket to provide protection and isolation for the LED chip 12. The bracket frame 13 can be set on the substrate 11, and the bracket frame 13 covers a part of the substrate 11 to form a frame area 17. Specifically, the LED chip 12 can be injection-molded around the substrate 11, and the material used as the bracket frame 13, such as transparent adhesive, can be specifically EMC (epoxy molding compound), PCT (polycyclohexane dimethanol terephthalate), PPA (polyphthalamide) and the like.

[0038] It can be understood that the area around the LED chip 12 where the bracket frame material is injected can cover a partial area of ​​the surface of the substrate 11, which can form a frame area 17, and the frame area can serve as a boundary to enclose an intermediate area on the surface of the substrate 11. The intermediate area can serve as a functional area 18 of the LED packaging structure, and together with the bracket frame 13 around it, it constitutes a bowl-cup structure of the LED bracket.

[0039] because Figure 2 The top view of the LED packaging structure, the frame area 17 is blocked by the frame of the bracket, this specification provides Figure 2 The LED packaging structure shown is a cross-sectional schematic diagram taken along MN and viewed from direction a, that is, Figure 3 . Combined Figure 2 and Figure 3 , the position areas of the border area 17 and the functional area 18 on the substrate 11 can be clearly seen.

[0040] The voltage regulator diode 14 is used as a clamping element to protect the LED chip 12 and prevent the LED chip 12 from being damaged by static electricity. Specifically, the voltage regulator diode 14 can be electrically connected to the LED electrode 15 of the substrate 11, so that the voltage regulator diode 14 and the LED chip 12 are connected in parallel between the LED electrode 15, so as to realize the static electricity protection effect of the voltage regulator diode 14 on the LED chip. The voltage regulator diode 14 and the LED electrode 15 of the substrate 11 can be connected using a lead wire or by other methods such as welding.

[0041] In the present embodiment, the Zener diode 14 is at least partially located outside the functional area 18. Specifically, the Zener diode 14 can be welded on the substrate 11, and at least a portion of the Zener diode 14 can be located in the border area 17, and the rest is located in the functional area 18. In this way, the occupation of the functional area can be reduced, which not only optimizes the layout of components in the LED packaging structure and improves the design flexibility of components in the LED packaging structure, but also has a certain degree of effect on improving other aspects of the performance of the LED packaging structure. For example, the LED packaging structure will generate heat when it is working. If the occupancy rate of the functional area is high, it may affect the efficiency of the heat conduction path and reduce the heat dissipation area, thereby causing the temperature of the LED chip to rise and easily be damaged. By reducing the occupation of the functional area, the possibility of heat dissipation problems due to excessive occupancy of the functional area can be reduced, the LED chip can be prevented from being damaged, and the reliability of the LED packaging structure can be improved.

[0042] In some embodiments, the voltage regulator diode 14 may be entirely located within the frame area 17. The voltage regulator diode 14 is completely covered by the material of the bracket frame 13. In this case, the voltage regulator diode 14 may be entirely located outside the functional area, further reducing the occupation of the functional area.

[0043] Specifically, the position of the Zener diode 14 can be set before the material of the bracket frame 13 is injection-molded, and then the Zener diode 14 can be at least partially or completely covered when the material of the bracket frame 13 is injection-molded to form an integrated LED bracket.

[0044] In some embodiments, the voltage-stabilizing diode 14 can also be connected in parallel with the LED chip 12 by means of leads, and the position of the voltage-stabilizing diode 14 can be flexibly set. For example, at least part of the voltage-stabilizing diode 14 can be set in the bracket frame 13 without contacting the substrate 11. Of course, the voltage-stabilizing diode 14 can also be set in a position outside other functional areas, as long as it is ensured to maintain a parallel state with the LED chip 12.

[0045] In some embodiments, at least a portion of the surface of the voltage zener diode 14 may be covered with white glue. Figure 1 In the LED packaging structure shown, a Zener diode is usually selected as the voltage regulator diode 14a for use, and the appearance of the Zener diode is usually black, so it will absorb part of the light emitted by the LED chip 12a, resulting in a reduction in the luminous flux and affecting the luminous efficiency of the LED packaging structure. By covering at least part of the surface of the voltage regulator diode 14 with white glue, the high reflectivity of white to light can be used to reduce the absorption of the light emitted by the LED chip 12 to a certain extent, increase the luminous flux, and improve the luminous efficiency of the LED packaging structure. Specifically, the white glue can be covered on the surface of the voltage regulator diode 14 by dispensing, coating, injection molding, etc. Of course, in the case of using voltage regulator diodes with other color appearances in the LED packaging structure, such as brown, red, etc., the voltage regulator diode will also have a certain degree of light absorption. By covering at least part of the surface of the voltage regulator diode with white glue, based on similar principles, the light absorption can also be reduced to a certain extent and the luminous flux can be increased.

[0046] In some embodiments, the voltage regulator diode 14 is optionally a Zener diode.

[0047] In some embodiments, optionally, the Zener diode 14 may also be completely covered by white glue, which can further reduce light absorption and improve luminous flux.

[0048] In some embodiments, the voltage-stabilizing diode 14 can be soldered between the LED electrodes 15 by a solder paste eutectic process. Specifically, a Zener diode pad can be designed between the positive electrode 151 and the negative electrode 152, and the pad is implanted with the voltage-stabilizing diode 14 by applying solder paste to form a eutectic. Compared with the wire bonding process, the electrical connection between the voltage-stabilizing diode 14 and the LED electrode 15 can be achieved by using the solder paste eutectic process, which can improve the stability and reliability of the fixation of the voltage-stabilizing diode 14, thereby improving the ESD performance of the LED packaging structure.

[0049] See also Figure 2-Figure 4 . In some embodiments, the positive electrode 151 and the negative electrode 152 respectively have a concave area 153 at the edge of one side close to the isolation channel 16, and the two ends of the Zener diode 14 are respectively welded on the concave areas 153 of the positive electrode 151 and the negative electrode 152. Specifically, the concave area 153 can be used as a concave pad, which is formed by stamping the corresponding positions at the edges of the positive and negative electrodes, and the lower groove 153 can also be formed by other methods, such as cutting, etching, ultrasound, etc., which are not specifically limited. The surface of the concave area 153 can be dotted with solder paste 19 to weld the Zener diode 14. Specifically, the surface of the concave area 153 can include a concave surface 154 facing away from the substrate, and a side surface adjacent to the concave surface 154. Solder paste 19 can be dotted on the concave surface 154 and the side surface to fix it with the Zener diode 14 by welding.

[0050] See also Figure 5 In some embodiments, the surface of the concave region 153 may be a rough surface. The rough surface may increase the eutectic thrust when filling the solder paste, making the welding structure between the Zener diode 14 and the concave region 153 more solid, improving stability and reliability, and thus improving ESD performance. Specifically, the rough surface may be configured as follows: Figure 4 The corrugated shape shown can of course be set to other shapes to achieve the effect of enhancing the eutectic thrust, and no specific limitation is made to this.

[0051] See also Figure 6 In some embodiments, the lower concave surface 154 may have an opening 155 for filling solder paste. Specifically, the lower concave surface 154 may be punched twice to form the opening 155. By providing the opening 155 on the lower concave surface 154, more solder paste can be filled on the pad, further increasing the eutectic thrust, and improving the stability and reliability of welding.

[0052] In some embodiments, multiple openings may be provided on the concave surface 154 , such as 2-3 openings at equal intervals, or openings may be provided on the side of the concave area 153 to fill more solder paste and improve stability.

[0053] See also Figure 7In some embodiments, the support frame 13 has an outer edge 131 in the arrangement direction of the positive electrode 151 and the negative electrode 152. The outer edge 131 may face one side of the voltage regulator diode 14 in the extension direction of the isolation channel 16. Preferably, there is a spacing d between the side of the voltage regulator diode 14 facing the outer edge 131 and the outer edge 131, and the value of d may be in the range of 0 to 0.785 mm. By controlling the spacing between the side of the voltage regulator diode 14 facing the outer edge 131 and the outer edge of the support frame 13 within the range, a certain functional area can be guaranteed, and it also has a good effect for avoiding light absorption of the voltage regulator diode. It can be understood that if the spacing d between the side of the voltage regulator diode 14 facing the outer edge 131 and the outer edge 131 is set larger, in order to enable the glue of the support frame 13 with injection molding on all sides to cover at least part of the voltage regulator diode 14, the area occupied by the frame area 17 on the substrate 11 will be relatively large, which will compress the area of ​​the functional area 18.

[0054] In some embodiments, the voltage regulator diode 14 may include a solid-state silicon Zener diode. Specifically, the solid-state silicon Zener diode may be a double-pad structure so as to be welded to the positive electrode 151 and the negative electrode 152 respectively. The solid-state silicon Zener diode may be specifically divided into a forward Zener, a reverse Zener, and a bidirectional Zener, and the Zener type may be selected according to the finished product requirements of the LED packaging structure.

[0055] See also Figure 2 ,as well as Figure 8-Figure 10 The LED packaging structure provided in the above embodiments can be applicable to LED designs of different sizes, such as 2835 size, 3030 size, 5050 size, 5730 size, etc. Figure 2 For an example of a 2835 size LED design, Figure 7 For example, the design is suitable for 3030 size LEDs. Figure 8 For an example of a 5730 size LED design, Fig. 9 This is an example of an LED design suitable for a size of 5050. For LED designs of different sizes, the LED packaging structure provided in the above embodiments can be applied to achieve the technical effects described in the above embodiments, and has universality and flexibility.

[0056] The embodiments of the present specification may provide an LED module, including an LED packaging structure as in any of the aforementioned embodiments. The LED module may be used as a component unit of an LED display device or a lighting device. Specifically, the LED module may also include a control unit, a drive circuit, and electronic components with current limiting, filtering, and other functions. In some embodiments, the LED module may also include other components, such as a polarizing plate, a CF layer, a TFT layer, and the like.

[0057] The embodiments of this specification may also provide an LED light-emitting device, including an LED packaging structure or an LED module as described in any of the aforementioned embodiments. The LED light-emitting device may be a lighting device, and may specifically include lighting fixtures, such as LED filaments, LED light strips, LED special-shaped lights, safety indicator lights, mining lamps, etc., and may also include automotive LED lights, such as position lights, brake lights, turn signals, daytime running lights, atmosphere lights, etc. The lighting device may also include optical components, such as lenses, reflectors, etc., or mounting structures, such as hangers, suspension devices, mounting brackets, etc. The LED light-emitting device may also be a display device, and may specifically include LED digital tubes, LED display panels, LED display screens, LED TV walls, etc.

[0058] See also Fig.11 The embodiment of the present specification also provides a method for preparing an LED packaging structure, and the method may include the following steps.

[0059] S110: Arranging a voltage stabilizing diode on the substrate; the voltage stabilizing diode and the LED chip are connected in parallel between the LED electrodes of the substrate;

[0060] S120: According to the position of the Zener diode, a plastic material is injected onto the substrate to form a bracket frame, so that the Zener diode is covered by the bracket frame; wherein the bracket frame covers a portion of the substrate to form a frame area, and the LED chip is located in a functional area surrounded by the frame area.

[0061] In this embodiment, by injecting plastic around the voltage regulator diode to form an integrally formed bracket, not only is the integration better, but the integrated structure is more compact, no additional package size is added, and the space occupation is smaller. In addition, the integrally formed bracket makes the voltage regulator diode have no external connection points, which can reduce the risk of ESD failure caused by poor connection points, thereby improving reliability.

[0062] It should be understood that the specific examples herein are only intended to help those skilled in the art to better understand the embodiments of the present specification, rather than to limit the scope of the present invention.

[0063] It can be understood that in the various implementations of this specification, the size of the sequence number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the implementation methods of this specification.

[0064] It can be understood that the various embodiments described in this specification can be implemented individually or in combination, and the embodiments of this specification are not limited to this.

[0065] Unless otherwise specified, all technical and scientific terms used in the embodiments of this specification have the same meaning as those generally understood by those skilled in the art of the technical field of this specification. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the scope of this specification. The term "and / or" used in this specification includes any and all combinations of one or more related listed items. The singular forms of "a", "above", and "the" used in the embodiments of this specification and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0066] The above is only a specific implementation of this specification, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in this specification, which should be included in the protection scope of this specification. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An LED packaging structure, characterized in that: include: A substrate, on which an LED chip is mounted; A bracket frame, wherein the bracket frame is arranged on the substrate; Zener diode; Wherein, the substrate has a functional area surrounded by the frame of the bracket; and the voltage regulator diode is at least partially located outside the functional area.

2. The LED packaging structure according to claim 1, characterized in that: The support frame covers a part of the substrate to form a frame area; the voltage regulator diode is located in the frame area.

3. The LED packaging structure according to claim 1, characterized in that: At least a portion of the surface of the voltage regulator diode is covered with white glue.

4. The LED packaging structure according to claim 3, characterized in that: The voltage regulator diode is a Zener diode.

5. The LED packaging structure according to claim 1, characterized in that: The substrate comprises a base material and an LED electrode arranged on the base material; wherein the LED electrode comprises an anode and a cathode, and the voltage regulator diode is soldered between the anode and the cathode through a solder paste eutectic process.

6. The LED packaging structure according to claim 5, characterized in that: An isolation channel is provided between the positive electrode and the negative electrode; the positive electrode and the negative electrode respectively have concave areas at the edge of one side close to the isolation channel; and the two ends of the voltage regulator diode are respectively welded to the concave areas of the positive electrode and the negative electrode.

7. The LED packaging structure according to claim 6, characterized in that: The surface of the concave area is a rough surface.

8. The LED packaging structure according to claim 6, characterized in that: The concave area has a concave surface facing away from the substrate; the concave surface has an opening for filling solder paste.

9. The LED packaging structure according to claim 5, characterized in that: The support frame has an outer edge in the arrangement direction of the positive electrode and the negative electrode; the distance between the side of the voltage regulator diode facing the outer edge and the outer edge ranges from 0 to 0.785 mm.

10. An LED module, characterized in that: It comprises the LED packaging structure as described in any one of claims 1 to 9.

11. An LED light emitting device, characterized in that: It comprises the LED packaging structure as described in any one of items 1 to 9 or the LED module as described in claim 10.

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