Power supply device and vehicle

Abstract

The utility model discloses a power supply device and a vehicle, and the power supply device comprises a water channel plate which is internally provided with a plane water channel; the power module is integrally and detachably connected to the first side of the water channel plate, and the power module is attached to the water channel plate and corresponds to the plane water channel in position. According to the power supply device and the vehicle, the structure is simple, installation is convenient, and heat dissipation of the power module can be effectively achieved.

Description

Technical Field

[0001] The present application relates to the field of automobile technology, and in particular to a power supply device and a vehicle. Background Art

[0002] As an important electrical component inside the power supply device, the heat dissipation design of the power device is crucial in the manufacturing process of the power supply device. The MOS tube inside the existing power supply device is mostly arranged in a single-tube plug-in layout, and is brushed with thermal conductive silicone grease and bonded to the ceramic plate. Finally, the ceramic plate is pressed tightly against the side wall of the vertical water channel of the box through a pressure strip, thereby achieving heat dissipation of the MOS tube.

[0003] The limitation of the above method is that there are multiple single-tube MOS tubes in the power supply device, and the following steps need to be performed for the assembly of each single-tube MOS tube: first, it is necessary to apply silicone grease and bond the ceramic plate, then install the MOS plug-in, and then press the pressure strip. This process has many steps and is cumbersome, making the assembly process more complicated. In addition, the processing of the vertical water channel is more complicated, the mold process requirements are higher, the cost is higher, and the mold life is shorter.

[0004] Therefore, improvements are needed to at least partially solve the above problems. Utility Model Content

[0005] A series of simplified concepts are introduced in the utility model content section, which will be further described in detail in the detailed implementation section. The utility model content section of the utility model does not mean to attempt to define the key features and essential technical features of the technical solution claimed for protection, nor does it mean to attempt to determine the scope of protection of the technical solution claimed for protection.

[0006] In order to at least partially solve the above problem, according to a first aspect of the utility model, a power supply device is provided, comprising:

[0007] A waterway plate, wherein a planar waterway is provided in the waterway plate;

[0008] A power module, wherein the power module is detachably connected to the first side of the waterway plate as a whole, and the power module is fitted to the waterway plate and corresponds to the position of the planar waterway.

[0009] Exemplarily, the power module is integrally and detachably connected to the first side of the waterway plate, the power module is fitted to the waterway plate and corresponds to the position of the planar waterway.

[0010] Exemplarily, the heat conducting plate includes a metal substrate and an insulating plate, the metal substrate is detachably connected to the first side of the waterway plate and is in contact with the waterway plate, the insulating plate is fixedly connected to the side of the metal substrate away from the waterway plate, and the power switch tube is fixedly connected to the insulating plate.

[0011] Exemplarily, the heat conducting plate is detachably connected to the first side of the water channel plate by screws.

[0012] Exemplarily, the projection of the planar water channel on the heat conducting plate covers the heat conducting plate.

[0013] Exemplarily, the planar water channel includes a first flow channel, a second flow channel and a third flow channel, the first flow channel, the second flow channel and the third flow channel are U-shaped as a whole, the first flow channel is parallel to the second flow channel, the third flow channel is located on the same side of the first flow channel and the second flow channel, and both ends of the third flow channel are respectively connected to the first flow channel and the second flow channel.

[0014] Exemplarily, at least one rib is provided in the planar water channel.

[0015] Exemplarily, the power supply device further includes a magnetic element module, which is connected to the second side of the waterway plate and corresponds to the position of the planar waterway.

[0016] Exemplarily, the magnetic element module includes a plastic frame, an inductor and a transformer, the plastic frame is connected to the waterway board, the inductor and the transformer are connected to the plastic frame, and the inductor and the transformer are thermally connected to the second side of the waterway board via thermal conductive adhesive.

[0017] Exemplarily, the power supply device further includes a circuit board, which is located on a side of the power module away from the waterway plate, and the power module and the magnetic element module are both connected to the circuit board.

[0018] Exemplarily, the magnetic element module includes a plurality of connecting pins, and the plurality of connecting pins are all connected to the circuit board;

[0019] The waterway plate is provided with a connection hole, and a plurality of the connection pins are passed through the connection hole, wherein the connection hole avoids the planar waterway.

[0020] Exemplarily, the power supply device further includes a filter module, and the filter module is connected to the circuit board.

[0021] According to a second aspect of the utility model, a vehicle is provided, comprising the power supply device as described above.

[0022] According to the power supply device and vehicle of the utility model, the power module is detachably connected to the waterway plate as a whole, and exchanges heat with the planar waterway. On the one hand, the overall installation of the power module can effectively simplify the structure and assembly process; on the other hand, the planar waterway is arranged in the waterway plate, which has lower mold process requirements, lower costs, and longer mold life. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The following drawings of the present application are hereby used as part of the present application for understanding the present application. The drawings show the embodiments of the present application and their descriptions, and are used to explain the device and principle of the present application. In the drawings,

[0024] Figure 1 FIG. 1 is a schematic diagram of the three-dimensional structure of a power supply device according to an embodiment of the present application.

[0025] Figure 2 It is a schematic diagram of an explosion of a power supply device according to an embodiment of the present application.

[0026] Figure 3 FIG. 1 is a schematic diagram of the internal structure of a power supply device according to an embodiment of the present application.

[0027] Figure 4 This is a schematic diagram of the top structure of a waterway plate according to an embodiment of the present application, wherein the waterway cover plate is not shown.

[0028] Figure 5 It is a side cross-sectional view of a power supply device according to an embodiment of the present application.

[0029] Description of reference numerals:

[0030] 100-box body, 110-middle frame, 111-water inlet, 112-water inlet pipe, 113-water outlet, 114-water outlet pipe, 120-upper cover plate, 130-lower cover plate;

[0031] 200-water channel plate, 210-plane water channel, 211-first flow channel, 212-second flow channel, 213-third flow channel, 201-water channel bottom plate, 202-water channel cover plate, 203-convex rib;

[0032] 300-power module, 310-heat conducting plate, 311-metal substrate, 312-insulating plate, 320-power switch tube;

[0033] 400-circuit board;

[0034] 500-magnetic component module;

[0035] 600-Filter module. DETAILED DESCRIPTION

[0036] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0037] It should be understood that the present application can be implemented in different forms and should not be construed as being limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present application to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0038] It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part.

[0039] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used herein for convenience of description to describe the relationship of one element or feature to other elements or features shown in the figures. It should be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation shown in the figures.

[0040] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0041] Embodiments of the utility model are described herein with reference to cross-sectional views as schematic diagrams of ideal embodiments (and intermediate structures) of the present application. In this way, variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, the embodiments of the present application should not be limited to the specific shapes shown herein, but include shape deviations due to, for example, manufacturing. Therefore, what is shown in the figures is schematic in nature, and their shapes are not intended to display the actual shape of the device and are not intended to limit the scope of the present application.

[0042] Refer to the attached Figure 1-5The power supply device according to an embodiment of the present application is exemplarily described. The power supply device is applied to a vehicle and can be a vehicle-mounted integrated power supply, etc. The power supply device includes a box 100, a waterway plate 200 and a power module 300, and the waterway plate 200 and the power module 300 are arranged in the box 100.

[0043] The waterway plate 200 is provided with a planar waterway 210, which serves as a circulation channel for cooling water and is used to dissipate heat from the electrical components inside the power supply device. The waterway plate 200 includes a waterway bottom plate 201 and a waterway cover plate 202. A waterway groove is provided on one side of the waterway bottom plate 201. The waterway cover plate 202 is fixedly connected to the waterway bottom plate 201 and is located at the top of the waterway groove. A planar waterway 210 is formed between the waterway cover plate 202 and the waterway bottom plate 201. The waterway bottom plate 201 and the waterway cover plate 202 can both be made of metal. The waterway cover plate 202 and the waterway bottom plate 201 can be fixedly connected by welding methods known to those skilled in the art, such as friction welding. See the attached drawings. Figure 4 In this embodiment, a convex rib 203 is provided in the planar water channel 210, the bottom of the convex rib 203 is connected to the bottom of the water channel groove, and the top of the convex rib 203 is in contact with the water channel cover plate 202. The planar water channel 210 includes a first flow channel 211, a second flow channel 212 and a third flow channel 213, the first flow channel 211, the second flow channel 212 and the third flow channel 213 are U-shaped as a whole, the first flow channel 211 is parallel to the second flow channel 212, the convex rib 203 is located between the first flow channel 211 and the second flow channel 212, the first flow channel 211 and the second flow channel 212 are separated by the convex rib 203, the third flow channel 213 is located on the same side of the first flow channel 211 and the second flow channel 212, and the two ends of the third flow channel are connected to the first flow channel 211 and the second flow channel 212 respectively. On the one hand, the ribs 203 can increase the heat dissipation area and enhance the heat dissipation effect; on the other hand, the setting of the ribs 203 makes the first flow channel 211, the second flow channel 212 and the third flow channel 213 as a whole U-shaped, which can be used to deflect the cooling water in the water channel, extend its flow path and residence time in the water channel, and improve the heat dissipation effect. In some other embodiments, one or more ribs can be further set at other positions in the planar water channel 210 to increase the heat exchange area and achieve better heat exchange effect. In some other embodiments, the planar water channel 210 can be set with S-shaped, V-shaped or other shapes of flow channels, and those skilled in the art can set them according to actual conditions. The use of the planar water channel 210 in the waterway plate 200 avoids the deep cavity processing of the traditional vertical water channel, which can significantly reduce the mold process requirements, reduce mold costs, and increase mold life.

[0044] The power module 300 is detachably connected to the first side of the waterway plate 210 as a whole. The power module 300 is attached to the waterway plate 200 and corresponds to the position of the planar waterway 210. Specifically, the power module 300 includes a heat conducting plate 310 and a plurality of power switch tubes 320 arranged on the heat conducting plate 310. The power switch tube 320 can be a MOS tube, an IGBT tube or other suitable power switch tube. The power module 300 is detachably connected to the first side of the waterway plate 200 as a whole. The heat conducting plate 310 is attached to the waterway plate 200 and corresponds to the position of the planar waterway 210. The power switch tube 320 is located on the side of the heat conducting plate 310 away from the waterway plate 200. It should be noted that the correspondence between the position of the heat conducting plate 310 and the planar water channel 210 mentioned here means that the projection of the heat conducting plate 310 on the water channel plate 200 at least partially overlaps with the position of the planar water channel, thereby effectively shortening the heat transfer path, enabling the heat conducting plate 310 to better exchange heat with the cooling water in the planar water channel 210, and improving the heat dissipation effect. When cooling water flows in the planar water channel 210, the side of the heat conducting plate 310 close to the water channel plate 200 contacts the water channel plate 200 for heat exchange (that is, heat exchange with cooling water), and the side of the heat conducting plate 310 away from the water channel plate 200 contacts the power switch tube 320 for heat exchange, thereby, the heat on the multiple power switch tubes 320 can be transferred to the cooling water in the planar water channel 210 through the heat conducting plate 200, thereby achieving heat dissipation of the multiple power switch tubes 320. In this embodiment, the projection of the planar water channel 210 on the heat conducting plate 310 covers the heat conducting plate 310, that is, the projection of the heat conducting plate 310 on the water channel plate 200 completely falls into the area where the planar water channel 210 is located, thereby significantly shortening the heat transfer path between the heat conducting plate 310 and the cooling water in the planar water channel 210, and significantly improving the heat exchange effect.

[0045] The embodiment of the present application integrates multiple power switch tubes 320 on the heat conductive plate 210 to form a power module 300, so that the overall installation of the power module 300 can be achieved without separately installing each power switch tube 320 and setting corresponding pressure strips, etc., which can effectively simplify the structure and assembly process.

[0046] In the embodiment of the present application, the heat conducting plate 310 includes a metal substrate 311 and an insulating plate 312. The metal substrate 311 is detachably connected to the first side of the waterway plate and is attached to the waterway plate 200. The insulating plate 312 is fixedly connected to the side of the metal substrate 311 away from the waterway plate 200. The power switch tube 320 is fixedly connected to the insulating plate 312. The metal substrate 311 can be made of a metal plate with good thermal conductivity such as an aluminum plate or a copper plate, and the insulating plate 312 can be made of a plate with insulation and thermal conductivity such as a ceramic composite plate. The metal substrate 311 has a large heat dissipation area and can better dissipate heat and evenly distribute heat. The insulating plate 312 is used to insulate multiple power switch tubes 320 from each other, and to insulate the power switch tube 320 from the metal substrate 311, so as to ensure that the power switch tube 320 can work safely and stably.

[0047] The metal substrate 311 is detachably connected to the first side of the waterway plate 200 by screws, specifically, it can be connected to the waterway cover plate 202. The metal substrate 311 is provided with a plurality of connection holes along its circumferential edge, and a plurality of second bolt holes are preset at positions corresponding to the bolt holes on the waterway plate 200 (i.e., on the waterway cover plate 202), and the first bolt holes and the second bolt holes are locked by a plurality of screws. The clamping force of the screws is controllable, so that those skilled in the art can adjust the tightness of the connection between the metal substrate 311 and the waterway plate 200 according to actual conditions.

[0048] In some other embodiments, the heat conducting plate 310 may only include the insulating plate 312. In some other embodiments, the heat conducting plate 310 may be connected to the waterway plate 200 by other connection methods such as welding, and those skilled in the art may configure the method according to actual conditions.

[0049] In the embodiment of the present application, thermal grease is disposed between the heat conducting plate 310 and the waterway plate 200. Specifically, the thermal grease is applied to the side of the metal substrate 311 facing the waterway plate 200, or to the side of the waterway plate 200 facing the metal substrate 311. The thermal grease has high thermal conductivity and can fill the gap between the metal substrate 311 and the waterway plate 200, thereby improving the heat exchange effect between the heat conducting plate 310 and the waterway plate 200.

[0050] In the embodiment of the present application, the box body 100 is made of a metal material with good thermal conductivity, and a housing cavity is formed in the box body 100. The waterway plate 200 is arranged in the housing cavity to separate the housing cavity into a first housing cavity and a second housing cavity. Specifically, the box body 100 includes a middle frame 110, an upper cover plate 120 and a lower cover plate 130. The upper cover plate 120 and the lower cover plate 130 are respectively located on both sides of the middle frame 110. The circumferential edge of the waterway plate 200 is fixedly connected to the middle of the middle frame. The upper cover plate 120 is detachably connected to the middle frame 110. A first housing cavity is formed between the waterway plate 200, the middle frame 110 and the upper cover plate 120. The power module 300 is located in the first housing cavity. The lower cover plate 130 is detachably connected to the middle frame 110. A second housing cavity is formed between the waterway plate 200, the middle frame 110 and the lower cover plate 130. Thus, the user can remove the upper cover plate 120 or the lower cover plate 130 to expose the electrical components inside the box body 100 for easy maintenance.

[0051] In some other embodiments, the middle frame 110 and the upper cover plate 120 may be fixedly connected (for example, fixedly connected by welding). In some other embodiments, the middle frame 110 and the lower cover plate 130 may be fixedly connected. In some other embodiments, the upper cover plate 120, the middle frame 110, and the lower cover plate 130 may all be fixedly connected. Those skilled in the art may make settings according to actual conditions.

[0052] A water inlet 111 and a water outlet 113 are provided on the middle frame 110. The water inlet 111 and the water outlet 113 are both connected to the planar waterway in the waterway plate 200. The water inlet 111 is used to connect the water inlet pipe 112, and the water outlet 113 is used to connect the water outlet pipe 114. The water inlet pipe 112 and the water outlet pipe 114 can be connected to an external cooling water supply device to allow cooling water to be introduced into the planar waterway 210 through the water inlet 111 and the water inlet pipe 112, and the cooling water is discharged through the water outlet 113 and the water outlet pipe 114 after heat exchange.

[0053] In an embodiment of the present application, the power supply device further includes a magnetic element module 500, which is connected to the second side of the waterway plate 200 and corresponds to the position of the planar waterway 210, that is, the magnetic element module 500 is located in the second accommodating cavity. It should be noted that the correspondence between the position of the magnetic element module 500 and the planar waterway 210 mentioned here means that the projection of the magnetic element module 500 on the waterway plate 200 at least partially overlaps with the position of the planar waterway, thereby effectively shortening the heat transfer path, enabling the magnetic element module 500 to better exchange heat with the cooling water in the planar waterway 210, and improving the heat dissipation effect. Thus, the power module and the magnetic element module can be cooled by the waterway plate 200 at the same time. The magnetic element module 500 is isolated from the metal wall of the power module 300 and the mainboard with the waterway, and the shielding effect is good, which improves the EMC performance while ensuring heat dissipation.

[0054] The magnetic element module 500 includes a plastic frame, an inductor (such as a resonant inductor, etc.) and a transformer. The inductor and the transformer are connected to the plastic frame, and the plastic frame can be connected to the second side of the waterway plate 200 through a connector such as a screw. The inductor and the transformer are thermally connected to the second side of the waterway plate 200 through a thermally conductive adhesive. Specifically, the second side of the waterway plate 200 has a receiving groove for accommodating the magnetic element module 500, the waterway plate 200 is located at the bottom of the receiving groove, the magnetic element module 500 is located in the receiving groove, and the receiving groove is filled with thermally conductive adhesive. The thermally conductive adhesive fills the gap between the inductor and the transformer and the receiving groove, that is, the gap between the inductor and the transformer and the waterway plate 200. Therefore, the heat generated by the inductor and the transformer can be transferred to the waterway plate through the thermally conductive adhesive and the waterway plate 200, and then the inductor and the transformer can be efficiently dissipated through the waterway plate to meet their cooling requirements.

[0055] In the embodiment of the present application, the power supply device further includes a circuit board 400, which is located on a side of the power module 300 away from the waterway plate 200, and the circuit board 400 is located in the first accommodation cavity. The power module 300 and the magnetic element module 500 are both connected to the circuit board 400, and the circuit board 400 is used to control the power module 300 and the magnetic element module 500 to work to realize the function of the power supply device.

[0056] Specifically, the pins of the multiple power switch tubes 320 of the power module 300 are plugged into the pinholes on the mainboard, and the pins are selectively wave soldered with the circuit board 400 to achieve physical and electrical connection between the power module 300 and the circuit board 400.

[0057] The magnetic component module 500 includes a plurality of connection pins, which may be metal pins of an inductor and a transformer, and are all connected to the circuit board 400. A connection hole is provided on the waterway board 200, and a plurality of connection pins of the magnetic component module 500 are inserted into the connection hole, wherein the connection hole avoids the planar waterway 210, and a plurality of connection pins of the magnetic component module 500 are inserted into the second accommodation cavity through the connection hole, and are plugged and assembled with the pinholes on the main board, and selective wave soldering is performed between the pins and the main board to realize the physical and electrical connection between the magnetic component module 500 and the circuit board 400.

[0058] In the embodiment of the present application, the power supply device further includes a filter module 600, and the filter module 600 is connected to the circuit board 400. The filter module 600 can be arranged in the second accommodating cavity and connected to the circuit board 400 through a connecting harness. The filter module 600 and the magnetic element module 500 are isolated from each other by the groove wall of the accommodating groove to improve the EMC performance.

[0059] An embodiment of the present application also provides a vehicle, which includes the power supply device as described above.

[0060] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application to this. Those of ordinary skill in the art may make various changes and modifications therein without departing from the scope and spirit of the present application. All these changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0061] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0062] Similarly, it should be understood that in order to streamline the present application and help understand one or more of the various utility model aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present application should not be interpreted as reflecting the following intention: the claimed application requires more features than the features explicitly stated in each claim. More specifically, as reflected in the corresponding claims, the inventive point is that the corresponding technical problem can be solved with features that are less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present application.

[0063] It will be understood by those skilled in the art that, except for mutually exclusive features, all features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed in this specification may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature that provides the same, equivalent or similar purpose.

[0064] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0065] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A power supply device, characterized in that: include: A waterway plate, wherein a planar waterway is provided in the waterway plate; A power module, wherein the power module is detachably connected to the first side of the waterway plate as a whole, and the power module is fitted to the waterway plate and corresponds to the position of the planar waterway.

2. The power supply device according to claim 1, characterized in that: The power module comprises a heat conducting plate and a plurality of power switch tubes arranged on the heat conducting plate; The heat conducting plate is in contact with the water channel plate and corresponds to the position of the planar water channel; The power switch tube is located on a side of the heat conducting plate away from the water channel plate.

3. The power supply device according to claim 2, characterized in that: The heat conducting plate comprises a metal substrate and an insulating plate. The metal substrate is detachably connected to a first side of the waterway plate and is in contact with the waterway plate. The insulating plate is fixedly connected to a side of the metal substrate away from the waterway plate. The power switch tube is fixedly connected to the insulating plate.

4. The power supply device according to claim 2, characterized in that: The heat conducting plate is detachably connected to the first side of the water channel plate by means of screws.

5. The power supply device according to claim 2, characterized in that: The projection of the planar water channel on the heat conducting plate covers the heat conducting plate.

6. The power supply device according to claim 1, characterized in that: The planar water channel includes a first flow channel, a second flow channel and a third flow channel. The first flow channel, the second flow channel and the third flow channel are U-shaped as a whole. The first flow channel is parallel to the second flow channel. The third flow channel is located on the same side of the first flow channel and the second flow channel. Both ends of the third flow channel are respectively connected to the first flow channel and the second flow channel.

7. The power supply device according to claim 1, characterized in that: At least one convex rib is arranged in the planar water channel.

8. The power supply device according to any one of claims 1 to 7, characterized in that: The power supply device further comprises a magnetic element module, which is connected to the second side of the waterway plate and corresponds to the position of the planar waterway.

9. The power supply device according to claim 8, characterized in that: The magnetic element module includes a plastic frame, an inductor and a transformer. The plastic frame is connected to the waterway plate. The inductor and the transformer are connected to the plastic frame. The inductor and the transformer are thermally connected to the second side of the waterway plate through thermal conductive adhesive.

10. The power supply device according to claim 8, characterized in that: The power supply device further comprises a circuit board, which is located at a side of the power module away from the waterway plate, and the power module and the magnetic element module are both connected to the circuit board.

11. The power supply device according to claim 10, characterized in that: The magnetic element module comprises a plurality of connecting pins, and the plurality of connecting pins are all connected to the circuit board; The waterway plate is provided with a connection hole, and a plurality of the connection pins are passed through the connection hole, wherein the connection hole avoids the planar waterway.

12. The power supply device according to claim 10, characterized in that: The power supply device further comprises a filter module, and the filter module is connected to the circuit board.

13. A vehicle, characterized in that: A power supply device comprising any one of claims 1-12.

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