Thermal circulation device for reflow soldering

Abstract

The utility model discloses a reflow soldering thermal circulation device which comprises an installation cylinder used for installing a thermal circulation assembly and further comprises a bottom plate fixed below the installation cylinder, one side of the air inlet end of the installation cylinder is detachably connected with a round frame, and a filter screen used for filtering impurities is embedded in the round frame. Limiting frames, bolts, round frames and filter screens are used in cooperation, the limiting frames are welded to the left side, the right side and the bottom of the air inlet end of a mounting cylinder, the round frames with the filter screens are clamped in the three limiting frames, the round frames and the filter screens are fixed through the bolts, and then the filter screens can be arranged at the air inlet end of the mounting cylinder and are convenient to disassemble and replace; the effect of preventing impurities from entering the air inlet end of the mounting barrel is achieved, then stable use of components in the mounting barrel is guaranteed, and the heat circulation effect of reflow soldering is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal cycle devices, in particular to a thermal cycle device for reflow soldering. Background Art

[0002] In the field of component welding processing of circuit boards, two methods are usually used: reflow soldering and wave soldering. Reflow soldering is a group or point soldering process in which an appropriate amount of solder in an appropriate form is placed on the PCB soldering position in advance, and then components are mounted on the surface. An external heat source is used to make the solder reflow to meet the welding requirements. Usually, the heat required by the reflow soldering machine during operation is provided by the heating wire installed in the furnace of the reflow soldering machine. The heat generated by the heating wire is transported to the surface of the component through the fan to heat the solder.

[0003] Patent No. CN208067524U discloses a reflow soldering hot air circulation device, including a mounting tube, a mounting plate, a motor, a fan blade, a heating tube, a PLC, a display screen, a switch, an adjustment frame structure, an extension tube structure, a detection frame structure, a connecting rod and a fan, wherein the mounting tube is welded to the upper part of the inner side of the detection frame structure; the mounting plate and the heating tube are respectively mounted on the left and right sides of the inner wall of the mounting tube; the motor bolts are mounted on the front surface of the mounting plate, and a fan blade is mounted on the output shaft. The beneficial effects of the utility model are as follows: by setting the adjustment frame structure, it is convenient to adjust the angle and height of the hot air circulation device during use, and it is also convenient to use the hot air circulation device. By setting the extension tube structure, it is convenient to use the hot air circulation device at a suitable spacing without scattering the hot air. When the heat circulation device of the above scheme is actually used, since the air inlet end of the mounting tube is open, impurities may be sucked in. The normal use of the components in the installation tube should be prevented, which in turn affects the use of the heat circulation device. To this end, we propose a reflow soldering hot air circulation device. Utility Model Content

[0004] The main purpose of the utility model is to provide a thermal cycle device for reflow soldering. By using a limit frame, bolts, a round frame and a filter screen in combination, the utility model solves the problem that when the thermal cycle device is actually used, impurities may be sucked in because the air inlet end of the installation tube is open, which should affect the normal use of the components in the installation tube and further affect the use of the thermal cycle device. The utility model can effectively solve the problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A reflow soldering thermal cycle device comprises a mounting cylinder for mounting a thermal cycle component and a bottom plate fixed below the mounting cylinder. A round frame is detachably connected to one side of the air inlet end of the mounting cylinder, and a filter screen for filtering impurities is embedded inside the round frame.

[0007] Furthermore, limit frames are welded on both sides and the bottom of the air inlet end face of the installation tube, and the outer sides of the limit frames on the left and right sides are threadedly connected with bolts for limiting the circular frame, and the outer diameter of the circular frame is smaller than the outer diameter of the installation tube.

[0008] Furthermore, a slot is provided in the middle of the left end of the bottom of the base plate, a bearing is embedded in the slot, a support rod is passed through the bearing, a rubber block is glued to the bottom of the support rod, and a screw for bearing limitation is threadedly connected to the left side of the base plate outside the slot.

[0009] Furthermore, support rods with rubber blocks are fixedly connected to the front and rear sides of the right end of the bottom of the bottom plate, and the three groups of support rods are distributed in a triangular shape.

[0010] Compared with the prior art, the utility model has the following beneficial effects: by using the limit frame, bolts, round frame and filter screen in coordination, the limit frames are welded on the left and right sides and the bottom of the air inlet end of the installation cylinder, and the round frame with the filter screen is clamped in the three groups of limit frames, and the round frame and the filter screen are fixed by bolts, so that the filter screen can be set at the air inlet end of the installation cylinder and is convenient to disassemble and replace, thereby preventing the air inlet end of the installation cylinder from entering, thereby ensuring the stable use of the internal components of the installation cylinder and ensuring the thermal cycle effect of reflow soldering; by using the provided slots, bearings, screws, support rods and rubber blocks in coordination, a slot is opened in the middle position on the left side of the bottom of the base plate to install the bearing connecting support rod, and the support rods are fixedly connected at the front and rear ends of the right side of the bottom of the base plate, and the three groups of support rods are distributed in a triangular shape to ensure the stable support of the base plate, while a single group of support rods can be rotated and adjusted, so that when the thermal cycle device is actually used, it is convenient to rotate and adjust the angle of the base plate, which is convenient for the actual production and use of the thermal cycle device. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 The utility model is a schematic diagram of the overall structure of a thermal cycle device for reflow soldering.

[0012] Figure 2 The utility model is a thermal cycle device for reflow soldering Figure 1 Enlarged structural diagram at A in the middle.

[0013] Figure 3 The utility model is a schematic diagram of the planar structure of a base plate connected to a support rod of a thermal cycle device for reflow soldering.

[0014] Figure 4The utility model is a schematic diagram of the support rod distribution structure of a thermal cycle device for reflow soldering.

[0015] In the figure: 1. bottom plate; 2. mounting cylinder; 3. round frame; 4. bolt; 5. filter screen; 6. limit frame; 7. slot; 8. bearing; 9. screw; 10. support rod; 11. rubber block. DETAILED DESCRIPTION

[0016] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0017] like Figure 1-4 As shown, a thermal cycle device for reflow soldering comprises a mounting cylinder 2 for mounting a thermal cycle component, and also comprises a bottom plate 1 fixed under the mounting cylinder 2, a round frame 3 is detachably connected to one side of the air inlet end of the mounting cylinder 2, a filter screen 5 for impurity filtering is embedded in the round frame 3, limiting frames 6 are welded on the left and right sides and the bottom of the end face of the air inlet end of the mounting cylinder 2, and the outer sides of the limiting frames 6 on the left and right sides are threadedly connected with bolts 4 for limiting the round frame 3, and the outer diameter of the round frame 3 is smaller than the outer diameter of the mounting cylinder 2; limiting frames 6 are welded on the left and right sides and the bottom of the air inlet end of the mounting cylinder 2, the round frame 3 with the filter screen 5 is clamped in the three groups of limiting frames 6, the round frame 3 and the filter screen 5 are fixed by bolts 4, and the filter screen 5 can be set at the air inlet end of the mounting cylinder 2 and can be easily disassembled and replaced, which has the effect of preventing impurities from entering the air inlet end of the mounting cylinder 2, thereby ensuring the stable use of the internal components of the mounting cylinder 2 and the thermal cycle effect of reflow soldering.

[0018] Among them, a slot 7 is opened in the middle position of the left end of the bottom of the base plate 1, a bearing 8 is embedded in the slot 7, a support rod 10 is passed through the bearing 8, a rubber block 11 is glued to the bottom of the support rod 10, a screw 9 for limiting the bearing 8 is threadedly connected at the outer position of the slot 7 on the left side of the base plate 1, and a support rod 10 with a rubber block 11 is fixedly connected to the front and rear sides of the right end of the bottom of the base plate 1, and the three groups of support rods 10 are distributed in a triangular shape; a slot 7 is opened in the middle position of the left side of the bottom of the base plate 1 to install the bearing 8 to connect the support rod 10, and the support rods 1 are fixedly connected at the front and rear ends of the right side of the bottom of the base plate 1. While the three groups of support rods 10 are distributed in a triangular shape to ensure the stable support of the base plate 1, a single group of support rods 10 can be rotatably adjusted. In this way, when the thermal cycler is actually used, it is convenient to rotate and adjust the angle of the base plate 1, which is convenient for the actual production and use of the thermal cycler.

[0019] It should be noted that the utility model is a thermal cycle device for reflow soldering. When working, the components are first installed and fixed. When air is introduced into the air inlet end of the installation tube 1, the filtering effect of the filter 5 can prevent impurities from entering, thereby ensuring the stable use of the internal components of the installation tube 2 and the thermal cycle effect of the reflow soldering. During the use of the thermal cycle device, the right end of the base plate 1 is slightly lifted, and with the rotation support of the left support rod 10 at the bottom of the base plate 1, it is convenient to rotate and adjust the angle of the base plate 1, that is, it is convenient to rotate and adjust the angle of the thermal cycle device, which is convenient for the actual production and use of the thermal cycle device.

[0020] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A reflow soldering thermal cycle device, comprising a mounting barrel (2) for mounting a thermal cycle component, characterized in that: It also comprises a bottom plate (1) fixed below the mounting cylinder (2); a round frame (3) is detachably connected to one side of the air inlet end of the mounting cylinder (2); a filter screen (5) for filtering impurities is embedded inside the round frame (3).

2. A thermal cycler for reflow soldering according to claim 1, characterized in that: Limiting frames (6) are welded to the left and right sides and the bottom of the air inlet end surface of the installation tube (2), and the outer sides of the limiting frames (6) on the left and right sides are threadedly connected with bolts (4) used for limiting the circular frame (3).

3. A thermal cycler for reflow soldering according to claim 1, characterized in that: A slot (7) is provided at the middle of the left end of the bottom of the base plate (1), a bearing (8) is embedded in the slot (7), a support rod (10) is passed through the bearing (8), and a rubber block (11) is glued to the bottom of the support rod (10).

4. A thermal cycler for reflow soldering according to claim 3, characterized in that: A screw rod (9) for limiting the position of the bearing (8) is threadedly connected at the outer position of the slot (7) on the left side of the bottom plate (1).

5. A thermal cycler for reflow soldering according to claim 4, characterized in that: Support rods (10) with rubber blocks (11) are fixedly connected to the front and rear sides of the right end of the bottom of the base plate (1), and three groups of support rods (10) are distributed in a triangular shape.

6. A thermal cycler for reflow soldering according to claim 1, characterized in that: The outer diameter of the circular frame (3) is smaller than the outer diameter of the mounting tube (2).

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