IMR film waste base material recovery device

Abstract

The utility model relates to the technical field of membrane material recycling, and provides an IMR membrane waste base material recycling device which comprises a conveying mechanism, a scrap removing mechanism and a shaping mechanism. The conveying mechanism can convey IMR film waste base materials along the conveying path. The scrap removing mechanism is correspondingly arranged at the head end of the conveying path and is used for removing scraps and impurities on the surface of the IMR film waste base material; the shaping mechanism is correspondingly arranged on the downstream portion of the scrap removing mechanism and used for conducting destressing shaping on the IMR film waste base material. The shaping mechanism comprises a first pressing piece, a second pressing piece and a driving piece which are arranged on the two sides of the IMR film waste base material correspondingly. Clamping and pressing shaping lines are correspondingly arranged in the clamping and pressing faces of the first pressing piece and the second pressing piece respectively. And the driving piece is used for driving the clamping and pressing molding lines to be close to each other to be pressed so as to eliminate the surface stress of the IMR film waste base material. The IMR film waste base material recovery device has the beneficial effects of high recovery efficiency, energy conservation, emission reduction and environmental protection.

Description

Technical Field

[0001] The present disclosure relates to the field of film material recovery technology, and in particular to an IMR film waste substrate recovery device. Background Art

[0002] IMR, also known as in-mold transfer, is a process in which a texture pattern is printed on a foil film, which is then transported to the mold cavity by a foil feeder, extruded by an injection molding machine, and the pattern texture is transferred to the injection molded part. The ink layer remains on the product, and the foil film is not attached to the surface. The film is just a carrier in the production process.

[0003] As we all know, the painted and metal anode appearance of the shell needs to use PET protective film consumables to protect the appearance before shipment. The PET film waste substrate left after the IMR in-mold transfer process has always been a scrapped consumable, and is basically recycled as raw materials for secondary smelting. If the waste substrate after IMR film molding can be used as a replacement for PET protective film for secondary use, it will save huge benefits and make great contributions to energy conservation, emission reduction and environmental protection.

[0004] In view of this, there is an urgent need for an IMR membrane waste substrate recovery device on the market to solve the problem that the IMR membrane waste substrate cannot be effectively recovered and reused in the prior art. Summary of the invention

[0005] The embodiments of the present disclosure provide an IMR membrane waste substrate recovery device and an IMR membrane waste substrate reuse method, in order to solve the problem that the IMR membrane waste substrate cannot be effectively recovered and reused in the prior art.

[0006] The IMR film waste substrate recovery device provided in the embodiment of the present disclosure includes a conveying mechanism, a dandruff removal mechanism and a shaping mechanism;

[0007] The conveying mechanism is capable of conveying the IMR film waste substrate along the conveying path;

[0008] The descaling mechanism is correspondingly arranged at the head end of the conveying path, and is used to remove descaling and impurities from the surface of the IMR film waste substrate;

[0009] The shaping mechanism is correspondingly arranged downstream of the chip removal mechanism, and is used for stress relief shaping of the IMR film waste substrate;

[0010] Wherein, the shaping mechanism comprises a first pressing member, a second pressing member and a driving member respectively arranged on both sides of the IMR film waste substrate;

[0011] The first pressing member and the second pressing member are provided with clamping and shaping patterns on their clamping surfaces respectively;

[0012] The driving member is used to drive the clamping and shaping patterns to be pressed close to each other so as to eliminate the surface stress of the IMR film waste substrate.

[0013] In one possible implementation manner, the clamping and shaping pattern includes convex patterns and concave patterns that match each other;

[0014] Of the convex lines and the concave lines, one is provided on the clamping surface of the first pressing member, and the other is correspondingly provided on the clamping surface of the second pressing member;

[0015] When the first pressing piece and the second pressing piece are clamped and pressed together, the raised pattern can be at least partially pressed against the sunken pattern.

[0016] In one possible implementation manner, the convex patterns are arranged as grid-like patterns, and the concave patterns are correspondingly arranged as grid-like depressions;

[0017] The raised lines have a raised height ranging from 0.8 mm to 1.2 mm and a width ranging from 1.8 mm to 2.2 mm;

[0018] The concave depth range of the concave lines is 0.25 mm greater than the convex height range of the convex lines, and the width of the concave lines is 0.5 mm greater than the width of the convex lines.

[0019] In one possible implementation manner, the convex edges of the convex lines and the concave edges of the concave lines are both provided with chamfers of 0.5 mm.

[0020] In one possible implementation, the shaping mechanism further includes a heating device;

[0021] The heating device is arranged in the shaping mechanism and is used for heating and raising the temperature of the shaping mechanism.

[0022] In one possible implementation manner, the heating device comprises a heat conducting plate, a heating tube and a temperature detector;

[0023] The heating tube and the temperature detector are respectively plugged into the heat conducting plate;

[0024] One side of the heat conducting plate is in heat-conducting contact with a side of the first pressing member that is opposite to the clamping surface;

[0025] The temperature detector can detect the temperature of the heat conducting plate and provide feedback to adjust the working state of the heating tube.

[0026] In one possible implementation, the driving member includes a driving cylinder;

[0027] The first pressing piece is arranged on one side of the second pressing piece via a guide column, and the two face each other as the clamping surface;

[0028] The piston rod of the driving cylinder is connected to the side of the first pressing member facing away from the clamping surface, and can be telescopically driven to drive the first pressing member to move back and forth along the guide column.

[0029] In one embodiment, the chip removal mechanism includes two correspondingly arranged chip removal rollers;

[0030] A rolling gap for rolling the IMR film waste substrate is formed between the roller surfaces of the two chip removing nip rollers.

[0031] In one possible embodiment, the IMR film waste substrate recovery device further comprises a cutting mechanism disposed downstream of the shaping mechanism;

[0032] The cutting mechanism is used to cut and divide the IMR film waste substrate.

[0033] In one possible implementation manner, the cutting mechanism comprises two cutting clamps arranged opposite to each other, and cutting blades are arranged on the board surfaces of the two cutting clamps facing each other.

[0034] In addition, the embodiments of the present disclosure also provide a method for recycling IMR membrane waste substrates, which can be applied to the above-mentioned IMR membrane waste substrate recovery device.

[0035] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages:

[0036] The IMR film waste substrate recycling device provided in the embodiment of the present disclosure can automatically and integratedly perform chip removal and stress relief shaping treatments on the IMR film waste substrate, so that the IMR film waste substrate can finally maintain a flat shape and be used as a PETT protective film for secondary use, effectively solving the problem in the prior art that the IMR film waste substrate cannot be effectively recycled and reused, and has the beneficial effects of cost reduction, profit increase, energy conservation and emission reduction, and environmentally friendly protection.

[0037] In addition, the IMR membrane waste substrate recycling method provided in the embodiment of the present disclosure can be applied to the above-mentioned IMR membrane waste substrate recovery device, and has the beneficial effects of simple operation steps and the ability to efficiently reuse the IMR membrane waste substrate.

[0038] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0040] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0041] Figure 1 A schematic diagram of an IMR membrane waste substrate recovery device provided by an embodiment of the present disclosure is shown;

[0042] Figure 2 A schematic diagram of a shaping mechanism in an IMR membrane waste substrate recovery device provided in an embodiment of the present disclosure is shown;

[0043] Figure 3 A schematic diagram of a first pressing member in an IMR membrane waste substrate recovery device provided by an embodiment of the present disclosure is shown;

[0044] Figure 4 A schematic diagram of a second pressing member in an IMR membrane waste substrate recovery device provided by an embodiment of the present disclosure is shown;

[0045] Figure 5 A flow chart of a method for recycling IMR membrane waste substrates provided by an embodiment of the present disclosure is shown.

[0046] Explanation of the numbers in the figure: 1. chip removal mechanism; 2. shaping mechanism; 21. first pressing member; 211. first pressing member; 22. second pressing member; 221. second pressing member; 23. driving member; 24. heating device; 241. heat conducting plate; 3. cutting mechanism. DETAILED DESCRIPTION

[0047] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0048] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0049] Combination Figure 1 and Figure 2As shown, the embodiment of the present disclosure provides an IMR film waste substrate recovery device, which includes a conveying mechanism, a shaving mechanism 1 and a shaping mechanism 2; the conveying mechanism can convey the IMR film waste substrate along the conveying path; the shaving mechanism 1 is correspondingly arranged at the head end of the conveying path, and is used to remove shavings and impurities from the surface of the IMR film waste substrate; the shaping mechanism 2 is correspondingly arranged downstream of the shaving mechanism 1, and is used to remove stress and shape the IMR film waste substrate;

[0050] Among them, the shaping mechanism 2 includes a first pressing member 21, a second pressing member 22 and a driving member 23 respectively arranged on both sides of the IMR film waste substrate; the first pressing member 21 and the second pressing member 22 are respectively provided with clamping and shaping patterns in the clamping surfaces; the driving member 23 is used to drive the clamping and shaping patterns to be close to each other and pressed, so as to eliminate the surface stress of the IMR film waste substrate.

[0051] When the IMR film waste substrate recovery device is used, the strip-shaped IMR film waste substrate is first intermittently fed through the conveying mechanism. The conveying mechanism can be specifically but not limited to an intermittent rotating reel-up roller group. The IMR film waste substrate during the conveying process will first enter the chip removal mechanism 1, and the two side surfaces of the IMR film waste substrate will be removed by the chip removal mechanism 1. Since the IMR film waste substrate is made of PET film material and is a scrap material after use, its surface has a certain self-curling stress, so it is necessary to use the shaping mechanism 2 to relieve stress and shape the IMR film waste substrate. The first pressing member 21 and the second pressing member 22 in the shaping mechanism 2 are driven by the driving member 23 in the gap when the conveying mechanism stops conveying, so that the two are respectively close to each other and pressed on the two side surfaces of the IMR film waste substrate, and the two side surfaces of the IMR film waste substrate are formed by clamping and pressing the shaping lines, and finally the surface stress of the IMR film waste substrate is eliminated, so that it can finally maintain a flat shape, which is convenient for the subsequent secondary use of the IMR film waste substrate as a PETT protective film.

[0052] The IMR film waste substrate recycling device provided in the embodiment of the present disclosure can automatically and integratedly perform chip removal and stress relief shaping treatments on the IMR film waste substrate, so that the IMR film waste substrate can finally maintain a flat shape and be used as a PETT protective film for secondary use, effectively solving the problem in the prior art that the IMR film waste substrate cannot be effectively recycled and reused, and has the beneficial effects of cost reduction, profit increase, energy conservation and emission reduction, and environmentally friendly protection.

[0053] In one embodiment, the clamping and shaping patterns include a convex pattern 211 and a concave pattern 221 that match each other; among the convex pattern 211 and the concave pattern 221, one is arranged on the clamping surface of the first pressing part 21, and the other is correspondingly arranged on the clamping surface of the second pressing part 22; when the first pressing part 21 and the second pressing part 22 are clamped and bonded, the convex pattern 211 can be at least partially pressed into the concave pattern 221.

[0054] Specific, combined Figure 3 and Figure 4 To further explain in detail, at this time, the raised pattern 211 is specifically set on the clamping surface of the first pressing piece 21, and the recessed pattern 221 is correspondingly set on the clamping surface of the second pressing piece 22. Of course, the shapes and sizes of the raised pattern 211 and the recessed pattern 221 should be adapted to each other, so that when the first pressing piece 21 and the second pressing piece 22 are clamped together, the raised pattern 211 can be correspondingly pressed against the recessed pattern 221, so that the two side surfaces of the IMR film waste substrate are correspondingly extruded to form shaping patterns, thereby eliminating the surface stress of the IMR film waste substrate and allowing it to maintain a flat shape.

[0055] In addition, the specific shapes of the convex lines 211 and the concave lines 221 may be, but are not limited to, staggered grid-like lines, fence-like lines, wavy lines, etc.

[0056] The specific arrangement of the above-mentioned clamping and shaping lines has the beneficial effects of being simple in structure and being able to effectively eliminate the surface stress of the IMR film waste substrate when the first pressing member 21 and the second pressing member 22 are clamped together.

[0057] In one possible implementation, the raised pattern 211 is configured as a grid-like pattern, and the recessed pattern 221 is correspondingly configured as a grid-like recessed pattern; the raised height of the raised pattern 211 ranges from 0.8 mm to 1.2 mm, and the width ranges from 1.8 mm to 2.2 mm; the recessed depth of the recessed pattern 221 ranges from 0.25 mm greater than the raised height of the raised pattern 211, and the width of the recessed pattern 221 is 0.5 mm greater than the width of the raised pattern 211.

[0058] Specific, combined Figure 3 and Figure 4 To further explain in detail, the raised lines 211 and the recessed lines 221 can be arranged in a diamond grid shape accordingly, and the raised height range of the raised lines 211 is set between 0.8mm and 1.2mm, specifically 0.8mm, 1mm, and 1.2mm, and the raised width range of the raised lines 211 is set between 1.8mm and 2.2mm, specifically 1.8mm, 2mm, and 2.2mm. In this way, the raised height and width of the raised lines 211 are both moderate in size, which can not only ensure the extrusion shaping effect on the surface of the IMR film waste substrate, but also avoid the problem that the raised height of the raised lines 211 is too large to squeeze and damage the IMR film waste substrate, and avoid the problem that the raised width of the raised lines 211 is too wide to affect the surface of the IMR film waste substrate.

[0059] In addition, the depth of the concave pattern 221 is 0.25 mm greater than the convex height of the convex pattern 211, and the width of the concave pattern 221 is 0.5 mm greater than the width of the convex pattern 211. In this way, when the convex pattern 211 is pressed toward the concave pattern 221, there will always be a certain safety margin between the two to ensure that the IMR film waste substrate will not be squeezed and broken.

[0060] In one embodiment, the raised edges of the raised lines 211 and the recessed edges of the recessed lines 221 are both provided with chamfers of 0.5 mm.

[0061] A 0.5 mm chamfer is provided at the convex edge of the convex pattern 211 and the concave edge of the concave pattern 221 respectively. The chamfer can be a rounded corner or a beveled corner. This can prevent sharp corners from scratching the IMR film waste substrate at the convex edge and the concave edge of the convex pattern 211. On the other hand, even if the first pressing part 21 and the second pressing part 22 are slightly misaligned after long-term use, the chamfer structure can better align the convex pattern 211 when it is pressed toward the concave pattern 221.

[0062] In one embodiment, the shaping mechanism 2 further includes a heating device 24 ; the heating device is disposed in the shaping mechanism 2 and is used to heat and increase the temperature of the shaping mechanism 2 .

[0063] Specific, combined Figure 1 and Figure 2 To further explain in detail, a heating device 24 for heating itself is provided in the shaping mechanism 2. The heating device 24 can be specifically but not limited to being provided as an electric heating device, and the heating device 24 can be specifically used to heat the first pressing part 21 and / or the second pressing part 22. In this way, through the heating and temperature-raising effect of the heating device 24, when the first pressing part 21 and the second pressing part 22 are clamped together, the high temperature can further effectively eliminate the surface stress of the IMR film waste substrate, so that the IMR film waste substrate can better maintain a flat state after lamination.

[0064] In one embodiment, the heating device 24 includes a heat conducting plate 241, a heating tube and a temperature detector; the heating tube and the temperature detector are respectively inserted into the heat conducting plate 241; one side of the heat conducting plate 241 is in heat-conducting contact with the side of the first pressing part 21 facing away from the clamping surface; wherein the temperature detector can detect the temperature of the heat conducting plate and provide feedback to adjust the working state of the heating tube.

[0065] Specific, combined Figure 2To further explain in detail, the heating device 24 is specifically configured as a heat conducting plate 241, a heating tube and a temperature detector. The heating tube can be specifically configured as an electric heating tube, and the temperature detector is electrically connected to an electric control switch in the electric heating tube. In this way, when the temperature detector detects that the temperature of the heat conducting plate exceeds a preset threshold temperature, the temperature detector can feed back to the electric control switch to disconnect the power supply of the heating tube, thereby avoiding the heating device 24 from overheating, causing the first pressing piece 21 and the second pressing piece 22 to sandwich the hot-melt IMR film waste substrate.

[0066] In addition, one side of the heat conducting plate 241 is heat-conductingly contacted with the side of the first pressing part 21 facing away from the clamping surface, so that the heat conducting plate 241 can evenly transfer its own heat to the first pressing part 21 to avoid local overheating of the first pressing part 21.

[0067] In one embodiment, the driving member 23 includes a driving cylinder; the first pressing member 21 is arranged on one side of the second pressing member 22 via a guide column, and the two face each other with the clamping surface; the piston rod of the driving cylinder is connected to the side of the first pressing member 21 facing away from the clamping surface, and can telescopically drive the first pressing member 21 to move back and forth along the guide column.

[0068] Specific, combined Figure 2 To further explain in detail, the driving member 23 is set as a driving cylinder, and the piston rod of the driving cylinder is connected to the side of the first pressing member 21 facing away from the clamping surface, and the first pressing member 21 is arranged on the side of the second pressing member 22 corresponding to the interval through the guide column, so that when the piston rod of the driving cylinder is telescopically driven, the first pressing member 21 can be accurately guided along the guide column to move toward or away from the second pressing member 22.

[0069] The specific arrangement of the driving cylinder and the guide column can fully ensure the accuracy of the moving trajectory of the first pressing member 21 and ensure the precise pressing effect with the second pressing member 22.

[0070] In one embodiment, the chip removal mechanism 1 includes two correspondingly arranged chip removal rollers 11 ; a rolling gap for rolling the IMR film waste substrate is formed between the roller surfaces of the two chip removal rollers 11 .

[0071] Specific, combined Figure 1 To further explain in detail, the chip removal mechanism 1 is configured to have two correspondingly arranged chip removal rollers 11, and a rolling gap for rolling the IMR film waste substrate is formed between the roller surfaces of the two chip removal rollers 11, so that the IMR film waste substrate is correspondingly plugged into the rolling gap, and as the IMR film waste substrate is conveyed, the chip removal rollers 11 can rotate accordingly and remove debris attached to both sides of the IMR film waste substrate.

[0072] The specific configuration of the above-mentioned debris removal mechanism 1 has the beneficial effect of being simple in structure and being able to remove debris on both sides of the IMR film waste substrate without the need for an additional power mechanism.

[0073] In one embodiment, the IMR film waste substrate recovery device further includes a cutting mechanism 3 disposed downstream of the shaping mechanism 2; the cutting mechanism 3 is used to cut and divide the IMR film waste substrate.

[0074] Specific, combined Figure 1 To further explain in detail, the above-mentioned cutting mechanism 3 can be specifically configured as a cutting press, and the cutting press can also be driven by a cylinder to move toward the IMR film waste substrate for cutting, so as to cut the shaped strip-shaped IMR film waste substrate into sheets for subsequent secondary processing.

[0075] In one embodiment, the cutting mechanism 3 includes two cutting plates that are arranged opposite to each other, and cutting blades are arranged on the plate surfaces of the two cutting plates that face each other.

[0076] Specific, combined Figure 1 To further explain in detail, the cutting clamps can be specifically configured as rectangular clamps, and the IMR film waste substrate can be cut by moving the two cutting clamps closer to each other and driving the cutting blades to clamp each other, which has the beneficial effect of efficient cutting.

[0077] In addition, the embodiment of the present disclosure also provides a method for recycling IMR film waste substrates, which can be applied to the above-mentioned IMR film waste substrate recovery device, and includes the following steps:

[0078] Correspondingly, the debris attached to both sides of the IMR membrane waste substrate is removed;

[0079] The clamping textures are formed on both sides of the corresponding clamping IMR film waste substrate to eliminate the surface stress of the IMR film waste substrate;

[0080] Cutting the IMR film waste substrate after clamping into a desired shape;

[0081] The backing adhesive is affixed to one side of the cut IMR film waste substrate and the finished product is packaged.

[0082] Specific, combined Figure 5 To further explain in detail, the IMR membrane waste substrate recycling method can be applied to the above-mentioned IMR membrane waste substrate recovery device, and has the beneficial effects of simple operation steps and being able to efficiently reuse the IMR membrane waste substrate.

[0083] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0084] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An IMR membrane waste substrate recovery device, characterized in that: include: A conveying mechanism capable of conveying the IMR film waste substrate along a conveying path; A debris removal mechanism (1), which is arranged at the head end of the conveying path and is used to remove debris and impurities from the surface of the IMR film waste substrate; A shaping mechanism (2) is arranged downstream of the descaling mechanism (1) and is used to perform stress relief shaping on the IMR film waste substrate; The shaping mechanism (2) comprises a first pressing member (21), a second pressing member (22) and a driving member (23) respectively arranged on both sides of the IMR film waste substrate; The first pressing member (21) and the second pressing member (22) are respectively provided with corresponding clamping and shaping patterns on their clamping surfaces; The driving member (23) is used to drive the clamping and shaping patterns to be pressed together to eliminate the surface stress of the IMR film waste substrate.

2. The IMR membrane waste substrate recovery device according to claim 1, characterized in that: The clamping and shaping patterns include convex patterns (211) and concave patterns (221) that match each other; Of the convex lines (211) and the concave lines (221), one is arranged on the clamping surface of the first pressing member (21), and the other is correspondingly arranged on the clamping surface of the second pressing member (22); When the first pressing piece (21) and the second pressing piece (22) are clamped and pressed together, the raised pattern (211) can be at least partially pressed against the recessed pattern (221).

3. The IMR film waste substrate recovery device according to claim 2, characterized in that: The convex patterns (211) are arranged as grid-like patterns, and the concave patterns (221) are arranged as grid-like depressions correspondingly; The convex lines (211) have a convex height ranging from 0.8 mm to 1.2 mm and a width ranging from 1.8 mm to 2.2 mm; The concave depth range of the concave lines (221) is 0.25 mm greater than the convex height range of the convex lines (211), and the width of the concave lines (221) is 0.5 mm greater than the width of the convex lines (211).

4. The IMR membrane waste substrate recovery device according to claim 3, characterized in that: The convex edges of the convex lines (211) and the concave edges of the concave lines (221) are both provided with chamfers of 0.5 mm.

5. The IMR membrane waste substrate recovery device according to claim 1, characterized in that: The shaping mechanism (2) further comprises a heating device (24); The heating device is arranged in the shaping mechanism (2) and is used to heat and increase the temperature of the shaping mechanism (2).

6. The IMR membrane waste substrate recovery device according to claim 5, characterized in that: The heating device (24) comprises a heat conducting plate (241), a heating tube and a temperature detector; The heating tube and the temperature detector are respectively plugged into the heat conducting plate (241); One side of the heat conducting plate (241) is in contact with a side of the first pressing member (21) that is opposite to the clamping surface; The temperature detector can detect the temperature of the heat conducting plate and provide feedback to adjust the working state of the heating tube.

7. The IMR membrane waste substrate recovery device according to claim 1, characterized in that: The driving member (23) comprises a driving cylinder; The first pressing piece (21) is arranged on one side of the second pressing piece (22) via a guide column, and the two face each other as clamping surfaces; The piston rod of the driving cylinder is connected to the side of the first pressing member (21) facing away from the clamping surface, and can be telescopically driven to reciprocate the first pressing member (21) along the guide column.

8. The IMR film waste substrate recovery device according to claim 1, characterized in that: The chip removal mechanism (1) comprises two correspondingly arranged chip removal rollers (11); A rolling gap for rolling the IMR film waste substrate is formed between the roller surfaces of the two chip removing rollers (11).

9. The IMR film waste substrate recovery device according to claim 1, characterized in that: The IMR film waste substrate recovery device further comprises a cutting mechanism (3) arranged downstream of the shaping mechanism (2); The cutting mechanism (3) is used to cut and divide the IMR film waste substrate.

10. The IMR membrane waste substrate recovery device according to claim 9, characterized in that: The cutting mechanism (3) comprises two cutting clamps arranged opposite to each other, and cutting blades are arranged on the plate surfaces of the two cutting clamps facing each other.

Images