Air exhaust ring assembly and thin film deposition equipment
By designing a pumping ring assembly including an inner ring, an outer ring, a top ring plate and a bottom ring plate, the problem of pumping inequality during wafer manufacturing is solved, and uniform film formation of the film is achieved.
Patent Information
- Application Number
- CN202421759175.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-07-24
AI Technical Summary
During the wafer manufacturing process, when using PECVD equipment to deposit the film, there is a problem of pumping inequality in the circumference of the wafer, which affects the film thickness uniformity of the film.
An exhaust ring assembly is designed, including an inner ring, an outer ring, a top ring plate and a bottom ring plate, the inner ring and an outer ring are coaxially nested, and the top and bottom ring plates are sealed. A plurality of first air holes are uniformly opened on the annular surface of the inner ring, and a plurality of second air holes are opened on the annular surface of the outer ring, and the hole size and spacing vary with the distance.
Through the exhaust ring assembly, the exhaust uniformity in the circumferential direction of the wafer is improved and the film formation uniformity of the film is improved.
Smart Images
Figure CN222613466U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor manufacturing, in particular to an air pumping ring component and a thin film deposition device. Background Art
[0002] During the wafer manufacturing process, plasma enhanced chemical vapor deposition (PECVD) equipment is required to deposit an insulating layer film, which can play an important role in insulating between metals, blocking metal diffusion, and blocking etching.
[0003] When using PECVD equipment to deposit thin films, the wafer is first placed on the wafer base in the vacuum reaction chamber, and the reaction gas reaches the wafer base through the shower head and deposits a thin film on the wafer thereon. Since the vacuum chamber's exhaust port can only be set on one side of the chamber, in order to achieve uniform exhaust of the process gas in the chamber in the circumferential direction of the wafer, a vacuum ring is usually placed between the wafer and the chamber exhaust port, and multiple equally spaced or equally curved exhaust holes are opened on the annular surface of the vacuum ring, so that the process gas on the surface of the wafer in the chamber first flows through the exhaust holes of the exhaust ring, then flows through the channel between the exhaust ring and the inner wall of the chamber, and finally is discharged from the exhaust port of the chamber. By reasonably setting the aperture and number of multiple exhaust holes on the circular exhaust ring, the exhaust uniformity in the circumferential direction of the wafer can usually be ensured. However, under some more extreme process gas flow or chamber pressure conditions, uneven exhaust in the circumferential direction of the wafer will still occur, that is, more gas is exhausted on the side of the wafer close to the chamber exhaust port, while less gas is exhausted on the side far from the chamber exhaust port, thereby affecting the uniformity of the film thickness of the deposited thin film on the wafer.
[0004] Therefore, how to provide an exhaust ring assembly and a thin film deposition device to improve the exhaust uniformity and film formation uniformity in the circumferential direction of the wafer has become a technical problem that needs to be solved urgently in the industry. Utility Model Content
[0005] In view of the above problems in the prior art, the utility model proposes an air pumping ring assembly, comprising an inner ring, an outer ring, a top ring plate and a bottom ring plate;
[0006] The inner ring and the outer ring are coaxially nested, and the diameter of the inner ring is smaller than the diameter of the outer ring;
[0007] The top ring plate and the bottom ring plate are sealed at the top and bottom ends of the inner ring and the outer ring, respectively, the innermost ends of the top ring plate and the bottom ring plate are aligned with the inner ring, and the outermost ends thereof extend beyond the outer ring by a predetermined length;
[0008] A plurality of first air holes are evenly opened on the annular surface of the inner ring, and the hole sizes of the plurality of first air holes are the same; and
[0009] A plurality of second air holes are provided on the annular surface of the outer ring, and the plurality of second air holes are staggered with the plurality of first air holes. The hole sizes of the plurality of second air holes along the circumference of the outer ring increase with increasing distance from the air exhaust port, and / or the hole spacing between adjacent second air holes decreases with increasing distance from the air exhaust port.
[0010] In one embodiment, the ring width of the top ring plate is the same as the ring width of the bottom ring plate, and the predetermined length accounts for 50%-70% of the ring width of the top ring plate or the ring width of the bottom ring plate.
[0011] In one embodiment, the diameter of the inner ring is 10-20 mm smaller than the diameter of the outer ring.
[0012] In one embodiment, the inner ring and the outer ring have the same height, the lower surface of the top ring plate is provided with a first groove and a second groove corresponding to the inner ring and the outer ring respectively, and the upper surface of the bottom ring plate is provided with a third groove and a fourth groove corresponding to the inner ring and the outer ring respectively, and when the two ends of the inner ring are respectively arranged in the first groove and the third groove and the two ends of the outer ring are respectively arranged in the second groove and the fourth groove, the top ring plate is parallel to the bottom ring plate.
[0013] In one embodiment, the plurality of second air holes are distributed on the annular surface of the outer ring at equal intervals, and the hole size thereof increases linearly with increasing distance from the second air holes to the air suction port.
[0014] In one embodiment, the hole sizes of the plurality of second air holes along the circumference of the outer ring are equal, wherein the hole spacing between each second air hole and its adjacent second air hole decreases as the distance from the second air hole to the air suction port increases.
[0015] In one embodiment, the plurality of first pores are staggered with the plurality of second pores in the height direction, or the plurality of first pores are staggered with the plurality of second pores in the circumferential direction, or the plurality of first pores are staggered with the plurality of second pores in both the height direction and the circumferential direction.
[0016] In one embodiment, the exhaust port is an exhaust port of a thin film deposition device, and an exhaust port is formed at the outermost end of the bottom ring plate for alignment with the exhaust port.
[0017] The utility model also provides a thin film deposition device, comprising any one of the above-mentioned pumping ring components, reaction chamber, wafer base and shower head;
[0018] The wafer base is arranged in the reaction chamber, the exhaust ring assembly is installed in the reaction chamber and communicated with the exhaust port on one side of the reaction chamber, the exhaust ring assembly is coaxially arranged on the outside of the wafer base, and extracts the process gas provided by the shower head and discharges the process gas from the reaction chamber through the exhaust port, the diameter of the inner ring of the exhaust ring assembly is larger than the diameter of the wafer base, and the shower head is installed at the upper end of the reaction chamber.
[0019] In one embodiment, the air suction port is aligned with the exhaust port at the outermost end of the bottom ring plate, and the air suction ring assembly is connected to the air suction port through the exhaust port.
[0020] Compared with the prior art in which only one exhaust ring is placed between the wafer and the exhaust port of the cavity, resulting in uneven exhaust, the exhaust ring assembly of the utility model comprises an inner ring, an outer ring, a top ring plate and a bottom ring plate; the inner ring and the outer ring are coaxially nested, and the diameter of the inner ring is smaller than the diameter of the outer ring; the top ring plate and the bottom ring plate are sealed at the top and bottom ends of the inner ring and the outer ring respectively, the innermost ends of the top ring plate and the bottom ring plate are aligned with the inner ring, and the outermost ends thereof extend beyond the predetermined length of the outer ring; a plurality of first air holes are uniformly provided on the annular surface of the inner ring, and the hole sizes of the plurality of first air holes are the same; a plurality of second air holes are provided on the annular surface of the outer ring, and the plurality of second air holes are staggered with the plurality of first air holes, and the hole sizes of the plurality of second air holes along the circumferential direction of the outer ring increase with increasing distance from the exhaust port, and / or the hole spacing between adjacent second air holes decreases with increasing distance from the exhaust port. The utility model can improve the uniformity of exhaustion and film formation in the circumferential direction of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.
[0022] Figure 1 It is a schematic diagram of the exploded structure of an embodiment of the pumping ring assembly of the utility model;
[0023] Figure 2 A schematic cross-sectional view of an embodiment of an air pumping ring assembly of the utility model; and
[0024] Figure 3 It is a schematic diagram of the composition structure of a thin film deposition device according to an embodiment of the utility model. DETAILED DESCRIPTION
[0025] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and functions of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation. On the contrary, the purpose of introducing the utility model in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present utility model. In order to provide an in-depth understanding of the present utility model, the following description will include many specific details. The present utility model can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present utility model, some specific details will be omitted in the description.
[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0027] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.
[0028] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as the second component, region, layer and / or part without departing from some embodiments of the present invention.
[0029] Please refer to Figure 1 as well as Figure 2 , which are respectively a schematic diagram of the exploded structure and a schematic diagram of the cross-sectional structure of an embodiment of the pumping ring assembly of the utility model. Figure 1 as well as Figure 2As shown, the vacuum ring assembly of the utility model includes an inner ring 10, an outer ring 12, a top ring plate 14 and a bottom ring plate 16. The inner ring 10 and the outer ring 12 are coaxially nested, and the diameter of the inner ring 10 is smaller than the diameter of the outer ring 12; the top ring plate 14 and the bottom ring plate 16 are sealed at the top and bottom ends of the inner ring 10 and the outer ring 12 respectively.
[0030] The innermost ends 141 and 161 of the top ring plate 14 and the bottom ring plate 16 are aligned with the inner ring 10, and the outermost ends 142 and 162 thereof extend beyond the predetermined length L of the outer ring 12; a plurality of first air holes 100 are evenly provided on the ring surface of the inner ring 10, and the hole sizes of the plurality of first air holes 100 are the same. A plurality of second air holes 120 are provided on the ring surface of the outer ring 12, and the plurality of second air holes 120 are staggered with the plurality of first air holes 100, and the hole sizes of the plurality of second air holes 120 along the circumference of the outer ring 12 follow the air extraction port 20 (see Figure 3 ), and / or the hole spacing between adjacent second air holes 120 decreases as the distance to the air suction port 20 increases. The hole spacing is the arc angle interval between adjacent second air holes 120.
[0031] The diameter of the inner ring 10 is 10 to 20 mm smaller than the diameter of the outer ring 12 . The diameter of the inner ring 10 is approximately 10 to 18 mm, and the diameter of the outer ring 12 is approximately 20 to 38 mm.
[0032] The ring width of the top ring plate 14 is the same as the ring width of the bottom ring plate 16, and the predetermined length L accounts for 50%-70% of the ring width of the top ring plate 14 or the ring width of the bottom ring plate 16. More specifically, the predetermined length L accounts for 50%, 55%, 60%, 65% or 70% of the ring width of the top ring plate 14 or the ring width of the bottom ring plate 16.
[0033] The heights of the inner ring 10 and the outer ring 12 are substantially the same. The lower surface of the top ring plate 14 is provided with a first groove and a second groove corresponding to the inner ring 10 and the outer ring 12, respectively. The upper surface of the bottom ring plate 16 is provided with a third groove and a fourth groove corresponding to the inner ring 10 and the outer ring 12, respectively. When the two ends of the inner ring 10 are respectively arranged in the first groove and the third groove and the two ends of the outer ring 12 are respectively arranged in the second groove and the fourth groove, the top ring plate 14 is parallel to the bottom ring plate 16. Sealing rings may be arranged in the first to fourth grooves. Figure 3 As shown, the exhaust port 20 is an exhaust port of a thin film deposition device, and an exhaust port 160 is provided at the outermost end of the bottom ring plate 16 for alignment with the exhaust port 20 .
[0034] The first groove and the second groove on the lower surface of the top ring plate 14 and the third groove and the fourth groove on the upper surface of the bottom ring plate 16 can be provided with matching patterns to achieve the limitation and alignment of the inner ring 10 and the outer ring 12, and the exhaust port 160 can also position the exhaust ring assembly 1 by aligning it with the exhaust port 20.
[0035] 40-60 first air holes 110 may be uniformly formed on the annular surface of the inner ring plate 10, and the first air holes 110 may be circular holes, square holes, slot holes, or holes of other shapes commonly used in the industry. 12-30 second air holes 120 may be formed on the annular surface of the outer ring plate 12, and the second air holes 120 may be circular holes, square holes, slot holes, or holes of other shapes commonly used in the industry.
[0036] In one embodiment, a plurality of second air holes 120 are distributed on the annular surface of the outer ring 12 at equal intervals, and the hole size thereof increases linearly with the increasing distance from the second air hole 120 to the air suction port 20. The increasing tolerance of the hole size of two adjacent second air holes 120 may be 2 mm, and the hole size of each second air hole varies in the range of 10 to 18 mm.
[0037] In another embodiment, the hole sizes of multiple second air holes 120 along the circumference of the outer ring 12 are equal, wherein the hole spacing between each second air hole 120 and its adjacent second air hole 120 decreases with the increasing distance from the second air hole 120 to the air exhaust port 20, and the decreasing tolerance of the angular spacing between two adjacent second air holes 120 may be 5°, and the angular spacing may vary in the range of 10°-30°.
[0038] In other embodiments, the hole sizes and hole spacings of the multiple second air holes 120 along the circumference of the outer ring 12 can vary simultaneously, the hole sizes of the multiple second air holes 120 along the circumference of the outer ring 12 increase with increasing distance from the exhaust port, and the hole spacings of adjacent second air holes 120 decrease with increasing distance from the exhaust port 20.
[0039] The plurality of first air holes 100 and the plurality of second air holes 120 may be staggered in the height direction, or the plurality of first air holes 100 and the plurality of second air holes 120 may be staggered in the circumferential direction, or the plurality of first air holes 100 and the plurality of second air holes 120 may be staggered in both the height direction and the circumferential direction. Figure 2 In the illustrated embodiment, the plurality of first air holes 100 and the plurality of second air holes 120 are staggered with each other in both the height direction and the circumferential direction.
[0040] See also Figure 3 , which is a schematic diagram of the composition structure of the thin film deposition device according to the embodiment of the utility model. To simplify the diagram, only some parts of the thin film deposition device are shown. Figure 3As shown, the thin film deposition device of the utility model includes an exhaust ring assembly 1, a reaction chamber 2, a wafer base 3 and a shower head 4. The wafer base 3 is arranged in the reaction chamber 2. The exhaust ring assembly 1 is installed in the reaction chamber 2 and communicated with the exhaust port 20 on one side of the reaction chamber 2. The exhaust ring assembly 1 is coaxially arranged on the outside of the wafer base 3, and extracts the process gas provided by the shower head 4 and discharges it from the reaction chamber 2 through the exhaust port 20. The diameter of the inner ring 10 of the exhaust ring assembly 1 is larger than the diameter of the wafer base 3. The shower head 4 is installed at the upper end of the reaction chamber 2. In this embodiment, the thin film deposition device can be a plasma enhanced chemical vapor deposition device, i.e., a PECVD device.
[0041] The air extraction port 20 is aligned with the exhaust port 160 at the outermost end of the bottom ring plate 16, and the air extraction ring assembly 1 is connected to the air extraction port 20 through the exhaust port 160. Figure 1 , Figure 2 The above description is used to understand the air pumping ring assembly 1, which will not be repeated here.
[0042] When using the vacuum ring assembly 1 of the utility model, the inner ring 10 and the outer ring 12 are coaxially nested first, and then the first ends of the inner ring 10 and the outer ring 12 are respectively set in the first groove and the second groove of the top ring plate 14, and then the second ends of the inner ring 10 and the outer ring 12 opposite to the first end are respectively set in the third groove and the fourth groove of the bottom ring plate 16, so that the top ring plate 14 and the bottom ring plate 16 are respectively sealed at the top and bottom ends of the inner ring 10 and the outer ring 12. Then, the vacuum ring assembly 1 is coaxially fixed to the outside of the wafer base 3 using screws or bolts, and the vacuum port 20 is aligned with the exhaust port 160 at the outermost end of the bottom ring plate 16. In this way, the process gas on the surface of the wafer in the reaction chamber 2 first flows through the multiple first air holes 100 on the inner ring 10, then flows through the annular space between the inner ring 10 and the outer ring 12, and then flows through the multiple second air holes 120 on the outer ring 12, and finally flows out of the reaction chamber 2 through the exhaust port 160 and the exhaust port 20. The multiple second air holes 120 can effectively improve the uniformity of exhaust in the circumferential direction of the wafer.
[0043] In summary, the vacuum ring assembly of the utility model includes an inner ring, an outer ring, a top ring plate and a bottom ring plate; the inner ring and the outer ring are coaxially nested, and the diameter of the inner ring is smaller than the diameter of the outer ring; the top ring plate and the bottom ring plate are sealed at the top and bottom ends of the inner ring and the outer ring respectively, the innermost ends of the top ring plate and the bottom ring plate are aligned with the inner ring, and the outermost ends thereof extend beyond the predetermined length of the outer ring; a plurality of first air holes are uniformly provided on the annular surface of the inner ring, and the hole sizes of the plurality of first air holes are the same; a plurality of second air holes are provided on the annular surface of the outer ring, and the plurality of second air holes are staggered with the plurality of first air holes, and the hole sizes of the plurality of second air holes along the circumferential direction of the outer ring increase with the increasing distance to the vacuum port, and / or the hole spacing between adjacent second air holes decreases with the increasing distance to the vacuum port. The utility model can improve the vacuum uniformity and film formation uniformity in the circumferential direction of the wafer.
[0044] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the universal principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein. The above-mentioned embodiments are provided to persons familiar with the art to implement or use the utility model, and persons familiar with the art may make various modifications or changes to the above-mentioned embodiments without departing from the inventive concept of the utility model, and thus the scope of protection of the utility model is not limited by the above-mentioned embodiments, but should be in accordance with the maximum scope of the innovative features mentioned in the claims.
Claims
1. A pumping ring assembly, characterized in that: It includes an inner ring, an outer ring, a top ring plate and a bottom ring plate; The inner ring and the outer ring are coaxially nested, and the diameter of the inner ring is smaller than the diameter of the outer ring; The top ring plate and the bottom ring plate are sealed at the top and bottom ends of the inner ring and the outer ring, respectively, the innermost ends of the top ring plate and the bottom ring plate are aligned with the inner ring, and the outermost ends thereof extend beyond the outer ring by a predetermined length; A plurality of first air holes are evenly opened on the annular surface of the inner ring, and the hole sizes of the plurality of first air holes are the same; and A plurality of second air holes are provided on the annular surface of the outer ring, and the plurality of second air holes are staggered with the plurality of first air holes. The hole sizes of the plurality of second air holes along the circumference of the outer ring increase with increasing distance from the air exhaust port, and / or the hole spacing between adjacent second air holes decreases with increasing distance from the air exhaust port.
2. The pumping ring assembly according to claim 1, characterized in that: The ring width of the top ring plate is the same as the ring width of the bottom ring plate, and the predetermined length accounts for 50%-70% of the ring width of the top ring plate or the ring width of the bottom ring plate.
3. The pumping ring assembly according to claim 1, characterized in that: The diameter of the inner ring is 10 to 20 mm smaller than the diameter of the outer ring.
4. The pumping ring assembly according to claim 1, characterized in that: The inner ring and the outer ring have the same height, the lower surface of the top ring plate is respectively provided with a first groove and a second groove corresponding to the inner ring and the outer ring, and the upper surface of the bottom ring plate is respectively provided with a third groove and a fourth groove corresponding to the inner ring and the outer ring, and when the two ends of the inner ring are respectively arranged in the first groove and the third groove and the two ends of the outer ring are respectively arranged in the second groove and the fourth groove, the top ring plate is parallel to the bottom ring plate.
5. The pumping ring assembly according to claim 1, characterized in that: The plurality of second air holes are distributed on the annular surface of the outer ring in an equidistant manner, and the hole sizes thereof increase linearly with increasing distances from the second air holes to the air suction port.
6. The pumping ring assembly according to claim 1, characterized in that: The hole sizes of the plurality of second air holes along the circumference of the outer ring are equal, wherein the hole spacing between each second air hole and its adjacent second air hole decreases as the distance from the second air hole to the air suction port increases.
7. The pumping ring assembly according to claim 1, characterized in that: The plurality of first pores are staggered with the plurality of second pores in the height direction, or the plurality of first pores are staggered with the plurality of second pores in the circumferential direction, or the plurality of first pores are staggered with the plurality of second pores in both the height direction and the circumferential direction.
8. The pumping ring assembly according to claim 1, characterized in that: The exhaust port is an exhaust port of a thin film deposition device, and an exhaust port is provided at the outermost end of the bottom ring plate for alignment with the exhaust port.
9. A thin film deposition device, characterized in that: It comprises the pumping ring assembly, reaction chamber, wafer base and shower head according to any one of claims 1 to 8; The wafer base is arranged in the reaction chamber, the exhaust ring assembly is installed in the reaction chamber and is connected with the exhaust port on one side of the reaction chamber, the exhaust ring assembly is coaxially arranged on the outside of the wafer base, and draws the process gas provided by the shower head and discharges it from the reaction chamber through the exhaust port, the diameter of the inner ring of the exhaust ring assembly is larger than the diameter of the wafer base, and the shower head is installed at the upper end of the reaction chamber.
10. The thin film deposition device according to claim 9, characterized in that: The air extraction port is aligned with the exhaust port at the outermost end of the bottom ring plate, and the air extraction ring assembly is connected to the air extraction port through the exhaust port.