Electroplating equipment
By using ultrasonic vibration devices and reflective elements in electroplating equipment, the problem of poor wetting ability of the plating solution when preparing metal grid lines with narrow line widths is solved, and more uniform plating formation and higher product yield are achieved.
Patent Information
- Application Number
- CN202420416207.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-05
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-03-05
AI Technical Summary
During the electroplating process, especially when preparing metal grid lines with narrow line widths, the ability of the electroplating solution to immerse the grid lines is poor, resulting in a gate breakage phenomenon and affecting product yield.
An electroplating device is adopted, which is equipped with an ultrasonic vibration device and a reflective element in the electroplating tank, and the bubbles around the area to be electroplating are oscillated and broken by ultrasonic waves or caused to break or leave the surface of the part to be electroplating, thereby improving the wetting ability of the electroplating solution.
It effectively avoids the problem that the electroplating solution cannot effectively contact the surface of the grid trough due to the existence of air bubbles, improves the uniformity of the plating layer, reduces the incidence of grid breakage, and improves the electroplating processing yield of the product.
Smart Images
Figure CN222613519U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to electroplating equipment. Background Art
[0002] At present, the photovoltaic industry generally uses screen printing silver paste to make electrodes. In order to reduce costs and increase efficiency, the use of electroplating copper technology to make electrodes is constantly being explored. The copper electrode is used instead of the silver electrode because the electroplating copper technology can produce grid lines with narrower line widths, which can generally be controlled at 10 to 20 μm. The narrower the line width of the electrode pattern, the smaller the shading area of the metal electrode obtained, and the higher the photoelectric conversion efficiency of the cell.
[0003] When using electroplating to make metal grid lines of products, it is necessary to perform mask pretreatment on the surface of the product, and then form openings on the mask as grid line grooves, so that fine metal grid lines can be electroplated in the grid line grooves. During electroplating, the plated metal is used as the anode, and the pretreated product to be plated is used as the cathode. Both the cathode and the anode are immersed in the plating solution containing the plating cations. After power is turned on, under the action of the potential difference, the cations in the plating solution move toward the cathode and are reduced on the surface of the product to form a plating layer, that is, a metal grid line.
[0004] However, since the mask part of the product surface pre-treatment has a strong hydrophobicity, the narrower the width of the gate line to be electroplated on the product surface, the worse the ability of the plating solution to infiltrate the gate line groove under the influence of the surface tension of the plating solution and the hydrophobicity of the mask, resulting in a certain proportion of broken gates when preparing gate lines with narrow line widths, causing product defects. Summary of the invention
[0005] The utility model aims to provide an electroplating device to avoid or reduce the phenomenon of grid breaking during the electroplating process of the product and improve the product yield.
[0006] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an electroplating device, the electroplating device comprising:
[0007] Electroplating tanks;
[0008] an anode member, disposed in the electroplating tank;
[0009] An electroplating power source, wherein the positive electrode of the electroplating power source is connected to the anode member;
[0010] An ultrasonic vibration device, disposed in the electroplating tank, wherein the ultrasonic vibration device has a propagation path;
[0011] A reflective element, wherein the reflective element is disposed on the propagation path and has a reflective path;
[0012] In the working state, the electroplating tank contains electroplating liquid, the anode component is located in the electroplating liquid, the area to be plated of the component to be plated is immersed in the electroplating liquid, and the component to be plated is connected to the negative pole of the electroplating power supply, and the area to be plated of the component to be plated is located on the reflection path.
[0013] Preferably, the structure of the ultrasonic vibration device can be any one of the following:
[0014] (1) The ultrasonic vibration device adopts a single vibrator structure and has one propagation path;
[0015] (2) The ultrasonic vibration device adopts a multi-vibrator structure, the number of the propagation paths is equal to the number of the vibrators, and two adjacent propagation paths are parallel or perpendicular to each other;
[0016] (3) The ultrasonic vibration device adopts a composite vibrator structure, the number of the propagation paths is equal to the number of the vibrators, and the angle between two adjacent propagation paths is greater than 0°.
[0017] Preferably, the electroplating equipment may also adopt any one of the following structures or a combination of two or more structures:
[0018] (1) The reflection path is perpendicular to the area to be plated of the part to be electroplated;
[0019] (2) There are multiple ultrasonic vibration devices, at least two of which are arranged opposite to each other, and the propagation paths overlap to form ultrasonic mixing;
[0020] (3) At least one of the ultrasonic vibration devices is arranged vertically;
[0021] (4) The anode member is a plate-like structure.
[0022] In some embodiments, the electroplating equipment further includes a transmission mechanism, which is disposed in the electroplating tank. The transmission mechanism has a transmission path and transports the workpiece to be electroplated along the transmission path, and the workpiece to be electroplated moves through the reflection path.
[0023] Preferably, there is at least one ultrasonic vibration device in the electroplating tank. When the number of the ultrasonic vibration device is one, the ultrasonic vibration device is located at the beginning of the transmission path. When there are more than one ultrasonic vibration device, at least one ultrasonic vibration device is located at the beginning of the transmission path.
[0024] In some embodiments, the ultrasonic vibration device has a vibration working surface, and the propagation starting point of the propagation path is located on the vibration working surface; wherein, there is a preset proportional value between the width of the vibration working surface and the width of the part to be electroplated.
[0025] In some embodiments, the electroplating equipment also includes a liquid extraction pipe, a defoaming mechanism and a liquid discharge pipe. The defoaming mechanism is connected to the electroplating tank through the liquid extraction pipe and the liquid discharge pipe. The liquid extraction pipe and the liquid discharge pipe are both provided with a pump body so that the electroplating tank, the liquid extraction pipe, the defoaming mechanism and the liquid discharge pipe together form a loop.
[0026] In some embodiments, the defoaming mechanism includes a defoaming chamber and a defoaming member, and the defoaming member adopts any one of the following structures or a combination of two or more structures:
[0027] (1) A heater is installed on the side wall of the defoaming chamber, and the heater contacts the plating solution in the defoaming chamber and changes its temperature;
[0028] (2) The defoaming chamber is connected to a centrifuge, and the centrifuge drives the defoaming chamber and the electroplating solution to perform centrifugal motion;
[0029] (3) The defoaming chamber is connected to a vacuum machine, and the vacuum machine is communicated with the interior of the defoaming chamber.
[0030] In some embodiments, the electroplating equipment also includes a spray assembly, which includes a tube body and a nozzle. Both ends of the tube body are respectively connected to the electroplating tank and the nozzle. The nozzle has a spray hole, and the spray hole faces the area to be plated of the electroplated part.
[0031] In some embodiments, a defoaming filter and / or a rotatable spiral defoaming paddle are disposed in the tube body and the nozzle.
[0032] Due to the application of the above technical scheme, the utility model has the following advantages compared with the prior art: the electroplating equipment of the utility model is provided with an ultrasonic vibration device and a reflection element in the electroplating tank, the ultrasonic vibration device has a propagation path, the reflection element is arranged on the propagation path and has a reflection path, when the area to be plated of the workpiece to be electroplated is located on the reflection path, the ultrasonic wave is emitted from the ultrasonic vibration device and propagates along the propagation path in the medium, when the ultrasonic wave encounters the reflection element, it is reflected and acts on the area to be plated along the reflection path, the bubbles around the area to be electroplated are oscillated and broken by the ultrasonic wave or are made to leave the surface of the workpiece to be electroplated, so as to avoid the factors such as bubbles in the electroplating solution causing the electroplating solution and the metal ions therein to be unable to contact well with the surface of the grid line groove, after the electroplating solution enters the grid line groove, the metal ions in the electroplating solution can adhere to the surface of the area to be electroplated and form a uniform plating layer thereon, so as to avoid the occurrence of broken grid phenomenon and improve the electroplating processing yield of the workpiece to be electroplated. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Attached Figure 1It is a schematic diagram of the arrangement of the reflective element and the vibration element in the electroplating tank of the electroplating equipment in a specific embodiment of the utility model;
[0034] Attached Figure 2 is a schematic diagram of a first structure of a vibration element;
[0035] Attached Figure 3 is a schematic diagram of a second structure of a vibration element;
[0036] Attached Figure 4 is a schematic diagram of the third structure of the vibration element;
[0037] Attached Figure 5 is a schematic diagram of the positional relationship between the vibration element and the reflection element;
[0038] Attached Figure 6 A schematic diagram of the positional relationship between the vibration element and the workpiece to be electroplated in one embodiment;
[0039] Attached Figure 7 A schematic diagram of the positional relationship between the vibration element and the workpiece to be electroplated in another embodiment;
[0040] Attached Figure 8 It is a partial structural schematic diagram of an electroplating device in a specific embodiment of the utility model. DETAILED DESCRIPTION
[0041] The technical solution of the utility model is further described below in conjunction with the accompanying drawings and specific embodiments.
[0042] The utility model discloses an electroplating device, which includes an electroplating tank 1, the electroplating tank 1 has a tank cavity for containing electroplating liquid, and the electroplating device also includes an anode (not shown in the figure) and an electroplating power supply (not shown in the figure), wherein the anode is arranged in the tank cavity of the electroplating tank 1, and the positive electrode of the electroplating power supply is electrically connected to the anode. When the electroplating device is in an electroplating working state, the anode is located in the electroplating liquid, and the negative electrode of the electroplating power supply is electrically connected to the workpiece 4 to be electroplated to form a loop. When the area 44 to be electroplated on the electroplating workpiece 4 is immersed in the electroplating liquid, under the drive of the power supply potential and the flow of the liquid, the metal electrons electrolyzed by the anode and the metal electrons in the electrolyte itself will be enriched on the surface of the area 44 to be electroplated of the workpiece to be electroplated, and deposited to form a metal coating, thereby completing the electroplating of the area 44 to be electroplated. Wherein, the workpiece to be electroplated can be a product that needs to be given some special physical properties or decorative properties, such as a PCB board, a solar cell, a silicon wafer, and a chip.
[0043] See also Figure 1As shown, the electroplating equipment also includes an ultrasonic vibration device 2 and a reflective element 3, wherein the ultrasonic vibration device 2 includes a vibration element 21, and the vibration element 21 is arranged in the tank cavity of the electroplating tank 1; the reflective element 3 has a reflective surface 31, and the reflective surface 31 is configured to receive the ultrasonic wave emitted by the vibration element 21 in the ultrasonic vibration device 2, and reflect the received ultrasonic wave toward the to-be-plated area 44 of the to-be-plated part 4. The vibration element 21 can be installed at any position in the cavity of the electroplating tank 1, and cooperates with the reflective element 3 so that the ultrasonic wave emitted by the vibration element 21 can eventually act on the to-be-plated area 44 of the to-be-plated part 4. The high-intensity ultrasonic wave can oscillate and break the bubbles around the to-be-plated area 44 or make them leave the surface of the to-be-plated part 4, so that the plating liquid can enter the grid line groove of the to-be-plated area 44, avoiding the plating liquid not being able to contact the grid line groove surface of the to-be-plated area 44 due to factors such as bubbles in the plating liquid, thereby further improving the uniformity of the coating formed in the to-be-plated area 44 and avoiding the occurrence of grid breakage.
[0044] The ultrasonic vibration device 2 has a propagation path. When the ultrasonic wave generated by the ultrasonic vibration device 2 propagates in a medium (such as a plating solution), it will propagate along a certain path. This path is the propagation path. The reflective element 3 is arranged on the propagation path, that is, the ultrasonic wave will contact and be affected by the reflective element 3 during the propagation process. The reflective element 3 is an element for reflecting ultrasonic waves, such as a reflective plate or a reflector. The reflective element 3 has a reflection path. When the ultrasonic wave encounters the reflective element, it will be reflected and propagate along a certain path. This path is the reflection path. The reflection path includes information such as the reflection angle, the reflection degree and the reflection position. The area to be plated 44 of the workpiece 4 to be plated is located on the reflection path. In this way, the ultrasonic wave can propagate to the area to be plated 44 through the medium (such as a plating solution), so that the surface and the periphery of the workpiece 4 to be plated produce a slight vibration, and the bubbles in the grid line groove of the area to be plated 44 are oscillated and broken.
[0045] The ultrasonic vibration device 2 includes a housing 22 and one or more vibration elements 21 disposed in the housing 22. The structure of the ultrasonic vibration device 2 may be any of the following:
[0046] (1) The ultrasonic vibration device 2 adopts a single vibrator structure and has one propagation path;
[0047] (2) The ultrasonic vibration device 2 adopts a multi-vibrator structure, the number of propagation paths is equal to the number of vibration elements 21, and two adjacent propagation paths are parallel or perpendicular to each other;
[0048] (3) The ultrasonic vibration device 2 adopts a composite vibrator structure, the number of propagation paths is equal to the number of vibration elements 21, and the angle between two adjacent propagation paths is greater than 0°.
[0049] Specifically, Figure 2 As shown, in the ultrasonic vibration device 2 of the single-vibrator structure, the number of the vibration element 21 is one, which emits ultrasonic waves in a single direction; Figure 3 As shown, in the ultrasonic vibration device 2 of the composite vibrator structure, the number of the vibration elements 21 is at least two, and the two vibration elements 21 are arranged side by side and at a certain angle in the housing 22, and the two vibration elements 21 emit ultrasonic waves respectively, and the sound emission directions of the two vibration elements 21 form an angle greater than 0°, which is specifically an acute angle here; Figure 4 As shown, in the ultrasonic vibration device 2 of the multi-vibrator structure, the number of vibration elements 21 is at least two, and specifically four are provided here. The four vibration elements 21 are provided together in the same housing 22, and the sound emission directions of the four vibration elements 21 are spaced 90° apart from each other, that is, ultrasonic waves are emitted in four directions at the same time. Of course, in other embodiments, the number of vibration elements 21 in the vibration element 21 can also be other numbers, and the arrangement method can also be other methods.
[0050] The ultrasonic vibration device 2 also includes a control element (not shown in the figure), which is electrically connected to the vibration element 21 for controlling the working state of the vibration element 21. For example, the frequency of the ultrasonic device 2 can be adjusted by the control element to achieve ultrasonic vibrations of different frequencies; the vibration amplitude can also be adjusted by the control element to control the intensity of the ultrasonic wave; the phase adjustment between different vibration elements 21 can also be achieved by the control element to achieve a complex vibration mode.
[0051] The reflective element 3 is fixedly arranged on the wall of the electroplating tank 1, and its reflective surface 31 faces the tank cavity. The tank wall of the electroplating tank 1 includes a plurality of side walls extending in the up-down direction, and a bottom wall located below the tank cavity, and the reflective element 3 is fixedly arranged on the bottom wall or at least one side wall. The sound emission direction of the vibration element 21 can be between vertically toward the reflective surface 31 and parallel to the reflective surface 31. The position and number of the reflective elements 3 are specifically determined according to the number of the vibration elements 21 and the sound emission direction of the vibration elements 21.
[0052] See also Figure 6 , Figure 7 As shown, the part 4 to be electroplated includes a base layer 41 and a seed layer 42 stacked in the thickness direction, and a mask layer 43 covering the seed layer 42, and an opening is formed on the mask layer 43 so that the seed layer 42 is exposed from the opening, and the opening is used to receive the electroplating treatment, that is, the opening serves as the area 44 to be electroplated.
[0053] The workpiece 4 to be plated can be plated in a vertical or horizontal manner, that is, the workpiece 4 to be plated is immersed in the plating solution in a vertical or horizontal state. Here, the horizontal plating of the workpiece 4 to be plated is taken as an example. The surface of the workpiece 4 to be plated where the plating area 44 is located is usually facing upward or downward. When the surface of the workpiece 4 to be plated is set upward, if the vibration element 21 is set above the workpiece 4 to be plated, such as Figure 6 As shown, the sound emission direction of the vibration element 21 is perpendicular to the surface of the workpiece 4 to be electroplated.
[0054] Then, the effect of ultrasonic wave acting on the area to be electroplated 44 is relatively good, and there is no need to use the reflective element 3 to reflect the ultrasonic wave. However, such an arrangement will occupy a certain space above the electroplating tank 1, which is not convenient for the arrangement of other components in the electroplating equipment.
[0055] If the vibration element 21 is arranged on the side of the workpiece 4 to be plated, Figure 7 As shown, the sound direction of the vibration element 21 is parallel to the surface of the part to be electroplated 4, so the effect of ultrasonic wave on the area to be electroplated 44 is poor, and the ability of the plating liquid to wet the surface of the area to be electroplated 44 is poor. At this time, it is necessary to use the reflective element 3 to reflect the ultrasonic wave emitted by the vibration element 21 to the area to be electroplated 44, so as to enhance the wetting ability of the plating liquid on the surface of the area to be electroplated 44. When arranged in this way, the vibration element 21 and the reflective element 3 can be conveniently arranged in the electroplating tank 1, which saves space and will not affect the arrangement of other components in the electroplating equipment.
[0056] Preferably, the reflection path is perpendicular to the area to be plated of the workpiece 4 to be plated, so that the ultrasonic wave can propagate into the grid line groove of the area to be plated 44, and the bubbles in the grid line groove are oscillated and broken or leave the surface of the grid line groove, so that the plating solution can drive the metal ions into the grid line groove and adhere to its surface. Specifically, the workpiece 4 to be plated is plated in the plating tank 4 in a preset route and state, thereby the installation positions of the ultrasonic vibration device 2 and the reflective element 3 can be determined accordingly.
[0057] In practical applications, at least one ultrasonic vibration device 2 is vertically arranged. By vertically arranging the ultrasonic vibration device 2, the space occupied inside the electroplating tank 1 can be reduced. Moreover, since the ultrasonic vibration device 2 has a variety of structures, a plurality of reflection paths can be formed by adjusting the number and layout of the vibration elements 21. The plurality of reflection paths also have different reflection directions. In this way, it is possible to simultaneously propagate ultrasonic waves to a plurality of different electroplating areas 44.
[0058] In order to increase the range of ultrasonic wave propagation, there are multiple ultrasonic vibration devices 2, at least two ultrasonic vibration devices 2 are arranged opposite to each other, and the propagation paths overlap to form ultrasonic mixing. Specifically, ultrasonic mixing refers to mixing two or more ultrasonic waves to form a new ultrasonic wave, thereby generating a new frequency, changing the amplitude, phase or frequency of the sound wave, etc. In addition, during the mixing process, the intensity and penetration ability of the original ultrasonic wave will be enhanced to achieve a better propagation effect.
[0059] The anode member disposed in the electroplating tank 1 may be a mesh structure, a plate structure, a belt structure, a tubular structure, etc. Preferably, the anode member adopts a plate structure, and the anode member of the plate structure generally has a larger surface area than other structures, so as to increase the contact area between the anode member and the electroplating solution and increase the metal ion concentration in the electroplating solution. In addition, in practical applications, there are multiple anode members, and the multiple anode members are arranged in an interval in the electroplating tank 1.
[0060] The electroplating equipment also includes a transmission mechanism, which is arranged in the electroplating tank 1. The transmission mechanism has a transmission path, and the parts to be electroplated are transported along the transmission path, and the parts to be electroplated move through the reflection path. Under this structure, the parts to be electroplated 4 are dynamically electroplated. If static electroplating is adopted, the electroplating equipment does not include a transmission mechanism, and the parts to be electroplated 4 are placed in the electroplating tank by hanging plating or the like. Specifically, when the parts to be electroplated 4 are vertically electroplated, in order to avoid fragments of the parts to be electroplated 4, the parts to be electroplated 4 can be carried by a carrier, and the transmission mechanism drives the carrier to move along the electroplating tank 1. The carrier enables the area to be electroplated 44 of the parts to be electroplated 4 to be always parallel to the tank wall of the electroplating tank 1. When the moving route of the parts to be electroplated 4 and the direction of the area to be electroplated 44 are pre-set, the ultrasonic vibration device 2 and the reflective element 3 can both determine their set positions to ensure that the parts to be electroplated move through the reflection path. When the workpiece 4 to be plated is horizontally plated, roller transmission can be used. There is a spacing between two adjacent rollers, and the area 44 to be plated located on the lower surface of the workpiece 4 to be plated will be exposed from the above spacing. The ultrasonic vibration device 2 is installed to the bottom wall of the electroplating tank 1, and transmits ultrasonic waves to the above spacing, so that the area 44 to be plated on the lower surface of the workpiece 4 to be plated and its surroundings vibrate to oscillate and burst the bubbles or make them leave the surface of the area 44 to be plated. Accordingly, a reflective element 3 can also be installed above the transmission mechanism so that there is a reflection path perpendicular to the area 44 to be plated on the upper surface of the workpiece 4 to be plated.
[0061] There is at least one ultrasonic vibration device 2 in the electroplating tank 1. When there is one ultrasonic vibration device 2, the ultrasonic vibration device 2 is located at the beginning of the transmission path. When there are more than one ultrasonic vibration device 2, at least one ultrasonic vibration device 2 is located at the beginning of the transmission path. In this way, after the workpiece 4 to be electroplated enters the electroplating tank 1, the bubbles in its grid line groove can be oscillated and broken or leave the surface of the workpiece to be electroplated by the ultrasonic vibration device 2, thereby quickly forming a coating on the surface of the workpiece 4 to be electroplated, so that a uniform coating can be formed in subsequent electroplating. In other words, during the electroplating process, multiple coatings will be formed on the surface of the workpiece 4 to be electroplated. As a coating closest to the surface of the workpiece 4 to be electroplated, its uniformity will have a key impact on the subsequent electroplating effect.
[0062] The ultrasonic vibration device 2 has a vibration working surface, and the propagation start end of the propagation path is located on the vibration working surface; wherein, there is a preset ratio value between the width of the vibration working surface and the width of the workpiece 4 to be electroplated. Specifically, by setting the preset ratio value, the optimal setting number between the ultrasonic vibration device 2 and the workpiece 4 to be electroplated can be obtained. For example, when the ratio of the width of the ultrasonic vibration device 2 to the width of the workpiece 4 to be electroplated is about 2:1, for example, the ratio is 1.8:1 or 2.2:1, the ultrasonic vibration device 2 can be applied to two side-by-side arranged workpieces 4 to be electroplated, that is, the electroplating equipment is a double-station structure. Similarly, when the ratio of the width of the ultrasonic vibration device 2 to the width of the workpiece 4 to be electroplated is about 3:1, for example, the ratio is 2.8:1 or 3.2:1, the ultrasonic vibration device 2 can be applied to three side-by-side arranged workpieces 4 to be electroplated, that is, the electroplating equipment is a three-station structure. In this way, increasing the number of workpieces 4 to be electroplated within the range of action of the ultrasonic vibration device 2 can further improve the efficiency of electroplating.
[0063] In order to reduce the amount of bubbles in the plating solution and prevent the bubbles from affecting the plating effect of the workpiece 4 to be plated, the electroplating equipment also includes a liquid extraction pipe 5, a defoaming mechanism 6 and a liquid discharge pipe 7. The defoaming mechanism 6 is connected to the electroplating tank 1 through the liquid extraction pipe 5 and the liquid discharge pipe 7. A pump body is provided on the liquid extraction pipe 5 and the liquid discharge pipe 7, so that the electroplating tank 1, the liquid extraction pipe 5, the defoaming mechanism 6 and the liquid discharge pipe 7 together form a loop. The plating liquid flows from the electroplating tank 1 to the defoaming mechanism 6 through the liquid extraction pipe 5, and the defoaming mechanism 6 can defoam the plating liquid. After defoaming, the plating liquid in the defoaming mechanism 6 will flow back to the electroplating tank 1 through the liquid discharge pipe 7.
[0064] The defoaming mechanism 6 includes a defoaming chamber and a defoaming member, and the defoaming member adopts any one of the following structures or a combination of two or more structures:
[0065] (1) A heater 61 is installed on the side wall of the defoaming chamber. The heater 61 contacts the plating solution in the defoaming chamber and changes its temperature. The plating solution is heated by the heater 61 to defoam the plating solution.
[0066] (2) The defoaming chamber is connected to the centrifuge 62, and the centrifuge 62 drives the defoaming chamber and the electroplating solution to perform centrifugal motion to defoam the electroplating solution;
[0067] (3) The defoaming chamber is connected to the vacuum machine 63, and the vacuum machine 63 is communicated with the inside of the defoaming chamber to evacuate the plating solution to defoam the plating solution.
[0068] Specifically, the heating machine 61 includes a heating element, which is usually a heat-conducting material of metal or alloy, which can generate heat through electric current, and heat the plating solution in the defoaming chamber through a heating rod, so that the bubbles in the plating solution are broken. The centrifuge 62 can drive the defoaming chamber to rotate at a high speed, so that the bubbles in the plating solution are broken by the centrifugal force. The vacuum machine 63 can adopt a vacuum device, and the defoaming chamber is evacuated, so that the bubbles in the plating solution in the defoaming chamber are broken.
[0069] The heater 61, the centrifuge 62 and the vacuum machine 63 can be combined, for example, a heating element is arranged in the side wall of the defoaming chamber, and a vacuum device is arranged on the top, so as to heat and vacuumize simultaneously. Alternatively, the centrifuge 62 is arranged at the bottom of the defoaming chamber, so as to perform centrifugal movement and vacuumize simultaneously. All of these should be understood within the present invention.
[0070] Further, the electroplating equipment also includes a spray assembly 8, which is used to spray the electroplating liquid onto the to-be-plated area 44 of the to-be-plated part 4, and the spray assembly 8 includes a tube body 81 and a nozzle 82, one end of the tube body 81 is connected to the electroplating tank, and the other end is connected to the nozzle 82, and the nozzle 82 forms a cavity, and a liquid spray hole is formed at the top of the cavity, and the liquid spray hole faces the to-be-plated area of the to-be-plated part 4. Furthermore, a defoaming filter and / or a rotatable spiral defoaming paddle are arranged in the tube body 81 and the cavity.
[0071] Specifically, a defoaming cavity is formed in the nozzle 82, and a liquid spray hole connected to the defoaming cavity is formed at the end of the nozzle 82. The bubbles will also burst when passing through the tiny liquid spray hole, thereby achieving defoaming. The plating liquid and the treatment liquid contained in the defoaming cavity are sprayed out through the liquid spray hole. The spray assembly adopts one of the following methods or a combination thereof to achieve defoaming of the plating liquid and the treatment liquid: first, a defoaming filter is provided in the tube body 81 and / or the defoaming cavity; second, a spiral defoaming paddle is provided in the defoaming cavity. Preferably, the spiral defoaming paddle can rotate, for example, a driving motor is used to drive the spiral defoaming paddle to rotate. A defoaming filter is provided in the tube body 81 and / or the defoaming cavity, and the defoaming filter can squeeze and break bubbles, thereby reducing the bubbles in the plating liquid and the treatment liquid flowing into the electroplating tank 1.
[0072] A spiral defoaming paddle is arranged in the defoaming chamber, and the plating solution and the treatment solution can form a vortex when passing through the spiral defoaming paddle, thereby breaking the bubbles in the plating solution and the treatment solution. When the spiral defoaming paddle can rotate, the bubbles in the plating solution and the treatment solution can be broken by the rotation of the spiral defoaming paddle, which can further improve the defoaming effect. In this way, the bubbles in the plating solution flowing into the electroplating tank 1 can be reduced.
[0073] The above-mentioned electroplating equipment can be used for horizontal electroplating processing of photovoltaic cells, which can avoid the grid breaking phenomenon in the electroplating process of the cells and significantly improve the production yield of the cells.
[0074] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.
Claims
1. An electroplating device, characterized in that: The electroplating equipment comprises: Electroplating tanks; an anode member, disposed in the electroplating tank; An electroplating power source, wherein the positive electrode of the electroplating power source is connected to the anode member; An ultrasonic vibration device, disposed in the electroplating tank, wherein the ultrasonic vibration device has a propagation path; A reflective element, wherein the reflective element is disposed on the propagation path and has a reflective path; In the working state, the electroplating tank contains electroplating liquid, the anode component is located in the electroplating liquid, the area to be plated of the component to be plated is immersed in the electroplating liquid, and the component to be plated is connected to the negative pole of the electroplating power supply, and the area to be plated of the component to be plated is located on the reflection path.
2. The electroplating equipment according to claim 1, characterized in that: The structure of the ultrasonic vibration device can be any of the following: (1) The ultrasonic vibration device adopts a single vibrator structure and has one propagation path; (2) The ultrasonic vibration device adopts a multi-vibrator structure, the number of the propagation paths is equal to the number of the vibrators, and two adjacent propagation paths are parallel or perpendicular to each other; (3) The ultrasonic vibration device adopts a composite vibrator structure, the number of the propagation paths is equal to the number of the vibrators, and the angle between two adjacent propagation paths is greater than 0°.
3. The electroplating equipment according to claim 1, characterized in that: The electroplating equipment may also adopt any of the following structures or a combination of two or more structures: (1) The reflection path is perpendicular to the area to be plated of the part to be electroplated; (2) There are multiple ultrasonic vibration devices, at least two of which are arranged opposite to each other, and the propagation paths overlap to form ultrasonic mixing; (3) At least one of the ultrasonic vibration devices is arranged vertically; (4) The anode member is a plate-like structure.
4. The electroplating equipment according to claim 1, characterized in that: The electroplating equipment also includes a transmission mechanism, which is arranged in the electroplating tank. The transmission mechanism has a transmission path and transports the workpiece to be electroplated along the transmission path. The workpiece to be electroplated moves through the reflection path.
5. The electroplating equipment according to claim 4, characterized in that: There is at least one ultrasonic vibration device in the electroplating tank. When the number of the ultrasonic vibration device is one, the ultrasonic vibration device is located at the beginning of the transmission path. When there are more than one ultrasonic vibration device, at least one ultrasonic vibration device is located at the beginning of the transmission path.
6. The electroplating equipment according to claim 1, characterized in that: The ultrasonic vibration device has a vibration working surface, and the propagation start end of the propagation path is located on the vibration working surface; There is a preset ratio value between the width of the vibrating working surface and the width of the part to be electroplated.
7. The electroplating equipment according to any one of claims 1 to 6, characterized in that: The electroplating equipment also includes a liquid extraction pipeline, a defoaming mechanism and a liquid discharge pipeline. The defoaming mechanism is connected to the electroplating tank through the liquid extraction pipeline and the liquid discharge pipeline. The liquid extraction pipeline and the liquid discharge pipeline are both provided with a pump body so that the electroplating tank, the liquid extraction pipeline, the defoaming mechanism and the liquid discharge pipeline together form a loop.
8. The electroplating equipment according to claim 7, characterized in that: The defoaming mechanism includes a defoaming chamber and a defoaming member, and the defoaming member adopts any one of the following structures or a combination of two or more structures: (1) A heater is installed on the side wall of the defoaming chamber, and the heater contacts the plating solution in the defoaming chamber and changes its temperature; (2) The defoaming chamber is connected to a centrifuge, and the centrifuge drives the defoaming chamber and the electroplating solution to perform centrifugal motion; (3) The defoaming chamber is connected to a vacuum machine, and the vacuum machine is communicated with the interior of the defoaming chamber.
9. The electroplating equipment according to claim 1, characterized in that: The electroplating equipment also includes a spray assembly, which includes a tube body and a nozzle. Both ends of the tube body are connected to the electroplating tank and the nozzle respectively. The nozzle has a spray hole, and the spray hole faces the area to be plated of the electroplated part.
10. The electroplating equipment according to claim 9, characterized in that: The tube body and the nozzle are both provided with a defoaming filter and / or a rotatable spiral defoaming paddle.