Ionic liquid plating solution feeding and storing device

Abstract

The utility model provides an ionic liquid plating solution feeding and storing device. The ionic liquid plating solution feeding and storing device comprises a solution storage tank, a solution supply assembly, a gas guide assembly, a vacuumizing assembly, an electro-deposition tank body and a closed deposition cabin body, the electro-deposition tank body is arranged in the deposition cabin body, the liquid storage tank is lower than the electro-deposition tank body, the liquid inlet end of the liquid supply assembly is communicated with the bottom of the liquid storage tank, the liquid outlet end of the liquid supply assembly is communicated with the electro-deposition tank body, one end of the gas guide assembly is communicated with the top of the liquid storage tank, and the other end of the gas guide assembly is communicated with the deposition cabin body. The air exhaust end of the vacuumizing assembly is communicated with the top of the liquid storage tank; according to the utility model, the plating solution can be conveniently pumped into the electrodeposition tank body from the liquid storage tank and can be conveniently pumped back into the liquid storage tank from the electrodeposition tank body, in addition, the problems that a peristaltic pump is relatively large in size and relatively difficult to enter and exit from the cabin body can be solved, and the problems that a pipeline is easy to damage and the cost is relatively high can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of ionic liquid plating devices, in particular to an ionic liquid plating liquid inlet and storage device. Background Art

[0002] Ionic liquid plating is a new electroplating technology that uses non-aqueous ionic liquid as the electrolyte. It has many advantages that traditional electroplating technologies cannot match. For example, it can realize the electroplating of active metals such as aluminum that cannot be electrodeposited from aqueous solutions. It has no risk of hydrogen embrittlement and is suitable for the electroplating of easily oxidized metals. At the same time, the electroplating process is green and environmentally friendly, so it has broad application prospects.

[0003] Existing ionic liquid plating uses the equipment disclosed in Chinese patent application number: ZL2017214277697. When the bath is first built, the plating solution is replenished, or the equipment is repaired, the plating solution needs to enter and exit the plating tank. However, when using this equipment, there are the following problems: 1. The plating solution enters and exits the bath through a peristaltic pump. If a peristaltic pump with a high flow rate is used, a fluorine-lined tube with a larger inner diameter is required, and the price of the peristaltic pump is relatively high. 2. The pipeline is prone to mechanical damage, and the pipeline needs to be replaced frequently, which is complicated to operate and has a high cost. 3. The peristaltic pump is large in size, making it difficult to enter and exit the cabin, and it occupies more space in the cabin. 4. The peristaltic pump has a small flow rate and takes a long time to pump and replenish the liquid. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide an ionic liquid plating liquid inlet and storage device, which can conveniently pump the plating liquid from the storage tank to the electrodeposition tank body, and can conveniently pump the plating liquid from the electrodeposition tank body back to the storage tank. In addition, it can solve the problem that the peristaltic pump is large in size and difficult to enter and exit the cabin, and can solve the problem that the pipeline is easy to be damaged and the cost is high.

[0005] The utility model provides an ionic liquid plating liquid inlet and storage device, comprising a liquid storage tank, a liquid supply component, an air guide component, a vacuum component, an electrodeposition tank body and a closed deposition chamber body; the deposition chamber body is arranged inside the deposition chamber body, the height of the liquid storage tank is lower than the deposition chamber body, the liquid inlet end of the liquid supply component is communicated with the bottom of the liquid storage tank, the liquid outlet end of the liquid supply component is communicated with the deposition chamber body, one end of the air guide component is communicated with the top of the liquid storage tank, the other end of the air guide component is communicated with the deposition chamber body, the air extraction end of the vacuum component is communicated with the liquid storage tank, and the vacuum extraction end of the vacuum component is communicated with the liquid storage tank. the top of the liquid storage tank; when the plating liquid in the liquid storage tank needs to be pumped into the electrodeposition tank body, the gas guide component is in a conducting state, and the liquid supply component is in a working state to pump the plating liquid in the liquid storage tank into the electrodeposition tank body; when the plating liquid in the electrodeposition tank body needs to be pumped back into the liquid storage tank, the gas guide component is first in a cut-off state, at which time the vacuum pumping component vacuumizes the liquid storage tank so that the negative pressure in the liquid storage tank reaches a certain value, and then the vacuum pumping component is closed and the gas guide component is connected, and the plating liquid in the electrodeposition tank body is siphoned into the liquid storage tank through the liquid supply component.

[0006] By adopting the above structure, the utility model can conveniently pump the plating solution from the liquid storage tank to the electrodeposition tank body, and can conveniently pump the plating solution from the electrodeposition tank body back to the liquid storage tank. In addition, it can solve the problem that the peristaltic pump is large in size and difficult to enter and exit the cabin, and can solve the problem that the pipeline is easy to be damaged and the cost is high.

[0007] In one possible embodiment, the air guide assembly includes an air guide pipe and a first valve; one end of the air guide pipe is connected to the top of the liquid storage tank, and the other end of the air guide pipe is connected to the sedimentation chamber body, and the first valve is installed on the air guide pipe; by adopting this air guide assembly, when the first valve is opened, the air guide assembly can be in a conducting state, and when the first valve is closed, the air guide assembly can be in a cut-off state. The air guide assembly has the advantage of a simple structure.

[0008] In one possible embodiment, the vacuum pumping assembly includes an exhaust pipe and a vacuum pressure reducing valve; one end of the exhaust pipe is connected to the top of the liquid storage tank, and the other end of the exhaust pipe is connected to the exhaust end of the vacuum pump, and the vacuum pressure reducing valve is installed on the exhaust pipe; by adopting this vacuum pumping assembly, when the vacuum pump is working, the vacuum pump can evacuate the liquid storage tank, and under the action of the vacuum pressure reducing valve, the vacuum pump can control the vacuum pressure of the liquid storage tank.

[0009] In a possible embodiment, the vacuum pumping assembly also includes a second valve, which is connected to an exhaust pipe between the vacuum reducing valve and the vacuum pump. By setting the second valve, when the vacuum pump stops working, the second valve can be closed to prevent air from the vacuum pump from flowing back into the liquid storage tank.

[0010] In a possible embodiment, the liquid supply assembly includes a magnetic pump, a first connecting pipe and a second connecting pipe; one end of the first connecting pipe is connected to the bottom of the liquid storage tank, the other end of the first connecting pipe is connected to the inlet end of the magnetic pump, one end of the second connecting pipe is connected to the outlet end of the magnetic pump, and the other end of the second connecting pipe extends from top to bottom into the electrodeposition tank body and is close to the inner bottom of the electrodeposition tank body; by adopting this liquid supply assembly, when the magnetic pump is working, the plating solution in the liquid storage tank can be pumped into the electrodeposition tank body by the magnetic pump; when When it is necessary to pump the plating liquid in the electrodeposition tank back into the liquid storage tank, the gas guide component is first in the cut-off state. At this time, the vacuum pumping component vacuums the liquid storage tank so that the negative pressure in the liquid storage tank reaches a certain value. Subsequently, the vacuum pumping component is closed and the gas guide component is turned on, and the plating liquid in the electrodeposition tank is siphoned into the liquid storage tank through the second connecting pipe, the magnetic pump and the first connecting pipe (because the magnetic pump is not sealed when it is not working, so that the plating liquid can be siphoned into the liquid storage tank through the second connecting pipe, the magnetic pump and the first connecting pipe).

[0011] In a possible embodiment, the liquid supply assembly also includes a third valve and a fourth valve, and the third valve and the fourth valve are respectively arranged on the first connecting pipe and the second connecting pipe; through the arrangement of the third valve and the fourth valve, when the magnetic pump needs to be replaced, the third valve and the fourth valve can be closed, thereby avoiding leakage of the plating solution from the electrodeposition tank body and the plating solution from the liquid storage tank.

[0012] In one possible embodiment, the bottom of the liquid storage tank is an inverted cone-shaped structure, and one end of the first connecting tube is located at the lowest point of the bottom of the liquid storage tank; by adopting this structure, when the liquid supply component extracts the plating liquid in the liquid storage tank, the plating liquid can more reliably converge to one end of the first connecting tube, thereby facilitating the liquid supply component to extract the plating liquid in the liquid storage tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0014] First, those skilled in the art should understand that these implementations are only used to explain the technical principles of the embodiments of the present application, and are not intended to limit the protection scope of the embodiments of the present application. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios.

[0015] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0016] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0017] The present application is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0018] See also Figure 1 As shown, the embodiment of the present application discloses an ionic liquid plating liquid inlet and storage device, including a liquid storage tank 1, a liquid supply component, a gas guide component, a vacuum component, an electrodeposition tank body 2 and a closed deposition chamber body 3; the deposition chamber body 2 is arranged inside the deposition chamber body 3, the height of the liquid storage tank 1 is lower than the deposition chamber body 2, the liquid inlet end of the liquid supply component is connected to the bottom of the liquid storage tank 1, the liquid outlet end of the liquid supply component is connected to the deposition chamber body 2, one end of the gas guide component is connected to the top of the liquid storage tank 1, the other end of the gas guide component is connected to the deposition chamber body 3, and the gas extraction end of the vacuum component is connected to the storage tank body 1. The top of the liquid tank 1 is connected; when the plating liquid in the liquid storage tank 1 needs to be pumped into the electrodeposition tank body 2, the gas guide component is in a conducting state, and the liquid supply component is in a working state to pump the plating liquid in the liquid storage tank 1 into the electrodeposition tank body 2; when the plating liquid in the electrodeposition tank body 2 needs to be pumped back into the liquid storage tank 1, the gas guide component is first in a cut-off state, at which time the vacuum pumping component vacuumizes the liquid storage tank 1 so that the negative pressure in the liquid storage tank 1 reaches a certain value, and then the vacuum pumping component is closed and the gas guide component is turned on, and the plating liquid in the electrodeposition tank body 2 is siphoned into the liquid storage tank 1 through the liquid supply component.

[0019] The air guide component includes an air guide pipe 41 and a first valve 42; one end of the air guide pipe 41 is connected to the top of the liquid storage tank 1, and the other end of the air guide pipe 41 is connected to the sedimentation chamber body 3, and the first valve 42 is installed on the air guide pipe 41; by adopting this air guide component, when the first valve is opened, the air guide component can be in a conducting state, and when the first valve is closed, the air guide component can be in a cut-off state. The air guide component has the advantage of simple structure.

[0020] The vacuum pumping assembly includes an exhaust pipe 51 and a vacuum pressure reducing valve 52; one end of the exhaust pipe 51 is connected to the top of the liquid storage tank 1, and the other end of the exhaust pipe 51 is connected to the exhaust end of the vacuum pump, and the vacuum pressure reducing valve 52 is installed on the exhaust pipe 51; by adopting this vacuum pumping assembly, when the vacuum pump is working, the vacuum pump can evacuate the liquid storage tank, and under the action of the vacuum pressure reducing valve, the vacuum pump can control the vacuum pressure of the liquid storage tank.

[0021] The vacuum pumping assembly also includes a second valve 53, which is connected to the exhaust pipe 51 between the vacuum reducing valve 52 and the vacuum pump. Through the setting of the second valve, when the vacuum pump stops working, the second valve can be closed to prevent the air from the vacuum pump from flowing back into the liquid storage tank.

[0022] The liquid supply assembly includes a magnetic pump 61, a first connecting pipe 62 and a second connecting pipe 63; one end of the first connecting pipe 62 is connected to the bottom of the liquid storage tank 1, the other end of the first connecting pipe 62 is connected to the inlet end of the magnetic pump 61, one end of the second connecting pipe 63 is connected to the outlet end of the magnetic pump 61, and the other end of the second connecting pipe 63 extends from top to bottom into the electrodeposition tank body 2 and is close to the inner bottom of the electrodeposition tank body 2; by adopting this liquid supply assembly, when the magnetic pump is working, the plating solution in the liquid storage tank can be pumped to the electrodeposition tank by the magnetic pump. body; when the plating liquid in the electrodeposition tank body needs to be pumped back into the liquid storage tank, the gas guide component is first in a cut-off state. At this time, the vacuum pumping component vacuums the liquid storage tank to make the negative pressure in the liquid storage tank reach a certain value. Subsequently, the vacuum pumping component is closed and the gas guide component is turned on, and the plating liquid in the electrodeposition tank body is siphoned into the liquid storage tank through the second connecting pipe, the magnetic pump and the first connecting pipe (because the magnetic pump is not sealed when it is not working, so that the plating liquid can be siphoned into the liquid storage tank through the second connecting pipe, the magnetic pump and the first connecting pipe).

[0023] The liquid supply assembly also includes a third valve 64 and a fourth valve 65, which are respectively arranged on the first connecting pipe 62 and the second connecting pipe 63; through the arrangement of the third valve and the fourth valve, when the magnetic pump needs to be replaced, the third valve and the fourth valve can be closed, thereby avoiding leakage of the plating solution from the electrodeposition tank body and the plating solution from the liquid storage tank.

[0024] The bottom of the liquid storage tank 1 is an inverted cone-shaped structure, and one end of the first connecting tube 62 is located at the lowest point of the bottom of the liquid storage tank 1; by adopting this structure, when the liquid supply component extracts the plating liquid in the liquid storage tank, the plating liquid can more reliably converge to one end of the first connecting tube, thereby facilitating the liquid supply component to extract the plating liquid in the liquid storage tank.

[0025] When the utility model is working, firstly ensure that the second valve, the third valve and the fourth valve are in the open state;

[0026] When it is necessary to pump the plating solution in the electrodeposition tank body back into the liquid storage tank: first, manually close the first valve to make the inner cavity of the deposition chamber body and the inner cavity of the liquid storage tank in a disconnected state, then turn on the vacuum pump to make the vacuum pump evacuate the liquid storage tank, and under the action of the vacuum pressure reducing valve, control the pressure in the liquid storage tank to reach -0.3Mpa, at this time, the plating solution in the electrodeposition tank body is sucked into the storage tank through the second connecting pipe, the magnetic pump and the first connecting pipe, then observe the pressure gauge on the vacuum pressure reducing valve, when the pressure rises to close to 0Mpa, manually open the first valve to make the inner cavity of the deposition chamber body communicate with the inner cavity of the liquid storage tank, at this time, under the action of siphon, the plating solution in the electrodeposition tank body can be siphoned into the liquid storage tank through the second connecting pipe, the magnetic pump and the first connecting pipe;

[0027] When it is necessary to pump the plating liquid in the liquid storage tank into the electrodeposition tank body, confirm that the first valve is in the open state so that the inner cavity of the deposition chamber body is connected with the inner cavity of the liquid storage tank, and then turn on the magnetic pump. At this time, the liquid supply component can pump the plating liquid in the liquid storage tank into the electrodeposition tank body.

[0028] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. An ionic liquid plating solution inlet and storage device, characterized in that: The invention comprises a liquid storage tank (1), a liquid supply component, an air guide component, a vacuum component, an electrodeposition tank body (2) and a closed deposition chamber body (3); the electrodeposition tank body (2) is arranged inside the deposition chamber body (3), the height of the liquid storage tank (1) is lower than that of the electrodeposition tank body (2), the liquid inlet end of the liquid supply component is connected to the bottom of the liquid storage tank (1), the liquid outlet end of the liquid supply component is connected to the electrodeposition tank body (2), one end of the air guide component is connected to the top of the liquid storage tank (1), the other end of the air guide component is connected to the deposition chamber body (3), the air extraction end of the vacuum component is connected to the liquid storage tank (1), when it is necessary to pump the plating liquid in the liquid storage tank (1) into the electrodeposition tank body (2), the gas guide component is in a conducting state, and the liquid supply component is in a working state to pump the plating liquid in the liquid storage tank (1) into the electrodeposition tank body (2); when it is necessary to pump the plating liquid in the electrodeposition tank body (2) back into the liquid storage tank (1), the gas guide component is first in a cut-off state, at which time the vacuum pumping component vacuumizes the liquid storage tank (1) so that the negative pressure in the liquid storage tank (1) reaches a certain value, and then the vacuum pumping component is closed and the gas guide component is connected, and the plating liquid in the electrodeposition tank body (2) is siphoned into the liquid storage tank (1) through the liquid supply component.

2. The ionic liquid plating solution inlet and storage device according to claim 1, characterized in that: The air guide assembly comprises an air guide pipe (41) and a first valve (42); one end of the air guide pipe (41) is connected to the top of the liquid storage tank (1), and the other end of the air guide pipe (41) is connected to the sedimentation chamber body (3); and the first valve (42) is installed on the air guide pipe (41).

3. The ionic liquid plating solution inlet and storage device according to claim 1, characterized in that: The vacuum pumping assembly comprises an air pumping pipe (51) and a vacuum pressure reducing valve (52); one end of the air pumping pipe (51) is connected to the top of the liquid storage tank (1), the other end of the air pumping pipe (51) is connected to the air pumping end of the vacuum pump, and the vacuum pressure reducing valve (52) is installed on the air pumping pipe (51).

4. The ionic liquid plating solution inlet and storage device according to claim 3, characterized in that: The vacuum pumping assembly further comprises a second valve (53), wherein the second valve (53) is connected to the vacuum pumping pipe (51) between the vacuum pressure reducing valve (52) and the vacuum pump.

5. The ionic liquid plating solution inlet and storage device according to claim 1, characterized in that: The liquid supply assembly comprises a magnetic pump (61), a first connecting pipe (62) and a second connecting pipe (63); one end of the first connecting pipe (62) is connected to the bottom of the liquid storage tank (1), the other end of the first connecting pipe (62) is connected to the inlet end of the magnetic pump (61), one end of the second connecting pipe (63) is connected to the outlet end of the magnetic pump (61), and the other end of the second connecting pipe (63) extends from top to bottom into the electrodeposition tank body (2) and is close to the inner bottom of the electrodeposition tank body (2).

6. The ionic liquid plating solution inlet and storage device according to claim 5, characterized in that: The liquid supply assembly further comprises a third valve (64) and a fourth valve (65), wherein the third valve (64) and the fourth valve (65) are respectively arranged on the first connecting pipe (62) and the second connecting pipe (63).

7. The ionic liquid plating solution inlet and storage device according to claim 5, characterized in that: The bottom of the liquid storage tank (1) is an inverted cone-shaped structure, and one end of the first connecting pipe (62) is located at the lowest point of the bottom of the liquid storage tank (1).

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