Liquid crystal display panel structure for testing binding temperature

Abstract

The utility model discloses a liquid crystal display panel structure for testing binding temperature. The liquid crystal display panel structure comprises CF glass, TFT glass, an IC chip and a temperature sensing line. One side of the TFT glass extends in the direction away from the CF glass to form a binding protruding part, an IC chip binding area is arranged on one side face of the binding protruding part, a panel binding PAD is arranged on the IC chip binding area, and an avoiding groove is formed in the panel binding PAD; the IC chip is in binding connection with the panel binding PAD; and the temperature sensing line is accommodated in the avoiding groove. Therefore, the avoiding groove is formed in the panel binding PAD, so that the temperature sensing line is directly accommodated in the avoiding groove, and the temperature sensing line can be in direct contact with the panel binding PAD; therefore, since the temperature sensing line is directly contacted with the panel binding PAD, the temperature sensing line can directly collect the binding temperature, so that the test accuracy of the binding temperature can be improved, and the test deviation can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to a liquid crystal display panel structure for testing binding temperature. Background Art

[0002] Liquid crystal display module is a commonly used mobile phone display screen. COG (Chip on Glass) process is an indispensable part of its production process, which refers to binding the control IC chip of the liquid crystal display module to the liquid crystal display LCD through ACF (anisotropic conductive film).

[0003] In order to completely solidify the ACF and break the gold balls in the ACF between the bonding bumps to achieve connectivity, a certain temperature (about 145°) and pressure (about 300N) need to be applied when bonding the IC chip.

[0004] Under high temperature, the panel binding PAD on the LCD screen will expand to a certain extent due to thermal expansion and contraction. Because the panel binding PADs are densely arranged, in order to prevent short circuits due to thermal expansion of adjacent binding PADs, the distance between the binding PADs needs to evaluate the expansion coefficient according to the temperature during binding to reserve a certain gap space. Therefore, process verification is usually performed first to confirm the actual heating temperature of the binding PAD during the binding process. In other words, the corresponding LCD screen structure needs to be designed to test the corresponding binding temperature.

[0005] However, when the existing test structure tests the binding temperature, there is a certain deviation, resulting in low test accuracy. Utility Model Content

[0006] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a liquid crystal display panel structure for testing binding temperature, thereby improving the testing accuracy of the binding temperature and reducing the testing deviation.

[0007] The purpose of this utility model is achieved through the following technical solutions:

[0008] A liquid crystal display panel structure for testing binding temperature comprises: CF glass, TFT glass, IC chip and temperature sensing line; one side of the TFT glass extends in a direction away from the CF glass to form a binding protrusion, one side surface of the binding protrusion is provided with an IC chip binding area, a panel binding PAD is provided on the IC chip binding area, and an avoidance groove is provided on the panel binding PAD; the IC chip is bound and connected to the panel binding PAD; the temperature sensing line is accommodated in the avoidance groove.

[0009] In one of the embodiments, a plurality of the panel binding PADs are provided, and the panel binding PADs are arranged in a linear manner. Each of the panel binding PADs is provided with an avoidance groove, and the temperature sensing line is respectively accommodated in each of the avoidance grooves.

[0010] In one embodiment, the avoidance grooves are aligned with each other.

[0011] In one of the embodiments, the panel binding PAD is a metal binding PAD.

[0012] In one of the embodiments, the IC chip is connected to the panel binding PAD by ACF conductive adhesive.

[0013] In one of the embodiments, an IC binding PAD is disposed on a side of the IC chip facing the TFT glass, and the IC binding PAD is bound and connected to the panel binding PAD through the ACF conductive adhesive.

[0014] In one embodiment, the depth of the avoidance groove is greater than or equal to the thickness of the temperature sensitive line.

[0015] In one embodiment, the thickness of the CF glass is 0.15 mm.

[0016] In one embodiment, the thickness of the TFT glass is 0.15 mm.

[0017] In one of the embodiments, an FPC binding position is provided on the binding protrusion, and an FPC is bound to the FPC binding position.

[0018] Compared with the prior art, the utility model has at least the following advantages:

[0019] The utility model discloses a liquid crystal display panel structure for testing binding temperature by arranging CF glass, TFT glass, IC chip and temperature sensing line, and a panel binding PAD is arranged on the TFT glass, and an avoidance groove is opened on the panel binding PAD so that the temperature sensing line is directly accommodated in the avoidance groove, so that the temperature sensing line can directly contact with the panel binding PAD; then, since the temperature sensing line is directly in contact with the panel binding PAD, the temperature sensing line can directly collect the binding temperature, thereby improving the test accuracy of the binding temperature and reducing the test deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0021] Figure 1 It is a structural schematic diagram of a liquid crystal display panel structure for testing binding temperature in one embodiment of the utility model;

[0022] Figure 2 This is a schematic diagram of the stacked structure of IC chip, ACF conductive adhesive, and TFT glass in a liquid crystal display panel structure for testing the binding temperature in one embodiment of the utility model;

[0023] Figure 3 A schematic diagram of the structure of an existing temperature sensing line is provided;

[0024] Figure 4 This is a schematic diagram of the connection structure of TFT glass, panel binding PAD, temperature sensing line and FPC in a liquid crystal display panel structure for testing binding temperature in one embodiment of the utility model;

[0025] Figure 5 for Figure 4 A schematic diagram of the stacking structure of TFT glass, panel binding PAD and temperature sensing wire in a liquid crystal display panel structure for testing the binding temperature;

[0026] Figure 6 for Figure 4 Schematic diagram of the stacking structure of TFT glass and panel bonding PAD in the liquid crystal display panel structure used to test the bonding temperature. DETAILED DESCRIPTION

[0027] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0028] See also Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, a liquid crystal display panel structure 10 for testing binding temperature includes: CF glass 100, TFT glass 200, IC chip 300 and temperature sensing line 400; one side of the TFT glass 200 extends in a direction away from the CF glass 100 to form a binding protrusion, and an IC chip binding area 210 is arranged on one side of the binding protrusion, and a panel binding PAD211 is arranged on the IC chip binding area 210, and an avoidance groove 211a is opened on the panel binding PAD211; the IC chip 300 is bound and connected to the panel binding PAD211; the temperature sensing line 400 is accommodated in the avoidance groove 211a.

[0029] Please note that Figure 3As shown, a schematic diagram of an existing temperature sensing line setting structure, the temperature sensing line is set between two rows of panel binding PAD211. At this time, the temperature measured by the temperature sensing line is the temperature from the pressure head → IC chip 300 → ACF conductive glue 500 → IC chip binding area 210. However, the binding temperature actually required to be tested should be the temperature on the panel binding PAD211. The binding temperature actually required to be tested is the temperature from the pressure head → IC chip 300 → IC binding PAD310 → ACF conductive glue 500 → panel binding PAD211. Due to the different temperature conduction paths, and there is a certain gap between the actual temperature of the area between the two rows of panel binding PADs and the temperature of the panel binding PAD itself, which generally differs by more than ten degrees Celsius. Therefore, if the existing temperature sensing line setting structure is adopted, it will lead to large deviations in the test results. Therefore, in the present invention, by opening an avoidance groove 211a on the panel binding PAD211, the temperature sensing line 400 is directly placed in the avoidance groove 211a, so that the temperature sensing line 400 can directly contact the panel binding PAD211; then, since the temperature sensing line 400 is directly in contact with the panel binding PAD211, the temperature sensing line 400 can directly collect the binding temperature, thereby improving the test accuracy of the binding temperature and reducing the test deviation. It should also be noted that during the test, the temperature sensing line is connected to the temperature measuring device to achieve the measurement operation of the binding temperature. The temperature tested in this way is the precise current temperature of the panel binding PAD, which can be used by designers to accurately calculate the expansion size of the panel binding PAD and the reserved spacing of the panel binding PAD.

[0030] Preferably, a plurality of panel binding PAD211 are provided, each panel binding PAD211 is arranged in a linear manner, and each panel binding PAD211 is provided with an avoidance groove 211a, and the temperature sensing line is respectively accommodated in each avoidance groove. In this way, a plurality of panel binding PAD211 are provided, which can ensure the firmness of the connection between the panel binding PAD211 and the IC chip 300.

[0031] Preferably, the avoidance grooves 211 a are aligned with each other, so that the temperature sensing wires 400 can be pre-buried in the avoidance grooves 211 a.

[0032] Preferably, the panel binding PAD 211 is a metal binding PAD, for example, a copper metal binding PAD.

[0033] Furthermore, the IC chip 300 is connected to the panel bonding PAD 211 through the ACF conductive adhesive 500. The ACF conductive adhesive 500 is an anisotropic conductive adhesive film, which uses conductive particles to connect the electrodes between the IC chip 300 and the TFT glass to make them conductive, while avoiding short circuits between adjacent electrodes, and achieving the purpose of conducting only in the Z-axis direction, thereby ensuring the conduction effect.

[0034] Preferably, an IC bonding PAD 310 is provided on one side of the IC chip 300 facing the TFT glass 200, and the IC bonding PAD 310 is bonded and connected to the panel bonding PAD 210 through an ACF conductive adhesive 500. The IC bonding PAD 310 is also a metal bonding PAD, such as copper metal, to ensure the conductive effect.

[0035] Preferably, the depth of the avoidance groove 211a is greater than or equal to the thickness of the temperature sensitive wire 400. In this way, it is possible to prevent the temperature sensitive wire 400 from protruding relative to the upper plane of the panel binding PAD210 and interfering with the normal binding of the IC chip 300. Further preferably, the depth of the avoidance groove 211a is greater than the thickness of the temperature sensitive wire 400.

[0036] Preferably, the thickness of the CF glass 100 is 0.15 mm.

[0037] Preferably, the thickness of the TFT glass 200 is 0.15 mm.

[0038] In one embodiment, an FPC binding position is provided on the binding protrusion, and an FPC 600 is bound to the FPC binding position. The FPC 600 is connected to the terminal power supply of the display module to realize the conduction of the liquid crystal display panel.

[0039] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A liquid crystal display panel structure for testing binding temperature, characterized in that: include: CF glass; TFT glass, one side of the TFT glass extends in a direction away from the CF glass to form a binding protrusion, an IC chip binding area is provided on one side of the binding protrusion, a panel binding PAD is provided on the IC chip binding area, and an avoidance groove is provided on the panel binding PAD; An IC chip, the IC chip is bound and connected to the panel binding PAD; and A temperature sensing line is placed in the avoidance groove.

2. The liquid crystal display panel structure for testing the binding temperature according to claim 1, characterized in that: There are multiple panel binding PADs, each of which is arranged in a linear manner, and each of which is provided with an avoidance groove, and the temperature sensing line is respectively accommodated in each of the avoidance grooves.

3. The liquid crystal display panel structure for testing binding temperature according to claim 2, characterized in that: The avoidance grooves are aligned with each other.

4. The liquid crystal display panel structure for testing binding temperature according to claim 2, characterized in that: The panel binding PAD is a metal binding PAD.

5. The liquid crystal display panel structure for testing binding temperature according to claim 1, characterized in that: The IC chip is connected to the panel binding PAD by ACF conductive glue.

6. The liquid crystal display panel structure for testing the binding temperature according to claim 5, characterized in that: An IC binding PAD is arranged on a side surface of the IC chip facing the TFT glass, and the IC binding PAD is bound and connected to the panel binding PAD through the ACF conductive adhesive.

7. The liquid crystal display panel structure for testing the binding temperature according to any one of claims 1 to 6, characterized in that: The depth of the avoidance groove is greater than or equal to the thickness of the temperature sensitive line.

8. The liquid crystal display panel structure for testing binding temperature according to claim 1, characterized in that: The thickness of the CF glass is 0.15 mm.

9. The liquid crystal display panel structure for testing binding temperature according to claim 1, characterized in that: The thickness of the TFT glass is 0.15 mm.

10. The liquid crystal display panel structure for testing binding temperature according to claim 1, characterized in that: The binding protrusion is provided with an FPC binding position, and the FPC is bound to the FPC binding position.

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