Semiconductor cleaning equipment and liquid supplementing device thereof

By designing a liquid replenishment device including a liquid storage device, a liquid replenishment pipeline, a gas supply pipeline, a control device and a pressure detection element in a semiconductor cleaning equipment, the problem of poor liquid replenishment is solved, and the stable replenishment of the cleaning liquid and the effectiveness of liquid management in the process tank is realized.

CN222619692UActive Publication Date: 2025-03-14BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
CN202420306903.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-19
Publication Date
2025-03-14
Estimated Expiration
2034-02-19

AI Technical Summary

Technical Problem

The liquid replenishment device of semiconductor process equipment has poor liquid replenishment stability, which affects the effective replenishment of cleaning liquid and the liquid management in the process tank.

Method used

A liquid replenishment device including a liquid storage device, a liquid replenishment pipeline, a gas supply pipeline, a control device and a pressure detection element are designed. By monitoring the pressure changes in the liquid storage device, the control device adjusts the flow rate of the gas supply pipeline to maintain the air pressure in the liquid storage device to ensure the stable flow rate of the liquid replenishment pipeline.

Benefits of technology

By stably controlling the air pressure in the liquid storage device, the pressure difference between the inlet and outlet ends of the liquid replenishment pipeline is stable, and the stability and efficiency of the liquid replenishment are improved, and the problem of affecting the flow rate and pressure during the pump body is avoided.

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Abstract

The utility model discloses semiconductor cleaning equipment and a liquid supplementing device thereof, and belongs to the technical field of semiconductor cleaning. The liquid supplementing device comprises a liquid storage device, a liquid supplementing pipeline, a gas supply pipeline, a control device and a pressure detection element, the liquid storage device is provided with a liquid outlet and a gas inlet, the first end of the liquid supplementing pipeline is communicated with the liquid outlet, the second end of the liquid supplementing pipeline is used for being communicated with the process tank, the gas supply pipeline is communicated with the gas inlet, and the pressure detection element is arranged on the liquid storage device. The pressure detection element is electrically connected with the control device to detect the pressure in the liquid storage device, the control device is used for controlling the flow of the gas supply pipeline, the pressure detection element is electrically connected with the control device, and the control device controls the flow of the gas supply pipeline to be reduced under the condition that the pressure detection element detects that the pressure value in the liquid storage device is larger than a first pressure value; and under the condition that the pressure detection element detects that the pressure in the liquid storage device is smaller than a first pressure value, the control device controls the flow of the gas supply pipeline to be increased. The semiconductor cleaning equipment comprises the liquid supplementing device.
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Description

Technical Field

[0001] The present application belongs to the field of semiconductor cleaning technology, and specifically relates to a semiconductor cleaning device and a liquid replenishing device thereof. Background Art

[0002] Semiconductor cleaning equipment usually includes multiple process modules, and the wafers are processed in each process module in turn. Each process module includes a process tank filled with cleaning liquid and a wafer carrier. The wafer carrier carries the wafer into the process tank for processing.

[0003] However, in the process of the wafer leaving the process tank, the surface of the wafer will carry part of the cleaning liquid, resulting in a reduction in the volume of the cleaning liquid in the process tank. Therefore, it is necessary to add a liquid replenishing device to replenish the liquid in the process tank. In the related art, the liquid replenishing device includes a liquid storage device and a liquid supply pipeline. The liquid storage device stores cleaning liquid. One end of the liquid supply pipeline is connected to the outlet of the liquid storage device, and the other end of the liquid supply pipeline is connected to the process tank. The height of the liquid storage device is greater than the height of the process tank, so that the cleaning liquid in the liquid storage device flows into the process tank under the action of its own gravity. In this way, there are certain requirements for the relative position of the liquid storage device and the process tank, and as the cleaning liquid in the liquid storage device decreases, the gravity of the cleaning liquid in the liquid storage device decreases, which will affect the flow rate of the cleaning liquid flowing into the process tank, making the liquid replenishment stability poor. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a semiconductor cleaning device and a liquid replenishing device thereof, which can solve the problem of poor liquid replenishing stability of the liquid replenishing device of the semiconductor process equipment in the related art.

[0005] In a first aspect, an embodiment of the present application provides a liquid replenishing device for semiconductor cleaning equipment, the liquid replenishing device comprising a liquid storage device, a liquid replenishing pipeline, an air supply pipeline, a control device and a pressure detection element, the liquid storage device is provided with a liquid outlet and an air inlet, a first end of the liquid replenishing pipeline is communicated with the liquid outlet, a second end of the liquid replenishing pipeline is used to communicate with a process tank, the air supply pipeline is communicated with the air inlet, the pressure detection element is arranged in the liquid storage device to detect the pressure in the liquid storage device, the control device is used to control the flow rate of the air supply pipeline, and the pressure detection element is electrically connected to the control device,

[0006] When the pressure detection element detects that the pressure value in the liquid storage device is greater than the first pressure value, the control device controls the flow rate of the air supply pipeline to decrease;

[0007] When the pressure detection element detects that the pressure in the liquid storage device is less than the first pressure value, the control device controls the flow rate of the air supply pipeline to increase.

[0008] In a second aspect, an embodiment of the present application further provides a semiconductor cleaning device, comprising the above-mentioned liquid replenishing device.

[0009] In the embodiment of the present application, the liquid storage device stores cleaning liquid. When the air pressure at the inlet end of the liquid infusion pipeline is greater than the air pressure at the outlet end of the liquid infusion pipeline, the cleaning liquid inside the liquid storage device can flow to the process tank through the liquid infusion pipeline. As the cleaning liquid in the liquid storage device decreases, the pressure in the liquid storage device changes continuously, that is, the air pressure at the outlet end of the liquid infusion pipeline changes, and the pressure difference between the inlet end and the outlet end of the liquid infusion pipeline changes, thereby affecting the flow rate of the liquid infusion pipeline. Therefore, by setting an air supply pipeline, while the liquid infusion pipeline is infusing liquid, the air supply pipeline introduces gas into the liquid storage device to change the air pressure in the liquid storage device, and The control device controls the flow of the gas supply pipeline according to the pressure value detected by the pressure detection element, and then controls the gas flow entering the liquid storage device, so that the gas pressure in the liquid storage device is stably maintained at the first pressure value, and the inlet end of the liquid replenishment pipeline is connected with the liquid outlet of the liquid storage device, so the pressure at the inlet end of the liquid replenishment pipeline is stable, and the outlet end of the liquid replenishment pipeline is connected with the process tank through the external atmosphere, so the pressure at the outlet end of the liquid replenishment pipeline is also stable at the atmospheric pressure value, then, the pressure difference between the inlet end and the outlet end of the liquid replenishment pipeline is stable, and the flow rate flowing through the liquid replenishment pipeline is also stable, which is beneficial to improving the stability of liquid replenishment. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the structure of the fluid infusion device disclosed in the embodiment of the present application.

[0011] Description of reference numerals:

[0012] 100-liquid storage device, 101-liquid outlet, 102-air inlet, 103-liquid inlet, 110-liquid level sensor, 111-high liquid level sensor, 112-middle liquid level sensor, 113-low liquid level sensor,

[0013] 200-liquid replenishment pipeline, 210-fifth control valve, 220-liquid heater, 230-flow meter, 240-liquid filter,

[0014] 300-gas supply pipeline, 310-pressure regulator, 320-pressure reducing valve, 330-second control valve, 340-first check valve, 350-gas filter,

[0015] 400-pressure detection element,

[0016] 500-first pressure relief pipeline, 510-first control valve, 520-pressure relief valve,

[0017] 600-second pressure relief pipeline, 610-second pressure relief device,

[0018] 700-liquid supply pipeline, 710-third control valve,

[0019] 800-drainage pipeline, 810-fourth control valve, 820-second check valve,

[0020] 900 - Crafting slots. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0022] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0023] The semiconductor cleaning equipment and liquid replenishing device provided by the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in combination with the accompanying drawings.

[0024] Please refer to Figure 1 The embodiment of the present application also provides a liquid storage device 100, a liquid replenishment pipeline 200, an air supply pipeline 300, a control device and a pressure detection element 400, wherein the liquid storage device 100 is used to store cleaning liquid, and the liquid storage device 100 can be a liquid storage box, a liquid storage barrel and other structures; the cleaning liquid in the liquid storage device 100 can enter the process tank 900 through the liquid replenishment pipeline 200 to replenish the process tank 900; the air supply pipeline 300 is connected to the liquid storage device 100, and is used to supply air to the liquid storage device 100. The control device is combined with the pressure detection element 400 to control the air pressure in the liquid storage device 100 to be stable.

[0025] The liquid storage device 100 is provided with a liquid outlet 101, the first end of the liquid replenishment pipeline 200 is connected to the liquid outlet 101, and the second end of the liquid replenishment pipeline 200 is used to connect to the process tank 900, so that the cleaning liquid in the liquid storage device 100 enters the process tank 900 through the liquid outlet 101 and the liquid replenishment pipeline 200, thereby replenishing the process tank 900. Among them, the first end of the liquid replenishment pipeline 200 is the inlet end, and the second end of the liquid replenishment pipeline 200 is the outlet end.

[0026] Optionally, the liquid outlet 101 is opened at the top of the liquid storage device 100, and the first end of the liquid infusion pipeline 200 can extend to the top of the liquid storage device 100, thereby directly communicating with the liquid outlet 101; or, the first end of the liquid infusion pipeline 200 extends from the liquid outlet 101 to the bottom or middle of the liquid storage device 100, so that the first end of the liquid infusion pipeline 200 is indirectly connected with the liquid outlet 101. In this way, the cleaning liquid can also flow out from the liquid infusion pipeline 200 when the liquid level in the liquid storage device 100 is low.

[0027] The liquid storage device 100 is provided with an air inlet 102, and the air supply pipeline 300 is connected to the air inlet 102. Specifically, one end of the air supply pipeline 300 is connected to an external air supply device, and the other end of the air supply pipeline 300 is connected to the air inlet 102, wherein the end of the air supply pipeline 300 connected to the external air supply device is the air inlet end, and the end of the air supply pipeline 300 connected to the air inlet 102 is the air outlet end. The pressure detection element 400 is arranged in the liquid storage device 100 to detect the pressure in the liquid storage device 100. Optionally, the pressure detection element 400 can be a pressure gauge or other device capable of detecting pressure; the control device is used to control the flow of the air supply pipeline 300, and the pressure detection element 400 is electrically connected to the control device. In this way, the control device can adjust the gas flow of the air supply pipeline 300 according to the pressure value detected by the pressure detection element 400, change the total amount of gas entering the liquid storage device 100, and adjust the air pressure in the liquid storage device 100.

[0028] It should be noted that the liquid storage device 100 is a sealed device, and the gas provided by the gas supply pipeline 300 is difficult to dissolve in the cleaning liquid in the liquid storage device 100. Therefore, the gas entering the liquid storage device 100 is suspended above the cleaning liquid. The greater the gas flow rate entering the liquid storage device 100, the greater the air pressure of the liquid storage device 100; the smaller the gas flow rate entering the liquid storage device 100, the smaller the air pressure of the liquid storage device 100.

[0029] In the embodiment of the present application, the liquid storage device 100 stores cleaning liquid. When the air pressure at the inlet end of the liquid replenishing pipeline 200 is greater than the air pressure at the outlet end of the liquid replenishing pipeline 200, the cleaning liquid inside the liquid storage device can flow to the process tank 900 through the liquid replenishing pipeline 200. As the cleaning liquid in the liquid storage device 100 decreases, the pressure in the liquid storage device 100 changes continuously, that is, the air pressure at the outlet end of the liquid replenishing pipeline 200 changes, and the pressure difference between the inlet end and the outlet end of the liquid replenishing pipeline 200 changes, thereby affecting the flow rate of the liquid replenishing pipeline 200. Therefore, by providing an air supply pipeline 300, while the liquid replenishing pipeline 200 is replenishing, the air supply pipeline 300 introduces gas into the liquid storage device 100 to change the air pressure in the liquid storage device 100, and the control device detects the pressure of the liquid replenishing pipeline 200 according to the pressure detection element 4. 00 detects the pressure value to control the flow of the gas supply pipeline 300, and then controls the gas flow entering the liquid storage device 100, so that the gas pressure in the liquid storage device 100 is maintained at a first pressure value, and the liquid replenishment pipeline 200 is connected with the liquid outlet 101 of the liquid storage device 100, so the pressure value at the inlet end of the liquid replenishment pipeline 200 is also stable at the first pressure value, and the outlet end of the liquid replenishment pipeline 200 is connected with the process tank 900 through the external atmosphere, that is, the outlet end of the liquid replenishment pipeline 200 is directly in contact with the external atmosphere, so the pressure value at the outlet end of the liquid replenishment pipeline 200 is equal to the atmospheric pressure value, and the pressure value at the outlet end of the liquid replenishment pipeline 200 is also constant, then, the pressure difference between the inlet end and the outlet end of the liquid replenishment pipeline 200 is stable, and the flow rate flowing through the liquid replenishment pipeline 200 is also stable, which is beneficial to improving the stability of liquid replenishment.

[0030] Moreover, the fluid replenishing device does not need to be equipped with a pump body to provide boosting power, and has no specific requirements for the relative position of the process tank 900 and the liquid storage device 100, which avoids the influence of the pump body on the flow and pressure when working, which is beneficial to reduce the cost of the fluid replenishing device, and can also avoid the introduction of particles into the cleaning liquid due to the pump body, thereby ensuring the cleanliness of the cleaning liquid and the cleaning effect.

[0031] Specifically, when the air pressure in the liquid storage device 100 is greater than the atmospheric pressure, it means that the pressure difference between the inlet end and the outlet end of the liquid replenishment pipeline 200 is greater than zero, and the cleaning liquid flows from the end with higher pressure of the liquid replenishment pipeline 200 to the end with lower pressure. Therefore, the liquid storage device 100 can inject cleaning liquid into the process tank 900 through the liquid replenishment pipeline 200, the liquid level in the liquid storage device 100 gradually decreases, and the space for accommodating gas in the liquid storage device 100 gradually increases. At the same time, the gas supply pipeline 300 provides gas to the liquid storage device 100.

[0032] When the pressure detection element 400 detects that the pressure value in the liquid storage device 100 is less than the first pressure value, it means that the air pressure value in the liquid storage device 100 is relatively low, and the air pressure at the inlet end of the liquid infusion pipeline 200 is also relatively low. Then, the pressure difference between the inlet end and the outlet end of the liquid infusion pipeline 200 is reduced, which will undoubtedly reduce the flow rate of the liquid infusion pipeline 200, resulting in unstable liquid infusion. At this time, the control device controls the flow rate of the air supply pipeline 300 to increase, increase the gas flow rate entering the liquid storage device 100, and then increase the air pressure in the liquid storage device 100, so that the air pressure value in the liquid storage device 100 increases and stabilizes at the first pressure value. Then, the pressure difference between the inlet end and the outlet end of the liquid infusion pipeline 200 is stable, ensuring that the flow rate of the liquid infusion pipeline 200 increases and remains stable.

[0033] When the pressure detection element 400 detects that the pressure value in the liquid storage device 100 is greater than the first pressure value, it means that the air pressure in the liquid storage device 100 is relatively high, and the air pressure at the inlet end of the liquid infusion pipeline 200 is also relatively high. Then, the pressure difference between the inlet end and the outlet end of the liquid infusion pipeline 200 increases, which will undoubtedly increase the flow rate of the liquid infusion pipeline 200, resulting in unstable liquid infusion. At this time, the control device controls the flow rate of the air supply pipeline 300 to decrease, reduce the gas flow rate entering the liquid storage device 100, and then reduce the air pressure in the liquid storage device 100, so that the air pressure value in the liquid storage device 100 is reduced and stabilized at the first pressure value. Then, the pressure difference between the inlet end and the outlet end of the liquid infusion pipeline 200 is stable, ensuring that the flow rate of the liquid infusion pipeline 200 is reduced and remains stable.

[0034] The first pressure value can be set as required.

[0035] In an optional embodiment, the control device may include a flow valve and a controller, the flow valve is provided in the gas supply pipeline 300, the flow valve may be located between the gas inlet end of the gas supply pipeline 300 and the gas outlet end of the gas supply pipeline 300, the controller is electrically connected to the flow valve and the pressure detection element 400 respectively, during the gas supply process of the gas supply pipeline 300, the controller changes the opening of the flow valve according to the pressure value detected by the pressure detection element 400, thereby adjusting the gas flow entering the liquid storage device 100, and further adjusting the gas pressure in the liquid storage device 100. In this way, the gas pressure is indirectly kept stable by adjusting the gas flow.

[0036] In another embodiment, the control device includes a pressure regulator 310 and a controller. The pressure regulator 310 is arranged on the gas supply pipeline 300. The pressure regulator 310 is located between the gas inlet end of the gas supply pipeline 300 and the gas outlet end of the gas supply pipeline 300. The controller is electrically connected to the pressure regulator 310 and the pressure detection element 400 respectively. The controller is used to control the pressure regulator 310 to adjust the pressure of the gas supply pipeline 300. Specifically, the controller is used to send a control signal to the pressure regulator 310, and the pressure regulator 310 adjusts the pressure of the gas supply pipeline 300 according to the control signal, thereby adjusting the flow of the gas supply pipeline 300. During the gas supply process of the gas supply pipeline 300, the controller continuously changes the output pressure of the pressure regulator 310 by reading the instantaneous pressure value of the pressure detection element 400 to adjust the pressure of the gas supply pipeline 300. Optionally, the controller can be a single chip microcomputer or a programmable logic controller. The pressure regulator 310 is a common component in the prior art, and its specific pressure regulation principle is not described in detail here.

[0037] According to this embodiment, the output pressure is directly adjusted by the pressure regulator 310 to change the gas flow rate passing therethrough, so as to maintain the pressure of the liquid storage device 100 stable, and the adjustment effect is more direct and accurate.

[0038] Of course, in other embodiments, the pressure regulator 310 may also be replaced by other components such as a pressure stabilizer that can directly adjust the pressure of the gas supply pipeline 300 .

[0039] In an optional embodiment, the liquid replenishing device further includes a pressure reducing valve 320, which is disposed on the gas supply pipeline 300. In the gas flow direction of the gas supply pipeline 300, the pressure reducing valve 320 is located upstream of the pressure regulator 310. In this way, the gas entering the gas supply pipeline 300 first flows through the pressure reducing valve 320 and then flows through the pressure regulator 310. Therefore, the pressure reducing valve 320 first limits the gas pressure of the gas supply pipeline 300 to a safe pressure range, and further adjusts the gas pressure within the safe pressure range through the pressure regulator 310, which is conducive to ensuring that the gas pressure of the liquid storage device 100 is within a safe range and improving safety performance.

[0040] Of course, in other embodiments, the fluid replenishing device may not be provided with the pressure reducing valve 320 , and only directly adjust the air pressure of the air supply pipeline 300 through the pressure regulator 310 .

[0041] In an optional embodiment, the liquid replenishing device further includes a gas filter 350, and the gas filter 350 is disposed in the gas supply pipeline 300. In this way, the gas filter 350 filters the gas entering the gas supply pipeline 300 to ensure the cleanliness of the gas entering the liquid storage device 100. Optionally, the gas filter 350 can be located between the pressure reducing valve 320 and the pressure regulating valve.

[0042] In an optional embodiment, the fluid replenishment device also includes a first pressure relief pipeline 500, which is connected to the air supply pipeline 300, and the connection between the first pressure relief pipeline 500 and the air supply pipeline 300 is a first connection. In the gas flow direction of the air supply pipeline 300, the first connection is located between the pressure regulator 310 and the liquid storage device 100, and the first pressure relief pipeline 500 is provided with a first pressure relief device.

[0043] Since the first pressure relief pipeline 500 is connected with the air supply pipeline 300 and the liquid storage device 100, when the pressure provided by the air supply pipeline 300 to the liquid storage device 100 is relatively large, so that the pressure inside the liquid storage device 100 is greater than the maximum pressure that it can withstand, the first pressure relief device opens to relieve pressure, and is able to relieve pressure on the liquid storage device 100, thereby ensuring that the air pressure of the liquid storage device 100 is maintained within a safe range, thereby ensuring the safety performance of the liquid storage device 100.

[0044] Of course, in other embodiments, the liquid storage device 100 may be directly provided with a pressure relief port, and a pressure relief safety valve may be provided at the pressure relief port.

[0045] In an optional embodiment, the first pressure relief device includes a first control valve 510 and a pressure relief valve 520 connected in parallel. When the pressure of the first pressure relief pipeline 500 is greater than the maximum pressure that the liquid storage device 100 can withstand, the pressure relief valve 520 is in an open state. Specifically, the first pressure relief pipeline 500 includes two parallel pipe sections, and the first control valve 510 and the pressure relief valve 520 are respectively arranged in the two pipe sections to control the opening and closing of the two pipe sections. Optionally, the first control valve 510 can be an exhaust pneumatic valve or other control valve that can be switched on and off.

[0046] By adopting this embodiment, the pressure relief valve 520 can be used to actively relieve pressure on the first pressure relief pipeline 500, and the first control valve 510 can also be used to passively relieve pressure. The pressure relief methods are increased, avoiding the situation where the pressure relief valve 520 cannot relieve pressure when a problem occurs, thereby ensuring timely pressure relief.

[0047] Of course, in other embodiments, the pressure relief device may only include the pressure relief valve 520 or the first control valve 510 .

[0048] In an optional embodiment, the gas supply pipeline 300 is provided with a second control valve 330, and the second control valve 330 controls the on-off of the gas supply pipeline 300. The second control valve 330 is located between the first connection and the pressure regulator 310, so that when the second control valve 330 is closed, the first pressure relief device can also relieve pressure on the liquid storage device 100. Optionally, the second control valve 330 can be an air intake pneumatic valve or other switch valve that can control the on-off of the gas supply pipeline 300. The pressure relief device also includes a second pressure relief pipeline 600, which is connected to the gas supply pipeline 300, and the connection between the second pressure relief pipeline 600 and the gas supply pipeline 300 is a second connection. In the gas flow direction of the gas supply pipeline 300, the second connection is located between the pressure regulator 310 and the second control valve 330, and the second pressure relief pipeline 600 is provided with a second pressure relief device 610.

[0049] Optionally, the second pressure relief device 610 can be a pressure relief safety valve, or it can be a necked pipe portion on the second pressure relief pipeline 600, that is, the local pipe diameter of the second pressure relief pipeline 600 is reduced, that is, the pipe diameter flowing through the second control valve 330 is larger than the pipe diameter at the second pressure relief device 610. When the second control valve 330 is normally opened, the obstruction degree of the second pressure relief pipeline 600 is relatively large, so the gas entering the gas supply pipeline 300 basically flows to the second control valve 330 and normally enters the liquid storage device 100. When the second control valve 330 is closed, the gas entering the gas supply pipeline 300 flows to the second pressure relief pipeline 600.

[0050] In this way, when gas supply is needed, the second control valve 330 is opened, and the gas provided by the inlet end of the gas supply pipeline 300 smoothly passes through the second control valve 330 into the liquid storage device 100; when the second control valve 330 is closed, the gas provided by the gas supply pipeline 300 flows to the outside through the second pressure relief pipeline 600 and the second pressure relief device 610, thereby avoiding excessive gas pressure caused by holding air in the gas supply pipeline 300.

[0051] In this embodiment, the first pressure relief pipeline 500 may also be provided with a necked pipe portion, and along the airflow direction of the first pressure relief pipeline 500 , the necked pipe portion is located downstream of the first pressure relief device.

[0052] In an optional embodiment, the liquid replenishing device further includes at least one liquid supply pipeline 700, the liquid storage device 100 is provided with a liquid inlet 103, each liquid supply pipeline 700 is respectively connected to the liquid inlet 103, and each liquid supply pipeline 700 is provided with a third control valve 710, and each third control valve 710 is respectively used to control the on-off of each liquid supply pipeline 700. Optionally, the third control valve 710 may include a liquid inlet pneumatic valve and a liquid inlet manual valve connected in series, and when the liquid inlet pneumatic valve cannot normally cut off the liquid supply pipeline 700, the liquid inlet manual valve is used to cut off the liquid supply pipeline 700; of course, the third control valve 710 may also be only a liquid inlet pneumatic valve or a liquid inlet manual valve.

[0053] Optionally, the number of the liquid supply pipelines 700 may be at least two, and each liquid supply pipeline 700 may provide different types of cleaning liquids into the liquid storage device 100 .

[0054] By adopting this embodiment, the third control valve 710 can be opened as needed, and the cleaning liquid can be stably provided to the liquid storage device 100 through the liquid supply pipeline 700, and the liquid inlet 103 can be kept in a closed state, that is, the liquid inlet 103 is not connected to the external atmosphere, so as to avoid affecting the air pressure in the liquid storage device 100.

[0055] Of course, in other embodiments, the liquid inlet 103 can be set at the top of the liquid storage device 100. When it is necessary to replenish the cleaning liquid into the liquid storage device 100, the liquid inlet 103 is opened, and the liquid replenishing device is directly manually controlled to replenish the cleaning liquid into the liquid storage device 100 through the liquid inlet 103. After the replenishment is completed, the liquid inlet 103 is closed.

[0056] In an optional embodiment, the liquid replenishing device further includes a liquid discharge pipeline 800, a first end of which is in communication with the liquid outlet 101, and a fourth control valve 810 is provided on the liquid discharge pipeline 800, and the fourth control valve 810 is used to control the on-off of the liquid discharge pipeline 800. Optionally, the fourth control valve 810 may be a liquid discharge pneumatic valve, or other switch valve capable of controlling the on-off of the liquid discharge pipeline 800; the liquid discharge pipeline 800 may also be provided with the necked tube portion described above.

[0057] With this embodiment, when the liquid storage device 100 needs to be cleaned or there is no need to replenish liquid in the process tank 900, and the liquid level of the cleaning liquid in the liquid storage device 100 is higher than the required liquid level, the fourth control valve 810 is opened and the cleaning liquid in the liquid storage device 100 is discharged using the drain pipe 800.

[0058] Of course, in other embodiments, the liquid replenishing device may not be provided with the liquid discharge pipeline 800 and the fourth control valve 810, and a liquid discharge port is provided at the bottom of the liquid storage device 100, and the liquid discharge port can be opened when liquid discharge is required.

[0059] In an optional embodiment, the infusion device further includes a first one-way valve 340, which is disposed on the gas supply pipeline 300, and in the gas flow direction of the gas supply pipeline 300, the first one-way valve 340 conducts the gas supply pipeline 300. Optionally, the first one-way valve 340 is located between the pressure regulating valve and the second connection. With this embodiment, the first one-way valve 340 is used to ensure that the gas supply pipeline 300 can only be conducted in one direction, thereby preventing the gas in the gas supply pipeline 300 from flowing back.

[0060] In an optional embodiment, the liquid replenishing device further includes a second one-way valve 820, which is disposed in the discharge pipeline 800, and in the direction from the first end of the discharge pipeline 800 to the second end of the discharge pipeline 800, the second one-way valve 820 conducts the discharge pipeline 800. Optionally, the second one-way valve 820 is located between the fourth control valve 810 and the necked tube portion. With this embodiment, the second one-way valve 820 is used to ensure that the discharge pipeline 800 can only be conducted in one direction, thereby preventing the liquid in the discharge pipeline 800 from flowing back.

[0061] In an optional embodiment, the liquid replenishing device may further include a liquid filter 240, which is disposed at the inlet end of the liquid replenishing pipeline 200 and the liquid draining pipeline 800, that is, the liquid filter 240 is located at the liquid outlet 101 of the liquid storage device 100. In this way, the cleaning liquid is filtered by the liquid filter 240 to ensure the cleanliness of the cleaning liquid entering the process tank 900.

[0062] In a further embodiment, a fifth control valve 210, a flow meter 230 and a liquid heater 220 may also be provided on the fluid infusion pipeline 200. The fifth control valve 210 is used to control the on-off of the fluid infusion pipeline 200. The flow meter 230 is used to detect the flow rate of the cleaning fluid flowing through the fluid infusion pipeline 200. The liquid heater 220 is used to heat the cleaning fluid flowing through the fluid infusion pipeline 200.

[0063] Optionally, the liquid storage device 100 is provided with a liquid level sensor 110, which is used to detect the liquid level of the cleaning liquid in the liquid storage device 100. Specifically, there are multiple liquid level sensors 110, including a high liquid level sensor 111, a middle liquid level sensor 112 and a low liquid level sensor 113. Before the gas supply pipeline 300 supplies gas to the liquid storage device 100, it is necessary to set the safe pressure range of the pressure reducing valve 320 first. Specifically, the cleaning liquid is first injected into the liquid storage device 100 until the low liquid level sensor 113 is triggered, and the first control valve 510 and the fourth control valve 810 are closed. Then, the gas supply pipeline 300 injects gas into the liquid storage device 100 and records the total amount of gas. The liquid outlet 101 is closed, and the gas pressure in the liquid storage device 100 continues to increase until the pressure relief valve 520 opens to relieve pressure. Since the pressure of the pressure relief valve 520 when relieving pressure is a constant value, the gas pressure value in the liquid storage device 100 at this time can be calculated by the total amount of gas and the volume of the liquid storage device 100. The gas pressure corresponding to the liquid storage device 100 is the pressure limit of the pressure reducing valve 320. Similarly, cleaning liquid is injected into the liquid storage device 100 until the high liquid level sensor 111 is triggered, the first control valve 510 and the fourth control valve 810 are closed, and then the gas supply pipeline 300 continuously injects gas into the liquid storage device 100 and records the total amount of gas, the liquid outlet 101 is closed, and the air pressure in the liquid storage device 100 continues to increase until the pressure relief valve 520 opens to relieve pressure. Since the pressure of the pressure relief valve 520 when relieving pressure is a fixed value, the air pressure value in the liquid storage device 100 at this time can be calculated by the total amount of gas and the volume of the liquid storage device 100. The air pressure corresponding to the liquid storage device 100 is the minimum pressure value limited by the pressure reducing valve 320, and the pressure reducing valve 320 is selected according to this safety pressure range.

[0064] In summary, when the liquid storage device 100 is storing liquid, the third control valve 710 is first opened, and the liquid supply pipeline 700 provides liquid to the liquid storage device 100, and the pressure in the liquid storage device 100 gradually increases, and then the first control valve 510 is opened to discharge the excess gas in the liquid storage device 100 to avoid excessive pressure in the liquid storage device 100. When the cleaning liquid gradually fills the liquid storage device 100, that is, when the high liquid level sensor 111 of the liquid storage device 100 is triggered, the first control valve 510 is closed to stop the pressure relief.

[0065] When the liquid storage device 100 needs to supply liquid to the process tank 900, the second control valve 330 is opened, and the gas provided by the gas supply pipeline passes through the pressure reducing valve 320, the gas filter 350, the pressure regulator 310, the first check valve 340 and the second control valve 330 in sequence to enter the liquid storage device 100. Since the density of the gas is less than the density of the cleaning liquid, the gas floats above the cleaning liquid. When the interior of the liquid storage device 100 is completely filled with gas and cleaning liquid, the pressure value detected by the pressure detection element 400 reaches the set value, such as the aforementioned first pressure value, so that the air pressure at the inlet end of the liquid replenishment pipeline 200 is greater than the air pressure at the outlet end of the liquid replenishment pipeline 200. At this time, the fifth control valve 210 is opened, and the cleaning liquid flows to the process tank 900 through the liquid filter 240, the flow meter 230 and the liquid heater 220.

[0066] As the cleaning liquid flows from the liquid storage device 100 to the process tank 900, the liquid level in the liquid storage device 100 decreases, and the pressure in the liquid storage device changes. When the pressure detection element 400 detects that the pressure value in the liquid storage device 100 is less than the first pressure value, the pressure regulator 310 increases the output pressure of the gas supply pipeline 300, so that the flow of the gas supply pipeline 300 increases, that is, the gas flow entering the liquid storage device 100 increases, and the gas pressure in the liquid storage device 100 also increases accordingly and remains stable, ensuring that the pressure difference between the inlet end and the outlet end of the liquid replenishment pipeline 200 is stable, thereby ensuring the stability of the liquid replenishment flow rate. Similarly, when the pressure detection element 400 detects that the pressure value in the liquid storage device 100 is greater than the first pressure value, the pressure regulator 310 reduces the output pressure of the air supply pipeline 300, thereby reducing the flow of the air supply pipeline 300, that is, the amount of air entering the liquid storage device 100 is reduced, and the air pressure in the liquid storage device 100 is also reduced accordingly and maintained stable, thereby ensuring that the pressure difference between the inlet end of the liquid infusion pipeline and the outlet end of the liquid infusion pipeline 200 is stable, thereby ensuring the stability of the liquid infusion flow rate.

[0067] It should be noted that for different types of pressure reducing valves 320, the first pressure value that needs to be maintained for the air pressure in the liquid storage device 100 is different. When a certain type of pressure reducing valve 320 is installed on the air supply pipeline 300, even if the liquid level in the liquid storage device 100 is different, after adjustment by the pressure regulator 310, the air pressure in the liquid storage device 100 is maintained at the corresponding first pressure value to ensure the stability of the pressure difference between the inlet and outlet ends of the fluid infusion pipeline 200, so as to ensure the stability of the fluid infusion flow rate.

[0068] Based on the liquid replenishing device disclosed in the embodiment of the present application, the embodiment of the present application also provides a semiconductor cleaning device, the semiconductor cleaning device includes the above liquid replenishing device. Using this embodiment, the liquid replenishing device of the semiconductor cleaning device can stably replenish the process tank 900, which is conducive to improving the stability of liquid replenishment.

[0069] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A liquid replenishing device used in semiconductor cleaning equipment, characterized in that: The invention comprises a liquid storage device (100), a liquid replenishment pipeline (200), an air supply pipeline (300), a control device and a pressure detection element (400); the liquid storage device (100) is provided with a liquid outlet (101) and an air inlet (102); a first end of the liquid replenishment pipeline (200) is connected to the liquid outlet (101); a second end of the liquid replenishment pipeline (200) is used to be connected to a process tank (900); the air supply pipeline (300) is connected to the air inlet (102); the pressure detection element (400) is arranged in the liquid storage device (100) to detect the pressure in the liquid storage device (100); the control device is used to control the flow rate of the air supply pipeline (300); and the pressure detection element (400) is electrically connected to the control device. When the pressure detection element (400) detects that the pressure value in the liquid storage device (100) is greater than a first pressure value, the control device controls the flow rate of the air supply pipeline (300) to decrease; When the pressure detection element (400) detects that the pressure in the liquid storage device (100) is less than the first pressure value, the control device controls the flow rate of the air supply pipeline (300) to increase.

2. The fluid replenishing device according to claim 1, characterized in that: The control device comprises a pressure regulator (310) and a controller, wherein the pressure regulator (310) is arranged on the gas supply pipeline (300), and the controller is electrically connected to the pressure regulator (310) and the pressure detection element (400) respectively, and the controller is used to control the pressure regulator (310) to adjust the pressure of the gas supply pipeline (300), thereby adjusting the flow rate of the gas supply pipeline (300).

3. The fluid replenishing device according to claim 2, characterized in that: The fluid replenishing device further comprises a pressure reducing valve (320), wherein the pressure reducing valve (320) is arranged on the gas supply pipeline (300), and in the gas flow direction of the gas supply pipeline (300), the pressure reducing valve (320) is located upstream of the pressure regulator (310).

4. The fluid replenishing device according to claim 2, characterized in that: The fluid replenishing device further comprises a first pressure relief pipeline (500), the first pressure relief pipeline (500) being in communication with the gas supply pipeline (300), and the connection point between the first pressure relief pipeline (500) and the gas supply pipeline (300) is a first connection point, and in the gas flow direction of the gas supply pipeline (300), the first connection point is located between the pressure regulator (310) and the liquid storage device (100), and the first pressure relief pipeline (500) is provided with a first pressure relief device.

5. The fluid replenishing device according to claim 4, characterized in that: The first pressure relief device comprises a first control valve (510) and a pressure relief valve (520) connected in parallel.

6. The fluid replenishing device according to claim 4, characterized in that: The gas supply pipeline (300) is provided with a second control valve (330), and the second control valve (330) is used to control the on-off of the gas supply pipeline (300). The second control valve (330) is located between the first connection point and the pressure regulator (310). The pressure relief device further comprises a second pressure relief pipeline (600), the second pressure relief pipeline (600) being in communication with the gas supply pipeline (300), and the connection point between the second pressure relief pipeline (600) and the gas supply pipeline (300) being a second connection point, and in the gas flow direction of the gas supply pipeline (300), the second connection point is located between the pressure regulator (310) and the second control valve (330), and the second pressure relief pipeline (600) is provided with a second pressure relief device (610).

7. The fluid replenishing device according to claim 1, characterized in that: The liquid replenishing device further comprises at least one liquid supply pipeline (700), the liquid storage device (100) is provided with a liquid inlet (103), each of the liquid supply pipelines (700) is respectively connected to the liquid inlet (103), and each of the liquid supply pipelines (700) is provided with a third control valve (710), and each of the third control valves (710) is respectively used to control the on-off of each of the liquid supply pipelines (700).

8. The fluid replenishing device according to claim 1, characterized in that: The liquid replenishing device further comprises a liquid discharge pipeline (800), a first end of the liquid discharge pipeline (800) being in communication with the liquid outlet (101), and the liquid discharge pipeline (800) is provided with a fourth control valve (810), and the fourth control valve (810) is used to control the on-off of the liquid discharge pipeline (800).

9. The fluid replenishing device according to claim 8, characterized in that: The liquid replenishing device further comprises a first one-way valve (340), wherein the first one-way valve (340) is arranged on the gas supply pipeline (300), and in the gas flow direction of the gas supply pipeline (300), the first one-way valve (340) conducts the gas supply pipeline (300); And / or, the fluid replenishing device also includes a second one-way valve (820), which is arranged on the drainage pipeline (800), and in the direction from the first end of the drainage pipeline (800) to the second end of the drainage pipeline (800), the second one-way valve (820) is connected to the drainage pipeline (800).

10. A semiconductor cleaning device, characterized in that: A fluid infusion device comprising any one of claims 1 to 9.

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