Heat dissipation structure and power module

Abstract

The utility model discloses a heat radiation structure and a power module, the heat radiation structure comprises a housing and a cover body, the housing is internally provided with an accommodating cavity, and the accommodating cavity is provided with an opening; the cover body detachably covers the opening to seal the containing cavity, the containing cavity comprises a liquid inlet area, a heat dissipation area and a liquid outlet area, the liquid inlet area, the heat dissipation area and the liquid outlet area all extend in the first direction, and in the second direction perpendicular to the first direction, the liquid inlet area and the liquid outlet area are located on the two sides of the heat dissipation area respectively; the length of the containing cavity in the first direction is larger than that in the second direction. According to the heat dissipation structure provided by the embodiment of the utility model, the temperature of the cooling liquid in the heat dissipation area can be better ensured to be more uniform, so that the heat of the to-be-dissipated pieces can be more uniformly absorbed, one to-be-dissipated piece is uniformly dissipated, or a plurality of to-be-dissipated pieces are better dissipated, and the to-be-dissipated pieces are effectively protected.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic devices, in particular to a heat dissipation structure and a power module. Background Art

[0002] In the related art, the heat dissipation method of the power module generally adopts coolant to dissipate the heat of the power module. However, the temperature of the coolant gradually rises when it flows, resulting in poor heat dissipation effect of the power module located downstream of the flow channel, which in turn easily affects the working efficiency of the power module located downstream, and even easily causes damage to the power module located downstream. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a heat dissipation structure that can better ensure that the temperature of the coolant in the heat dissipation area is relatively uniform, so that the heat of the heat dissipation component can be relatively uniformly absorbed, so that one heat dissipation component can be uniformly cooled, or multiple heat dissipation components can be well cooled, thereby effectively protecting the heat dissipation component.

[0004] The utility model also provides a power module with the heat dissipation structure.

[0005] According to the first aspect of the utility model, the heat dissipation structure of the embodiment includes: a shell, the shell has a accommodating cavity, the accommodating cavity has an opening; a cover body, the cover body is arranged at the opening to seal the accommodating cavity, wherein the accommodating cavity includes a liquid inlet area, a heat dissipation area and a liquid outlet area, the liquid inlet area, the heat dissipation area and the liquid outlet area all extend along a first direction, in a second direction perpendicular to the first direction, the liquid inlet area and the liquid outlet area are respectively located on both sides of the heat dissipation area, and the length of the accommodating cavity in the first direction is greater than the length in the second direction.

[0006] According to the heat dissipation structure of the embodiment of the utility model, by setting a liquid inlet area and a liquid outlet area extending along a first direction in the heat dissipation structure, and in the second direction, the liquid inlet area and the liquid outlet area are respectively located on both sides of the heat dissipation area. When the coolant enters the liquid inlet area, it can flow along the first direction, and the coolant in the liquid inlet area can flow toward the heat dissipation area along the second direction. When the coolant flows in the heat dissipation area along the second direction, it can flow better to the liquid outlet area extending along the first direction, so that the coolant that has absorbed heat can flow out of the heat dissipation structure along the liquid outlet area better along the first direction, and can better ensure that the temperature of the coolant in the heat dissipation area is relatively uniform, so that the heat of the heat dissipation component to be cooled can be relatively uniformly absorbed, so that one heat dissipation component to be cooled can be cooled evenly, or multiple heat dissipation components to be cooled can be cooled better, thereby effectively protecting the heat dissipation component to be cooled.

[0007] According to some embodiments of the utility model, the shell includes a first bottom surface opposite to the liquid inlet area, a second bottom surface opposite to the heat dissipation area, and a third bottom surface opposite to the liquid outlet area, and the distance from the second bottom surface to the cover body is greater than the distance from the first bottom surface to the cover body, and the distance from the second bottom surface to the cover body is greater than the distance from the third bottom surface to the cover body.

[0008] According to some embodiments of the utility model, the heat dissipation structure also includes: a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is arranged at the end of the liquid inlet area in the first direction, and the liquid outlet pipe is arranged at the end of the liquid outlet area in the first direction, wherein a portion of the inner surface of the liquid inlet pipe is coplanar with the first bottom surface, and a portion of the inner surface of the liquid outlet pipe is coplanar with the third bottom surface.

[0009] According to some embodiments of the present invention, in the first direction, the liquid inlet pipe and the liquid outlet pipe are respectively located at two ends of the shell.

[0010] According to some embodiments of the present invention, in the first direction, the length of the liquid inlet area, the length of the heat dissipation area and the length of the liquid outlet area are all equal.

[0011] According to some embodiments of the present invention, a plurality of heat-conducting blocks are disposed on a side of the cover body facing the accommodating cavity.

[0012] According to some embodiments of the present invention, the plurality of heat-conducting blocks are arranged in a plurality of rows along the first direction or the second direction.

[0013] According to some embodiments of the utility model, a plurality of the heat conductive blocks are arranged in multiple rows along the first direction, and the heat conductive blocks in two adjacent rows are staggered along the second direction; or, a plurality of the heat conductive blocks are arranged in multiple rows along the second direction, and the heat conductive blocks in two adjacent rows are staggered along the first direction.

[0014] According to some embodiments of the present invention, the cross-section of the heat conductive block is circular, elliptical, diamond-shaped or rectangular.

[0015] A power module according to an embodiment of the second aspect of the utility model comprises a chip and a heat dissipation structure according to an embodiment of the first aspect of the utility model, wherein the chip is fixedly connected to the cover.

[0016] According to the power module of the embodiment of the utility model, by providing the above-mentioned heat dissipation structure, it can better ensure that the temperature of the coolant in the heat dissipation area is relatively uniform, so that the heat of the chip can be absorbed more evenly, so that one chip can be evenly cooled, or multiple chips can be better cooled, thereby effectively protecting the chip.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is a three-dimensional diagram of a power module according to some embodiments of the utility model;

[0020] Figure 2 yes Figure 1 Schematic diagram of a medium power module;

[0021] Figure 3 yes Figure 2 Sectional view along line AA;

[0022] Figure 4 is a schematic diagram of a power module according to other embodiments of the utility model;

[0023] Figure 5 yes Figure 4 The cross section along line BB;

[0024] Figure 6 yes Figure 1 A schematic diagram of a middle cover body, wherein a chip is disposed on the cover body;

[0025] Figure 7 yes Figure 1 A schematic diagram of the middle cover body from another angle;

[0026] Figure 8 yes Figure 1 A schematic diagram of the middle cover body from another angle;

[0027] Fig. 9 yes Figure 1 Schematic diagram of the middle shell.

[0028] Reference numerals:

[0029] 100. power module; 101. chip; 102. half bridge;

[0030] 10. Heat dissipation structure; 11. Heat dissipation channel;

[0031] 20. Shell; 21. Accommodating cavity; 211. Liquid inlet area; 212. Heat dissipation area; 213. Liquid outlet area; 214. Opening; 22. First bottom surface; 23. Second bottom surface; 24. Third bottom surface;

[0032] 30. Cover body; 31. Heat conducting block;

[0033] 41. Liquid inlet pipe; 42. Liquid outlet pipe. DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] Reference below Figure 1-Figure 9 A heat dissipation structure 10 according to an embodiment of the present invention is described.

[0036] Reference Figure 1-Figure 9 The heat dissipation structure 10 includes a housing 20 and a cover 30. The housing 20 has a receiving chamber 21. The receiving chamber 21 has an opening 214. The cover 30 is disposed at the opening 214 to seal the receiving chamber 21. For example, the cover 30 and the housing 20 can be fixedly connected by welding, or the cover 30 and the housing 20 can be fixedly connected by fastening bolts. The receiving chamber 21 includes a liquid inlet area 211, a heat dissipation area 212, and a liquid outlet area 213. The liquid inlet area 211, the heat dissipation area 212, and the liquid outlet area 213 are all arranged along a first direction (see the attached drawing). Fig. 9 The first direction is e1 (as shown in FIG. 1 ), and the second direction is perpendicular to the first direction (see FIG. 1 ). Fig. 9 In the direction e2 shown in the figure, the liquid inlet area 211 and the liquid outlet area 213 are respectively located on both sides of the heat dissipation area 212, and the liquid inlet area 211 can be connected to the heat dissipation area 212, and the heat dissipation area 212 can be connected to the liquid outlet area 213. Therefore, after the coolant enters the liquid inlet area 211, it can flow along the first direction. In this way, the coolant in part of the liquid inlet area 211, or the coolant in the entire liquid inlet area 211 extending along the first direction can flow toward the heat dissipation area 212 along the second direction. Therefore, the temperature difference of the coolant flowing from the liquid inlet area 211 to the heat dissipation area 212 can be avoided to a certain extent, so that the coolant can absorb heat evenly, so as to avoid the different heat absorption effects of the heat dissipation area 212 affecting the heat dissipation effect of the heat dissipation element. Furthermore, when the coolant flows along the second direction in the heat dissipation zone 212, the length of the accommodating cavity 21 in the first direction is greater than the length in the second direction, and the coolant can flow better into the liquid outlet zone 213 extending along the first direction, so that the coolant that has absorbed heat can flow out of the heat dissipation structure 10 along the liquid outlet zone 213 better along the first direction, and the coolant that has absorbed heat can be further prevented from affecting the coolant temperature in the heat dissipation zone 212, thereby better ensuring that the coolant in the heat dissipation zone 212 evenly absorbs the heat of the heat dissipation component.

[0037] Reference Figure 2In a specific example shown, a plurality of chips 101 are provided on the cover 30, and the plurality of chips 101 can form a half bridge 102, and the half bridge 102 can be provided along the second direction, and a plurality of half bridges 102 can be provided, and the plurality of half bridges 102 are arranged at intervals along the first direction. Thus, by respectively providing the liquid inlet area 211 and the liquid outlet area 213 on both sides of the heat dissipation area 212 along the second direction, the temperature of the coolant flowing into the heat dissipation area 212 is relatively uniform, and the coolant in the heat dissipation area 212 flows roughly along the second direction, and then flows out of the heat dissipation structure along the liquid outlet area 213 extending in the first direction, so that the coolant can absorb heat from the plurality of half bridges 102 more uniformly, and can better ensure that the plurality of half bridges 102 can be well cooled, and then the plurality of chips 101 can be well cooled, and the chips 101 can be effectively protected.

[0038] Reference Figure 2 In a specific example shown, the length of the heat dissipation area 212 along the first direction is greater than the length of the heat dissipation area 212 along the second direction, and the number of chips 101 arranged in the heat dissipation area 212 along the first direction is greater than the number of chips 101 arranged in the heat dissipation area 212 along the second direction. The flow of the coolant in the heat dissipation area 212 along the second direction is less than the flow distance of the coolant in the heat dissipation area 212 along the first direction, which can reduce the temperature difference of the chips 101 caused by the temperature rise when the coolant flows, and thus reduce the temperature difference between the chips 101. The above is only an exemplary description and cannot be used as a limitation of the present application.

[0039] According to the heat dissipation structure 10 of the embodiment of the utility model, by setting a liquid inlet area 211 and a liquid outlet area 213 extending along the first direction in the heat dissipation structure 10, and in the second direction, the liquid inlet area 211 and the liquid outlet area 213 are respectively located on both sides of the heat dissipation area 212. When the coolant enters the liquid inlet area 211, it can flow along the first direction, and the coolant in the liquid inlet area 211 can flow toward the heat dissipation area 212 along the second direction. When the coolant flows in the heat dissipation area 212 along the second direction, it can flow well to the liquid outlet area 213 extending along the first direction, so that the coolant that has absorbed heat can flow out of the heat dissipation structure 10 along the first direction along the liquid outlet area 213, and can better ensure that the temperature of the coolant in the heat dissipation area 212 is relatively uniform, so that the heat of the heat dissipation component to be cooled can be relatively uniformly absorbed, so that one heat dissipation component to be cooled is uniformly cooled, or multiple heat dissipation components to be cooled are better cooled, thereby effectively protecting the heat dissipation component to be cooled.

[0040] According to some embodiments of the present invention, referring to Figure 1 , Fig. 9The shell 20 includes a first bottom surface 22, a second bottom surface 23 and a third bottom surface 24. The first bottom surface 22 is opposite to the liquid inlet area 211, the second bottom surface 23 is opposite to the heat dissipation area 212, and the third bottom surface 24 is opposite to the liquid outlet area 213. In the height direction of the accommodating cavity 21, the distance from the second bottom surface 23 to the cover body 30 is greater than the distance from the first bottom surface 22 to the cover body 30, and the distance from the second bottom surface 23 to the cover body 30 is greater than the distance from the third bottom surface 24 to the cover body 30. Since the distance from the second bottom surface 23 to the cover body 30 is greater than the distance from the first bottom surface 22 to the cover body 30, the coolant flowing into the liquid inlet area 211 can flow well along the liquid inlet area 211 in the first direction, and then flow evenly to the heat dissipation area 212 along the second direction; since the distance from the second bottom surface 23 to the cover body 30 is greater than the distance from the third bottom surface 24 to the cover body 30, when the coolant flows along the second direction in the heat dissipation area 212 to the liquid outlet area 213 extending along the first direction, the coolant that has absorbed heat can better flow out of the heat dissipation structure 10 along the first direction along the liquid outlet area, which can better avoid the coolant that has absorbed heat from affecting the coolant temperature in the heat dissipation area 212, thereby better ensuring that the coolant in the heat dissipation area 212 evenly absorbs the heat of the heat dissipation component.

[0041] According to some embodiments of the present invention, referring to Figure 1-Figure 2 , Fig. 9 The heat dissipation structure 10 also includes a liquid inlet pipe 41 and a liquid outlet pipe 42. The liquid inlet pipe 41 is arranged at the end of the liquid inlet area 211 in the first direction, and the liquid outlet pipe 42 is arranged at the end of the liquid outlet area 213 in the first direction. The coolant can flow to the liquid inlet area 211 through the liquid inlet pipe 41, and the coolant in the liquid outlet area 213 can flow out of the liquid outlet area 213 through the liquid outlet pipe 42. Among them, part of the inner surface of the liquid inlet pipe 41 is coplanar with the first bottom surface 22, and the flow resistance of the coolant in the liquid inlet pipe 41 to the liquid inlet area 211 is small, which can facilitate the coolant in the liquid inlet pipe 41 to flow to the liquid inlet area 211, and also allow the coolant to flow evenly in the liquid inlet pipe 41 and the liquid inlet area 211; part of the inner surface of the liquid outlet pipe 42 is coplanar with the third bottom surface 24, and the flow resistance of the coolant in the liquid outlet area 213 to the liquid outlet pipe 42 is small, which can facilitate the coolant in the liquid outlet area 213 to flow to the liquid outlet pipe 42, and also allow the coolant to flow evenly in the liquid outlet area 213 and the liquid outlet pipe 42.

[0042] According to some embodiments of the present invention, referring to Figure 1-Figure 2 , Fig. 9In the first direction, the liquid inlet pipe 41 and the liquid outlet pipe 42 are respectively located at the two ends of the shell 20, which can ensure that the coolant can flow through the entire heat dissipation area 212, and can further improve the heat dissipation effect of the coolant on the heat dissipation element. For example, multiple heat dissipation structures 10 can be arranged in series, and the liquid inlet pipe 41 and the liquid outlet pipe 42 are respectively located at the two ends of the shell 20. The coolant flowing out of the liquid outlet pipe 42 can flow to the liquid inlet pipe 41 of the next heat dissipation structure 10, which can facilitate the flow of the coolant in multiple heat dissipation structures 10.

[0043] According to some embodiments of the present invention, referring to Figure 1-Figure 2 , Fig. 9 In the first direction, the length of the liquid inlet area 211, the length of the heat dissipation area 212 and the length of the liquid outlet area 213 are all equal, and the flow resistance of the coolant in the liquid inlet area 211 and the liquid outlet area 213 is less than the flow resistance of the coolant in the heat dissipation area 212. The coolant can first fill the liquid inlet area 211, and then the coolant in the liquid inlet area 211 flows toward the heat dissipation area 212 along the second direction, and the coolant in the heat dissipation area 212 flows toward the liquid outlet area 213 along the second direction. The length of the liquid inlet area 211, the length of the heat dissipation area 212 and the length of the liquid outlet area 213 are all equal, so that the temperature of the coolant flowing into the heat dissipation area 212 is relatively uniform, which can better ensure that the temperature of the coolant in the heat dissipation area 212 is relatively uniform, thereby better ensuring that the coolant in the heat dissipation area 212 evenly absorbs the heat of the heat dissipation component.

[0044] According to some embodiments of the present invention, referring to Figure 7-Figure 8 The cover body 30 is provided with a plurality of heat-conducting blocks 31, and the plurality of heat-conducting blocks 31 face one side of the accommodating cavity 21. When the cover body 30 is covered at the opening 214 to seal the accommodating cavity 21, the heat-conducting blocks 31 can transfer the heat of the heat-dissipating element to be cooled to the coolant in the heat-dissipating area 212, and the heat-conducting blocks 31 can also transfer the cold of the coolant in the heat-dissipating area 212 to the heat-dissipating element to be cooled, so as to dissipate the heat of the heat-dissipating element. By arranging the heat-conducting blocks 31 to dissipate the heat of the heat-dissipating element to be cooled, the heat dissipation efficiency of the coolant to the heat-dissipating element to be cooled can be improved.

[0045] According to some embodiments of the present invention, referring to Figure 7-Figure 8 , multiple heat-conducting blocks 31 are arranged in multiple rows along the first direction, or multiple heat-conducting blocks 31 are arranged in multiple rows along the second direction. When the cover body 30 is covered at the opening 214 to seal the accommodating cavity 21, a heat dissipation channel 11 can be formed between the multiple heat-conducting blocks 31, and the coolant can flow in the heat dissipation channel 11. The flow direction of the coolant can be restricted, so that the coolant can flow along the second direction in the heat dissipation area 212.

[0046] According to some embodiments of the present invention, referring to Figure 7-Figure 8, multiple heat-conducting blocks 31 are arranged in multiple rows along the first direction, and the heat-conducting blocks 31 in two adjacent rows are arranged in a staggered manner along the second direction, or multiple heat-conducting blocks 31 are arranged in multiple rows along the second direction, and the heat-conducting blocks 31 in two adjacent rows are arranged in a staggered manner along the first direction. The heat-conducting blocks 31 in two adjacent rows are arranged in a staggered manner, so that the heat dissipation channel extends in a winding manner, which can increase the flow resistance of the coolant in the heat dissipation channel, and can better ensure that the coolant temperature in the heat dissipation area 212 is relatively uniform, so that the heat of the heat dissipation component to be cooled can be relatively uniformly absorbed, so that one heat dissipation component to be cooled is uniformly cooled, or multiple heat dissipation components to be cooled are well cooled, thereby effectively protecting the heat dissipation component to be cooled.

[0047] According to some embodiments of the present invention, the cross-section of the heat-conducting block 31 is circular, elliptical, diamond-shaped or rectangular. The cross-section of the heat-conducting block 31 in the above shapes can play the role of heat dissipation and heat conduction.

[0048] The power module 100 according to the second aspect of the present invention comprises a chip 101 and a heat dissipation structure 10 according to the first aspect of the present invention, and the heat dissipation element to be dissipated may be the chip 101. The chip 101 is fixedly connected to the cover 30, and the chip 101 and the heat conductive block 31 may be respectively arranged on opposite sides of the cover 30. For example, the chip 101 may be fixed to the cover 30 by welding; or, a heat conductive pad may be arranged between the chip 101 and the cover 30, so that the heat of the chip 101 may be quickly transferred to the cover 30 through the heat conductive pad.

[0049] According to the power module 100 of the embodiment of the utility model, by providing the above-mentioned heat dissipation structure 10, it can better ensure that the temperature of the coolant in the heat dissipation area 212 is relatively uniform, so that the heat of the chip 101 can be absorbed more evenly, so that one chip 101 can be evenly cooled, or multiple chips 101 can be better cooled, thereby effectively protecting the chip 101.

[0050] In the description of the present utility model, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0051] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0052] In the description of this specification, the description with reference to the terms "some embodiments", "optionally", "further" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0053] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A heat dissipation structure, characterized in that: include: A housing, wherein the housing has a receiving cavity, and the receiving cavity has an opening; A cover body is provided at the opening to seal the accommodating cavity, wherein: The accommodating cavity includes a liquid inlet area, a heat dissipation area and a liquid outlet area. The liquid inlet area, the heat dissipation area and the liquid outlet area all extend along a first direction. In a second direction perpendicular to the first direction, the liquid inlet area and the liquid outlet area are respectively located on both sides of the heat dissipation area. The length of the accommodating cavity in the first direction is greater than the length in the second direction.

2. The heat dissipation structure according to claim 1, characterized in that: The shell includes a first bottom surface opposite to the liquid inlet area, a second bottom surface opposite to the heat dissipation area, and a third bottom surface opposite to the liquid outlet area. The distance from the second bottom surface to the cover body is greater than the distance from the first bottom surface to the cover body, and the distance from the second bottom surface to the cover body is greater than the distance from the third bottom surface to the cover body.

3. The heat dissipation structure according to claim 2, characterized in that: Also includes: A liquid inlet pipe and a liquid outlet pipe, wherein the liquid inlet pipe is arranged at the end of the liquid inlet area in the first direction, and the liquid outlet pipe is arranged at the end of the liquid outlet area in the first direction, wherein a portion of the inner surface of the liquid inlet pipe is coplanar with the first bottom surface, and a portion of the inner surface of the liquid outlet pipe is coplanar with the third bottom surface.

4. The heat dissipation structure according to claim 3, characterized in that: In the first direction, the liquid inlet pipe and the liquid outlet pipe are respectively located at two ends of the shell.

5. The heat dissipation structure according to claim 1, characterized in that: In the first direction, the length of the liquid inlet area, the length of the heat dissipation area and the length of the liquid outlet area are all equal.

6. The heat dissipation structure according to claim 1, characterized in that: A plurality of heat conducting blocks are arranged on one side of the cover body facing the accommodating cavity.

7. The heat dissipation structure according to claim 6, characterized in that: The plurality of heat conducting blocks are arranged in a plurality of rows along the first direction or the second direction.

8. The heat dissipation structure according to claim 7, characterized in that: The plurality of heat-conducting blocks are arranged in a plurality of rows along the first direction, and the heat-conducting blocks in two adjacent rows are staggered along the second direction, or, The plurality of heat conducting blocks are arranged in a plurality of rows along the second direction, and the heat conducting blocks in two adjacent rows are staggered along the first direction.

9. The heat dissipation structure according to claim 6, characterized in that: The cross section of the heat conducting block is circular, elliptical, diamond-shaped or rectangular.

10. A power module, characterized in that: It comprises a chip and the heat dissipation structure according to any one of claims 1 to 9, wherein the chip is fixedly connected to the cover.

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