Vapor chamber for EDFA module
By designing a heat-sinking plate for EDFA modules, including a heat-sinking shell, a heat-sinking plate, mounting column and boss, the heat-sinking problem of EDFA modules is solved, and efficient heat dissipation and stable operation of laser components are achieved.
Patent Information
- Application Number
- CN202420573147.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-03-22
AI Technical Summary
Due to the increase in function and power consumption of EDFA module, the heat generation is increased, and the heat dissipation problem has not been effectively solved, resulting in reduced system efficiency, instability, shortened service life and material thermal damage.
A heat-smoothing plate for EDFA modules is designed, including a heat-smoothing shell, a heat-smoothing plate, a mounting column and a boss. The heat-smoothing plate is soldered on the heat-dissipating shell by solder paste, and thermal grease is applied to the boss to improve the heat dissipation effect of the laser component.
The heat-smoothing plate is compact in structure and easy to operate, which can effectively ensure the heat dissipation effect of the laser components, extend its life, and avoid system instability and material damage caused by high temperatures.
Smart Images

Figure CN222620379U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of EDFA module heat dissipation, in particular to a heat spreader used for an EDFA module. Background Art
[0002] As the functions of EDFA modules increase, power consumption increases, and the heat generated by the modules increases. If the heat dissipation problem of electronic devices is not properly solved, the operating temperature will be very high, which will directly lead to a decrease in system efficiency, instability, reduced life, thermal damage to materials, or even burning, and many other problems; therefore, the heat dissipation problem of electronic components has become a bottleneck restricting the development of related industries.
[0003] To this end, we propose a heat sink for EDFA modules. Utility Model Content
[0004] In view of the shortcomings of the above-mentioned existing production technology, the applicant provides a heat spreader for EDFA module, so as to ensure that the laser assembly can operate safely and stably.
[0005] The technical solution adopted by the utility model is as follows:
[0006] A heat spreader for an EDFA module, comprising:
[0007] Heat dissipation housing
[0008] A heat spreader, which is evenly and fully welded on the heat dissipation housing;
[0009] An installation column is connected to the heat dissipation housing and passes through the heat spreader to install and fix the laser assembly;
[0010] The boss is arranged on the heat spreader and located at the lower end of the laser assembly, and is used to improve the heat dissipation effect of the laser assembly.
[0011] Furthermore, the heat dissipation housing and the heat spreader are welded using solder paste, and the thickness of the solder paste is 0.1-0.2 mm.
[0012] Furthermore, heat dissipation teeth are processed on the side wall of the heat dissipation shell.
[0013] Furthermore, thermal grease is applied on the boss with a thickness of 0.05-0.15 mm.
[0014] Furthermore, the height of the boss is smaller than the height of the mounting column, and the height difference between the two is between 0.05-0.15.
[0015] Furthermore, the boss adopts a T-shaped design to match the position of the laser assembly and the corresponding mounting column.
[0016] Furthermore, the boss is made of the same material as the heat spreader.
[0017] Furthermore, the boss is a protruding structure at a corresponding position of the heat spreader.
[0018] Furthermore, the surfaces of the heat dissipation housing and the heat spreader are nickel plated.
[0019] The beneficial effects of the utility model are as follows:
[0020] The utility model has a compact and reasonable structure, is easy to operate, and has a simple and reliable processing technology for structural parts. A boss is directly made on the heat spreader to install the laser component, which can well ensure the heat dissipation effect of the installed laser component. The installation process is simple, and the boss on the heat spreader is slightly lower than the installation column. The laser component is fixed to the installation column by screws, which is convenient for applying thermal grease. The thermal grease is not easy to enter the screw installation hole, affecting the screw installation. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a structural schematic diagram of the utility model.
[0022] Figure 2 It is an exploded view of the utility model.
[0023] Figure 3 for Figure 1 Schematic diagram of the structure after removing the laser component.
[0024] Among them: 1. Laser assembly; 2. Heat sink; 3. Heat dissipation shell; 4. Boss; 5. Mounting column. DETAILED DESCRIPTION
[0025] The specific implementation of the present utility model is described below in conjunction with the accompanying drawings.
[0026] like Figure 1-Figure 3 As shown, the heat spreader for the EDFA module of this embodiment includes a heat dissipation shell 3, a heat spreader 2, a mounting column 5 and a boss 4, which can realize the rapid installation of the laser component 1 while ensuring the flatness and heat dissipation effect of the laser component 1, and has strong practicality.
[0027] like Figure 1-Figure 3 As shown, the heat spreader 2 in this embodiment is evenly soldered on the heat dissipation housing 3 by solder paste, and the thickness of the solder paste is 0.1-0.2mm, which improves the heat conduction effect;
[0028] like Figure 1 and Figure 3 As shown, the mounting column 5 in this embodiment is connected to the heat dissipation housing 3 and passes through the heat spreader 2, and is used to install and fix the laser assembly 1. At the same time, the mounting column 5 is used to adjust the flatness of the laser assembly 1;
[0029] like Figure 1-Figure 3 As shown, the boss 4 in this embodiment is arranged on the heat spreader 2 and located at the lower end of the laser assembly 1. Thermal grease is applied on the boss 4 with a thickness of 0.05-0.15 mm. The boss 4 and the laser assembly 1 are connected together through the thermal grease to improve the thermal conductivity of the laser assembly 1.
[0030] In this embodiment, heat dissipation teeth are processed on the side wall of the heat dissipation housing 3 to further improve the heat dissipation effect of the heat dissipation housing 3 .
[0031] The height of the boss 4 in this embodiment is smaller than the height of the mounting column 5, and the height difference between the two is between 0.05-0.15. The installation process is simple. The laser assembly 1 is fixed to the mounting column 5 by screws, which is convenient for applying thermal grease. The thermal grease is not easy to enter the screw mounting hole, affecting the screw installation.
[0032] like Figure 2-Figure 3 As shown, the boss 4 in this embodiment adopts a T-shaped design to match the position of the laser component 1 and the corresponding mounting column 5, while increasing the contact area with the laser component 1.
[0033] The boss 4 in this embodiment is a protruding structure at a corresponding position of the heat spreader 2 .
[0034] In another embodiment, the boss 4 is made of the same material as the vapor chamber 2 to improve the heat conduction effect.
[0035] The installation process in this embodiment is as follows:
[0036] Both the heat dissipation housing 3 and the heat spreader 2 are subjected to surface nickel plating;
[0037] The heat spreader 2 is evenly and fully welded on the heat dissipation housing 3;
[0038] Apply thermal grease on the boss 4 of the heat spreader 2 with a thickness of 0.05-0.15mm;
[0039] The laser assembly 1 is mounted on the corresponding mounting pillars 5 on the heat dissipation housing 3 .
[0040] The processing technology of the structural part of the utility model is simple and reliable. The boss 4 is directly formed on the heat spreader 2 to mount the laser component 1, which can well ensure the heat dissipation effect of the installed laser component 1.
[0041] Working principle:
[0042] When EDFA is working, the laser component 1 generates a lot of heat, the heat is highly concentrated at this position, the temperature is high, and the laser component 1 is easily damaged. Since the thermal conductivity of the heat spreader 2 is above 10000W / (mK), the heat of the laser component 1 can be quickly dispersed to the entire large surface, effectively reducing the heat accumulation at the pump position.
[0043] Solder paste is used to weld the heat dissipation shell 3 and the heat spreader 2. The amount of solder paste used is strictly controlled so that the heat spreader 2 is fully welded on the heat dissipation shell 3. The thickness of the solder paste is 0.1-0.2mm, so that the heat spreader 2 can efficiently transfer heat to the heat dissipation shell 3; heat dissipation teeth are processed on the heat dissipation shell 3, which can dissipate heat into the air well.
[0044] The contact place between the heat spreader 2 and the laser assembly 1 is connected by a boss 4. The boss 4 can well ensure a high surface flatness and is not easy to damage the laser assembly 1. The distance between the boss 4 and the bottom of the laser assembly 1 is controlled within 0.1mm, that is, the boss 4 is slightly lower than the mounting column 5. In this embodiment, the height of the boss 4 is less than the height of the mounting column 5, and the height difference between the two is between 0.05-0.15, so as to ensure that the heat of the laser assembly 1 can be quickly transferred to the heat spreader 2.
[0045] In summary, the present invention mainly introduces the contact method between the heat spreader 2 and the heat dissipation housing 3, and the contact method between the heat spreader 2 and the laser assembly 1, so as to ensure that the laser assembly 1 can operate safely and stably.
[0046] The above description is an explanation of the utility model, not a limitation of the utility model. The scope of the utility model is defined by the claims. Any form of modification can be made within the protection scope of the utility model.
Claims
1. A heat spreader for an EDFA module, characterized in that: include: Heat dissipation housing (3) A heat spreader (2) which is evenly and fully welded on the heat dissipation housing (3); A mounting column (5) connected to the heat dissipation housing (3) and passing through the heat spreader (2) for mounting and fixing the laser assembly (1); A boss (4) is arranged on the heat spreader (2) and located at the lower end of the laser assembly (1), and is used to improve the heat dissipation effect of the laser assembly (1).
2. A heat spreader for an EDFA module as claimed in claim 1, characterized in that: The heat dissipation housing (3) and the heat spreader (2) are welded using solder paste, with the thickness of the solder paste being 0.1-0.2 mm.
3. A heat spreader for an EDFA module as claimed in claim 1, characterized in that: The side wall of the heat dissipation housing (3) is machined with heat dissipation teeth.
4. A heat spreader for an EDFA module as claimed in claim 1, characterized in that: Thermal grease is applied on the boss (4) with a thickness of 0.05-0.15 mm.
5. A heat spreader for an EDFA module as claimed in claim 1, characterized in that: The height of the boss (4) is smaller than the height of the mounting column (5), and the height difference between the two is between 0.05 and 0.
15.
6. A heat spreader for an EDFA module as claimed in claim 1, characterized in that: The boss (4) is designed in a T-shape to match the position of the laser assembly (1) and the corresponding mounting column (5).
7. A heat spreader for an EDFA module as claimed in claim 1, characterized in that: The boss (4) is made of the same material as the heat spreader (2).
8. A heat spreader for an EDFA module as claimed in claim 1, characterized in that: The boss (4) is a protruding structure at a corresponding position of the heat spreader (2).
9. A heat spreader for an EDFA module as claimed in claim 1, characterized in that: The surfaces of the heat dissipation housing (3) and the heat spreader (2) are nickel-plated.