Ultrasonic probe
By using phase change materials in the backing of the wireless ultrasonic probe, it absorbs heat and delays the heating of the ultrasonic transducer, the performance problems caused by the increase in heat of the wireless ultrasonic probe are solved, achieving better temperature management and user experience.
Patent Information
- Application Number
- CN202420438252.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-04
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-03-04
AI Technical Summary
When the wireless ultrasonic probe is working, the heat generated by the sound head, integrated circuit board and battery causes the temperature of the sound window and case to increase, affecting performance and user experience. The existing heat dissipation solutions have problems such as weight increase, seal damage, and volume increase.
An ultrasonic probe structure containing phase change material in the backing is adopted. The solid-liquid phase change or solid-solid phase change occurs when the temperature rises, absorbing heat and delaying the heating of the ultrasonic transducer.
It effectively reduces the temperature of the ultrasonic probe, extends the use time of the probe, improves performance and user experience, while avoiding the problems of weight increase and seal damage.
Smart Images

Figure CN222622989U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of medical instruments, in particular to an ultrasonic probe. Background Art
[0002] Compared with traditional wired ultrasound probes, wireless ultrasound probes are more portable, smaller in size, and more convenient for users to perform ultrasound examinations. They have gradually become a new choice for medical ultrasound examinations.
[0003] The acoustic head, integrated circuit board and battery contained in the wireless ultrasound probe will generate heat when working, and the better the performance of the probe, the higher the power consumption and the greater the heat generated. On the one hand, the temperature of the acoustic window and shell of the wireless ultrasound probe needs to be controlled within a certain value to meet the requirements of relevant regulations and standards and improve the user experience. On the other hand, the acoustic head and battery are easily heated by the heat from the integrated circuit board, which may cause performance damage.
[0004] Conventional wired ultrasound probes generally use heat-conducting components to improve temperature uniformity, thereby reducing the surface temperature of the acoustic window. However, for wireless ultrasound probes that contain processors and batteries, incorrect use of heat-conducting components will cause the surface temperature of the acoustic window and the housing to increase. Therefore, wireless ultrasound probes need to adopt special heat dissipation structures that contain heat-insulating components.
[0005] For the heat dissipation of wireless ultrasound probes, the solutions adopted by the industry include:
[0006] 1) Phase change energy storage materials are used. When the probe works continuously for a long time, the surface temperature of the acoustic window is still overheated;
[0007] 2) Using replaceable phase-change energy storage materials, this method must be used with an external refrigeration device, which will destroy the sealing of the probe;
[0008] 3) Using heat pipes and metal housings with fins, this method will increase the weight of the probe, have poor solvent resistance, and be difficult to clean;
[0009] 4) Using an external heat dissipation structure of the probe will increase the volume of the probe and affect the user experience;
[0010] 5) Using a metal housing will increase the weight of the probe, make it less resistant to solvents, and make it difficult to clean;
[0011] 6) Using the charging box for heat dissipation cannot reduce the temperature of the probe during continuous use;
[0012] 7) Using a fan and a non-sealed housing will destroy the sealing of the probe;
[0013] 8) Using a vacuum chamber temperature-averaging shell, this method has a complex structure and high cost; Utility Model Content
[0014] The utility model provides an ultrasonic probe containing a phase change material in a backing, and utilizes the phase change heat absorption effect of the phase change material to delay the temperature rise of the ultrasonic transducer.
[0015] In one embodiment, an ultrasound probe is provided, including a housing and an ultrasound transducer, wherein the ultrasound transducer includes an acoustic lens, a matching layer, a piezoelectric element array, and a backing.
[0016] The acoustic lens includes a first side and a second side facing the matching layer, the matching layer includes a third side facing the acoustic lens and a fourth side facing the piezoelectric element array, the piezoelectric element array includes a fifth side facing the matching layer and a sixth side facing the backing, the backing includes a seventh side facing the piezoelectric element array and an eighth side facing away from the piezoelectric element array, the second side of the acoustic lens matches the third side of the matching layer, the fourth side of the matching layer matches the fifth side of the piezoelectric element array, and the sixth side of the piezoelectric element array matches the seventh side of the backing.
[0017] The backing of the ultrasonic probe also includes a matrix and a filler, wherein the filler includes phase-change particles dispersed in the matrix. The phase-change particles include a core structure and a solid shell structure, wherein the solid shell structure wraps the core structure, and the core structure includes one or more phase-change materials. When the temperature of the phase-change material in the core structure rises to its phase-change point, the phase-change material in the core structure undergoes a solid-liquid phase change and absorbs heat while being wrapped by the solid shell structure, thereby absorbing at least part of the heat generated by the ultrasonic transducer.
[0018] In one embodiment, the phase change material of the ultrasound probe includes paraffin, polyol or fatty acid.
[0019] In one embodiment, the shell structure of the ultrasound probe includes one or more of polymethyl methacrylate, polystyrene, and silicon dioxide.
[0020] In one embodiment, an ultrasound probe is provided, including a housing and an ultrasound transducer, wherein the ultrasound transducer includes an acoustic lens, a matching layer, a piezoelectric element array, and a backing.
[0021] The acoustic lens includes a first side and a second side facing the matching layer, the matching layer includes a third side facing the acoustic lens and a fourth side facing the piezoelectric element array, the piezoelectric element array includes a fifth side facing the matching layer and a sixth side facing the backing, the backing includes a seventh side facing the piezoelectric element array and an eighth side facing away from the piezoelectric element array, the second side of the acoustic lens matches the third side of the matching layer, the fourth side of the matching layer matches the fifth side of the piezoelectric element array, and the sixth side of the piezoelectric element array matches the seventh side of the backing.
[0022] The phase change particles in the ultrasonic probe include one or more phase change materials selected from paraffin composite cross-linked high-density polyethylene, polyols and fatty acids. When the temperature of the phase change material in the phase change particles rises to its phase change point, the phase change material in the phase change particles undergoes a solid-solid phase change and absorbs heat, thereby absorbing at least part of the heat generated by the ultrasonic transducer.
[0023] In one embodiment, an ultrasound probe is provided, including a housing and an ultrasound transducer, wherein the ultrasound transducer includes an acoustic lens, a matching layer, a piezoelectric element array, and a backing.
[0024] The acoustic lens includes a first side and a second side facing the matching layer, the matching layer includes a third side facing the acoustic lens and a fourth side facing the piezoelectric element array, the piezoelectric element array includes a fifth side facing the matching layer and a sixth side facing the backing, the backing includes a seventh side facing the piezoelectric element array and an eighth side facing away from the piezoelectric element array, the second side of the acoustic lens matches the third side of the matching layer, the fourth side of the matching layer matches the fifth side of the piezoelectric element array, and the sixth side of the piezoelectric element array matches the seventh side of the backing.
[0025] The backing of the ultrasonic transducer includes a first material layer and a second material layer, which are stacked in sequence and contact each other. The thickness of the first material layer and the thickness of the second material layer are both less than one quarter of the wavelength of the sound wave of the center frequency of the ultrasonic probe in the corresponding material layer. The second material layer includes one or more phase change materials selected from paraffin composite cross-linked high-density polyethylene, polyols and fatty acids. When the temperature of the phase change material in the second material layer reaches its phase change point, the phase change material in the second material layer undergoes a solid-solid phase change or a solid-liquid phase change and absorbs heat, thereby absorbing at least part of the heat generated by the ultrasonic transducer.
[0026] In one embodiment, the first material layer and the second material layer of the ultrasonic transducer are both multi-layered, and the first material layer and the second material layer are alternately stacked, from top to bottom: the first layer and the last layer are the first material layer. When the second material layer is solid-liquid, the first material layer is impermeable to liquid.
[0027] In one embodiment, the filler of the ultrasonic transducer further includes a thermally conductive microstructure, and the thermally conductive microstructure includes one or more of nanometal wires, carbon nanotubes, and graphene.
[0028] In one embodiment, the first material layer of the ultrasonic transducer further includes a thermally conductive microstructure, and the thermally conductive microstructure includes one or more of nanometal wires, carbon nanotubes, and graphene.
[0029] In one embodiment, the filler of the ultrasonic transducer also includes acoustic filler.
[0030] In one embodiment, the first material layer of the ultrasonic transducer further includes acoustic filler.
[0031] In one embodiment, the ultrasonic transducer further comprises a heat sink, and the heat sink is fitted on the eighth side of the backing.
[0032] In one embodiment, the heat sink of the ultrasonic transducer has one or more protrusions extending into the interior of the backing.
[0033] In one embodiment, the ultrasonic transducer further comprises a heat conducting component, the backing further comprises a ninth side surface and a tenth side surface adjacent to the seventh side surface and the eighth side surface respectively, and the heat sink comprises an eleventh side surface and a twelfth side surface. The heat conducting component is connected to the ninth side surface of the backing and the eleventh side surface of the heat sink, and / or the heat conducting component is connected to the tenth side surface of the backing and the twelfth side surface of the heat sink.
[0034] In one embodiment, an ultrasound probe is provided, including a housing and an ultrasound transducer, wherein the ultrasound transducer includes an acoustic lens, a matching layer, a piezoelectric element array, and a backing.
[0035] The acoustic lens includes a first side and a second side facing the matching layer, the matching layer includes a third side facing the acoustic lens and a fourth side facing the piezoelectric element array, the piezoelectric element array includes a fifth side facing the matching layer and a sixth side facing the backing, the backing includes a seventh side facing the piezoelectric element array and an eighth side facing away from the piezoelectric element array, the second side of the acoustic lens matches the third side of the matching layer, the fourth side of the matching layer matches the fifth side of the piezoelectric element array, and the sixth side of the piezoelectric element array matches the seventh side of the backing.
[0036] The backing of the ultrasonic probe comprises a matrix and a filler, wherein the filler comprises phase-change particles dispersed in the matrix, and the phase-change particles comprise a phase-change material.
[0037] In the embodiment of the utility model, when the temperature of the phase change material in the ultrasonic probe backing rises to its phase change point, the phase change material undergoes phase change and absorbs heat, thereby absorbing at least part of the heat generated by the ultrasonic transducer and delaying the temperature rise of the ultrasonic transducer. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] Figure 1 is a schematic diagram of the structure of an ultrasonic probe according to an embodiment;
[0039] Figure 2 is a schematic diagram of the structure of an ultrasonic probe according to an embodiment;
[0040] Figure 3 is a schematic diagram of the structure of an ultrasonic probe according to an embodiment;
[0041] Figure 4 is a schematic diagram of the structure of an ultrasonic probe according to an embodiment;
[0042] Figure 5 is a schematic diagram of the structure of an ultrasonic probe according to an embodiment;
[0043] Figure 6 is a schematic diagram of the structure of an ultrasonic probe according to an embodiment;
[0044] Figure 7 is a schematic diagram of the structure of an ultrasonic probe according to an embodiment;
[0045] Figure 8 is a schematic diagram of the structure of an ultrasonic probe according to an embodiment;
[0046] Fig. 9 The ultrasonic probe structure diagram of an embodiment is shown in FIG. DETAILED DESCRIPTION
[0047] The present invention is further described in detail below through specific implementations in conjunction with the accompanying drawings. Figure 1 , Figure 2 and Figure 3 As shown in one embodiment, a general ultrasonic probe includes: a housing 1 and an ultrasonic transducer 2 , wherein the ultrasonic transducer 2 includes an acoustic lens 3 , a matching layer 4 , a piezoelectric element array 5 and a backing 6 .
[0048] The acoustic lens 3 includes a first side 7 and a second side 8 facing the matching layer 4, the matching layer 4 includes a third side 9 facing the acoustic lens 3 and a fourth side 10 facing the piezoelectric element array 5, the piezoelectric element array 5 includes a fifth side 11 facing the matching layer 4 and a sixth side 12 facing the backing 6, the backing 6 includes a seventh side 13 facing the piezoelectric element array 5 and an eighth side 14 facing away from the piezoelectric element array 5, the second side 8 of the acoustic lens 3 cooperates with the third side 9 of the matching layer 4, the fourth side 10 of the matching layer 4 cooperates with the fifth side 11 of the piezoelectric element array 5, and the sixth side 12 of the piezoelectric element array 5 cooperates with the seventh side 13 of the backing 6.
[0049] The backing 6 of the ultrasonic probe further includes a matrix 14 and a filler 15, wherein the filler 15 includes phase change particles 16 dispersed in the matrix 14. The phase change particles 16 include a core structure 17 and a solid shell structure 18, wherein the solid shell structure 18 wraps the core structure 17, and the core structure 17 includes one or more phase change materials. When the temperature of the phase change material in the core structure 17 rises to its phase change point, the phase change material in the core structure 17 undergoes a solid-liquid phase change and absorbs heat while being wrapped by the solid shell structure 18, thereby absorbing at least part of the heat generated by the ultrasonic transducer 2.
[0050] The solid shell structure 18 can be composed of organic materials, such as polymethyl methacrylate, polystyrene, urea-formaldehyde resin, melamine-formaldehyde resin, polyurea, inorganic materials (such as silicon dioxide, etc.), or a composite thereof. The phase change material can be paraffin, polyol, fatty acid, etc., and the phase change mode of the phase change material can be solid-liquid or solid-solid. The preparation method of the phase change particles 16 can be emulsion polymerization, interfacial polymerization, coagulation, sol-gel, electrohydrodynamic spraying, spray drying, etc. The particle size of the phase change particles is 0.001 to 1 mm, the phase change temperature is 20 to 40°C, and the phase change enthalpy can be relatively high (for example, ≥80 J / g, etc.).
[0051] like Figure 4 As shown, in one embodiment, the phase change particles 16 in the ultrasonic probe include one or more phase change materials selected from paraffin composite cross-linked high-density polyethylene, polyols and fatty acids. When the temperature of the phase change material in the phase change particles 16 rises to its phase change point, the phase change material in the phase change particles 16 undergoes a solid-solid phase change and absorbs heat, thereby absorbing at least part of the heat generated by the ultrasonic transducer 2.
[0052] The shape of the phase change material can be spherical, flake or irregular. In order to increase the thermal conductivity of the filler 15, a thermally conductive microstructure 19 such as nanometal wires, carbon nanotubes, graphene, etc. can be added to the filler 15, or a high thermally conductive matrix 14 such as foamed metal and foamed graphite can be used. In order to adjust the acoustic attenuation and acoustic impedance of the backing 6, an acoustic filler 20 such as hollow glass microspheres, tungsten or tungsten oxide powder can be added to the backing 6.
[0053] like Figure 5 As shown, in one embodiment, the backing 6 of the ultrasonic probe includes a first material layer 21 and a second material layer 22, which are stacked in sequence and in contact with each other, and the thickness of the first material layer 21 and the thickness of the second material layer 22 are both less than one quarter of the wavelength of the sound wave of the center frequency of the ultrasonic probe in the corresponding material layer, and the second material layer 22 includes one or more phase change materials selected from paraffin composite cross-linked high-density polyethylene, polyols and fatty acids. When the temperature of the phase change material in the second material layer 22 reaches its phase change point, the phase change material in the second material layer 22 undergoes a solid-solid phase change or a solid-liquid phase change and absorbs heat, thereby absorbing at least part of the heat generated by the ultrasonic transducer 2.
[0054] The first material layer 21 and the second material layer 22 of the ultrasonic transducer are both multi-layered, and the first material layer 21 and the second material layer 22 are alternately stacked, from top to bottom: the first layer and the last layer are the first material layer 21. When the second material layer 22 is solid-liquid, the first material layer 21 is impermeable to liquid.
[0055] The impedance of the backing 6 can be adjusted by adjusting the thickness ratio of the first material layer 21 and the second material layer 22 to achieve better acoustic attenuation and impedance adaptation. The first material layer 21 and the second material layer 22 can be assembled by hot pressing, bonding, coating, casting, rolling, etc. The angle between the stacked structure and the piezoelectric element array can be determined according to the acoustic design, and is not limited to 180° or 90°.
[0056] The first material layer 21 further includes a heat-conducting microstructure 19, which includes one or more of nano-metal wires, carbon nanotubes, and graphene. The first material layer further includes an acoustic filler 20, such as hollow glass microspheres, tungsten or tungsten oxide powder, and the like.
[0057] like Figure 6 As shown, in one embodiment, the ultrasonic transducer further includes a heat sink 23 , which is fitted on the eighth side 14 of the backing 6 .
[0058] like Figure 7 As shown, in one embodiment, the heat sink 23 of the ultrasonic transducer has one or more protrusions 24 , and the protrusions 24 extend into the interior of the backing 6 .
[0059] like Figure 8 As shown, in one embodiment, the ultrasonic transducer further includes a heat-conducting component 25, the backing 6 further includes a ninth side 26 and a tenth side 27 adjacent to the seventh side 13 and the eighth side 14 respectively, and the heat sink 23 includes an eleventh side 28 and a twelfth side 29. The heat-conducting component 25 is connected to the ninth side 26 of the backing 6 and the eleventh side 28 of the heat sink 23, and / or, the heat-conducting component 25 is connected to the tenth side 27 of the backing 6 and the twelfth side 29 of the heat sink 23.
[0060] like Fig. 9 As shown, in one embodiment, the backing 6 of the ultrasonic probe includes a matrix 14 and a filler 15, the filler 15 includes phase change particles 16, which are dispersed in the matrix 14, and the phase change particles 16 include a phase change material. When the temperature of the phase change material in the backing 6 rises to its phase change point, the phase change material undergoes a phase change and absorbs heat, thereby absorbing at least part of the heat generated by the ultrasonic transducer 2, and delaying the temperature rise of the ultrasonic transducer 2.
[0061] The present invention is described above through specific embodiments, but the present invention is not limited to these specific embodiments. Those skilled in the art should understand that various modifications, equivalent substitutions, changes, etc. can be made to the present invention, and these changes should be within the scope of protection of the present invention as long as they do not deviate from the spirit of the present invention. In addition, the "one embodiment" mentioned in many places above represents different embodiments, and of course, all or part of them can be combined in one embodiment.
Claims
1. An ultrasonic probe, characterized in that: include: shell; an ultrasonic transducer connected to the housing, the ultrasonic transducer comprising an acoustic lens, a matching layer, a piezoelectric element array, and a backing; in: The acoustic lens comprises a first side and a second side facing the matching layer, the matching layer comprises a third side facing the acoustic lens and a fourth side facing the piezoelectric element array, the piezoelectric element array comprises a fifth side facing the matching layer and a sixth side facing the backing, the backing comprises a seventh side facing the piezoelectric element array and an eighth side facing away from the piezoelectric element array, the second side of the acoustic lens matches the third side of the matching layer, the fourth side of the matching layer matches the fifth side of the piezoelectric element array, and the sixth side of the piezoelectric element array matches the seventh side of the backing; The backing includes a matrix and a filler, wherein the filler includes phase-change particles dispersed in the matrix; The phase-change particles include a core structure and a solid shell structure, wherein the solid shell structure encapsulates the core structure, and the core structure within the solid shell structure can undergo a solid-liquid phase change and absorb heat.
2. The ultrasonic probe according to claim 1, characterized in that: The filler also includes a thermally conductive microstructure.
3. The ultrasonic probe according to claim 1, characterized in that: The fillers also include acoustic fillers.
4. The ultrasonic probe according to claim 1, characterized in that: Also included is a heat sink engaged to the eighth side of the backing.
5. The ultrasonic probe according to claim 4, characterized in that: The heat sink has one or more protrusions that extend into the interior of the backing.
6. The ultrasonic probe according to claim 4, characterized in that: Also comprising a heat conducting component, the backing further comprising a ninth side surface and a tenth side surface adjacent to the seventh side surface and the eighth side surface respectively, and the heat sink comprising an eleventh side surface and a twelfth side surface; The thermally conductive component is connected to the ninth side of the backing and the eleventh side of the heat sink, and / or the thermally conductive component is connected to the tenth side of the backing and the twelfth side of the heat sink.
7. An ultrasonic probe, characterized in that: include: shell; an ultrasonic transducer connected to the housing, the ultrasonic transducer comprising an acoustic lens, a matching layer, a piezoelectric element array, and a backing; in: The acoustic lens comprises a first side and a second side facing the matching layer, the matching layer comprises a third side facing the acoustic lens and a fourth side facing the piezoelectric element array, the piezoelectric element array comprises a fifth side facing the matching layer and a sixth side facing the backing, the backing comprises a seventh side facing the piezoelectric element array and an eighth side facing away from the piezoelectric element array, the second side of the acoustic lens matches the third side of the matching layer, the fourth side of the matching layer matches the fifth side of the piezoelectric element array, and the sixth side of the piezoelectric element array matches the seventh side of the backing; The backing includes a matrix and a filler, wherein the filler includes phase-change particles dispersed in the matrix; When the temperature rises to the phase change point, the phase change particles may undergo a solid-solid phase change and absorb heat.
8. The ultrasonic probe according to claim 7, characterized in that: The filler also includes a thermally conductive microstructure.
9. The ultrasonic probe according to claim 7, characterized in that: The fillers also include acoustic fillers.
10. The ultrasonic probe according to claim 7, characterized in that: Also included is a heat sink engaged to the eighth side of the backing.
11. The ultrasonic probe according to claim 10, characterized in that: The heat sink has one or more protrusions that extend into the interior of the backing.
12. The ultrasonic probe according to claim 10, characterized in that: Also comprising a heat conducting component, the backing further comprising a ninth side surface and a tenth side surface adjacent to the seventh side surface and the eighth side surface respectively, and the heat sink comprising an eleventh side surface and a twelfth side surface; The thermally conductive component is connected to the ninth side of the backing and the eleventh side of the heat sink, and / or the thermally conductive component is connected to the tenth side of the backing and the twelfth side of the heat sink.
13. An ultrasonic probe, characterized in that: include: shell; an ultrasonic transducer connected to the housing, the ultrasonic transducer comprising an acoustic lens, a matching layer, a piezoelectric element array, and a backing; in: The acoustic lens comprises a first side and a second side facing the matching layer, the matching layer comprises a third side facing the acoustic lens and a fourth side facing the piezoelectric element array, the piezoelectric element array comprises a fifth side facing the matching layer and a sixth side facing the backing, the backing comprises a seventh side facing the piezoelectric element array and an eighth side facing away from the piezoelectric element array, the second side of the acoustic lens matches the third side of the matching layer, the fourth side of the matching layer matches the fifth side of the piezoelectric element array, and the sixth side of the piezoelectric element array matches the seventh side of the backing; The backing includes a first material layer and a second material layer, which are stacked in sequence and in contact with each other. The thickness of the first material layer and the thickness of the second material layer are both less than one quarter of the wavelength of the sound wave of the center frequency of the ultrasonic probe in the corresponding material layer. When the temperature reaches the phase change point, the second material layer can undergo a solid-solid phase change or a solid-liquid phase change and absorb heat.
14. The ultrasonic probe according to claim 13, characterized in that: The first material layer and the second material layer are both multi-layered, and the first material layer and the second material layer are alternately stacked. From top to bottom: the first layer and the last layer are the first material layer. When the second material layer undergoes a solid-liquid phase transition, the first material layer is impermeable to liquid.
15. The ultrasonic probe according to claim 13, characterized in that: The first material layer includes a thermally conductive microstructure, and the thermally conductive microstructure includes one or more of nanometal wires, carbon nanotubes, and graphene.
16. The ultrasonic probe according to claim 13, characterized in that: The first material layer also includes acoustic filler.
17. The ultrasonic probe according to claim 13, characterized in that: Also included is a heat sink engaged to the eighth side of the backing.
18. The ultrasonic probe according to claim 17, characterized in that: The heat sink has one or more protrusions that extend into the interior of the backing.
19. The ultrasonic probe according to claim 17, characterized in that: Also comprising a heat conducting component, the backing further comprising a ninth side surface and a tenth side surface adjacent to the seventh side surface and the eighth side surface respectively, and the heat sink comprising an eleventh side surface and a twelfth side surface; The thermally conductive component is connected to the ninth side of the backing and the eleventh side of the heat sink, and / or the thermally conductive component is connected to the tenth side of the backing and the twelfth side of the heat sink.