Electroplating equipment

Abstract

The utility model provides electroplating equipment. The electroplating equipment comprises a feeding mechanism, an electroplating mechanism and a plate supplementing mechanism arranged between the feeding mechanism and the electroplating mechanism, the plate supplementing mechanism comprises a plate storage table, and a plurality of accompanying plating plates are arranged on the plate storage table; and the driving device is adjacent to the plate storage table, and the driving device can move between a material taking position where the accompanying plating plates are picked up from the plate storage table and a material feeding position where the accompanying plating plates are placed on the electroplating mechanism. According to the technical scheme, the problem that the circuit board is scrapped due to shutdown of electroplating equipment in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor production, and specifically provides an electroplating device. Background Art

[0002] The current electronic circuit board production line has the characteristics of high automation and rapidity, with less human intervention. Among them, the electroplating process of circuit boards also has these characteristics. Electroplating processing production equipment is usually divided into a feeding mechanism and an electroplating mechanism. The feeding mechanism transports the circuit boards to the electroplating mechanism in a certain order. Correspondingly, the circuit boards entering the electroplating mechanism in order are processed by pickling, water washing, copper plating and other processes in turn.

[0003] The feeding mechanism is usually equipped with multiple processing devices, and multiple sensing devices are set between these processing devices to detect whether the previous process is completed. Once the sensing device fails, it will affect the subsequent actions of the feeding mechanism and the electroplating mechanism, and eventually cause the entire electroplating equipment to stop.

[0004] Since the electroplating tank in the electroplating mechanism contains a large amount of copper sulfate solution, once a shutdown occurs, the circuit board that has entered the electroplating mechanism will be immersed in the copper sulfate solution or exposed to the air. In addition to etching away the existing electroplated copper, the copper layer will also be delaminated due to discontinuous electroplating if the circuit board is immersed in the copper sulfate solution for a long time. The delamination will make the electrical properties of the plated copper abnormal and difficult to pass the subsequent reliability test. In addition, if the circuit board is exposed to the air for a long time, copper oxide crystals will precipitate at the bottom of the blind hole on the circuit board. The copper oxide crystals will make the bottom copper and the electroplated copper combine poorly, which will also cause reliability problems and cause the circuit board to be scrapped.

[0005] Therefore, this field needs a new technical solution to solve the above problems. Utility Model Content

[0006] In order to solve the problem of scrapping circuit boards due to shutdown of electroplating equipment in the prior art, the utility model provides an electroplating equipment. The electroplating equipment of the utility model includes a feeding mechanism, an electroplating mechanism, and a plate-repairing mechanism arranged between the feeding mechanism and the electroplating mechanism, wherein the plate-repairing mechanism includes: a plate storage table, on which a plurality of accompanying plated plates are arranged; and a driving device, which is adjacent to the plate storage table and can be switched between a material taking position for picking up the accompanying plated plates from the plate storage table and a material loading position for placing the accompanying plated plates on the electroplating mechanism.

[0007] The utility model adopts a scheme of setting a plate-repairing mechanism between the feeding mechanism and the electroplating mechanism, so that when the transmission device or the induction device of the feeding mechanism fails, the plate-repairing mechanism can replace the feeding mechanism to continue feeding, thereby maintaining the downstream electroplating mechanism to continue operating. Through the setting of the plate storage table, multiple accompanying plating plates can be stored in advance for easy access. Each accompanying plating plate can replace the circuit board that originally entered the electroplating mechanism to participate in the operation, so that the circuit boards that have entered the electroplating process when the feeding mechanism fails can complete the electroplating and be transferred to other processing equipment intact, so that the circuit boards are saved from being scrapped. Through the setting of the driving device, it is ensured that the joint action between the feeding mechanism and the electroplating mechanism can be continued, and it is also convenient to control the feeding speed of the plate-repairing mechanism to be consistent with the feeding speed of the feeding mechanism.

[0008] In the preferred technical solution of the electroplating equipment, the driving device is used to place the accompanying plate from the material taking position to the loading position after the feeding mechanism fails. Through the above configuration, when the feeding mechanism operates normally, the plate replenishing mechanism is in a standby state; when the feeding mechanism fails, the plate replenishing mechanism starts to operate, that is, the accompanying plate is sent into the electroplating mechanism through the driving device to maintain the electroplating mechanism to continue to operate.

[0009] In the preferred technical solution of the electroplating equipment, the driving device is used to put the electroplating mechanism into normal operation after the feeding mechanism fails. Through the above arrangement, the electroplating mechanism does not need to adjust the control program, which reduces the implementation cost of this solution.

[0010] In the preferred technical solution of the electroplating equipment, the accompanying plate is a waste plate. Through the above arrangement, the cost of transferring the circuit board from the electroplating mechanism is reduced.

[0011] In the preferred technical solution of the electroplating equipment, the plate storage platform includes a base and a platform, the base is fixedly connected to the platform, the platform includes an upper surface, the upper surface is arranged on a side of the platform opposite to the base, and the accompanying plate is arranged on the upper surface. Through the arrangement of the base and the platform, the structure of the plate storage platform is relatively simple, suitable for installation in existing electroplating equipment, so as to solve the problem of scrapping of circuit boards caused by failure of the feeding mechanism.

[0012] In the preferred technical solution of the electroplating equipment, the upper surface is tilted toward the driving device. Through the above arrangement, the accompanying plating plate placed on the upper surface is more easily picked up by the driving device.

[0013] In the preferred technical solution of the electroplating equipment, the upper surface is rectangular and has a vertex with the lowest height in the vertical direction. The upper surface also has a first edge and a second edge adjacent to the vertex. The plate storage table also includes a support portion, which is arranged on the first edge and the second edge and extends outward from the upper surface by a predetermined distance. The upper surface is arranged to be rectangular and has a vertex with the lowest height, and the support portion is arranged on the first edge and the second edge, so that the circuit board, which is also roughly rectangular, is supported from two different directions, and the storage on the plate storage table is more stable. In addition, no support portion is arranged on the two adjacent edges of the upper surface opposite to the first edge and the second edge to reduce the interference of the support portion, so as to facilitate the driving device to pick up the accompanying plate. By extending the support portion outward from the upper surface by a predetermined distance, it is ensured that multiple accompanying plates with a certain thickness can be stored on the upper surface without slipping.

[0014] In the preferred technical solution of the electroplating equipment, the support part includes a plurality of support blocks, at least one support block is provided on each of the first edge and the second edge, and each support block is spaced apart from each other. By providing the spaced support blocks, the material used in the support part is reduced, and the production cost is reduced.

[0015] In the preferred technical solution of the above electroplating equipment, the support part is formed integrally with the platform or is fixedly connected with the platform by fasteners. Through the above arrangement, the support part forms a stable connection with the platform, keeping the accompanying plating plate stable and preventing it from slipping.

[0016] In the preferred technical solution of the electroplating equipment, the number of accompanying plating boards is 10. Through the above configuration, it can be ensured that all circuit boards that have entered the electroplating mechanism complete the predetermined processing flow when the feeding mechanism fails. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings, in which:

[0018] Figure 1 It is a schematic diagram of an embodiment of the electroplating equipment of the utility model;

[0019] Figure 2 It is a structural schematic diagram of an embodiment of a plate storage table of electroplating equipment of the utility model.

[0020] List of reference numerals:

[0021] 100. electroplating equipment; 10. feeding mechanism; 20. electroplating mechanism; 30. plate supplementing mechanism; 31. plate storage table; 311. base; 312. platform; 3121. upper surface; 31211. first edge; 31212. second edge; 3122. lower surface; 313. supporting part; 3131. supporting block; 32. accompanying plating plate; 33. driving device; 331. robot arm; 332. suction cup. DETAILED DESCRIPTION

[0022] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0023] It should be noted that, in the description of the present invention, the terms “first” and “second” are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0024] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, an indirect connection through an intermediate medium, or the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In order to solve the problem of scrapping circuit boards due to shutdown of electroplating equipment in the prior art, the utility model provides an electroplating equipment 100. The electroplating equipment 100 of the utility model includes a feeding mechanism 10, an electroplating mechanism 20, and a plate replenishing mechanism 30 arranged between the feeding mechanism 10 and the electroplating mechanism 20, and the plate replenishing mechanism 30 includes: a plate storage table 31, on which a plurality of accompanying plated plates 32 are arranged; and a driving device 33, the driving device 33 is adjacent to the plate storage table 31, and the driving device 33 can be switched between a material taking position for picking up the accompanying plated plates 32 from the plate storage table 31 and a material loading position for placing the accompanying plated plates 32 on the electroplating mechanism 20.

[0026] Figure 1 Schematic diagram of an embodiment of the electroplating equipment of the utility model. Figure 1As shown, the electroplating equipment 100 of the utility model includes a feeding mechanism 10, an electroplating mechanism 20 and a plate supplementing mechanism 30 arranged between the feeding mechanism 10 and the electroplating mechanism 20. The feeding mechanism 10 includes a plurality of devices, including but not limited to a transmission device, an induction device, etc., which play a role in conveying the circuit board to the electroplating mechanism 20 in a certain order. The electroplating mechanism 20 also includes a plurality of devices, including but not limited to a pickling device, a water washing device, a copper plating device, etc., which can further electroplate the circuit board conveyed by the feeding mechanism 10. The plate supplementing mechanism 30 includes a plate storage table 31, a plurality of accompanying plated plates 32 placed on the plate storage table 31, and a driving device 33 adjacent to the plate storage table 31. The driving device 33 can switch between a material taking position for picking up the accompanying plated plates 32 from the plate storage table 31 and a material loading position for placing the accompanying plated plates 32 on the electroplating mechanism 20. The material picking position refers to the position where the driving device picks up the accompanying plating plate on the plate storage table; the material loading position refers to the position where the accompanying plating plate picked up from the plate storage table is placed on the electroplating mechanism.

[0027] In one or more embodiments, the drive device is configured to remove the accompanying plate from the material taking position and place it in the loading position after the loading mechanism fails. In one or more embodiments, the drive device is used to put the electroplating mechanism in a normal operating state after the loading mechanism fails. The normal operating state means that after the circuit board is placed in the loading position of the electroplating mechanism, the electroplating mechanism sequentially performs pickling, pre-preg, copper plating and other processing on the circuit board according to a predetermined process. Alternatively, the drive device can also be configured to have other suitable uses according to the actual situation on the production line.

[0028] In one or more embodiments, the accompanying plating plate is a waste plate. A waste plate refers to a plate that does not need to participate in the processing in the electroplating mechanism and is only used to replace the valuable circuit board to be processed from the electroplating mechanism. To this end, each accompanying plating plate 32 can be configured as a copper foil substrate or a stainless steel plate. Alternatively, the accompanying plating plate 32 can also be set to other suitable metal plates to facilitate normal participation in the electroplating process and ensure that the electroplating mechanism 20 is not damaged or alarmed. In one or more embodiments, the number of accompanying plating plates 32 is 10. Alternatively, the accompanying plating plates 32 can also be set to other suitable numbers according to actual conditions, as long as it is ensured that when the feeding mechanism 10 fails, each circuit board that has entered the electroplating mechanism 20 can complete all the electroplating processes. Specifically, if the circuit board needs to go through 10 processes to complete the processing after entering the electroplating mechanism 20, when the feeding mechanism 10 fails, there are 10 circuit boards in the electroplating mechanism 20 that still need to be processed. Therefore, every time a plating plate 32 is sent into the electroplating mechanism 20 by the driving device 33, one circuit board is processed; when 10 plating plates 32 are sent into the electroplating mechanism 20, 10 circuit boards are processed, avoiding the scrap caused by direct shutdown. In other words, if the circuit board needs to go through n processes after entering the electroplating mechanism 20, the number of plating plates 32 should be at least n.

[0029] Figure 2 Schematic diagram of the structure of the embodiment of the plate storage platform of the electroplating equipment of the utility model. Figure 2 As shown, in one or more embodiments, the plate storage table 31 includes a base 311 and a platform 312 that is fixedly connected to the base 311. Alternatively, the base 311 may be eliminated, and the platform 312 may be fixed at a suitable position of the electroplating equipment 100 by other means. In one or more embodiments, the number of the bases 311 is 3, so as to stably support the platform 312 and prevent the platform 312 from turning over. Alternatively, the number of the bases 311 may also be set to other suitable numbers according to actual conditions, such as 1, 2, 4, etc. In one or more embodiments, the platform 312 is a plate-like component and has an upper surface 3121 and a lower surface 3122. Figure 2 In the orientation shown, the upper surface 3121 is tilted toward the "upward" direction, and the lower surface 3122 is toward the "downward" direction. In one or more embodiments, the up and down direction is the vertical direction. The base 311 and the lower surface 3122 are fixedly connected, and the connection method includes but is not limited to screw connection, clamping connection, welding, etc. The upper surface 3121 is a plane, and the accompanying plating plate 32 can be stacked on the upper surface 3121. Alternatively, the platform 312 can also be configured as other components with at least one plane, and the at least one plane is used to store the accompanying plating plate 32.

[0030] like Figure 1As shown, in one or more embodiments, the upper surface 3121 is tilted toward the driving device 33, so that the driving device 33 can pick up the accompanying plating plate 32 placed on the upper surface 3121. Alternatively, the upper surface 3121 can also be configured into a substantially rectangular shape according to the actual In one or more embodiments, the upper surface 3121 is configured into a substantially rectangular shape to match the accompanying plating plate 32 which is also rectangular. In such an embodiment, when the upper surface 3121 is tilted toward the driving device 33, the upper surface 3121 has a vertex with the lowest height in the vertical direction, and accordingly, the remaining three vertices are all higher than the lowest vertex in the vertical direction. The upper surface 3121 also has a first edge 31211 and a second edge 31212 adjacent to the vertex. In one or more embodiments, the plate storage table 31 also includes a support portion 313. The support portion 313 is disposed on the first edge 31211 and the second edge 31212 to prevent the accompanying plating plate 32 from falling. The support portion 313 may be configured to extend continuously from the first edge 31211 to the second edge 31212, or may be configured to be disposed at intervals on the first edge 31211 and the second edge 31212. Alternatively, the support portion 313 may be omitted, and other suitable methods may be used to keep the accompanying plating plate 32 on the upper surface 3121.

[0031] In one or more embodiments, Figure 2 As shown, the support portion 313 includes four support blocks 3131 spaced apart from each other, and two support blocks 3131 are respectively provided on the first edge 31211 and the second edge 31212. Alternatively, the support blocks 3131 on the first edge 31211 and the second edge 31212 can also be set to other suitable numbers, and it is only necessary to ensure that at least one support block 3131 is respectively provided on the first edge 31211 and the second edge 31212. In an alternative embodiment, the support portion 313 can also be provided on other edges of the upper surface 3121 other than the first edge 31211 and the second edge 31212, so as to further ensure the stability of the accompanying plating plate 32. In one or more embodiments, each support portion 313 extends outward from the upper surface 3121 by a predetermined distance, and the predetermined distance can be configured to be 0.5-2 cm. Alternatively, the predetermined distance can also be configured to other suitable values ​​according to the actual number of accompanying plating plates 32, and it is only necessary to ensure that the accompanying plating plates 32 placed on the upper surface 3121 can remain stable and not slip.

[0032] In an alternative embodiment, the upper surface 3121 may also be configured to have two vertices with the lowest height in the vertical direction, that is, the upper surface 3121 has two horizontal edges, and the support portion 313 may be provided on the edge with the lower height in the vertical direction of the two horizontal edges to prevent the accompanying plating plate 32 from sliding off.

[0033] In an alternative embodiment, the upper surface 3121 may also be configured to have other suitable shapes. Accordingly, the support portion 313 is also disposed at a lower height in the vertical direction at the edge of the upper surface 3121 to maintain the stability of the accompanying plating plate 32 .

[0034] In one or more embodiments, the support portion 313 is integrally formed with the platform 312 or is fixedly connected by fasteners, including but not limited to screws, rivets, etc. Alternatively, the support portion 313 may also be fixed to the platform 312 by other suitable means, such as welding.

[0035] In one or more embodiments, the platform 312 is made of tin material, which has a low cost and ensures the service life of the platform 312. Alternatively, the platform 312 can also be made of other suitable materials, such as plastic materials.

[0036] In one or more embodiments, the support portion 313 is made of tinplate material. Alternatively, the support portion 313 can also be made of other suitable materials, such as stainless steel, hard plastic, etc. The side of the upper surface of the support portion often collides or rubs against the metal plating plate. Through the above configuration, the service life of the support portion is extended.

[0037] Continue reading Figure 1 In one or more embodiments, the driving device 33 includes a mechanical arm 331 and a suction cup 332. The suction cup 332 is fixedly connected to the end of the mechanical arm 331 and is used to absorb the accompanying plating plate 32. The mechanical arm 331 can drive the suction cup 332 to move between a material taking position for picking up the accompanying plating plate 32 from the plate storage table 31 and a loading position for placing the accompanying plating plate 32 on the electroplating mechanism 20. In one or more embodiments, the mechanical arm 331 is a six-axis mechanical arm 331. Alternatively, the driving device 33 can also be configured in other suitable forms, and only needs to complete the action of moving the accompanying plating plate 32 from the material taking position to the loading position and then returning to the material taking position.

[0038] So far, the technical solution of the present invention has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. An electroplating device, characterized in that: The electroplating equipment comprises a feeding mechanism, an electroplating mechanism and a plate-repairing mechanism arranged between the feeding mechanism and the electroplating mechanism, wherein the plate-repairing mechanism comprises: A plate storage platform, on which a plurality of accompanying plating plates are arranged; and A driving device is adjacent to the plate storage table, and the driving device can be switched between a material taking position for picking up the accompanying plate from the plate storage table and a material loading position for placing the accompanying plate on the electroplating mechanism.

2. The electroplating equipment according to claim 1, characterized in that: The driving device is used to move the accompanying plating plate from the material taking position to the material loading position after the material loading mechanism fails.

3. The electroplating equipment according to claim 2, characterized in that: The driving device is used to put the electroplating mechanism into a normal operating state after the feeding mechanism fails.

4. The electroplating equipment according to any one of claims 1 to 3, characterized in that: The accompanying plating plate is a waste plate.

5. The electroplating equipment according to claim 1, characterized in that: The plate storage table includes a base and a platform, the base is fixedly connected to the platform, the platform includes an upper surface, the upper surface is arranged on a side of the platform opposite to the base, and the accompanying plating plate is arranged on the upper surface.

6. The electroplating equipment according to claim 5, characterized in that: The upper surface is inclined toward the driving device.

7. The electroplating equipment according to claim 6, characterized in that: The upper surface is rectangular and has a vertex with the lowest height in the vertical direction, and the upper surface also has a first edge and a second edge adjacent to the vertex; The pallet storage table further includes a support portion that is provided on the first edge and the second edge and extends outwardly from the upper surface by a predetermined distance.

8. The electroplating equipment according to claim 7, characterized in that: The support portion includes a plurality of support blocks, at least one support block is disposed on each of the first edge and the second edge, and each of the support blocks is spaced apart from each other.

9. The electroplating equipment according to claim 7, characterized in that: The support portion is formed integrally with the platform or is fixedly connected to the platform via fasteners.

10. The electroplating equipment according to claim 1, characterized in that: The number of the accompanying plating plates is 10.

Images