Non-contact surface profilometer heating module

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to a non-contact surface profilometer heating module which comprises a heat preservation furnace main body, a glass door, an internal heat conduction layer, a middle heating layer and a supporting component. The glass door is connected with the heat preservation furnace body and located on one side of the heat preservation furnace body, the internal heat conduction layer is arranged in the heat preservation furnace body, the middle heating layer is arranged on the side, close to the internal heat conduction layer, of the heat preservation furnace body, and the supporting component is located on one side of the heat preservation furnace body. The warping degree of the chip is accurately measured, the influence of temperature fluctuation on a measurement result is eliminated, and different measurement results at different temperatures can be measured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a non-contact surface profiler heating module. Background Art

[0002] The surface profiler is a measuring instrument based on the Windows system as an operating platform with powerful data processing and analysis functions. When performing surface profile detection, chip warping is a common problem in the field of electronic packaging. It is usually caused by the mismatch of thermal expansion coefficients between the chip and substrate materials. During the manufacturing and packaging process of the chip, it will experience multiple temperature changes, resulting in different materials due to different degrees of thermal expansion and contraction. Internal stress generates, which in turn causes chip warping.

[0003] This warping not only affects the appearance of the product, but may also cause problems such as chip cracking, material delamination, and poor welding, thereby reducing the quality and reliability of the product.

[0004] In order to accurately measure the warpage of the chip, a laser measurement system is usually required. However, during the measurement process, the temperature change of the chip may affect the accuracy of the measurement result. Therefore, it is particularly important to provide a device that can uniformly heat the chip and maintain a constant temperature. Utility Model Content

[0005] The purpose of the utility model is to provide a non-contact surface profiler heating module, which can eliminate the influence of temperature fluctuation on the measurement result while ensuring accurate measurement of chip warpage by equipping with an advanced constant temperature heating device, and can measure different measurement results at different temperatures.

[0006] To achieve the above-mentioned purpose, the utility model provides a non-contact surface profiler heating module, comprising a heat preservation furnace body, a glass door, an internal heat conduction layer, a middle heating layer and a supporting member;

[0007] The glass door is connected to the insulation furnace body and is located on one side of the insulation furnace body. The internal heat-conducting layer is arranged inside the insulation furnace body. The middle heating layer is arranged on one side of the insulation furnace body close to the internal heat-conducting layer. The supporting member is located on one side of the insulation furnace body.

[0008] The heat preservation furnace body has a disbursement boss and a laser injection port, wherein the disbursement boss is located at the top of the heat preservation furnace body; and the laser injection port is located at the top of the heat preservation furnace body.

[0009] Wherein, the insulation furnace body also has an external insulation layer, and the external insulation layer is arranged on one side of the insulation furnace body.

[0010] Wherein, the supporting structure includes a bottom insulation platform and an insulation sheet, wherein the bottom insulation platform is arranged at the bottom of the insulation furnace body; the insulation sheet is fixedly connected to the insulation furnace body and is located on one side of the insulation furnace body close to the bottom insulation platform.

[0011] The bottom insulation platform has a movable groove and a placement boss, wherein the movable groove is located on a side of the bottom insulation platform close to the insulation furnace body; and the placement boss is located at the center of the bottom insulation platform.

[0012] The utility model discloses a non-contact surface profiler heating module, which positions the chip placed inside the insulation furnace body through the laser injected by the laser injection port, and then heats the chip through the middle heating layer in cooperation with the internal heat-conducting layer and the external insulation layer provided on the insulation furnace body. When heated to a specified range, the corresponding measurement and the corresponding data processing can be started. During the measurement, the data processing module processes the laser signal in real time or offline, calculates the chip surface height and warpage, and the system automatically performs warpage analysis and generates a three-dimensional morphology model and a warpage report. It is realized that by equipping with an advanced constant temperature heating device, it is possible to ensure that the chip warpage is accurately measured while eliminating the influence of temperature fluctuations on the measurement results, and can measure different measurement results at different temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0014] Figure 1 It is a schematic diagram of the overall structure of the non-contact surface profiler heating module of the first embodiment of the utility model.

[0015] Figure 2 It is a diagram showing the internal structure of the insulation furnace body of the first embodiment of the utility model.

[0016] Figure 3 It is a schematic diagram of the overall structure of the non-contact surface profiler heating module of the second embodiment of the utility model.

[0017] Figure 4 It is a cross-sectional view of the main body of the insulation furnace of the second embodiment of the utility model.

[0018] In the figure: 101 - insulation furnace body, 102 - glass door, 103 - internal heat conduction layer, 104 - middle heating layer, 105 - expenditure boss, 106 - laser injection port, 107 - external insulation layer, 201 - bottom insulation platform, 202 - insulation sheet, 203 - movable groove, 204 - placement boss. DETAILED DESCRIPTION

[0019] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0020] The first embodiment of the present application is:

[0021] See also Figure 1 and Figure 2 ,in Figure 1 This is a schematic diagram of the overall structure of the heating module of the non-contact surface profiler. Figure 2 It is a diagram showing the internal structure of the insulation furnace body 101.

[0022] The utility model provides a non-contact surface profiler heating module: including a heat preservation furnace body 101, a glass door 102, an internal heat conduction layer 103, a middle heating layer 104 and a supporting member, wherein the heat preservation furnace body 101 has a disbursement boss 105 and a laser injection port 106, and the heat preservation furnace body 101 also has an external heat preservation layer 107. It can be equipped with an advanced constant temperature heating device to ensure that the influence of temperature fluctuation on the measurement result is eliminated while accurately measuring the chip warpage, and different measurement results at different temperatures can be measured.

[0023] In this embodiment, the glass door 102 is connected to the insulation furnace body 101 and is located on one side of the insulation furnace body 101, the internal heat-conducting layer 103 is arranged inside the insulation furnace body 101, the middle heating layer 104 is arranged on the side of the insulation furnace body 101 close to the internal heat-conducting layer 103, the supporting member is located on one side of the insulation furnace body 101, and the expenditure boss 105 is located at the top of the insulation furnace body 101; the laser injection port 106 is located at the top of the insulation furnace body 101, and the external insulation layer 107 is arranged on one side of the insulation furnace body 101. The expenditure boss 105 provided on the top of the insulation furnace body 101 is provided with an injection port matching the laser injection port 106 at the top of the insulation furnace body 101. The two injection ports can ensure that the laser of the laser displacement sensor can It can be smoothly shot into the insulation furnace body 101 to work. Because the width of the laser is very small, the size of the laser injection port 106 is also small, which can reduce the temperature loss inside the insulation furnace. The glass door 102 is composed of two layers of glass, which can keep warm and insulate to prevent heat from being transferred to the outside to cause burns, and prevent the risk of breakage caused by excessive temperature difference on both sides of the glass. When it is necessary to take and place the chip, the upper part of the furnace can be directly raised through the motor lifting mechanism below to take and place the chip. At the same time, the glass door 102 can be used to monitor and observe the situation inside the insulation furnace body 101 during work. Because the top of the furnace is connected to the laser part, and the laser part is fixed on a slide equipped with a motor, the lifting and lowering of the motor can be controlled by a computer, and the lifting height can be controlled to avoid collision between the insulation sheet and the bottom insulation material.

[0024] Among them, the outer insulation layer arranged inside the insulation furnace main body 101 is made of a material with good thermal insulation performance, which can reduce the internal heat loss. The middle heating layer is composed of a resistance wire or other electric heating elements, with high heating efficiency and stable temperature rise. The inner heat-conducting layer is made of a material with good thermal conductivity to make the internal temperature of the insulation furnace uniform. A heat dissipation layer is formed between the expenditure boss 105 on the top of the insulation furnace main body 101 and the top wall of the insulation body. By arranging a corresponding heat dissipation device on the heat dissipation layer, the influence of the dissipated heat on the laser displacement sensor above can be reduced.

[0025] When the non-contact surface profiler heating module of the present embodiment is in use, the laser shot in through the laser shot inlet 106 positions the chip placed inside the insulation furnace body 101, and then the middle heating layer 104 cooperates with the internal heat conductive layer 103 and the external insulation layer 107 provided on the insulation furnace body to heat it. When it is heated to the specified range, the corresponding measurement and the corresponding data processing can be started. During the measurement, the data processing module processes the laser signal in real time or offline, calculates the chip surface height and warpage, and the system automatically performs warpage analysis and generates a three-dimensional morphology model and a warpage report. It is realized that by equipping with an advanced constant temperature heating device, it is possible to ensure that while accurately measuring the chip warpage, the influence of temperature fluctuations on the measurement results is eliminated, and different measurement results at different temperatures can be measured.

[0026] Second embodiment:

[0027] See also Figure 3 and Figure 4 , Figure 3 This is a schematic diagram of the overall structure of the non-contact surface profiler heating module of the second embodiment. Figure 4 It is a cross-sectional view of the insulation furnace body 101 of the second embodiment. The support member provided by the utility model includes a bottom insulation platform 201 and an insulation sheet 202 . The bottom insulation platform 201 has a movable groove 203 and a placement boss 204 .

[0028] Among them, the bottom insulation platform 201 is arranged at the bottom of the insulation furnace body 101; the insulation sheet 202 is fixedly connected to the insulation furnace body 101, and is located on the side of the insulation furnace body 101 close to the bottom insulation platform 201, and the movable groove 203 is located on the side of the bottom insulation platform 201 close to the insulation furnace body 101; the placement boss 204 is located at the center of the bottom insulation platform 201, and the placement boss 204 in the middle of the bottom insulation platform 201 is used to place the chip, and a circle around the placement boss 204 is hollowed out to form the movable groove 203, and then the movable groove 203 is used as the movement range of the platform, and the entire bottom platform is made of insulation material to reduce heat loss, and the insulation sheet 202 is arranged at the bottom of the insulation furnace body 101 The position where it contacts the surface of the bottom insulation platform 201, the movable groove 203 can be shielded by the insulation sheet 202, thereby reducing heat loss.

[0029] When using a non-contact surface profiler heating module of this embodiment, the insulation furnace body 101 and the laser displacement sensor above are fixed on the bracket and remain motionless, the insulation sheet 202 is fixed on the insulation furnace, and the height is adjusted according to actual needs, and the bottom insulation platform 201 is fixed on the displacement platform below, so that in actual operation, the corresponding position adjustment can be performed through the movable groove 203 provided around the placement boss 204 in the center of the bottom insulation platform 201, which greatly enhances the practicality of the entire device.

[0030] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A non-contact surface profiler heating module, characterized in that: It includes a heat preservation furnace body, a glass door, an internal heat-conducting layer, a middle heating layer and a supporting member; The glass door is connected to the insulation furnace body and is located on one side of the insulation furnace body. The internal heat-conducting layer is arranged inside the insulation furnace body. The middle heating layer is arranged on one side of the insulation furnace body close to the internal heat-conducting layer. The supporting member is located on one side of the insulation furnace body.

2. The non-contact surface profiler heating module according to claim 1, characterized in that: The heat preservation furnace body has a disbursement boss and a laser injection port, wherein the disbursement boss is located at the top of the heat preservation furnace body; and the laser injection port is located at the top of the heat preservation furnace body.

3. The non-contact surface profiler heating module according to claim 1, characterized in that: The heat-insulating furnace body also has an external heat-insulating layer, and the external heat-insulating layer is arranged on one side of the heat-insulating furnace body.

4. The non-contact surface profiler heating module according to claim 1, characterized in that: The supporting member comprises a bottom insulation platform and an insulation sheet, wherein the bottom insulation platform is arranged at the bottom of the insulation furnace body; the insulation sheet is fixedly connected to the insulation furnace body and is located on one side of the insulation furnace body close to the bottom insulation platform.

5. The non-contact surface profiler heating module according to claim 4, characterized in that: The bottom insulation platform has a movable groove and a placement boss, wherein the movable groove is located on a side of the bottom insulation platform close to the insulation furnace body; and the placement boss is located at the center of the bottom insulation platform.

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