Heat exchange assembly, pressure head structure and testing device

Abstract

The utility model relates to a heat exchange assembly, a pressure head structure and a testing device, the heat exchange assembly comprises a first flow channel layer, the first flow channel layer comprises a plurality of liquid inlet flow channels which are mutually independent, the first flow channel layer is provided with a liquid outlet area, and each liquid inlet flow channel comprises a liquid outlet hole located in the liquid outlet area; the second flow channel layer is located on one side of the first flow channel layer, the second flow channel layer is provided with a liquid inlet area, and the liquid inlet area corresponds to the liquid outlet area; the second runner layer comprises a plurality of diversion groups which are independent from one another, each diversion group comprises a plurality of heat exchange runners which are sequentially and adjacently arranged around the liquid inlet area, each heat exchange runner comprises a liquid inlet hole located in the liquid inlet area, and a liquid outlet hole of each liquid inlet runner is communicated with a plurality of liquid inlet holes of the corresponding diversion group; therefore, each liquid inlet flow channel supplies flow to the multiple heat exchange flow channels in the corresponding flow dividing set. And each flow dividing group is communicated with the liquid outlet flow channel. The heat exchange assembly is suitable for chip temperature control of various powers.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a heat exchange component, a pressure head structure and a testing device. Background Art

[0002] Before a chip is shipped, it needs to go through multiple stages including design, manufacturing and testing. Usually during testing, the chip needs to be temperature controlled to ensure the accuracy of the production process or the test data.

[0003] At present, electronic testing equipment uses the temperature confrontation between the heat exchange component for cooling and the heating element to control the chip temperature. Generally, a spiral channel is set inside the heat exchange component, and the refrigerant flows from the outer circle of the spiral channel to the center, and then flows from the center to the outer circle outlet. In this process, the temperature of the refrigerant will gradually increase after the heat exchange with the chip, making the temperature in the center of the flow channel higher than the temperature in the outer circle. This is inconsistent with the distribution state that the heating temperature in the center area of ​​the chip is higher and the temperature in the periphery is lower, which is not conducive to the effective temperature control requirements of the chip and has an adverse effect on the performance test of the chip. Utility Model Content

[0004] Based on this, it is necessary to provide a heat exchange component, a pressure head structure and a testing device to address the problem that the flow channel structure distribution of the heat exchange component does not match the chip temperature distribution, resulting in the inability to effectively control the chip temperature.

[0005] A heat exchange component, comprising:

[0006] A first flow channel layer, comprising a plurality of liquid inlet flow channels independent of each other, the first flow channel layer having a liquid outlet area, each of the liquid inlet flow channels comprising a liquid outlet hole located in the liquid outlet area;

[0007] A second flow channel layer is located on one side of the first flow channel layer, the second flow channel layer has a liquid inlet area, and the liquid inlet area corresponds to the liquid outlet area; the second flow channel layer includes a plurality of flow diversion groups independent of each other, each of the flow diversion groups includes a plurality of heat exchange flow channels arranged adjacent to each other in sequence around the liquid inlet area, each of the heat exchange flow channels includes a liquid inlet hole located in the liquid inlet area, and the liquid outlet hole of each of the liquid inlet flow channels is connected to the plurality of liquid inlet holes of the corresponding flow diversion group, so as to realize that each of the liquid inlet flow channels supplies flow to the plurality of heat exchange flow channels in the corresponding flow diversion group;

[0008] The liquid outlet flow channel is connected to each of the flow distribution groups.

[0009] In some embodiments, the liquid outlet flow channel includes a plurality of liquid outlet flow channels, and each flow distribution group is connected to a different liquid outlet flow channel;

[0010] The connected liquid inlet flow channel, the flow distribution group and the liquid outlet flow channel form a medium flow path, and each medium flow path is used to connect with different medium sources.

[0011] In some embodiments, the heat exchange component further includes guide ribs, which are disposed in the heat exchange channel and divide the heat exchange channel into a plurality of flow segments, each of which is connected in sequence to form a zigzag extending channel.

[0012] In some embodiments, all the guide ribs in each of the heat exchange channels are sequentially arranged at intervals along a corresponding preset direction, and extend longitudinally along a direction intersecting the preset direction;

[0013] One longitudinal end of each two adjacent guide ribs is respectively connected to two inner walls of the heat exchange channel that are arranged opposite to each other, and the other longitudinal end of each guide rib is spaced from the inner wall of the heat exchange channel.

[0014] In some embodiments, the length of each of the flow segments is arranged to increase gradually from the inlet end of the heat exchange channel toward the outlet end of the heat exchange channel.

[0015] In some embodiments, the heat exchange component further includes a liquid separator column, which is disposed in the flow segment to separate the flow segment into a plurality of microchannels that are interconnected.

[0016] In some embodiments, each of the liquid inlet channels includes a plurality of liquid outlet holes, and the plurality of liquid outlet holes of the same liquid inlet channel are connected one-to-one with the plurality of liquid inlet holes of the corresponding flow diversion group.

[0017] In some embodiments, the liquid outlet channel includes a first liquid outlet channel located in the first channel layer, the first channel layer includes a first confluence channel connected to the first liquid outlet channel, and a confluence hole is provided in the first confluence channel;

[0018] The flow diversion group includes a first flow diversion group, and outlet ends of all the heat exchange channels of the first flow diversion group are connected to the first confluence channel via the confluence hole.

[0019] In some embodiments, the liquid outlet channel includes a second liquid outlet channel located in the second channel layer, and the second channel layer includes a second converging channel connected to the second liquid outlet channel; the second converging channel is arranged around the outlet ends of all the heat exchange channels;

[0020] The flow splitting group includes a second flow splitting group, and outlet ends of all the heat exchange flow channels of the second flow splitting group have confluence ports that are connected to the second confluence channel.

[0021] In some embodiments, in each of the flow splitting groups, each two adjacent heat exchange channels are separated by the heat exchange channels of the remaining flow splitting groups;

[0022] The heat exchange component includes a plurality of flow dividing walls arranged on the second flow channel layer, and the plurality of flow dividing walls are arranged to surround and form each of the heat exchange flow channels; and each two adjacent heat exchange flow channels share the flow dividing wall.

[0023] In some embodiments, the heat exchange assembly includes a cover plate, an intermediate plate and a bottom plate; the first flow channel layer is arranged on one side of the intermediate plate and is covered by the cover plate, and a liquid inlet interface and a liquid outlet interface are arranged on the cover plate, the liquid inlet interface is communicated with the liquid inlet end of the liquid inlet flow channel, and the liquid outlet interface is communicated with the liquid outlet end of the liquid outlet flow channel;

[0024] The second flow channel layer is disposed on one side of the bottom plate and covered by the middle plate.

[0025] A pressing head structure is used for pressing a temperature-controlled electronic component, comprising any of the heat exchange components described above.

[0026] A testing device comprises a testing module and the pressing head structure as described above, wherein the pressing head structure is used to press an electronic component onto the testing module for testing.

[0027] The above-mentioned heat exchange assembly, pressure head assembly and testing device, since the heat exchange assembly includes multiple liquid inlet channels, in actual application, heat exchange medium can be selectively introduced into all or part of the liquid inlet channels to change the heat exchange capacity of the heat exchange assembly, so that the heat exchange capacity of the heat exchange assembly can be adaptively matched to the power size of the electronic component, thereby achieving better heat exchange effect while saving energy.

[0028] Moreover, the heat exchange medium is dispersed around the liquid inlet area with the liquid inlet area as the center due to the diversion of the heat exchange channels of the second channel layer. The heat exchange capacity of the heat exchange medium in the heat exchange channel of the second channel layer close to the liquid inlet area is higher. In contrast, the farther the heat exchange channel is from the liquid inlet area, the lower the heat exchange capacity of the heat exchange medium flowing therein. When used to cool the chip, the temperature field distribution of the second channel layer is adapted to the temperature field distribution of the chip with high temperature in the middle and low temperature around it, which can evenly cool the chip and realize effective temperature control of the chip, which is beneficial to the performance test of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0030] Figure 1 A schematic diagram of the appearance of a heat exchange assembly provided in some embodiments of the present application.

[0031] Figure 2 for Figure 1 An exploded schematic diagram of the heat exchange assembly is shown.

[0032] Figure 3 for Figure 2 A schematic structural diagram of the first flow channel layer in the heat exchange component shown.

[0033] Figure 4 for Figure 2 A schematic structural diagram of the second flow channel layer in the heat exchange component shown.

[0034] Figure 5 for Figure 4 A partial enlarged view of the second flow channel layer in FIG.

[0035] The reference numerals in the specific implementation manner are as follows:

[0036] 10. Heat exchange component; 11. Cover plate; 11a. Liquid inlet interface; 11b. Liquid outlet interface; 12. Middle plate; 12a. Transition hole; 13. Bottom plate; 13a. Guide rib; 13b. Liquid separator column; 13c. Diverter wall; 10A. First flow channel layer; A1. Liquid inlet flow channel; A2. Liquid outlet area; A3. Liquid outlet hole; A4. First confluence channel; A5. Confluence hole; 10B. Second flow channel layer; B1. Liquid inlet area; B2. Diverter group; B21. First diverter group; B22. Second diverter group; B2b. Heat exchange flow channel; b1. Liquid inlet hole; b2. Flow section; b4. Confluence; q. Notch; B3. Second confluence channel; C. Liquid outlet flow channel; C1. First liquid outlet flow channel; C2. Second liquid outlet flow channel. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0038] In the description of the present application, it should be understood that terms such as “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships, if any, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In addition, if present, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0040] In this application, unless otherwise clearly specified and limited, if any, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0041] In the present application, if it appears, unless otherwise clearly specified and limited, a first feature “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature “above”, “above” and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature “below”, “below” and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0042] It should be noted that, if present, when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0043] This application proposes a new heat exchange component to solve the problem that the flow channel structure distribution of the relevant heat exchange component does not match the chip temperature distribution, resulting in the inability to effectively control the chip temperature. The heat exchange component of the embodiment of this application is introduced in detail below.

[0044] According to some embodiments of this application, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The heat exchange assembly 10 provided in the embodiment of the present application includes a first channel layer 10A, a second channel layer 10B and a liquid outlet channel C. The first channel layer 10A includes a plurality of liquid inlet channels A1 that are independent of each other. The first channel layer 10A has a liquid outlet area A2. Each liquid inlet channel A1 includes a liquid outlet hole A3 located in the liquid outlet area A2. The second channel layer 10B is located on one side of the first channel layer 10A. The second channel layer 10B has a liquid inlet area B1, which corresponds to the liquid outlet area A2. The second flow channel layer 10B includes a plurality of flow shunt groups B2 that are independent of each other, each flow shunt group B2 includes a plurality of heat exchange flow channels B2b that are sequentially arranged adjacent to each other around the liquid inlet area B1, each heat exchange flow channel B2b includes a liquid inlet hole b1 located in the liquid inlet area B1, and a liquid outlet hole A3 of each liquid inlet flow channel A1 is connected to a plurality of liquid inlet ends of the corresponding flow shunt group B2, so that each liquid inlet flow channel A1 supplies liquid to a plurality of heat exchange flow channels B2b in the corresponding flow shunt group B2. Each flow shunt group B2 is connected to a liquid outlet flow channel C.

[0045] The inlet flow channel A1 is connected to the medium source, and is used for the heat exchange medium provided by the medium source to enter the heat exchange component 10. The outlet flow channel C is connected to the outside, and is used to discharge the heat exchange medium in the heat exchange component 10. The inlet flow channel A1 and the outlet flow channel C can be straight channels, curved channels, etc. The heat exchange medium is a flowable substance in liquid, gas, or a mixture of gas and liquid used for heating or cooling.

[0046] Typically but not limited to, the liquid outlet area A2 is located in the middle of the first flow channel layer 10A. The liquid outlet holes A3 of all the liquid inlet flow channels A1 are located in the liquid outlet area A2. Each liquid inlet flow channel A1 may include one or more liquid outlet holes A3, one end of each liquid outlet hole A3 is connected to the liquid inlet flow channel A1, and the other end is used to supply fluid to the heat exchange flow channel B2b in the second flow channel layer 10B.

[0047] Usually, the second flow channel layer 10B is located on one side in the thickness direction of the first flow channel layer 10A, and the second flow channel layer 10B mainly plays a role in medium diversion. Specifically, the second flow channel layer 10B has a liquid inlet area B1, and the liquid inlet area B1 is usually arranged in the middle of the second flow channel layer 10B. The liquid outlet area A2 is arranged corresponding to the liquid inlet area B1, which usually means that in the arrangement direction of the first flow channel layer 10A and the second flow channel layer 10B, the orthographic projection of the liquid outlet area A2 intersects with the orthographic projection of the liquid inlet area B1. Among them, the liquid outlet hole A3 can be directly connected to the liquid inlet hole b1, or it can be connected through other intermediate channels. Usually, the arrangement of the liquid outlet area A2 and the liquid inlet area B1 can make all the liquid inlet channels A1 concentrated in one area for liquid discharge, and all the heat exchange channels B2b concentrated in one area for liquid inlet.

[0048] The second flow channel layer 10B includes multiple groups of diversion groups B2, each of which includes multiple heat exchange channels B2b, and the multiple heat exchange channels B2b of each diversion group B2 are arranged around the liquid inlet area B1. Usually, all the heat exchange channels B2b are arranged around the liquid inlet area B1, and each heat exchange channel B2b is connected to the liquid outlet A3 of the first flow channel layer 10A through its liquid inlet hole b1 located in the liquid inlet area B1, so as to realize the diversion of the heat exchange medium flowing into the heat exchange component 10, so that the heat exchange medium is evenly distributed. In one example, the multiple heat exchange channels B2b of each group of diversion groups B2 are concentrated in one area, and the distribution areas of the heat exchange channels B2b of different diversion groups B2 are different, and all the distribution areas are arranged around the liquid inlet area B1. In another example, the heat exchange channels B2b of other diversion groups B2 are arranged between the heat exchange channels B2b in each group of diversion groups B2. The arrangement of the heat exchange channels B2b in each flow distribution group B2 can be flexibly set according to the requirements. Generally, the minimum flow rate of each heat exchange channel B2b is the same, so that the heat exchange medium flow distribution is more uniform.

[0049] The liquid outlet channel C can be distributed to the second channel layer 10B, can also be distributed to the first channel layer 10A, can also be distributed to the third channel layer outside the first channel layer 10A and the second channel layer 10B, and the specific arrangement of the liquid outlet channel C can be flexibly set according to needs. The liquid outlet channel C can be connected to the circulation loop of the medium source with the liquid inlet, and can also be connected to a collection container different from the medium source.

[0050] The multiple heat exchange channels B2b of each flow branch group B2 can be connected to the liquid outlet channel C independently, or can be connected to the liquid outlet flow after converging. All heat exchange channels B2b of all flow branch groups B2 can be connected to the same liquid outlet channel C. Each flow branch group B2 can be connected to a different liquid outlet channel C. The number of liquid outlet channels C can be one or more.

[0051] In actual application, the heat exchange medium enters the heat exchange component 10 through the liquid inlet channel A1 of the first channel layer 10A, and then is diverted by the heat exchange channels B2b of the second channel layer 10B, so that the heat exchange medium is dispersed around the liquid inlet area B1 with the liquid inlet area B1 as the center. The heat exchange capacity of the heat exchange medium in the heat exchange channel B2b of the second channel layer 10B close to the liquid inlet area B1 is relatively high. In contrast, the farther the heat exchange channel B2b is from the liquid inlet area B1, the gradually lower the heat exchange capacity of the heat exchange medium flowing therein. When the heat exchange component 10 is used to cool electronic components such as chips, the area close to the liquid inlet area B1 in the second flow channel layer 10B can perform high-intensity heat exchange on the middle area of ​​the chip, thereby effectively reducing the temperature in the middle of the chip, and the area away from the liquid inlet area B1 in the second flow channel layer 10B can perform low-intensity heat exchange on the peripheral area of ​​the chip. In this way, the temperature field distribution of the second flow channel layer 10B is adapted to the temperature field distribution in which the temperature in the middle of the chip is high and the peripheral temperature is low, which can evenly cool the chip, realize effective temperature control of the chip, and is beneficial to the performance testing of the chip.

[0052] Moreover, in actual application, heat exchange medium can be selectively introduced into all or part of the liquid inlet channel A1 to change the heat exchange capacity of the heat exchange component 10, so that the heat exchange capacity of the heat exchange component 10 can be adaptively matched with the power size of the electronic component, thereby achieving better heat exchange effect while saving energy.

[0053] In some embodiments, please refer to Figures 3 to 5 The liquid outlet flow channel C includes multiple, and each flow branch group B2 is connected to a different liquid outlet flow channel C. The connected liquid inlet flow channel A1, flow branch group B2 and liquid outlet flow channel C constitute a medium flow path, and each medium flow path is used to connect different medium sources.

[0054] Typically, but not limited to, a medium flow path includes an inlet flow channel A1, a group of branch groups B2, and an outlet flow channel C. The inlet flow channel A1 and the outlet flow channel C in the same medium flow path are used to connect to the circulation loop of the same medium source. The inlet flow channels A1 in different medium flow paths are used to connect to different medium sources.

[0055] In actual applications, for electronic components with different temperature control requirements (such as chips with different heating powers), different medium sources can be used to provide heat exchange media with different temperatures to the heat exchange component 10 to achieve different degrees of temperature control.

[0056] In some cases, heat exchange medium can be provided to each medium flow path through multiple medium sources. In this case, heat exchange medium flows through each flow branch group B2. The heat exchange area of ​​the heat exchange component 10 is large and the heat exchange capacity is strong, which can be applied to scenes with large temperature control requirements. In other cases, only part of the medium flow path can be connected to the medium source. In this case, heat exchange medium flows through only part of the flow branch group B2. The heat exchange area of ​​the heat exchange component 10 is small and the heat exchange capacity is weak, which can be applied to scenes with small temperature control requirements.

[0057] In this way, the heat exchange assembly 10 has more diverse usages and better adaptability.

[0058] In some embodiments, reference Figure 4 and Figure 5 The heat exchange component 10 also includes a guide rib 13a, which is disposed in the heat exchange channel B2b and divides the heat exchange channel B2b into a plurality of flow segments b2, and each flow segment b2 is sequentially connected to form a tortuously extending channel.

[0059] The guide rib 13a is usually arranged in a strip shape, and two flow segments b2 separated by the guide rib 13a are arranged adjacent to each other in the thickness direction of the guide rib 13a. Each flow segment b2 is connected in sequence to form a zigzag flow channel, which can extend the flow time of the heat exchange medium in the heat exchange flow channel B2b and improve the utilization rate of the heat exchange medium.

[0060] Specifically in the embodiment, refer to Figure 4 and Figure 5 All the guide ribs 13a in each heat exchange channel B2b are arranged in sequence along the corresponding preset direction and extend longitudinally in a direction intersecting the preset direction. One longitudinal end of each two adjacent guide ribs 13a is respectively connected to two opposite inner walls of the heat exchange channel B2b, and the other longitudinal end of each guide rib 13a is spaced from the inner wall of the heat exchange channel B2b.

[0061] The preset direction may refer to the direction from the inlet end of the heat exchange channel B2b to its outlet end. The liquid inlet hole b1 of the heat exchange channel B2b is located at its inlet end, and the preset directions corresponding to the guide ribs 13a located in different heat exchange channels B2b are different. In a specific example, the inlet end of the heat exchange channel B2b is located at the liquid inlet area B1, and all the heat exchange channels B2b extend radially relative to the liquid inlet area B1.

[0062] Generally, the longitudinal direction of the guide rib 13a is substantially perpendicular to the preset direction. The longitudinal directions of the guide ribs 13a are substantially parallel. Adjacent guide ribs 13a are spaced to form flow segments b2. Each flow segment b2 extends substantially along the longitudinal direction of the guide rib 13a.

[0063] One end of each guide rib 13a in the longitudinal direction is a first end, and the other end is a second end. The first end of each guide rib 13a is connected to the inside of the heat exchange flow channel B2b, and the second end of each guide rib 13a is spaced from the heat exchange flow channel B2b to form a conducting port connected to the adjacent flow segment b2. The two first ends of two adjacent guide ribs 13a are respectively connected to two inner walls of the heat exchange flow channel B2b that are opposite to each other to form a zigzag extending flow channel.

[0064] At this time, each guide rib 13a blocks the straight path of the heat exchange medium flowing directly from the inlet end of the heat exchange channel B2b to the outlet end of the heat exchange channel B2b, which can effectively slow down the flow speed of the heat exchange medium, extend the flow time of the heat exchange medium in the heat exchange channel B2b, and improve the utilization rate of the heat exchange medium.

[0065] Specifically in the embodiment, refer to Figure 4 and Figure 5 The length of each flow segment b2 is set to increase from the inlet end of the heat exchange flow channel B2b to the outlet end of the heat exchange flow channel B2b.

[0066] The length of the flow segment b2 refers to its dimension in the longitudinal direction of the corresponding guide rib 13a. Since the length of the flow segment b2 increases from the inlet end of the heat exchange flow channel B2b to the outlet end of the heat exchange flow channel B2b, the flow area of ​​the heat exchange flow channel B2b can be set to increase from its inlet end to its outlet end. The heat exchange flow channel B2b can be roughly fan-shaped, triangular, etc.

[0067] At this time, the heat exchange medium is dispersed in a larger range from the liquid inlet hole b1 to the periphery of the liquid inlet area B1, and the heat exchange area of ​​the heat exchange channel B2b is larger, which helps to improve the heat exchange efficiency of the heat exchange component 10.

[0068] In some embodiments, reference Figure 4 and Figure 5 The heat exchange component 10 further includes a liquid separator column 13b, which is disposed in the flow segment b2 to separate the flow segment b2 into a plurality of microchannels that are interconnected.

[0069] Specifically, a plurality of liquid separation columns 13b are provided in each flow section b2, and each liquid separation column 13b is spaced apart from each other. Usually, but not limited to, each liquid separation column 13b is cylindrical, conical, or the like.

[0070] At this time, a separator column 13b is set in the flow section b2. The microchannels formed between the separator columns 13b can further make the heat exchange medium evenly distributed. In addition, the outer surface of the separator column 13b increases the contact area between the heat exchange component 10 and the heat exchange medium, which helps to improve the utilization rate of the heat exchange medium and further improve the heat exchange capacity of the heat exchange component 10.

[0071] In some embodiments, in combination Figures 3 to 5 Each liquid inlet channel A1 includes a plurality of liquid outlet holes A3, and the plurality of liquid outlet holes A3 of the same liquid inlet channel A1 are connected one by one with the plurality of liquid inlet holes b1 of the corresponding flow distribution group B2.

[0072] It can be understood that each flow branch group B2 includes a plurality of heat exchange channels B2b, and each heat exchange channel B2b includes at least one liquid inlet hole b1, so each flow branch group B2 includes a plurality of liquid inlet holes b1. Each liquid inlet hole b1 is connected to a liquid outlet hole A3 of a corresponding liquid inlet channel A1 in a one-to-one correspondence. Usually, each heat exchange channel B2b has a liquid inlet hole b1, and the number of liquid outlet holes A3 is consistent with the number of liquid inlet holes b1 in each group of flow branch groups B2.

[0073] In this way, each liquid inlet flow channel A1 can be diverted to multiple liquid inlet holes b1 through multiple liquid outlet holes A3 at the same time, and the diversion of the heat exchange medium is more uniform.

[0074] In some embodiments, reference Figure 3 The liquid outlet channel C includes a first liquid outlet channel C1 located in the first channel layer 10A, the first channel layer 10A includes a first confluence channel A4 connected to the first liquid outlet channel C1, and a confluence hole A5 is provided in the first confluence channel A4. The flow group B2 includes a first flow group B21, and the outlet ends of all the heat exchange channels B2b of the first flow group B21 are connected to the first confluence channel A4 via the confluence hole A5.

[0075] It is understandable that at least one confluence hole A5 is provided at the outlet end of each heat exchange channel B2b in the first flow group B21 to converge the heat exchange medium in each independent heat exchange channel B2b in the first flow group B21 into the first confluence channel A4. The first liquid outlet channel C1 is used to communicate with an external medium source or a container for collecting heat exchange medium.

[0076] At this time, the outlet ends of the heat exchange channels B2b in the first flow group B21 on the second flow channel layer 10B are connected to the first flow channel A4 through the confluence hole A5 on the first flow channel layer 10A, and then connected to the first liquid outlet channel C1 through the first flow channel A4. In this way, the liquid outlet solution of the first flow group B21 can be arranged by using the structure of the first flow channel layer 10A, and the structure of the heat exchange component 10 can be more compact.

[0077] The number of the first flow distribution groups B21 can be one or more. If the number of the first flow distribution groups B21 is more than one, the multiple first flow distribution groups B21 can be connected to the same first flow confluence channel A4 through the corresponding confluence holes A5.

[0078] In some embodiments, reference Figure 4 and Figure 5 The liquid outlet channel C includes a second liquid outlet channel C2 located in the second channel layer 10B, the second channel layer 10B includes a second confluence channel B3 connected to the second liquid outlet channel C2, and the second confluence channel B3 is arranged around the outlet ends of all heat exchange channels B2b. The flow group B2 includes a second flow group B22, and the outlet ends of all heat exchange channels B2b of the second flow group B22 have a confluence port b4 connected to the second confluence channel B3.

[0079] At least one confluence port b4 is provided at the outlet end of each heat exchange flow channel B2b in the second flow branch group B22, and is connected to the peripheral second confluence flow channel B3 through the confluence port b4. Usually, the confluence port b4 is arranged at the tail end of the flow segment b2 farthest from the liquid inlet area B1, so that the flow path formed by multiple flow segments b2 is the longest.

[0080] The heat exchange medium in each heat exchange channel B2b of the second branch group B22 converges into the second converging channel B3 through its confluence port b4, then flows to the second liquid outlet channel C2, and finally flows to an external medium source or a container for collecting the heat exchange medium.

[0081] In actual application, the second flow channel layer 10B is utilized for heat exchange contact with electronic components such as chips. At this time, a liquid outlet scheme of the second diversion group B22 is arranged on the second flow channel layer 10B, which increases the flow path and flow time of the heat exchange medium on the second flow channel layer 10B and improves the heat exchange capacity of the heat exchange component 10.

[0082] The number of the second flow distribution groups B22 can be one or more. If the number of the second flow distribution groups B22 is more than one, the multiple second flow distribution groups B22 can be connected to the same second confluence channel B3 through the confluence port b4.

[0083] In practical applications, the first liquid outlet channel C1 and the second liquid outlet channel C2 may be connected to the same medium source or the same collection container, or may be connected to different medium sources or different collection containers.

[0084] In some embodiments, reference Figure 5 In each flow branch group B2, every two adjacent heat exchange channels B2b are separated by the heat exchange channels B2b of the remaining flow branch groups B2. For example, the heat exchange assembly 10 includes a first flow branch group B21 and a second flow branch group B22, and every two adjacent heat exchange channels B2b of the first flow branch group B21 are separated by a heat exchange channel B2b of the second flow branch group B22, and every two adjacent heat exchange channels B2b of the second flow branch group B22 are separated by an adjacent heat exchange channel B2b of the first flow branch group B21.

[0085] Since every two adjacent heat exchange channels B2b are separated by the heat exchange channels B2b of the remaining flow branch groups B2, the heat exchange channels B2b in each flow branch group B2 can be evenly distributed around the liquid inlet area B1.

[0086] Thus, when one of the flow-dividing groups B2 is activated to circulate the heat exchange medium, the heat exchange uniformity of the heat exchange component 10 is better because the heat exchange channels B2b in each of the flow-dividing groups B2 are spaced apart and evenly arranged around the liquid inlet area B1.

[0087] In some embodiments, reference Figure 4 and Figure 5 The heat exchange component 10 includes a plurality of flow dividing walls 13c disposed in the second channel layer 10B. The plurality of flow dividing walls 13c surround and form each heat exchange channel B2b, and each two adjacent heat exchange channels B2b share a flow dividing wall 13c.

[0088] The common diverter wall 13c of the heat exchange flow channel B2b usually extends outward from the liquid inlet area B1. The wall surface of the diverter wall 13c forms the inner wall of the heat exchange flow channel B2b. It can be understood that the heat exchange flow channel B2b can be formed by surrounding a plurality of diverter walls 13c, and adjacent heat exchange flow channels B2b can only share part of the diverter wall 13c.

[0089] At this time, the common flow dividing wall 13c between the adjacent heat exchange channels B2b can improve the area utilization rate of the second channel layer 10B and increase the heat exchange area.

[0090] In some embodiments, reference Figures 1 to 3The heat exchange assembly 10 includes a cover plate 11, an intermediate plate 12 and a bottom plate 13. The first flow channel layer 10A is arranged on one side of the middle plate 12 and covered by the cover plate 11. The cover plate 11 is provided with a liquid inlet interface 11a and a liquid outlet interface 11b. The liquid inlet interface 11a is connected to the liquid inlet end of the liquid inlet flow channel A1, and the liquid outlet interface 11b is connected to the liquid outlet end of the liquid outlet flow channel C. The second flow channel layer 10B is arranged on one side of the bottom plate 13 and covered by the intermediate plate 12.

[0091] Specifically, the cover plate 11, the middle plate 12 and the bottom plate 13 are stacked to form the heat exchange assembly 10. In the stacking direction, the middle plate 12 is located between the cover plate 11 and the bottom plate 13. The first flow channel layer 10A is arranged on the middle plate 12, and a concave structure can be formed on the middle plate 12 to form each flow channel and the liquid outlet A3 in the first flow channel layer 10A. The cover plate 11 is covered on the middle plate 12 to close the first flow channel layer 10A. The second flow channel layer 10B is arranged on the bottom plate 13, and a concave structure can be formed on the bottom plate 13 to form each flow channel and the liquid inlet b1 in the second flow channel layer 10B, and the middle plate 12 is covered on the bottom plate 13 to close the second flow channel layer 10B.

[0092] In this way, the processing of the first flow channel layer 10A and the second flow channel layer 10B is more convenient, and the heat exchange component 10 is easy to process and manufacture.

[0093] The liquid inlet interface 11a is used to communicate with the medium source, so as to allow the heat exchange medium to enter the heat exchange component 10. The liquid outlet interface 11b can be used to communicate with the medium source, so as to allow the heat exchange medium in the heat exchange component 10 to flow back to the medium source.

[0094] It is understandable that the specific formation method of the first flow channel layer 10A and the second flow channel layer 10B is not limited to the above scheme, and those skilled in the art can make conventional settings.

[0095] In one embodiment of the present application, Figures 2 to 5 The heat exchange assembly 10 includes a cover plate 11, an intermediate plate 12 and a bottom plate 13. The side of the intermediate plate 12 facing the cover plate 11 is recessed to form a first flow channel layer 10A. The first flow channel layer 10A includes two liquid inlet channels A1, a first confluence channel A4 and a first liquid outlet channel C1. The two liquid inlet channels A1 are both provided with liquid outlet holes A3 in the liquid outlet area A2 of the first flow channel layer 10A. The side of the bottom plate 13 facing the intermediate plate 12 is recessed to form a second flow channel layer 10B. The second flow channel layer 10B includes a first flow distribution group B21, a second flow confluence channel B3 of a second liquid distribution group and a second liquid outlet channel C2.

[0096] The second flow channel layer 10B has a liquid inlet area B1 arranged corresponding to the liquid outlet area A2. The heat exchange flow channels B2b of the first flow group B21 and the heat exchange flow channels B2b of the second flow group are arranged around the liquid inlet area B1 of the second flow channel layer 10B. Each heat exchange flow channel B2b has a liquid inlet hole b1 located in the liquid inlet area B1. Each liquid inlet hole b1 of the first flow group B21 is connected to the liquid outlet hole A3 of one of the liquid inlet flow channels A1 in a one-to-one correspondence, and each liquid inlet hole b1 of the second flow group B22 is connected to the liquid outlet hole A3 of another liquid inlet flow channel A1 in a one-to-one correspondence. The first flow channel layer 10A also includes a confluence hole A5 arranged on the middle plate 12, and each heat exchange flow channel B2b of the first flow group B21 is connected to the first confluence area through the confluence hole A5. The second flow channel layer 10B includes a notch q provided on the bottom plate 13, and the notch q serves as a confluence port b4 to connect the outlet end of the heat exchange flow channel B2b and the second confluence channel B3. A transition hole is provided on the middle plate 12, and the first liquid outlet flow channel C1 is connected to the liquid outlet interface 11b on the cover plate 11, and the second liquid outlet flow channel C2 is connected to another liquid outlet interface 11b on the cover plate 11 through the transition hole. The first confluence channel A4 is arranged around the liquid outlet area A2, and the first liquid outlet flow channel C1 and the two liquid inlet flow channels A1 are arranged on different sides of the first flow channel layer 10A.

[0097] In actual application, different heat exchange media are introduced into the two liquid inlet channels A1, and the heat exchange medium of one of the liquid inlet channels A1 is diverted through the heat exchange channel B2b of the first diversion group B21, and then flows through the first converging channel A4 and the first liquid outlet channel C1, and finally discharged from the heat exchange component 10, wherein the heat exchange medium of the other liquid inlet channel A1 is diverted through the heat exchange channel B2b of the second diversion group B22, and then flows through the second converging channel B3 and the second liquid outlet channel C2, and finally discharged from the heat exchange component 10. When the required heat exchange amount is low, only one of the liquid inlet channels A1 and the diversion group B2 can be enabled, and when the required heat exchange amount is high, both liquid inlet channels A1 and the diversion group B2 can be enabled, so that the heat exchange component of the present application can select the heat exchange capacity according to different heat exchange requirements.

[0098] In addition, the embodiment of the present application further provides a pressure head structure, which is used for crimping temperature-controlled electronic components, and includes the heat exchange component 10 in any of the above embodiments. In some application scenarios, the pressure head structure may only include the heat exchange component 10, in which case the second flow channel layer 10B of the heat exchange component 10 can be directly used to contact the electronic component to control its temperature. Of course, in some examples, the pressure head structure may also include a heating element, which is arranged on the side of the second flow channel layer 10B away from the first flow channel layer 10A, and a cooling medium can flow through the heat exchange component 10. The coldness of the cooling medium counteracts the heat generated by the heating element, and the temperature of the electronic component is controlled together. At this time, the heating element can be crimped onto the electronic component, and the heat of the second flow channel layer 10B is transferred to the electronic component through the heating element.

[0099] In addition, the embodiment of the present application also provides a test device, including a test module and the above-mentioned pressure head structure, the pressure head structure is used to press the electronic component onto the test module for testing. Among them, the test module is used to perform performance testing on the electronic component, and the specific type is not limited. In summary, based on the heat exchange component of the present application, the test device of the present application can also meet the testing requirements of different power chips.

[0100] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A heat exchange component (10), characterized in that: include: A first flow channel layer (10A) comprising a plurality of liquid inlet flow channels (A1) independent of each other, the first flow channel layer (10A) having a liquid outlet area (A2), each of the liquid inlet flow channels (A1) comprising a liquid outlet hole (A3) located in the liquid outlet area (A2); a second flow channel layer (10B), located on one side of the first flow channel layer (10A), the second flow channel layer (10B) having a liquid inlet area (B1), the liquid inlet area (B1) corresponding to the liquid outlet area (A2); the second flow channel layer (10B) comprising a plurality of flow diversion groups (B2) independent of each other, each of the flow diversion groups (B2) comprising a plurality of heat exchange flow channels (B2b) arranged adjacent to each other in sequence around the liquid inlet area (B1), each of the heat exchange flow channels (B2b) comprising a liquid inlet hole (b1) located in the liquid inlet area (B1), the liquid outlet hole (A3) of each of the liquid inlet flow channels (A1) being connected to the plurality of liquid inlet holes (b1) of the corresponding flow diversion group (B2), so as to realize that each of the liquid inlet flow channels (A1) supplies flow to the plurality of heat exchange flow channels (B2b) in the corresponding flow diversion group (B2); and A liquid outlet channel (C), each of the flow distribution groups (B2) is connected to the liquid outlet channel (C).

2. The heat exchange assembly (10) according to claim 1, characterized in that: The liquid outlet flow channel (C) includes a plurality of liquid outlet flow channels, and each of the flow distribution groups (B2) is connected to a different liquid outlet flow channel (C); The connected liquid inlet channel (A1), the flow distribution group (B2) and the liquid outlet channel (C) form a medium flow path, and each of the medium flow paths is used to connect to different medium sources.

3. The heat exchange assembly (10) according to claim 1, characterized in that: The heat exchange component (10) further comprises a guide rib (13a), wherein the guide rib (13a) is arranged in the heat exchange flow channel (B2b) and divides the heat exchange flow channel (B2b) into a plurality of flow segments (b2), and each of the flow segments (b2) is connected in sequence to form a zigzag extending flow channel.

4. The heat exchange assembly (10) according to claim 3, characterized in that: All of the guide ribs (13a) in each of the heat exchange flow channels (B2b) are sequentially arranged at intervals along a corresponding preset direction, and extend longitudinally along a direction intersecting the preset direction; One longitudinal end of each two adjacent guide ribs (13a) is respectively connected to two inner walls of the heat exchange channel (B2b) that are arranged opposite to each other, and the other longitudinal end of each guide rib (13a) is spaced from the inner wall of the heat exchange channel (B2b).

5. The heat exchange assembly (10) according to claim 3, characterized in that: The length of each flow segment (b2) is arranged to increase gradually from the inlet end of the heat exchange channel (B2b) toward the outlet end of the heat exchange channel (B2b).

6. The heat exchange assembly (10) according to claim 3, characterized in that: The heat exchange component (10) further comprises a liquid separation column (13b), wherein the liquid separation column (13b) is arranged in the flow section (b2) to separate the flow section (b2) into a plurality of microchannels that are interconnected.

7. The heat exchange assembly (10) according to claim 1, characterized in that: Each of the liquid inlet channels (A1) comprises a plurality of liquid outlet holes (A3), and the plurality of liquid outlet holes (A3) of the same liquid inlet channel (A1) are connected one-to-one with the plurality of liquid inlet holes (b1) of the corresponding flow diversion group (B2).

8. The heat exchange assembly (10) according to claim 1, characterized in that: The liquid outlet channel (C) comprises a first liquid outlet channel (C1) located in the first channel layer (10A), the first channel layer (10A) comprises a first confluence channel (A4) connected to the first liquid outlet channel (C1), and a confluence hole (A5) is arranged in the first confluence channel (A4); The flow diversion group (B2) includes a first flow diversion group (B21), and the outlet ends of all the heat exchange channels (B2b) of the first flow diversion group (B21) are connected to the first confluence channel (A4) via the confluence hole (A5).

9. The heat exchange assembly (10) according to claim 1, characterized in that: The liquid outlet channel (C) comprises a second liquid outlet channel (C2) located in the second channel layer (10B), and the second channel layer (10B) comprises a second converging channel (B3) connected to the second liquid outlet channel (C2); the second converging channel (B3) is arranged around the outlet ends of all the heat exchange channels (B2b); The flow diversion group (B2) includes a second flow diversion group (B22), and the outlet ends of all the heat exchange channels (B2b) of the second flow diversion group (B22) have a confluence port (b4) connected to the second confluence channel (B3).

10. The heat exchange assembly (10) according to claim 1, characterized in that: In each of the flow-dividing groups (B2), each two adjacent heat-exchanging channels (B2b) are separated by the heat-exchanging channels (B2b) of the remaining flow-dividing groups (B2); The heat exchange component (10) comprises a plurality of flow dividing walls (13c) arranged on the second flow channel layer (10B), the plurality of flow dividing walls (13c) surrounding each of the heat exchange flow channels (B2b); and each two adjacent heat exchange flow channels (B2b) share the flow dividing wall (13c).

11. The heat exchange assembly (10) according to claim 1, characterized in that: The heat exchange component (10) comprises a cover plate (11), an intermediate plate (12) and a bottom plate (13); the first flow channel layer (10A) is arranged on one side of the intermediate plate (12) and is covered by the cover plate (11); a liquid inlet interface (11a) and a liquid outlet interface (11b) are arranged on the cover plate (11); the liquid inlet interface (11a) is connected to the liquid inlet end of the liquid inlet flow channel (A1), and the liquid outlet interface (11b) is connected to the liquid outlet end of the liquid outlet flow channel (C); The second flow channel layer (10B) is arranged on one side of the bottom plate (13) and is covered via the middle plate (12).

12. A pressure head structure for crimping temperature-controlled electronic components, characterized in that: It comprises a heat exchange component (10) as claimed in any one of claims 1 to 11.

13. A testing device, characterized in that: It comprises a test module and a pressing head structure as claimed in claim 12, wherein the pressing head structure is used to press the electronic component onto the test module for testing.

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