Wafer protective film tearing device

Abstract

The utility model belongs to the technical field of semiconductor production process, and particularly relates to a wafer protective film tearing device, which is used for being arranged above an external wafer film tearing workbench, and comprises a mounting frame, a wafer protective film tearing device and a wafer protective film tearing device, the adhesive tape mounting assembly is arranged on the mounting frame; the adhesive tape clamping assembly can be transversely and movably arranged on the mounting frame and is positioned beside the adhesive tape mounting assembly; the adhesive tape bonding assembly can be vertically and movably arranged on the mounting frame and is positioned beside the adhesive tape clamping assembly; and the adhesive tape cutting assembly is arranged on the mounting frame and located beside the adhesive tape bonding assembly. According to the utility model, the adhesive tape mounting assembly is used for placing the adhesive tape roll, the adhesive tape clamping assembly is used for clamping the adhesive tape, the adhesive tape bonding assembly is used for bonding the adhesive tape clamped by the adhesive tape clamping assembly on the surface of the wafer protective film, and the adhesive tape cutting assembly is used for cutting off the adhesive tape after the adhesive tape is bonded on the surface of the wafer protective film, so that the full-automatic film tearing of the wafer protective film is realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production process, and in particular relates to a wafer protection film tearing device. Background Art

[0002] In the wafer production process, a protective film needs to be attached to the front of the wafer to protect the front lithography circuit and prevent the wafer from cracking, breaking and being contaminated. After completing a series of processes, the protective film on the surface of the wafer needs to be torn off.

[0003] In the prior art, the protective film is torn off manually. The utility model patent of the authorization announcement CN208377259 discloses a film tearing mechanism of a wafer film tearing machine, including a film tearing machine body, a wafer fixing plate is arranged on the upper surface of the film tearing machine body, a wafer body is arranged on the upper surface of the wafer fixing plate, slide rails are arranged on both sides of the wafer body, the slide rails are arranged on the upper surface of the film tearing machine body, a connecting frame is arranged on the upper surface of the slide rails, a roller is arranged inside the connecting frame, a gear is arranged on the outer surface of the roller, a guide rack is arranged on the outer surface of the gear, and the bottom surface of the guide rack is arranged on the upper surface of the film tearing machine body, both ends of the roller pass through the side of the connecting frame to reach the outside of the connecting frame, a second bite metal sheet is arranged on the outer surface of the roller, a knob is arranged on the outside of the roller, a first bite metal sheet is arranged on the inner surface of the knob, and the top of the roller is sleeved and connected with the inner wall of the knob.

[0004] Although the wafer protective film can be quickly torn off by manual operation, manual operation will cause dust pollution and scratches on the wafer surface, affecting the wafer quality. Therefore, it is necessary to design a new solution to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a wafer protective film tearing device, aiming to solve the technical problem that the wafer protective film tearing device in the prior art is prone to dust pollution.

[0006] To achieve the above-mentioned purpose, the embodiment of the utility model provides a wafer protective film tearing device, which is used to be arranged above an external wafer film tearing workbench, and includes:

[0007] Mounting frame;

[0008] An adhesive tape installation assembly, the adhesive tape installation assembly is arranged on the installation frame and is used for placing an adhesive tape roll;

[0009] A tape clamping assembly, which can be laterally movably arranged on the mounting frame and is located beside the tape mounting assembly, and is used to clamp the tape on the tape mounting assembly;

[0010] A tape bonding assembly, which can be vertically movably disposed on the mounting frame and is located beside the tape clamping assembly, and is used to bond the tape clamped by the tape clamping assembly to the surface of the wafer protective film; and

[0011] The tape cutting assembly is arranged on the mounting frame and located beside the tape bonding assembly, and is used for cutting the tape after the tape is bonded to the surface of the wafer protection film.

[0012] As a preferred solution, the tape bonding assembly includes a bonding drive mechanism, a pressure head heating mechanism and a pressure head; the bonding drive mechanism is vertically arranged on the mounting frame; the pressure head heating mechanism is connected to the bonding drive mechanism so that the bonding drive mechanism drives the pressure head heating mechanism to move up and down; the pressure head is connected to the bottom of the pressure head heating mechanism, and is used to press the tape against the surface of the wafer protective film after being heated by the pressure head heating mechanism.

[0013] As a preferred embodiment, the tape cutting assembly includes a guide bar, a cutter and a cutter driving mechanism; the guide bar is fixed on the mounting frame, and a guide groove is longitudinally provided on the guide bar; the cutter is arranged on the side of the guide bar and extends into the guide groove; the cutter driving mechanism is connected to the cutter and drives the cutter to move longitudinally.

[0014] As a preferred embodiment, the tape clamping assembly includes a driving guide rail, a connecting plate, a clamping seat, a clamping drive mechanism and a clamping piece; the driving guide rail is horizontally arranged on the mounting frame; one end of the connecting plate is connected to the driving guide rail, and the driving guide rail drives the connecting plate to move horizontally; the clamping seat is arranged at the other end of the connecting plate, and a clamping space is provided in the clamping seat; the clamping drive mechanism is vertically arranged on the clamping seat; the clamping piece is located in the clamping space and connected to the output shaft of the clamping drive mechanism, and the clamping drive mechanism drives the clamping piece to move vertically in the clamping space, so that the clamping piece and the clamping seat cooperate to clamp the tape.

[0015] As a preferred solution, the mounting frame is provided with a slide rail, a slide seat, a mounting plate and a lifting drive mechanism; the bottom of the slide rail is fixed to the mounting frame; the slide seat is arranged on the slide rail; the mounting plate is fixedly connected to the slide seat, and the tape mounting assembly is arranged on the mounting plate; the lifting drive mechanism is fixed to the mounting frame, and the output shaft of the lifting drive mechanism is connected to the mounting plate for driving the mounting plate to move vertically.

[0016] As a preferred embodiment, the tape installation assembly includes an installation roller, a guide roller and a rotating roller; the installation roller is used to place the tape roll; the guide roller is arranged on the side of the installation roller and is used to guide the tape on the tape roll to turn; the rotating roller is arranged on the side of the guide roller, and a rotating drive mechanism is provided at the rear end of the rotating roller, and the rotating drive mechanism drives the rotating roller to rotate so as to make the tape on the guide roller move.

[0017] As a preferred embodiment, it also includes a tape support assembly, which is arranged on the mounting frame and located between the tape cutting assembly and the tape mounting assembly; the tape support assembly includes a support base, a support drive mechanism and a support tray; the support base is fixed on the mounting frame; the support drive mechanism is arranged on the support base; the support tray is connected to the drive end of the support drive mechanism, and is used to support the movement of the tape.

[0018] The above one or more technical solutions in the wafer protective film tearing device provided by the embodiment of the utility model have at least one of the following technical effects:

[0019] The utility model provides a tape installation component for placing a tape roll, a tape clamping component for clamping the tape, a tape bonding component for bonding the tape clamped by the tape clamping component to the surface of the wafer protective film, and a tape cutting component for cutting the tape after the tape is bonded to the surface of the wafer protective film, thereby achieving fully automatic film tearing of the wafer protective film without manual intervention, avoiding dust pollution, and improving the quality and yield rate of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 A schematic diagram of the overall structure of a wafer protective film tearing device provided by an embodiment of the utility model;

[0022] Figure 2 A schematic diagram of the overall structure of the wafer protective film tearing device provided by an embodiment of the utility model from another angle;

[0023] Figure 3 A schematic diagram of the partial structure of a wafer protective film tearing device provided by an embodiment of the utility model;

[0024] Figure 4A schematic diagram of the wafer protective film tearing device provided by an embodiment of the utility model in use;

[0025] Figure 5 A schematic diagram of the three-dimensional structure of the tape clamping assembly provided in an embodiment of the utility model;

[0026] Figure 6 A schematic diagram of the three-dimensional structure of the tape bonding assembly provided in an embodiment of the utility model;

[0027] Among them, the reference numerals in the figure are:

[0028] 100-mounting frame; 110-slide rail; 120-slide seat; 130-mounting plate; 140-lifting drive mechanism;

[0029] 200-tape installation assembly; 210-installation roller; 220-guide roller; 230-rotation roller; 240-rotation drive mechanism;

[0030] 300-tape clamping assembly; 310-driving guide rail; 320-connecting plate; 330-clamping seat; 331-clamping space; 340-clamping driving mechanism; 350-clamping member;

[0031] 400-tape bonding assembly; 410-bonding driving mechanism; 420-pressing head heating mechanism; 430-pressing head;

[0032] 500-tape cutting assembly; 510-guide bar; 511-guide groove; 520-cutter; 530-cutter driving mechanism;

[0033] 600-tape support assembly; 610-support base; 620-support drive mechanism; 630-support tray;

[0034] A-Tape Roll; a-Tape. DETAILED DESCRIPTION

[0035] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0036] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0038] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0039] In one embodiment of the present invention, Figure 1-Figure 3 As shown, a wafer protective film tearing device is provided, which is used to be arranged above an external wafer tearing workbench, including a mounting frame 100, a tape mounting assembly 200, a tape clamping assembly 300, a tape bonding assembly 400 and a tape cutting assembly 500.

[0040] The mounting frame 100 is provided with a slide rail 110, a slide seat 120, a mounting plate 130 and a lifting drive mechanism 140. The bottom of the slide rail 120 is fixed to the mounting frame 100. The slide seat 120 is arranged on the slide rail 120. The mounting plate 130 is fixedly connected to the slide seat 120. The lifting drive mechanism 140 is fixed to the mounting frame 100, and the output shaft of the lifting drive mechanism 140 is connected to the mounting plate 130, and is used to drive the mounting plate 130 to move vertically. Since the tape clamping assembly 300 clamps the tape a and moves from right to left when tearing the film, the lifting drive mechanism 140 is provided to lift the tape mounting assembly 200, leaving enough space for the tape clamping assembly 300 to move.

[0041] The adhesive tape installation assembly 200 is arranged on the installation plate 130 of the installation frame 100, and is used to place the adhesive tape roll A. The adhesive tape installation assembly 200 includes an installation roller 210, a guide roller 220 and a rotating roller 230. The installation roller 210 is used to place the adhesive tape roll A. The guide roller 220 is arranged beside the installation roller 210 and is used to guide the adhesive tape a on the adhesive tape roll A to turn. The rotating roller 230 is arranged beside the guide roller 220, and a rotating driving mechanism 240 is arranged at the rear end of the rotating roller 230, and the rotating driving mechanism 240 drives the rotating roller 230 to rotate so that the adhesive tape a on the guide roller 220 moves.

[0042] The tape clamping assembly 300 can be movably arranged on the mounting frame 100 and located beside the tape mounting assembly 200 in a transverse manner, and the tape clamping assembly 300 is used to clamp the tape a on the tape mounting assembly 200. The tape clamping assembly 300 includes a driving rail 310, a connecting plate 320, a clamping seat 330, a clamping drive mechanism 340 and a clamping member 350. The driving rail 310 is transversely arranged on the mounting frame 100. One end of the connecting plate 320 is connected to the driving rail 310, and the driving rail 310 drives the connecting plate 320 to move transversely. The clamping seat 330 is arranged at the other end of the connecting plate 320, and a clamping space 331 is provided in the clamping seat 330. The clamping drive mechanism 340 is vertically arranged on the clamping seat 330. The clamping member 350 is located in the clamping space 331 and connected to the output shaft of the clamping drive mechanism 340. The clamping drive mechanism 340 drives the clamping member 350 to move vertically in the clamping space 331 so that the clamping member 350 and the clamping seat 330 cooperate to clamp the tape a.

[0043] The tape bonding assembly 400 can be vertically movably arranged on the mounting frame 100 and located beside the tape clamping assembly 300, and is used to bond the tape clamped by the tape clamping assembly 300 to the surface of the wafer protective film. The tape bonding assembly 400 includes a bonding drive mechanism 410, a pressure head heating mechanism 420 and a pressure head 430. The bonding drive mechanism 410 is vertically arranged on the mounting frame 100. The pressure head heating mechanism 420 is connected to the bonding drive mechanism 410 so that the bonding drive mechanism 410 drives the pressure head heating mechanism 420 to move up and down. The pressure head 430 is connected to the bottom of the pressure head heating mechanism 420, and is used to press the tape a on the surface of the wafer protective film after being heated by the pressure head heating mechanism 420, so that the tape a and the wafer protective film are melt-bonded, which is convenient for tearing off from the surface of the wafer.

[0044] The tape cutting assembly 500 is arranged on the mounting frame 100 and is located beside the tape bonding assembly 400, and is used to cut the tape a after the tape a is bonded to the surface of the wafer protective film. The tape cutting assembly 500 includes a guide bar 510, a cutter 520 and a cutter driving mechanism 530. The guide bar 510 is fixed on the mounting frame 100, and a guide groove 511 is longitudinally opened on the guide bar 510. The cutter 520 is arranged beside the guide bar 510 and extends into the guide groove 511. The cutter driving mechanism 530 is connected to the cutter 520 and drives the cutter 520 to move longitudinally.

[0045] In one embodiment of the utility model, the wafer protective film tearing device further includes a tape support assembly 600, which is disposed on the mounting frame 100 and is located between the tape cutting assembly 500 and the tape mounting assembly 200. The tape support assembly 600 includes a support base 610, a support drive mechanism 620 and a support tray 630. The support base 610 is fixed on the mounting frame 100. The support drive mechanism 620 is disposed on the support base 610. The support tray 630 is connected to the driving end of the support drive mechanism 620, and is used to support the movement of the tape a.

[0046] The method of using the utility model is described in detail as follows:

[0047] like Figure 4 As shown, first, the tape roll A is placed on the installation roller 210, and the tape a on the tape roll A is manually inserted through each of the guide rollers 220 and the rotating roller 230, and extends to the support tray 630. Then, the support drive mechanism 620 drives the support tray 630 to move to the right, the drive rail 310 drives the clamping seat 330 to move to the left until it contacts the tape a, and the clamping drive mechanism 340 mobilizes the clamping member 350 to clamp the tape a in the clamping space 331. Next, the drive rail 310 drives the clamping seat 330 to move rightward to the right side of the tape bonding mechanism, and the bonding drive mechanism 410 drives the pressure head 430 to move downward, so that the pressure head 430 heated by the pressure head heating mechanism 420 contacts and bonds the tape a with the wafer protective film on the surface of the wafer. Then, the tool driving structure 530 drives the tool 520 to move in the guide groove 511, and cuts the tape a on the guide bar 510, and the cut tape a falls on the surface of the wafer protection film and adheres. Finally, the driving guide rail 310 drives the clamped tape a to move to the left, so that the wafer protection film adhered by the tape a is torn off from the surface of the wafer from right to left.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer protective film tearing device, used to be arranged above an external wafer film tearing workbench, characterized in that: include: Mounting frame; An adhesive tape installation assembly, the adhesive tape installation assembly is arranged on the installation frame and is used for placing an adhesive tape roll; A tape clamping assembly, which can be laterally movably arranged on the mounting frame and is located beside the tape mounting assembly, and is used to clamp the tape on the tape mounting assembly; A tape bonding assembly, which can be vertically movably disposed on the mounting frame and is located beside the tape clamping assembly, and is used to bond the tape clamped by the tape clamping assembly to the surface of the wafer protective film; and The tape cutting assembly is arranged on the mounting frame and located beside the tape bonding assembly, and is used for cutting the tape after the tape is bonded to the surface of the wafer protection film.

2. The wafer protective film tearing device according to claim 1, characterized in that: The tape bonding assembly includes a bonding drive mechanism, a pressure head heating mechanism and a pressure head; the bonding drive mechanism is vertically arranged on the mounting frame; the pressure head heating mechanism is connected to the bonding drive mechanism so that the bonding drive mechanism drives the pressure head heating mechanism to move up and down; the pressure head is connected to the bottom of the pressure head heating mechanism, and is used to press the tape on the surface of the wafer protective film after being heated by the pressure head heating mechanism.

3. The wafer protection film tearing device according to claim 2, characterized in that: The tape cutting assembly includes a guide bar, a cutter and a cutter driving mechanism; the guide bar is fixed on the mounting frame, and a guide groove is longitudinally opened on the guide bar; the cutter is arranged on the side of the guide bar and extends into the guide groove; the cutter driving mechanism is connected to the cutter and drives the cutter to move longitudinally.

4. The wafer protection film tearing device according to claim 3, characterized in that: The tape clamping assembly includes a driving guide rail, a connecting plate, a clamping seat, a clamping drive mechanism and a clamping piece; the driving guide rail is horizontally arranged on the mounting frame; one end of the connecting plate is connected to the driving guide rail, and the driving guide rail drives the connecting plate to move horizontally; the clamping seat is arranged at the other end of the connecting plate, and a clamping space is provided in the clamping seat; the clamping drive mechanism is vertically arranged on the clamping seat; the clamping piece is located in the clamping space and connected to the output shaft of the clamping drive mechanism, and the clamping drive mechanism drives the clamping piece to move vertically in the clamping space, so that the clamping piece and the clamping seat cooperate to clamp the tape.

5. The wafer protective film tearing device according to any one of claims 1 to 4, characterized in that: The mounting frame is provided with a slide rail, a slide seat, a mounting plate and a lifting drive mechanism; the bottom of the slide rail is fixed on the mounting frame; the slide seat is arranged on the slide rail; the mounting plate is fixedly connected to the slide seat, and the tape mounting assembly is arranged on the mounting plate; the lifting drive mechanism is fixed to the mounting frame, and the output shaft of the lifting drive mechanism is connected to the mounting plate for driving the mounting plate to move vertically.

6. The wafer protection film tearing device according to claim 5, characterized in that: The tape installation assembly includes an installation roller, a guide roller and a rotating roller; the installation roller is used to place the tape roll; the guide roller is arranged on the side of the installation roller and is used to guide the tape on the tape roll to turn; the rotating roller is arranged on the side of the guide roller, and a rotating drive mechanism is arranged at the rear end of the rotating roller, and the rotating drive mechanism drives the rotating roller to rotate so that the tape on the guide roller moves.

7. The wafer protection film tearing device according to claim 5, characterized in that: It also includes a tape support assembly, which is arranged on the mounting frame and located between the tape cutting assembly and the tape mounting assembly; the tape support assembly includes a support base, a support drive mechanism and a support tray; the support base is fixed on the mounting frame; the support drive mechanism is arranged on the support base; the support tray is connected to the drive end of the support drive mechanism, and is used to support the movement of the tape.

Images