Wafer centering assembly and centering equipment with same

Abstract

The utility model relates to a wafer centering assembly and centering equipment with the same, and the wafer centering assembly comprises a centering disc which comprises a hollow part located in the middle of the centering disc and a plurality of centering walls facing the hollow part, and the radiuses of different centering walls are different; the translation mechanism is used for driving the sub-centering disc to be centered or move towards the edge; the fixing mechanism is used for adsorbing and fixing the wafer; and the lifting mechanism drives the fixing mechanism to move up and down at the hollow part. According to the wafer centering assembly provided by the utility model, the centering walls with multiple sizes are arranged, so that wafers with different sizes can be centered, and the compatibility is high.

Description

Technical Field

[0001] The utility model relates to a fixture for wafer manufacturing, in particular to a wafer centering component and a centering device having the same. Background Art

[0002] In wafer processing, many types of equipment and processes require wafer centering. Currently, the centering equipment in use is often only applicable to wafers of a single size, with poor compatibility; and the applicable warpage range is small, which cannot adapt to the production of new semiconductor wafers.

[0003] In view of this, it is necessary to provide a new wafer alignment component to solve the above technical problems. Utility Model Content

[0004] The utility model aims to solve one of the above-mentioned technical problems and provides a wafer centering component and a centering device having the same so as to be compatible with wafers of multiple sizes.

[0005] In order to achieve the above-mentioned invention object, the utility model adopts the following technical solutions:

[0006] A wafer centering assembly, comprising:

[0007] A centering plate, comprising a hollow portion located in the middle thereof and a plurality of centering walls facing the hollow portion, wherein the radii of different centering walls are different;

[0008] A translation mechanism drives the sub-centering plate to move to the center or to the edge;

[0009] A fixing mechanism, used for adsorbing and fixing the wafer;

[0010] The lifting mechanism drives the fixing mechanism to move up and down at the hollow portion.

[0011] As a further improvement of the utility model, several pairs of center walls are circular and are arranged with a common center.

[0012] As a further improvement of the present invention, in the direction outward from the center of the centering disk, the radius of the centering wall on the outer side is greater than the radius of the centering wall on the inner side, and the centering wall on the outer side is higher than the centering wall on the inner side.

[0013] As a further improvement of the present invention, in the direction outward from the center of the centering disk, the distances between any adjacent centering walls in the inner and outer directions are consistent, or the distance between a certain centering wall and the centering wall adjacent to the outer side is greater than the distance between it and the centering wall adjacent to the inner side.

[0014] As a further improvement of the present invention, the centering plate comprises at least two independent sub-centering plates, the inner sides of the sub-centering plates are provided with notches, and all the notches together constitute the hollow portion; the sub-centering plates are provided with a plurality of centering sections facing the notches, different centering sections have different radii, and centering sections of the same radius on different sub-centering plates are spliced ​​to form the centering wall;

[0015] The wafer centering assembly further includes a translation mechanism for driving the sub-centering plate to move toward the center or toward the outer edge.

[0016] As a further improvement of the utility model, the fixing mechanism includes a fixing frame and a plurality of suction nozzle assemblies located on the fixing frame.

[0017] As a further improvement of the utility model, the fixing frame is ring-shaped and is provided with a taking-in and putting-out opening.

[0018] As a further improvement of the present invention, a wafer detection sensor is also provided on the fixing mechanism, and the wafer detection sensor is located on the fixing frame.

[0019] As a further improvement of the utility model, the lifting mechanism includes a vertical slide rail, a slider moving along the vertical slide rail, and a lifting motor driving the slider to move along the vertical slide rail, and the fixing mechanism is connected to the slider.

[0020] A centering device comprises the centering component.

[0021] Compared with the prior art, the wafer centering assembly and centering equipment of the present invention can center wafers of different sizes by providing centering walls of multiple sizes, and has high compatibility.

[0022] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a wafer centering assembly of the present invention;

[0024] Figure 2 for Figure 1 A schematic diagram of the structure of the centering plate;

[0025] Figure 3 for Figure 1 Exploded diagram of

[0026] Figure 4 for Figure 1 A schematic diagram of the structure of the centering plate of the wafer centering assembly;

[0027] Figure 5 for Figure 1A schematic diagram of the structure of the nozzle assembly of the wafer centering assembly;

[0028] Figure 6 A schematic diagram of a wafer being placed on a centering assembly by a wafer pick-up arm;

[0029] Figure 7 A schematic diagram of placing a wafer on a centering assembly;

[0030] Figure 8 for Figure 6 Bottom view of

[0031] Fig. 9 for Figure 8 Cross-sectional view along the AA direction.

[0032] Among them, 100-wafer centering assembly, 1-centering plate, 10-sub-centering plate, 11-hollow part, 12-centering wall, 2-fixing mechanism, 21-fixing frame, 22-nozzle assembly, 23-wafer detection sensor, 24-pick-up and unpacking port, M1-wafer, M2-wafer picking arm. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the embodiments and drawings. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0034] See also Figures 1 to 9 As shown, the wafer centering assembly 100 of the present invention is used to center the wafer M1, which includes a centering plate 1 for assisting in centering the wafer M1, a fixing mechanism 2 for adsorbing and fixing the wafer M1, and a lifting mechanism (not shown) for driving the fixing mechanism 2 to move up and down.

[0035] The centering plate 1 is provided with a hollow portion 11 in the middle thereof and a plurality of centering walls 12 facing the hollow portion 11 . The fixing mechanism 2 moves up and down in the hollow portion to drive the wafer M1 to cooperate with a centering wall 12 of the centering plate 1 to achieve centering.

[0036] In the utility model, different centering walls 12 have different radii, so that wafers M1 of different sizes can be centered, and the compatibility is high.

[0037] Preferably, several centering walls 12 are circular and consistent with the outer contour of the wafer M1. Therefore, the centering wall 12 is in linear contact with the outer edge of the wafer M1. Even if there are notches, cut edges and other structures on the wafer M1, it will not affect the centering of the wafer M1 by the centering wall 12, and the centering effect is stable and reliable.

[0038] In this embodiment, a plurality of centering walls 12 are co-centrically arranged, and the centers of wafers M1 of different sizes are consistent after centering, so there is no need to move the fixing mechanism 2 in the horizontal direction, which is also convenient for subsequent processes.

[0039] In addition, in the direction from the center of the centering plate 1 to the outside, the radius of the centering wall 12 on the outside is greater than the radius of the centering wall 12 on the inside, and the centering wall 12 on the outside is higher than the centering wall 12 on the inside, that is, in the height direction, the centering wall 12 on the outside is located upward, and the centering wall 12 on the inside is located downward. With this design, there is no interference between the centering walls 12 with different radius sizes.

[0040] It can also be understood that: a plurality of steps are provided on the centering plate 1, and the steps gradually rise from the center of the centering plate 1 to the outside, and the radius of the steps gradually increases, and the entire centering plate 1 is funnel-shaped; the inner side surface of the steps facing the center constitutes the centering wall 12.

[0041] In a specific embodiment, the lowest centering wall 12 is located on the inner side to center the 6-inch wafer M1; the middle centering wall 12 is used to center the 8-inch wafer M1; and the highest centering wall 12 is located on the outer side to center the 12-inch wafer M1. Of course, this is not limited to this, and centering walls 12 of more sizes can be designed as needed.

[0042] Preferably, in the direction from the center of the centering plate 1 to the outside, the distances between any adjacent centering walls 12 in the inner and outer directions are consistent, that is, the widths of the steps are consistent, which can provide good support for wafers M1 of various sizes and stably achieve the centering effect. Alternatively, in the direction from the center of the centering plate 1 to the outside, the distance between a certain centering wall 12 and the adjacent centering wall 12 on the outside is greater than the distance between it and the adjacent centering wall 12 on the inside, that is, the width of the outer step is greater than the width of the inner step, which provides greater support for large-sized wafers M1 and high stability.

[0043] In addition, the centering plate 1 includes at least two independent sub-centering plates 10, the inner side of the sub-centering plates 10 is provided with notches, and all the notches together constitute the hollow portion 11; the sub-centering plates 10 are provided with a plurality of centering sections facing the notches, and different centering sections have different radii, and the centering sections with the same radius on different sub-centering plates 10 are spliced ​​to form the centering wall 12.

[0044] Accordingly, the wafer centering assembly 100 further includes a translation mechanism to drive the sub-centering plate 10 to move toward the center or toward the outer edge. A plurality of sub-centering plates 10 are simultaneously centered and close together to clamp and center the wafer M1; after moving toward the outer edge, they leave the wafer M1 to facilitate the up and down movement of the wafer M1 and subsequent processes.

[0045] Each sub-centering plate 10 can be driven by an independent translation mechanism, which is a common technical means. For example, the translation mechanism includes a first screw extending along the radial direction of the centering plate 1, a first screw connection member threadedly connected to the screw, and a translation motor driving the first screw to rotate.

[0046] A translation mechanism realizes the synchronous inward and outward movement of several sub-centering plates 10 through a synchronous transmission mechanism, which is also a conventional design. Taking the centering plate 1 including two sub-centering plates 10 as an example, the translation mechanism includes a second screw extending along the arrangement direction of the two sub-centering plates 10, two second screw connectors threadedly connected to the second screw, and a translation motor driving the second screw to rotate. The two second screw connectors are respectively connected to the two sub-centering plates 10, and the thread directions of the two second screw connectors are opposite. When the second screw rotates forward, the two second screw connectors move toward each other, and the two sub-centering plates 10 are centered on the wafer M1; when the second screw rotates reversely, the two second screw connectors move in reverse, driving the two sub-centering plates 10 to separate.

[0047] The fixing mechanism 2 includes a fixing frame 21 and a plurality of suction nozzle assemblies 22 located on the fixing frame 21. The suction surfaces of the plurality of suction nozzle assemblies 22 are located on the same horizontal plane. The lifting mechanism drives the fixing frame 21 to move, and drives the plurality of suction nozzle assemblies 22 to rise or fall synchronously.

[0048] Preferably, a plurality of nozzle assemblies 22 are evenly arranged along the circumferential direction to adsorb and fix different positions of the wafer M1 so that the force is evenly applied thereto.

[0049] The fixing mechanism 2 is also provided with a wafer detection sensor 23 for detecting whether a wafer M1 is placed thereon, so as to control the suction nozzle assembly 22 to suck and place the wafer M1 and control the lifting mechanism to drive the fixing mechanism 2 to rise or fall.

[0050] In this embodiment, the wafer detection sensor 23 is located on the fixing frame 21 , and the wafer detection sensor 23 is not higher than the nozzle assembly 22 .

[0051] In a preferred embodiment, the fixing frame 21 is further provided with a pick-up and placement opening 24 , and after the wafer M1 is placed on the fixing mechanism 2 , the wafer picking arm M2 moves downward from the pick-up and placement opening 24 away from the wafer M1 to avoid affecting the wafer M1 .

[0052] In another embodiment, the fixing frame 21 is an annular frame with high structural strength. In this case, the height of the nozzle assembly 22 is not less than 1.5 cm, leaving enough descending space for the film-taking arm M2 to facilitate the extraction and insertion of the film-taking arm M2.

[0053] The lifting mechanism includes a vertical slide rail, a slider moving along the vertical slide rail, and a lifting motor driving the slider to move along the vertical slide rail, and the fixing mechanism 2 is connected to the slider. Preferably, the slider is fixed to the fixing frame 21; it should be noted that the slider and the fixing frame 21 can be two parts of an integrated structure or two separate structures.

[0054] The wafer centering assembly 100 further includes a wafer picking arm M2 , the length of which is not less than the diameter of the centering plate 1 , and wafers M1 of multiple sizes can be picked up and placed by one wafer picking arm M2 .

[0055] For ease of understanding, the present invention will provide multiple usages below to help understand the structure and function of the centering assembly of the present application.

[0056] Embodiment 1:

[0057] The fixing mechanism 2 is driven to move upward by the lifting mechanism, so that the nozzle assembly 22 is higher than at least one centering wall 12 of the centering platform; the wafer M1 is placed on the nozzle assembly 22 of the fixing mechanism 2 by the film-taking arm M2, at which time the nozzle assembly 22 does not work, and the wafer M1 can move on the nozzle assembly 22; the fixing mechanism 2 is driven to move downward by the lifting mechanism, until the wafer M1 falls to the centering wall 12 corresponding to the size of the wafer M1, and the centering is achieved; then the nozzle assembly 22 is started to adsorb and fix the wafer M1. Subsequently, the fixing mechanism 2 can be driven to move upward by the lifting mechanism, and the wafer M1 leaves the centering plate 1, so as to facilitate the next step of operation.

[0058] Embodiment 2:

[0059] The wafer M1 is placed on the nozzle assembly 22 of the fixing mechanism 2 by the film-taking arm M2. At this time, the nozzle assembly 22 is not started, and the wafer M1 can move on the nozzle assembly 22; the fixing mechanism 2 is driven up and down by the lifting mechanism until the wafer M1 is located at the centering wall 12 corresponding to the size of the wafer M1; the sub-centering plate 10 is driven to move toward the center by the translation mechanism to clamp and center the wafer M1 with high centering accuracy; then the nozzle assembly 22 is started to fix the wafer M1; the translation mechanism drives the sub-centering plate 10 to move outward and leave the wafer M1. Subsequently, the lifting mechanism can be used to drive the fixing mechanism 2 to move up or down to facilitate the next step.

[0060] The utility model also provides a centering device, which includes any one of the above-mentioned centering components and is compatible with wafers M1 of different sizes.

[0061] In summary, the wafer centering assembly 100 and the centering device of the present invention can align wafers M1 of different sizes by providing a plurality of centering walls 12 of different sizes, and have high compatibility.

[0062] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field may make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A wafer centering assembly, characterized in that: include: The centering plate comprises a hollow portion located in the middle thereof and a plurality of centering walls facing the hollow portion, wherein the radii of different centering walls are different; the centering plate comprises at least two independent sub-centering plates, wherein the inner sides of the sub-centering plates are provided with notches, and all the notches together constitute the hollow portion; the sub-centering plates are provided with a plurality of centering sections facing the notches, wherein the radii of different centering sections are different, and the centering sections with the same radius on different sub-centering plates are spliced ​​to form the centering wall; A translation mechanism drives the sub-centering disk to move toward the center or toward the outer edge; A fixing mechanism, used for adsorbing and fixing the wafer; The lifting mechanism drives the fixing mechanism to move up and down at the hollow portion.

2. The wafer centering assembly according to claim 1, wherein: The plurality of pairs of center walls are circular and are arranged with a common center.

3. The wafer centering assembly according to claim 1, wherein: In the direction outward from the center of the centering disk, the radius of the centering wall on the outer side is greater than the radius of the centering wall on the inner side, and the centering wall on the outer side is higher than the centering wall on the inner side.

4. The wafer centering assembly according to claim 1, wherein: In the direction outward from the center of the centering disk, the distances between any adjacent centering walls in the inner and outer directions are consistent, or the distance between a certain centering wall and the centering wall adjacent to the outer side is greater than the distance between it and the centering wall adjacent to the inner side.

5. The wafer centering assembly according to claim 1, wherein: The fixing mechanism comprises a fixing frame and a plurality of suction nozzle assemblies located on the fixing frame.

6. The wafer centering assembly according to claim 5, characterized in that: The fixing frame is ring-shaped and is provided with a taking-in and putting-out opening.

7. The wafer centering assembly according to claim 5, characterized in that: The fixing mechanism is also provided with a wafer detection sensor, and the wafer detection sensor is located on the fixing frame.

8. The wafer centering assembly according to claim 1, wherein: The lifting mechanism comprises a vertical slide rail, a slider moving along the vertical slide rail, and a lifting motor driving the slider to move along the vertical slide rail, and the fixing mechanism is connected to the slider.

9. A centering device, comprising the centering assembly according to any one of claims 1 to 8.

Images