End effector of robot

Abstract

The utility model provides an end effector of a robot, which relates to the technical field of semiconductor processing equipment, and comprises a connecting block, a mounting plate and a carrying assembly, the connecting block is connected with the robot, the carrying assembly is connected with the connecting block through the mounting plate, and the carrying assembly is used for carrying wafers; the carrying assembly comprises a first ceramic carrying part and a second ceramic carrying part which are oppositely arranged, one end of the first ceramic carrying part and one end of the second ceramic carrying part are connected with the mounting plate, and the thickness of the first ceramic carrying part and the thickness of the second ceramic carrying part range from 5.0 mm to 6.5 mm. According to the end effector of the robot, the thickness of the end effector is reduced, the condition that the window size of a process unit is continuously reduced is met, and the amplitude and repeated positioning precision of the end effector are not affected.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to an end effector of a robot. Background Art

[0002] With the continuous development of the semiconductor equipment industry, the automation level of wafer processing equipment is getting higher and higher, and the use of wafer handling robots to improve equipment production capacity has become popular. At present, the end effectors (i.e. fingers) of wafer handling robots mainly include ceramic fingers and aluminum alloy fingers. Among them, aluminum alloy fingers are mainly used for wafer transfer between various process units (such as glue coating unit, developing unit, etc.).

[0003] As the size of the process unit window continues to decrease, the thickness of the aluminum alloy finger is difficult to meet the requirements. Thinning the aluminum alloy finger will cause the finger amplitude to increase significantly. Therefore, there is an urgent need for an end effector that can meet the requirements of thinning thickness without affecting the finger amplitude and repeatability. Utility Model Content

[0004] The utility model aims to provide an end effector of a robot, which not only reduces the thickness of the end effector and satisfies the condition of continuously reducing the size of the process unit window, but also does not affect the amplitude and repeated positioning accuracy of the end effector.

[0005] To achieve the above-mentioned purpose, the utility model provides an end effector of a robot, including a connecting block, a mounting plate and a conveying assembly, wherein the connecting block is connected to the robot, the conveying assembly is connected to the connecting block through the mounting plate, and the conveying assembly is used to convey wafers; the conveying assembly includes a first ceramic conveying member and a second ceramic conveying member arranged opposite to each other, one end of the first ceramic conveying member and one end of the second ceramic conveying member are respectively connected to the mounting plate, and the thickness of the first ceramic conveying member and the second ceramic conveying member is 5.0mm-6.5mm.

[0006] Optionally, the first ceramic transport member has a first splicing portion and a first bearing portion, the first splicing portion is connected to the mounting plate, and the first bearing portion is arc-shaped; the second ceramic transport member has a second splicing portion and a second bearing portion, the second splicing portion is connected to the mounting plate, the first bearing portion is arc-shaped, and the first bearing portion and the second bearing portion are used to carry the wafer.

[0007] Optionally, a first step platform is provided on the inner edge of the first bearing portion, and a second step platform is provided on the inner edge of the second bearing portion, and the first step platform and the second step platform are used for bearing and limiting the wafer.

[0008] Optionally, limiting columns are provided at both ends of the first step platform and both ends of the second step platform, and a plurality of the limiting columns enclose a limiting space to limit the wafer.

[0009] Optionally, at least one vacuum suction cup is disposed on the inner edge of the first step platform and the inner edge of the second step platform, and the vacuum suction cup is used to absorb the wafer.

[0010] Optionally, a suction cup pad is provided on the vacuum suction cup, and a surface of the suction cup pad is higher than a surface of the first step platform and a surface of the second step platform.

[0011] Optionally, a vacuum air duct is provided on the mounting plate, and one end of the vacuum air duct is divided into a first air duct and a second air duct; a first hole is provided in the first ceramic transporting piece, and one end of the first hole is connected to the vacuum suction cup, and the other end of the first hole is connected to the first air duct; a second hole is provided in the second ceramic transporting piece, and one end of the second hole is connected to the vacuum suction cup, and the other end of the second hole is connected to the second air duct.

[0012] Optionally, an air groove is opened on the mounting plate, and an air groove baffle is arranged on the air groove to form the vacuum air duct.

[0013] Optionally, a mounting groove is opened on the mounting plate, the air groove is opened at the bottom of the mounting groove, and the air groove and the bottom of the mounting groove form a third step, and the air groove baffle is attached to the third step so that the surface of the air groove baffle is lower than the surface of the mounting plate, or is flush with the surface of the mounting plate.

[0014] Optionally, it further includes a first sealing ring and a second sealing ring, wherein the first sealing ring is arranged at the connection point between the first air channel and the first hole channel, and the second sealing ring is arranged at the connection point between the second air channel and the second hole channel.

[0015] The present application provides an end effector of a robot, which is divided into three parts: a connecting block, a mounting plate and a transport assembly. The connecting block is installed on the robot, and the transport assembly is connected to the connecting block through the mounting plate. The transport assembly is further divided into a first ceramic transport member and a second ceramic transport member that are relatively arranged to transport a supporting wafer. The thickness of the first ceramic transport member and the second ceramic transport member are both 5.0mm-6.5mm, which are thinner than traditional robot fingers. Not only does it reduce the thickness of the end effector, meeting the condition of continuously reducing the size of the process unit window, but it also does not affect the amplitude and repeatability of the end effector. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the structure of the end effector of the robot of this application;

[0018] Figure 2 This is a schematic diagram of the exploded structure of the end effector of the robot of this application;

[0019] Figure 3 A schematic diagram of the structure of the installation board for this application;

[0020] Figure 4 Schematic diagram of the exploded structure of the handling components for this application.

[0021] Icons: 100-connecting block; 200-mounting plate; 210-vacuum air duct; 211-first air duct; 212-second air duct; 220-air groove baffle; 230-third step platform; 300-conveying assembly; 310-first ceramic conveying piece; 311-first splicing part; 312-first bearing part; 312a-first step platform; 320-second ceramic conveying piece; 321-second splicing part; 322-second bearing part; 322a-second step platform; 330-limiting column; 340-vacuum suction cup; 350-suction cup pad; 360-first sealing ring; 370-second sealing ring.

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the utility model clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the utility model application are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0026] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0027] As the size of the process unit window continues to decrease, the thickness of the aluminum alloy finger is difficult to meet the requirements. The thinning of the aluminum alloy finger will cause the finger amplitude to increase significantly. Therefore, there is an urgent need for an end effector that can meet the requirements of thinning thickness without affecting the finger amplitude and repeatability. In response to the above problems, the embodiments of the present application provide the following technical solutions to overcome the above problems.

[0028] Please refer to Figure 1 and Figure 2 The embodiment of the present application provides an end effector of a robot, including a connecting block 100, a mounting plate 200 and a transport assembly 300, wherein the connecting block 100 is connected to the robot, and the transport assembly 300 is connected to the connecting block 100 through the mounting plate 200, and the transport assembly 300 is used to transport wafers; the transport assembly 300 includes a first ceramic transport member 310 and a second ceramic transport member 320 that are relatively arranged, and one end of the first ceramic transport member 310 and one end of the second ceramic transport member 320 are respectively connected to the mounting plate 200, and the thickness of the first ceramic transport member 310 and the second ceramic transport member 320 is 5.0mm-6.5mm.

[0029] Specifically, the connection block 100 is installed on the robot, and the transport assembly 300 is connected to the connection block 100 through the mounting plate 200. The transport assembly 300 is composed of a first ceramic transport member 310 and a second ceramic transport member 320 that are arranged opposite to each other. One end of the first ceramic transport member 310 and one end of the second ceramic transport member 320 are respectively connected to the mounting plate 200. The robot drives the first ceramic transport member 310 and the second ceramic transport member 320 to transport the wafers placed on the first ceramic transport member 310 and the second ceramic transport member 320. It should be noted that the thickness of the first ceramic transport member 310 and the second ceramic transport member 320 is 5.0mm-6.5mm to meet the actual situation of the continuous reduction of the process unit window size, and the first ceramic transport member 310 and the second ceramic transport member 320 are both made of ceramic material, which has high strength, high hardness, high temperature resistance, and corrosion resistance to acid and alkali at high temperature, stable performance, no pollution to contact products, and can be used in harsh environments.

[0030] The end effector of the robot provided in the present application is divided into three parts: a connecting block 100, a mounting plate 200 and a conveying assembly 300. The connecting block 100 is installed on the robot, and the conveying assembly 300 is connected to the connecting block 100 through the mounting plate 200. The conveying assembly 300 is further divided into a first ceramic conveying member 310 and a second ceramic conveying member 320 that are relatively arranged to carry the supporting wafer. The thickness of the first ceramic conveying member 310 and the second ceramic conveying member 320 are both 5.0mm-6.5mm, which are thinner than traditional robot fingers. Not only does it reduce the thickness of the end effector, meeting the condition of the continuous reduction in the size of the process unit window, but it also does not affect the amplitude and repeatability of the end effector.

[0031] Please refer to Figure 1 , Figure 2 and Figure 4 In an embodiment of the present application, the first ceramic transport member 310 has a first splicing portion 311 and a first bearing portion 312, the first splicing portion 311 is connected to the mounting plate 200, and the first bearing portion 312 is in an arc shape; the second ceramic transport member 320 has a second splicing portion 321 and a second bearing portion 322, the second splicing portion 321 is connected to the mounting plate 200, and the second bearing portion 322 is in an arc shape, and the first bearing portion 312 and the second bearing portion 322 are used to carry the wafer.

[0032] Specifically, the first splicing portion 311 is connected to one side of the mounting plate 200, and the second splicing portion 321 is connected to the other side of the mounting plate 200, so that the first bearing portion 312 and the second bearing portion 322 are arranged relative to each other, and the shapes of the first bearing portion 312 and the second bearing portion 322 are both arranged to be arc-shaped to adapt to the shape of the wafer, so as to facilitate the first bearing portion 312 and the second bearing portion 322 to limit and transport the wafer.

[0033] In the embodiment of the present application, a first step platform 312a is opened on the inner edge of the first supporting portion 312, and a second step platform 322a is opened on the inner edge of the second supporting portion 322. The first step platform 312a and the second step platform 322a are used to support and limit the wafer.

[0034] Specifically, a first step platform 312a is provided on the inner edge of the arc-shaped first bearing part 312, and the surface of the first step platform 312a is lower than the surface of the first bearing part 312. A second step platform 322a is provided on the inner edge of the arc-shaped second bearing part 322, and the surface of the second step platform 322a is the surface of the second bearing part 322. When the first bearing part 312 and the second bearing part 322 carry and transport the wafer, the wafer is located on the first step platform 312a and the second step platform 322a, and the surface of the wafer is not higher than the surface of the first bearing part 312 and the surface of the second bearing part 322, so as to prevent the wafer from colliding with the process window.

[0035] In the embodiment of the present application, limiting posts 330 are disposed at both ends of the first step platform 312 a and both ends of the second step platform 322 a , and a plurality of the limiting posts 330 enclose a limiting space to limit the wafer.

[0036] Specifically, limiting posts 330 are provided at both ends of the first step platform 312a and both ends of the second step platform 322a, so that a limiting space that can accommodate the wafer is formed between the multiple limiting posts 330, so that the wafer can be mechanically limited during the wafer transfer process, thereby preventing the wafer from slipping on the handling assembly 300, and improving the processing efficiency and yield rate of the wafer. It can be understood that the limiting posts 330 are elastic structures, and the materials of the limiting posts 330 can be PTFE, PEEK, etc. It should be noted that the Chinese name of PEEK is polyetheretherketone, which is a polymer material with the characteristics of high temperature resistance, chemical corrosion resistance, high strength, good fatigue resistance and aging resistance. The Chinese name of PTFE is polytetrafluoroethylene, which is a synthetic polymer material with the characteristics of chemical corrosion resistance, high temperature resistance, and low friction coefficient.

[0037] In an embodiment of the present application, at least one vacuum suction cup 340 is provided on the inner edge of the first step platform 312a and the inner edge of the second step platform 322a. The vacuum suction cup 340 is used to adsorb the wafer. A suction cup pad 350 is provided on the vacuum suction cup 340. The surface of the suction cup pad 350 is higher than the surface of the first step platform 312a and the surface of the second step platform 322a.

[0038] Specifically, at least one vacuum suction cup 340 is provided on the inner edge of the first step platform 312a and the inner edge of the second step platform 322a, and a suction cup pad 350 is provided on the vacuum suction cup 340. Furthermore, the surface of the suction cup pad 350 is higher than the surface of the first step platform 312a and the surface of the second step platform 322a, and lower than the surface of the first bearing part 312 and the surface of the second bearing part 322. When the vacuum suction cup 340 generates negative pressure, the wafer is adsorbed on the suction cup pad 350, so that the lower surface of the wafer will not contact the surface of the first step platform 312a and the second step platform 322a, ensuring that the surface of the wafer is not damaged during the process of sucking the wafer, and the suction cup pad 350 is made of elastic material, such as rubber, etc., which can further protect the surface of the wafer. It should be noted that when the wafer is adsorbed on the suction pad 350, the upper surface of the wafer is lower than the surface of the first supporting part 312 and the surface of the second supporting part 322, which further protects the surface of the wafer and prevents collision with the industrial window during the wafer transportation process.

[0039] Please refer to Figures 1 to 4 In an embodiment of the present application, a vacuum air duct 210 is provided on the mounting plate 200, and one end of the vacuum air duct 210 is divided into a first air duct 211 and a second air duct 212; a first hole is provided in the first ceramic transporting member 310, one end of the first hole is connected to the vacuum suction cup 340, and the other end of the first hole is connected to the first air duct 211; a second hole is provided in the second ceramic transporting member 320, one end of the second hole is connected to the vacuum suction cup 340, and the other end of the second hole is connected to the second air duct 212.

[0040] Specifically, one end of the vacuum air duct 210 on the mounting plate 200 is divided into two, forming a first air duct 211 and a second air duct 212. The first air duct 211 is connected to a connecting hole at a position where the first ceramic transporting member 310 is installed on the mounting plate 200, and the second air duct 212 is connected to a connecting hole at a position where the second ceramic transporting member 320 is installed on the mounting plate 200. A first channel is provided in the first ceramic transporting member 310, one end of the first channel is connected to a connecting hole located on the first joint portion 311, and the other end is connected to the vacuum suction cup 340. A second channel is provided in the second ceramic transporting member 320, and one end of the second channel is connected to the vacuum suction cup 340. The connecting hole on the second splicing part 321 is connected, and the other end is connected to the vacuum suction cup 340; when the first ceramic transporting piece 310 is connected to the mounting plate 200, the connecting hole on the mounting plate 200 is connected to the connecting hole on the first splicing part 311 correspondingly, so that the vacuum air channel 210 is connected to the first channel, and further connected to the vacuum suction cup 340; when the second ceramic transporting piece 320 is connected to the mounting plate 200, the connecting hole on the mounting plate 200 is connected to the connecting hole on the second splicing part 321 correspondingly, so that the vacuum air channel 210 is connected to the second channel, and further connected to the vacuum suction cup 340.

[0041] When sucking the wafer, the robot generates negative pressure in the vacuum air channel 210 . Since the vacuum air channel 210 is connected to the vacuum suction cup 340 , the vacuum suction cup 340 also generates negative pressure at this time, and the wafer is sucked onto the suction cup pad 350 on the vacuum suction cup 340 .

[0042] In the embodiment of the present application, an air groove is opened on the mounting plate 200 , and an air groove baffle 220 is arranged on the air groove to form the vacuum air passage 210 .

[0043] Specifically, an air groove is provided on the surface of the mounting plate 200, and an air groove baffle 220 having the same shape as the air groove is provided. The air groove baffle 220 is fixedly provided above the vacuum air passage 210 so that the air groove baffle 220 and the air groove are sealed to form the vacuum air passage 210. The above arrangement reduces the processing difficulty of the vacuum air passage 210 and saves the manufacturing cost of the mounting plate 200.

[0044] In an embodiment of the present application, a mounting groove is provided on the mounting plate 200, the air groove is provided at the bottom of the mounting groove, and the air groove and the bottom of the mounting groove form a third step 230, and the air groove baffle 220 is attached to the third step 230 so that the surface of the air groove baffle 220 is lower than the surface of the mounting plate 200, or is flush with the surface of the mounting plate 200.

[0045] Specifically, a mounting groove is opened on the mounting plate 200, and the bottom surface of the mounting groove is lower than the surface of the mounting plate 200. An air groove is further opened at the bottom of the mounting groove, and the air groove and the bottom of the mounting groove form a third step platform 230. The surface of the third step platform 230 is lower than the surface of the mounting plate 200. When the air groove baffle 220 is fixedly covered on the mounting groove, it is just set on the third step platform 230, so that the surface of the air groove baffle 220 is lower than the surface of the mounting plate 200, or is flush with the surface of the mounting plate 200, further preventing the surface of the air groove baffle 220 from being higher than the surface of the mounting plate 200, thereby avoiding the air groove baffle 220 from colliding with the process window and damaging the equipment or wafer during the process of transporting the wafer.

[0046] In an embodiment of the present application, the vacuum air passage 210 is configured as an air hole, so that the vacuum air passage 210 itself forms a sealed space.

[0047] Specifically, the vacuum air passage 210 can also be provided in the form of air holes, that is, air holes are drilled inside the mounting plate 200, or the vacuum air passage 210 is provided inside the mounting plate 200 by integral molding. The above-mentioned provision ensures the airtightness of the vacuum air passage 210, ensures the reliability of the end effector of the robot when sucking the wafer, and avoids the vacuum suction cup 340 from being unable to generate negative pressure and thus failing to suck the wafer due to airtightness problems.

[0048] In the embodiment of the present application, a first sealing ring 360 and a second sealing ring 370 are also included. The first sealing ring 360 is arranged at the connection between the first air channel 211 and the first hole, and the second sealing ring 370 is arranged at the connection between the second air channel 212 and the second hole.

[0049] Specifically, when the first ceramic transport member 310 is connected to the mounting plate 200, the first sealing ring 360 is set at the position corresponding to the connection hole on the mounting plate 200 and the connection hole on the first joint 311, so that the connection between the vacuum air channel 210 and the first channel is sealed; when the second ceramic transport member 320 is connected to the mounting plate 200, the second sealing ring 370 is set at the position corresponding to the connection hole on the mounting plate 200 and the connection hole on the second joint 321, so that the connection between the vacuum air channel 210 and the second channel is sealed. The above-mentioned setting form is adopted to increase the air tightness between the vacuum air channel 210 and the first channel, and increase the air tightness between the vacuum air channel 210 and the second channel, further ensure the reliability of the wafer suction process, and improve the processing efficiency and yield rate of the wafer.

[0050] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. An end effector of a robot, characterized in that: It includes a connection block, a mounting plate and a transport component, wherein the connection block is connected to the robot, the transport component is connected to the connection block through the mounting plate, and the transport component is used to transport wafers; The transport assembly includes a first ceramic transport member and a second ceramic transport member that are arranged opposite to each other. One end of the first ceramic transport member and one end of the second ceramic transport member are respectively connected to the mounting plate. The thickness of the first ceramic transport member and the second ceramic transport member is 5.0 mm-6.5 mm.

2. The end effector of the robot according to claim 1, characterized in that: The first ceramic transporting member comprises a first splicing portion and a first bearing portion, the first splicing portion is connected to the mounting plate, and the first bearing portion is in an arc shape; The second ceramic transporting member has a second splicing portion and a second bearing portion, the second splicing portion is connected to the mounting plate, and the second bearing portion is in an arc shape; Wherein, the first carrying part and the second carrying part are used for carrying the wafer.

3. The end effector of the robot according to claim 2, characterized in that: A first step platform is provided on the inner edge of the first carrying portion, and a second step platform is provided on the inner edge of the second carrying portion. The first step platform and the second step platform are used to carry and limit the wafer.

4. The end effector of the robot according to claim 3, characterized in that: Limiting columns are arranged at both ends of the first step platform and both ends of the second step platform, and a plurality of the limiting columns enclose a limiting space to limit the wafer.

5. The end effector of the robot according to claim 3, characterized in that: At least one vacuum suction cup is disposed on the inner edge of the first step platform and the inner edge of the second step platform, and the vacuum suction cup is used to absorb the wafer.

6. The end effector of the robot according to claim 5, characterized in that: A suction cup pad is arranged on the vacuum suction cup, and a surface of the suction cup pad is higher than a surface of the first step platform and a surface of the second step platform.

7. The end effector of the robot according to claim 5, characterized in that: A vacuum air passage is provided on the mounting plate, and one end of the vacuum air passage is divided into a first air passage and a second air passage; A first channel is provided in the first ceramic transporting member, one end of the first channel is connected to the vacuum suction cup, and the other end of the first channel is connected to the first air channel; A second channel is provided in the second ceramic transporting member, one end of the second channel is communicated with the vacuum suction cup, and the other end of the second channel is communicated with the second air channel.

8. The end effector of the robot according to claim 7, characterized in that: An air groove is formed on the mounting plate, and an air groove baffle is provided on the air groove to form the vacuum air passage.

9. The end effector of the robot according to claim 8, characterized in that: A mounting groove is provided on the mounting plate, the air groove is provided at the bottom of the mounting groove, and the air groove and the bottom of the mounting groove form a third step, and the air groove baffle is attached to the third step so that the surface of the air groove baffle is lower than the surface of the mounting plate, or is flush with the surface of the mounting plate.

10. The end effector of the robot according to any one of claims 7 to 9, characterized in that: It also includes a first sealing ring and a second sealing ring, wherein the first sealing ring is arranged at the connection between the first air channel and the first hole channel, and the second sealing ring is arranged at the connection between the second air channel and the second hole channel.

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