Shell structure of charge pump
By designing a side combination heat dissipation structure on the charge pump housing, the upper combination heat dissipation structure and the thermal conduction layer cooperate with each other, and combining the bottom heat dissipation fin plate and through holes, the problem of insufficient heat dissipation area of the existing charge pump housing is solved, and a more efficient heat dissipation effect is achieved, and the service life of the charge pump is extended.
Patent Information
- Application Number
- CN202421282894.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-06-06
AI Technical Summary
The heat dissipation area of the existing charge pump housing is not large enough, resulting in low heat dissipation efficiency, affecting the normal operation and service life of the charge pump.
A charge pump housing structure is designed, using a side combination heat dissipation structure, an upper combination heat dissipation structure, a side thermal column, an upper thermal column, a lower shell thermal layer and an upper shell thermal layer are cooperated with each other to increase the heat dissipation area and efficiency, and to improve the heat dissipation effect on the bottom surface through the bottom heat dissipation fin plate and through holes.
It realizes rapid transfer of heat inside and outside the charge pump, effectively exports heat, avoids excessive temperature, extends the service life of the charge pump, and improves heat dissipation efficiency.