Four-in-one RGB silver colloid short circuit prevention support structure

By adopting a multi-copolar structure and plastic dam design in the four-in-one RGB bracket, the short circuit problem caused by silver glue migration is solved, ensuring the normal use of the device and the compactness of the structure.

CN222639018UActive Publication Date: 2025-03-18YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD
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Patent Information

Application Number
CN202420551142.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-21
Publication Date
2025-03-18
Estimated Expiration
2034-03-21

AI Technical Summary

Technical Problem

The existing four-in-one RGB bracket is prone to short-circuit due to silver glue migration in high refresh electric field environment, resulting in the lack of brightness of the entire device, and the use of four lamp beads will be affected when the single common pole damage fails.

Method used

A four-in-one RGB anti-silver glue short-circuit bracket structure is designed, a positive electrode conductive plate with a multi-common electrode structure is used, and a plastic dam is set up around the LED chip to prevent the diffusion and migration of the conductive glue.

Benefits of technology

Through the design of multi-common pole structure and plastic dam, the diffusion and migration of conductive adhesives can be effectively blocked, short circuits can be avoided, the normal use of four lamp beads, and the structural compactness of the product is improved.

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Abstract

The utility model discloses a four-in-one RGB anti-elargol short circuit support structure which comprises a substrate, four lamp beads are distributed on the substrate at intervals in a matrix mode, a positive electrode conductive plate is arranged on the substrate, and positive electrodes of the four lamp beads are all the positive electrode conductive plate; an LED wafer and a negative conducting strip are arranged in each lamp bead, the positive electrode of the LED wafer is electrically connected with the positive conducting plate, and the negative electrode of the LED wafer is electrically connected with the corresponding negative conducting strip; and a box dam for preventing the conductive adhesive from extending is arranged in each lamp bead. An existing common-pole structure is changed, the migration path of the elargol is prolonged to the maximum extent, and the problem of short circuit caused by diffusion of the conductive adhesive is solved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of LED packaging brackets and relates to a four-in-one RGB anti-silver glue short-circuit bracket structure. Background Art

[0002] The bracket products are flat or stretched metal substrates with injection-molded PPA insulating plastic material structures. The circuit structures are insulated by filling with PPA plastic material. However, since the conductive particles in the conductive glue are relatively active, even after curing, silver element migration will occur during actual use in the high-refresh electric field environment driven by the light board, causing the metal circuit structure to conduct and cause a short circuit.

[0003] Especially in the four-in-one bracket products, because the four-in-one are all made of single particles, if a single silver glue in the four-in-one is short-circuited or the common pole in the pin is damaged and fails, it will directly cause the entire four-in-one device to lack light. Compared with the conventional single-particle design, the ratio of the failure area to the number of lamps is greatly increased.

[0004] Therefore, it is necessary to improve the prior art to overcome the defects in the prior art. Utility Model Content

[0005] The purpose of the utility model is to provide a four-in-one RGB anti-silver glue short-circuit bracket structure, change the existing common-pole structure, and maximize the extension of the silver glue migration path to solve the short-circuit problem caused by the diffusion of conductive glue.

[0006] The purpose of the utility model is achieved through the following technical solutions:

[0007] A four-in-one RGB anti-silver glue short-circuit bracket structure comprises a substrate, on which four lamp beads are distributed in a matrix at intervals, a positive conductive plate is arranged on the substrate, and the positive poles of the four lamp beads are all the positive conductive plate; each of the lamp beads is provided with an LED chip and a negative conductive sheet, the positive pole of the LED chip is electrically connected to the positive conductive plate, and the negative pole of the LED chip is electrically connected to the corresponding negative conductive sheet; each of the lamp beads is provided with a dam to prevent the conductive glue from extending.

[0008] Furthermore, there are at least two common poles on the positive conductive plate.

[0009] Furthermore, the common pole on the positive conductive plate is a pin, and the number of the pins is two, which are symmetrically distributed on both sides of the positive conductive plate.

[0010] Furthermore, the LED chips include a blue chip, a red chip and a green chip.

[0011] Furthermore, the dams are distributed around the red light chip.

[0012] Specifically, the height of the dam is 0.01 mm to 0.03 mm; the width of the dam is 0.06 mm to 0.08 mm.

[0013] Furthermore, the dam is a dam made of plastic material.

[0014] The above technical solution has the following beneficial effects: the design of isolating the silver glue plane extension path through the plastic dam can effectively prevent the conductive glue from spreading and migrating, so that the horizontal extension capacity and migration capacity of the conductive glue are within 0.2mm, so as to prevent the conductive glue from diffusing to other polarity areas; the power supply is uniformly provided by the positive conductive plate common pole, making the product structure compact; by increasing the number of common poles, the simultaneous failure of four lamp beads caused by damage to a single common pole can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0016] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0017] Figure 1 This is a structural schematic diagram provided by the utility model.

[0018] In the figure: 1-positive conductive plate; 2-dam; 3-red light chip; 4-blue light chip; 5-green light chip. DETAILED DESCRIPTION

[0019] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Example

[0021] See also Figure 1As shown, a four-in-one RGB anti-silver glue short-circuit bracket structure includes a substrate, on which four lamp beads S1, S2, S3, and S4 are distributed in a matrix at intervals, and a positive conductive plate 1 is provided on the substrate, and the positive conductive plate 1 is centrally arranged on the substrate. The positive conductive plate 1 is a common pole plate, and the positive poles of the four lamp beads S1, S2, S3, and S4 are all positive conductive plates 1. In order to avoid the simultaneous failure of four lamp beads due to damage to a single common pole, the positive conductive plate 1 in this embodiment adopts a multi-common pole structure, that is, there are at least two common poles on it, so that the use of the four lamp beads is not affected when one of them is damaged.

[0022] In this embodiment, the structures of the four lamp beads S1, S2, S3, and S4 are the same. For the convenience of description, the lamp bead S1 is taken as an example for explanation.

[0023] The lamp bead S1 is provided with LED chips and negative conductive sheets, wherein the LED chips include a blue chip 4, a red chip 3 and a green chip 5. The positive electrodes of the blue chip 4, the red chip 3 and the green chip 5 are all electrically connected to the positive conductive plate 1 through leads, and the negative conductive sheet connected to the negative electrode of the red chip 3 forms a pin R-; the negative conductive sheet connected to the negative electrode of the blue chip 4 forms a pin G-; and the negative conductive sheet connected to the negative electrode of the green chip 5 forms a pin B-. The common pole on the positive conductive plate 1 is a pin, and the number of the above pins is two, symmetrically distributed on both sides of the positive conductive plate 1.

[0024] In this embodiment, each lamp bead S1, S2, S3, S4 is provided with a dam 2 to prevent the conductive adhesive from spreading. Since the dam 2 of the four lamp beads S1, S2, S3, S4 has the same structure and position, for the convenience of description, the lamp bead S1 is taken as an example for explanation.

[0025] The dams of this embodiment are distributed around the red light chip 3. The dams are made of plastic material, with a height of 0.01mm to 0.03mm and a width of 0.06 to 0.08mm on the substrate. By making plastic dams around the fixed position of the red light chip 4 to prevent the conductive glue from diffusing to other polarity areas, the silver glue plane extension path can be effectively isolated.

[0026] The above is a detailed description of the embodiments of the present invention in conjunction with the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. A four-in-one RGB anti-silver glue short-circuit bracket structure, characterized in that: It comprises a substrate, on which four lamp beads are distributed in a matrix at intervals, a positive conductive plate is arranged on the substrate, and the positive poles of the four lamp beads are all the positive conductive plate; each of the lamp beads is provided with an LED chip and a negative conductive sheet, the positive pole of the LED chip is electrically connected to the positive conductive plate, and the negative pole of the LED chip is electrically connected to the corresponding negative conductive sheet; each of the lamp beads is provided with a dam to prevent the conductive adhesive from extending.

2. The four-in-one RGB anti-silver glue short-circuit bracket structure according to claim 1, characterized in that: There are at least two common poles on the positive conductive plate.

3. The four-in-one RGB anti-silver glue short-circuit bracket structure according to claim 2, characterized in that: The common pole on the positive conductive plate is a pin, and the number of the pins is two, which are symmetrically distributed on both sides of the positive conductive plate.

4. The four-in-one RGB anti-silver glue short-circuit bracket structure according to claim 2 or 3, characterized in that: The LED chips include a blue light chip, a red light chip and a green light chip.

5. The four-in-one RGB anti-silver glue short-circuit bracket structure according to claim 4, characterized in that: The dams are distributed around the red light chip.

6. The four-in-one RGB anti-silver glue short-circuit bracket structure according to claim 5, characterized in that: The height of the dam is 0.01 mm to 0.03 mm; the width of the dam is 0.06 mm to 0.08 mm.

7. The four-in-one RGB anti-silver glue short-circuit bracket structure according to claim 5 or 6, characterized in that: The dam is made of plastic material.