LED light source with high luminous efficiency and high power

Abstract

The utility model relates to the technical field of LED light sources, and discloses a high-luminous-efficiency and high-power LED light source which comprises a substrate, the top of the substrate is provided with a light-emitting area, the light-emitting area is provided with a plurality of LED chips, two copper sheets which are relatively isolated and independently arranged are arranged in the substrate, the tops of the copper sheets are provided with top end faces which are arranged upwards, and the top end faces of the copper sheets face upwards. The bottom of the copper sheet is provided with a bottom end face arranged downwards, a peripheral face is arranged between the top end face and the bottom end face, and the peripheral face is arranged inwards in a sunken mode in the direction from top to bottom, so that the area of the bottom end face is smaller than that of the top end face; according to the LED light source, more LED chips can be welded in the light-emitting area of the substrate by increasing the sizes of the substrate and the light-emitting area, so that high luminous efficiency and high power of the LED light source are achieved, the substrate is installed through two copper sheets for electric conduction, the area of the bottom end face is smaller than that of the top end face due to the fact that the peripheral face is concavely arranged inwards, and the light-emitting efficiency of the LED light source is improved. Therefore, the 5050 plush-LED light source can also be installed on the PCB of the 5050 plush-LED light source in an adaptive mode, and the problem that the adaptive function of the 5050 plush-LED light source is poor is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED light sources, and in particular to a high-light-efficiency and high-power LED light source. Background Art

[0002] The existing 5050LED light source cannot meet the lighting efficiency needs of end customers in the market, and the use of 7070LED light source is wasteful and the cost increases too much. In order to improve the lighting efficiency and luminous power, the 5050plus-LED light source, which is the 5050plus version, is designed.

[0003] However, such a design also makes the size of the 5050plus-LED light source larger, which in turn causes the size of the conductive copper sheet of the 5050plus-LED light source to increase, so that the 5050plus-LED light source cannot be adapted to be installed on the PCB board of the 5050LED light source. Utility Model Content

[0004] The utility model aims to provide a high-light-efficiency and high-power LED light source, aiming to solve the problem of poor adaptation function of the 5050plus-LED light source in the prior art.

[0005] The utility model is implemented as follows: a high-light-efficiency and high-power LED light source comprises a substrate, the top of the substrate has a light-emitting area, the light-emitting area is provided with a plurality of LED chips, two relatively isolated and independently arranged copper sheets are provided in the substrate, the top of the copper sheet has a top end surface arranged upward, the bottom of the copper sheet has a bottom end surface arranged downward, an outer peripheral surface is provided between the top end surface and the bottom end surface, and along the direction from top to bottom, the outer peripheral surface is arranged to be recessed inwardly so that the area of ​​the bottom end surface is smaller than the area of ​​the top end surface.

[0006] Furthermore, along the direction from top to bottom, the radial dimension of the outer peripheral surface gradually decreases, so that the area of ​​the bottom end surface is smaller than the area of ​​the top end surface.

[0007] Furthermore, the substrate has an upward end surface arranged upward and a downward end surface arranged downward, the light-emitting area is located on the upward end surface, and the outer peripheral surface is exposed below the downward end surface.

[0008] Furthermore, the top surface is exposed in the light-emitting area, and the LED chip is welded on the top surface.

[0009] Furthermore, a heat dissipation channel is formed between the two copper sheets at a relative interval, and the heat dissipation channel is connected to the outside.

[0010] Furthermore, the light-emitting area is provided with a plurality of light-emitting zones, each of the light-emitting zones is provided with a plurality of the LED chips, the plurality of LED chips form a plurality of series structures that are independently arranged from each other, the series structures include a plurality of LED chips connected in series with each other, the series structures contain at least one LED chip in each light-emitting zone, and the plurality of series structures are arranged in parallel with each other.

[0011] Furthermore, the plurality of LED chips connected in series are arranged to cross each other or to be adjacent to each other.

[0012] Furthermore, a plurality of LED chips in the series structure are arranged in an interlaced and mixed manner in the light-emitting area.

[0013] Furthermore, the top end surface is higher than the upward end surface, and a heat dissipation ring wall exposed on the upward end surface is formed on the outer periphery of the top end surface.

[0014] Furthermore, the heat dissipation ring wall has a plurality of reinforcement sections extending outward away from the copper sheet, the plurality of reinforcement sections are arranged around and spaced along the circumference of the heat dissipation ring wall, and the bottom of the reinforcement section is embedded in the upward end surface.

[0015] Compared with the prior art, the high-efficiency and high-power LED light source provided by the utility model increases the size of the substrate and the light-emitting area so that more LED chips can be soldered in the light-emitting area of ​​the substrate, thereby achieving high-efficiency and high-power LED light sources. The substrate is installed with two copper sheets for conductivity, and the outer peripheral surface is recessed inward so that the area of ​​the bottom end surface is smaller than the area of ​​the top end surface, so that the 5050plus-LED light source can also be adapted to be installed on the PCB board of the 5050LED light source, thereby solving the problem of poor adaptation function of the 5050plus-LED light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of a top view cutaway structure of a high light efficiency and high power LED light source provided by the utility model;

[0017] Figure 2 This is a schematic diagram of the upward structure of the high-light-efficiency and high-power LED light source provided by the utility model;

[0018] Figure 3 This is a schematic diagram of the top view of the structure of the high-light-efficiency and high-power LED light source provided by the utility model;

[0019] Figure 4 It is a side structural schematic diagram of the substrate provided by the utility model.

[0020] In the figure: substrate 10, copper sheet 20, light emitting area 30, LED chip 40, series structure 50, upward end surface 11, downward end surface 12, top end surface 21, bottom end surface 22, outer peripheral surface 23, heat dissipation channel 24, heat dissipation ring wall 25, reinforcement section 26. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0023] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on the present utility model. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0024] Reference Figure 1-4 As shown, it is a preferred embodiment provided by the utility model.

[0025] A high-light-efficiency and high-power LED light source includes a substrate 10, the top of the substrate 10 has a light-emitting area 30, the light-emitting area 30 is provided with a plurality of LED chips 40, two relatively isolated and independently arranged copper sheets 20 are provided in the substrate 10, the top of the copper sheet 20 has a top end surface 21 arranged upward, the bottom of the copper sheet 20 has a bottom end surface 22 arranged downward, an outer peripheral surface 23 is provided between the top end surface 21 and the bottom end surface 22, and the outer peripheral surface 23 is arranged inwardly concave along the direction from top to bottom so that the area of ​​the bottom end surface 22 is smaller than the area of ​​the top end surface 21.

[0026] The high-efficiency and high-power LED light source provided above increases the size of the substrate 10 and the light-emitting area 30 so that more LED chips 40 can be welded in the light-emitting area 30 of the substrate 10, thereby achieving high-efficiency and high-power LED light sources. The substrate 10 is installed for conductivity through two copper sheets 20, and the outer peripheral surface 23 is recessed inwardly so that the area of ​​the bottom end surface 22 is smaller than the area of ​​the top end surface 21, so that the 5050plus-LED light source can also be adapted to be installed on the PCB board of the 5050LED light source, thereby solving the problem of poor adaptation function of the 5050plus-LED light source.

[0027] Along the direction from top to bottom, the radial dimension of the outer peripheral surface 23 gradually decreases, so that the area of ​​the bottom end surface 22 is smaller than the area of ​​the top end surface 21 .

[0028] The substrate 10 has an upward end surface 11 arranged upward and a downward end surface 12 arranged downward. The light emitting region 30 is located on the upward end surface 11 , and the outer peripheral surface 23 is exposed below the downward end surface 12 .

[0029] In this embodiment, the top surface 21 is exposed in the light emitting area 30, and the LED chip 40 is welded on the top surface 21. In this way, the LED chip 40 can dissipate heat better, increase the brightness of the flash lamp when it emits light, and have better heat dissipation performance and better light effect.

[0030] In this embodiment, a heat dissipation channel 24 is formed between the two copper sheets 20 at a relative interval, and the heat dissipation channel 24 is communicated with the outside, thereby increasing the heat dissipation effect of the overall structure.

[0031] In this embodiment, a plurality of light-emitting zones are provided on the light-emitting area 30, each light-emitting zone is provided with a plurality of LED chips 40, and the plurality of LED chips 40 form a plurality of series structures 50 which are independently arranged from each other, and the series structure 50 includes a plurality of LED chips 40 connected in series with each other, and the series structure 50 includes at least one LED chip 40 in each light-emitting zone, and the plurality of series structures 50 are arranged in parallel with each other.

[0032] A plurality of LED chips 40 are used to form a plurality of series structures 50 which are independently arranged from each other, and the series structure 50 includes at least one LED chip 40 in each light-emitting area, so that when a single series structure 50 fails, the use of the LED light source is not affected; even when a single series structure 50 fails, it can still emit light uniformly, achieving high-power and high-reliability effects, and also improving the utilization rate of the LED chips 40 in the series structure 50 of the LED light source.

[0033] In this embodiment, a plurality of LED chips 40 connected in series are arranged to cross each other or to be adjacent to each other at intervals.

[0034] The LED chips 40 of the plurality of series-connected structures 50 are arranged in a staggered and mixed manner in the light-emitting area.

[0035] In this way, even if a single series structure 50 fails, the LED chips 40 of the remaining series structures 50 can still emit light, and because the LED chips 40 of multiple series structures 50 are arranged in an interlaced and mixed manner, the LED light source can emit light evenly, achieving high power and high reliability effects.

[0036] In this embodiment, the top end surface 21 is higher than the upward end surface 11, and a heat dissipation ring wall 25 exposed on the upward end surface 11 is formed on the outer periphery of the top end surface 21. In this way, the copper sheet 20 can not only raise the LED chip 40 by using the heat dissipation ring wall 25, but also make the LED chip 40 dissipate heat better.

[0037] In this embodiment, the heat dissipation ring wall 25 has a plurality of reinforcement sections 26 extending outward away from the copper sheet 20, and the plurality of reinforcement sections 26 are arranged at intervals along the circumference of the heat dissipation ring wall 25, and the bottom of the reinforcement section 26 is embedded in the upward end surface 11. In this way, the heat dissipation ring wall 25 can increase the connection stability between the copper sheet 20 and the substrate 10 through the reinforcement section 26, and can also improve the heat dissipation effect through the reinforcement section 26.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. High light efficiency and high power LED light source, characterized in that: The invention comprises a substrate, wherein the top of the substrate has a light-emitting area, the light-emitting area is provided with a plurality of LED chips, the substrate is provided with two relatively isolated and independently arranged copper sheets, the top of the copper sheet has a top end surface arranged upward, the bottom of the copper sheet has a bottom end surface arranged downward, an outer peripheral surface is provided between the top end surface and the bottom end surface, and along the direction from top to bottom, the outer peripheral surface is arranged to be recessed inwardly so that the area of ​​the bottom end surface is smaller than the area of ​​the top end surface.

2. The high light efficiency and high power LED light source as claimed in claim 1, characterized in that: Along the direction from top to bottom, the radial dimension of the outer peripheral surface gradually decreases, so that the area of ​​the bottom end surface is smaller than the area of ​​the top end surface.

3. The high light efficiency and high power LED light source as claimed in claim 2, characterized in that: The substrate has an upward end surface arranged upward and a downward end surface arranged downward, the light emitting area is located on the upward end surface, and the outer peripheral surface is exposed below the downward end surface.

4. The high light efficiency and high power LED light source as claimed in claim 3, characterized in that: The top end surface is exposed in the light emitting area, and the LED chip is welded on the top end surface.

5. The high light efficiency and high power LED light source according to any one of claims 1 to 4, characterized in that: A heat dissipation channel is formed between the two copper sheets at a relative interval, and the heat dissipation channel is communicated with the outside.

6. The high light efficiency and high power LED light source according to any one of claims 1 to 4, characterized in that: The light-emitting area is provided with a plurality of light-emitting zones, each of the light-emitting zones is provided with a plurality of the LED chips, the plurality of LED chips form a plurality of series structures which are independently arranged from each other, the series structures include a plurality of LED chips connected in series with each other, the series structures contain at least one LED chip in each light-emitting zone, and the plurality of series structures are arranged in parallel with each other.

7. The high light efficiency and high power LED light source as claimed in claim 6, characterized in that: The LED chips connected in series are arranged to cross each other or to be adjacent to each other.

8. The high light efficiency and high power LED light source as claimed in claim 7, characterized in that: A plurality of LED chips in the series structure are arranged in a staggered and mixed manner in the light emitting area.

9. The high light efficiency and high power LED light source as claimed in claim 4, characterized in that: The top end surface is higher than the upward end surface, and a heat dissipation ring wall exposed on the upward end surface is formed on the outer periphery of the top end surface.

10. The high light efficiency and high power LED light source as claimed in claim 9, characterized in that: The heat dissipation ring wall is provided with a plurality of reinforcement sections extending outward away from the copper sheet. The plurality of reinforcement sections are arranged at intervals along the circumference of the heat dissipation ring wall, and the bottom of the reinforcement section is embedded in the upward end surface.

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