PET bottle preform injection molding cooling device

Abstract

The utility model relates to the technical field of bottle preform injection molding, in particular to a PET bottle preform injection molding cooling device which comprises a device shell, the top of the device shell is fixedly connected with a water storage tank, and a refrigeration assembly is arranged in the device shell; the refrigeration assembly comprises a partition plate, the partition plate is fixedly connected to the interior of the device shell, a semiconductor refrigerator is fixedly connected to the interior of the partition plate, a cold conduction copper block is fixedly connected to the refrigeration end of the semiconductor refrigerator, and a containing groove is formed in the side surface of the cold conduction copper block; a first water guide pipe is fixedly connected to the interior of the containing groove, a forming column is fixedly connected to the front face of the device shell, and a second water guide pipe is fixedly connected to the interior of the forming column. According to the PET bottle preform injection molding cooling device, the forming column can be cooled, so that injection molding cooling of a bottle preform is completed, the stability and practicability of injection molding cooling of the bottle preform are effectively improved, and the situation that injection molding cooling of the bottle preform is easily affected by the environment is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of bottle embryo injection molding, in particular to a PET bottle embryo injection molding cooling device. Background Art

[0002] PET preforms are typical injection molding products, which are easy to transport. They are mostly made of plastic, have uniform texture and good insulation. They are intermediate products of plastic bottles and oil barrels. During the production process of PET preforms, some chemical materials need to be melted at high temperature, then poured into a specific mold and cooled to form a preform.

[0003] Therefore, a cooling device is required during the injection molding process of the preform, and the existing cooling device partially uses air cooling during use, which is easily affected by the environment during use. When the ambient temperature is too high, the temperature difference between the inside and outside of the device is not large, which will lead to poor air cooling effect and uneven cooling of the preform. Utility Model Content

[0004] The purpose of the utility model is to provide a PET preform injection cooling device to solve the problem mentioned in the background art that when the ambient temperature is too high, the temperature difference between the inside and outside of the device is not large, which leads to poor air cooling effect and uneven cooling of the preform. To achieve the above purpose, the utility model provides the following technical solutions: a PET preform injection cooling device, comprising a device shell, a water tank is fixedly connected to the top of the device shell, and a refrigeration component is arranged inside the device shell;

[0005] The refrigeration component includes a partition plate, which is fixedly connected to the inside of the device shell, and a semiconductor refrigerator is fixedly connected to the inside of the partition plate. A cooling copper block is fixedly connected to the cooling end of the semiconductor refrigerator. A placement groove is opened on the side surface of the cooling copper block, and a water pipe 1 is fixedly connected to the inside of the placement groove. A molding column is fixedly connected to the front of the device shell, and a water pipe 2 is fixedly connected to the inside of the molding column. The refrigeration component is set up. During use, the semiconductor refrigerator is first started for cooling, and the cooling copper block can conduct the cooling effect of the semiconductor refrigerator. Then, when the coolant flows into the inside of the water pipe 1, it will be cooled by the cooling copper block. Then, the cooled coolant will flow into the water pipe 2, thereby cooling the molding column, thereby completing the injection cooling of the bottle preform, effectively improving the stability and practicality of the injection cooling of the bottle preform, avoiding the injection cooling of the bottle preform being easily affected by the environment, and facilitating the production operations of the staff.

[0006] Further preferably, the semiconductor refrigerator is symmetrically distributed inside the partition plate, the placement grooves are distributed vertically and parallelly to the side surface of the cooling copper block, the forming columns are symmetrically distributed to the front of the device shell, and the water pipe 2 is connected to the water pipe 1.

[0007] Further preferably, the water tank is provided with a water guiding component inside, the water guiding component includes a water inlet pipe, the water inlet pipe is fixedly connected to the top of the water tank, the right side of the water tank is fixedly connected with a drain pipe, the left side of the water tank is fixedly connected with a return pipe, the return pipe is connected with the second water guiding pipe, and the water guiding component is provided, during use, the staff injects the coolant into the water tank through the water inlet pipe, and then starts the water pump to draw the coolant inside the water tank, and output the coolant to the inside of the first water guiding pipe through the water delivery pipe at its output end, and through the output of the water pump, the coolant inside the first water guiding pipe is pushed into the second water guiding pipe, and finally the coolant inside the second water guiding pipe is pushed into the return water pipe, so that the return water pipe returns the coolant to the inside of the water tank, which effectively improves the practicability and environmental protection, reduces the production cost, and facilitates the use of the staff.

[0008] Further preferably, a water pump is fixedly connected to the inside of the water tank, and the output end of the water pump is fixedly connected to a water pipe, the water pipe passes through the top of the device shell, the other end of the water pipe is fixedly connected to a water guide pipe, and a guide block is fixedly connected to the inside of the water tank and on the left side of the water pump.

[0009] Further preferably, a heat dissipation component is provided inside the device shell, and the heat dissipation component includes a heat-conducting copper block, which is fixedly connected to the heating end of the semiconductor refrigerator, and a ventilation groove is provided inside the heat-conducting copper block. The back of the heat-conducting copper block is fixedly connected to a support frame. Due to the provision of the heat dissipation component, the semiconductor refrigerator will heat up at the other end while it is cooling. During the heating process, the semiconductor refrigerator first absorbs the heat dissipated by the heat-conducting copper block, and then starts the cooling fan to allow external air to quickly enter the device shell through the air inlet groove, and the internal air to quickly pass through the heat dissipation groove, so that the air can circulate, and the air can cool and dissipate the heat of the heat-conducting copper block during the circulation process, thereby improving the safety and stability of the semiconductor refrigerator and extending the service life of the semiconductor refrigerator.

[0010] Further preferably, a cooling fan is fixedly connected to the interior of the support frame, an air inlet slot is provided at the bottom of the device shell, a heat dissipation slot is provided at the back of the device shell, and a bar grille is fixedly connected to the interior of the heat dissipation slot.

[0011] Further preferably, a push rod is fixedly connected to the back side of the device housing, and a threaded groove is provided inside the molding column.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] In the utility model, the setting of the refrigeration component, during the use process, first start the semiconductor refrigerator for cooling, and the cooling copper block can conduct the cooling effect of the semiconductor refrigerator, and then when the coolant flows into the inside of the water pipe one, it will be cooled by the cooling copper block, and then the cooled coolant will flow into the water pipe two, so that the molding column can be cooled, thereby completing the injection cooling of the bottle preform, effectively improving the stability and practicality of the bottle preform injection cooling, avoiding the bottle preform injection cooling being easily affected by the environment, and facilitating the production operations of the staff.

[0014] In the utility model, the water guide component is arranged, during use, the staff injects the coolant into the water tank through the water inlet pipe, and then starts the water pump, so that the water pump draws the coolant in the water tank, and outputs the coolant to the inside of water guide pipe one through the water delivery pipe at its output end, and pushes the coolant in the inside of water guide pipe one into water guide pipe two through the output of the water pump, and finally pushes the coolant in the inside of water guide pipe two into the return pipe, so that the return pipe returns the coolant to the inside of the water tank, which effectively improves the practicability and environmental protection, reduces the production cost, and facilitates the use of the staff.

[0015] In the utility model, the heat dissipation component is arranged, and the other end of the semiconductor refrigerator will generate heat while cooling. During the heating process, the semiconductor refrigerator first absorbs the heat emitted by the semiconductor refrigerator through the heat-conducting copper block, and then starts the heat dissipation fan, so that the external air passes through the air inlet slot quickly into the device shell, and the internal air passes through the heat dissipation slot quickly, so that the air circulates, and the air can cool the heat-conducting copper block and dissipate the heat during the circulation process, thereby improving the safety and stability of the semiconductor refrigerator and extending the service life of the semiconductor refrigerator. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the overall cross-section of the utility model;

[0018] Figure 3 This is a schematic diagram of the second overall cross-section structure of the utility model;

[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of the local components of the refrigeration assembly of the utility model;

[0020] Figure 5 It is a schematic diagram of the third structure of the overall cross section of the utility model;

[0021] Figure 6 It is a schematic diagram of the plane structure of the forming column of the utility model.

[0022] In the figure: 1. device shell; 2. water storage tank; 3. refrigeration component; 4. water guide component; 5. heat dissipation component; 6. threaded groove; 7. push rod; 301. partition plate; 302. semiconductor refrigerator; 303. cooling copper block; 304. placement groove; 305. water guide pipe 1; 306. forming column; 307. water guide pipe 2; 401. water inlet pipe; 402. drain pipe; 403. water pump; 404. water delivery pipe; 405. return pipe; 406. guide block; 501. heat-conducting copper block; 502. ventilation groove; 503. support frame; 504. cooling fan; 505. air inlet groove; 506. heat dissipation groove; 507. bar grille. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1 - Figure 6 The utility model provides a technical solution: a PET preform injection cooling device, comprising a device housing 1, a water storage tank 2 is fixedly connected to the top of the device housing 1, and a refrigeration component 3 is arranged inside the device housing 1;

[0025] The refrigeration assembly 3 includes a partition plate 301, which is fixedly connected to the inside of the device shell 1. A semiconductor refrigerator 302 is fixedly connected to the inside of the partition plate 301. A cooling copper block 303 is fixedly connected to the cooling end of the semiconductor refrigerator 302. A placement groove 304 is provided on the side surface of the cooling copper block 303. A water pipe 1 305 is fixedly connected to the inside of the placement groove 304. A molding column 306 is fixedly connected to the front of the device shell 1. A water pipe 2 307 is fixedly connected to the inside of the molding column 306. The semiconductor refrigerator 302 is symmetrically distributed to the inside of the partition plate 301. The placement grooves 304 are distributed in parallel up and down to the side surface of the cooling copper block 303. The molding columns 306 are symmetrically distributed to the front of the device shell 1. The water pipe 2 307 is connected to the water pipe 1 305.

[0026] In this embodiment, Figure 1and Figure 5 As shown, a water guide component 4 is provided inside the water tank 2, and the water guide component 4 includes a water inlet pipe 401, which is fixedly connected to the top of the water tank 2, a drain pipe 402 is fixedly connected to the right side of the water tank 2, and a return pipe 405 is fixedly connected to the left side of the water tank 2, and the return pipe 405 is connected to the water guide pipe 307, a water pump 403 is fixedly connected inside the water tank 2, and the output end of the water pump 403 is fixedly connected to a water delivery pipe 404, the water delivery pipe 404 runs through the top of the device shell 1, and the other end of the water delivery pipe 404 is fixedly connected to the water guide pipe 305, and a guide block 406 is fixedly connected inside the water tank 2 and on the left side of the water pump 403.

[0027] In this embodiment, Figure 2 , Figure 3 and Figure 4 As shown, a heat dissipation component 5 is arranged inside the device shell 1, and the heat dissipation component 5 includes a heat-conducting copper block 501, and the heat-conducting copper block 501 is fixedly connected to the heating end of the semiconductor refrigerator 302. A ventilation groove 502 is opened inside the heat-conducting copper block 501, and a support frame 503 is fixedly connected to the back of the heat-conducting copper block 501. A heat dissipation fan 504 is fixedly connected to the inside of the support frame 503. An air inlet groove 505 is opened at the bottom of the device shell 1, and a heat dissipation groove 506 is opened on the back of the device shell 1. A bar grille 507 is fixedly connected to the inside of the heat dissipation groove 506.

[0028] In this embodiment, Figure 1 and Figure 3 As shown, a push rod 7 is fixedly connected to the back of the device housing 1 , and a threaded groove 6 is provided inside the molding column 306 .

[0029] The use method and advantages of the utility model: When the PET preform injection cooling device is used, the working process is as follows:

[0030] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, during use, the staff injects the coolant into the water storage tank 2 through the water inlet pipe 401, and then starts the water pump 403, so that the water pump 403 extracts the coolant in the water storage tank 2, and outputs the coolant to the inside of the water pipe 305 through the water delivery pipe 404 at its output end, and at the same time starts the semiconductor refrigerator 302 for cooling, and the cooling copper block 303 can conduct the cooling effect of the semiconductor refrigerator 302, and then when the coolant flows into the inside of the water pipe 305, it will be cooled by the cooling copper block 303, and through the output of the water pump 403, the coolant in the water pipe 305 is pushed into the water pipe 2 307, so that the bottle embryo can be cooled, and then the water pump 40 3, and then pushes the coolant in the water pipe 307 into the return pipe 405, so that the return pipe 405 returns the coolant to the inside of the water storage tank 2; and due to the setting of the heat dissipation component 5, the semiconductor refrigerator 302 will heat up at the same time as it is cooling, and during the heating process, the semiconductor refrigerator 302 first absorbs the heat emitted by the semiconductor refrigerator 302 through the heat-conducting copper block 501, and then starts the heat dissipation fan 504, so that the external air passes through the air inlet slot 505 and quickly enters the inside of the device shell 1, and the internal air passes through the heat dissipation slot 506 quickly, so that the air circulates, and the air can cool and dissipate the heat of the heat-conducting copper block 501 during the circulation process.

[0031] The above shows and describes the basic principle, main features and advantages of the utility model. Technical staff in this industry should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A PET preform injection cooling device, comprising a device housing (1), characterized in that: A water storage tank (2) is fixedly connected to the top of the device housing (1), and a refrigeration component (3) is arranged inside the device housing (1); The refrigeration assembly (3) comprises a partition plate (301), the partition plate (301) is fixedly connected to the inside of the device shell (1), a semiconductor refrigerator (302) is fixedly connected to the inside of the partition plate (301), a cooling end of the semiconductor refrigerator (302) is fixedly connected to a cooling copper block (303), a placement groove (304) is provided on the side surface of the cooling copper block (303), a water pipe 1 (305) is fixedly connected to the inside of the placement groove (304), a molding column (306) is fixedly connected to the front of the device shell (1), and a water pipe 2 (307) is fixedly connected to the inside of the molding column (306).

2. A PET preform injection molding cooling device according to claim 1, characterized in that: The semiconductor refrigerator (302) is symmetrically distributed inside the partition plate (301), the placement groove (304) is distributed vertically and parallelly to the side surface of the cooling copper block (303), the forming column (306) is symmetrically distributed on the front of the device shell (1), and the water pipe 2 (307) is connected to the water pipe 1 (305).

3. A PET preform injection molding cooling device according to claim 2, characterized in that: A water guide assembly (4) is arranged inside the water storage tank (2), and the water guide assembly (4) comprises a water inlet pipe (401), and the water inlet pipe (401) is fixedly connected to the top of the water storage tank (2). The right side of the water storage tank (2) is fixedly connected to a drainage pipe (402), and the left side of the water storage tank (2) is fixedly connected to a return pipe (405), and the return pipe (405) is connected to the second water guide pipe (307).

4. A PET preform injection molding cooling device according to claim 1, characterized in that: A water pump (403) is fixedly connected to the interior of the water storage tank (2); the output end of the water pump (403) is fixedly connected to a water delivery pipe (404); the water delivery pipe (404) passes through the top of the device housing (1); the other end of the water delivery pipe (404) is fixedly connected to a water guide pipe 1 (305); and a guide block (406) is fixedly connected to the interior of the water storage tank (2) and located on the left side of the water pump (403).

5. A PET preform injection molding cooling device according to claim 1, characterized in that: A heat dissipation component (5) is arranged inside the device housing (1), and the heat dissipation component (5) comprises a heat-conducting copper block (501). The heat-conducting copper block (501) is fixedly connected to the heating end of the semiconductor refrigerator (302), a ventilation groove (502) is provided inside the heat-conducting copper block (501), and a support frame (503) is fixedly connected to the back of the heat-conducting copper block (501).

6. A PET preform injection molding cooling device according to claim 5, characterized in that: A cooling fan (504) is fixedly connected inside the support frame (503), an air inlet slot (505) is provided at the bottom of the device housing (1), a heat dissipation slot (506) is provided at the back of the device housing (1), and a bar grille (507) is fixedly connected inside the heat dissipation slot (506).

7. A PET preform injection molding cooling device according to claim 1, characterized in that: A push rod (7) is fixedly connected to the back of the device housing (1), and a threaded groove (6) is provided inside the molding column (306).

Images