Evaporation component

Abstract

At least one embodiment of the utility model provides an evaporation assembly. The evaporation assembly comprises a metal frame, a first electrode and a second electrode, the supporting mask plates are erected on the metal frame, and a gap extending in the first direction is formed between every two adjacent supporting mask plates; the first metal strip extends in the first direction so as to be erected on the metal frame, the first metal strip is configured to shield the gap, the evaporation assembly can meet the film coating requirement of a large-size substrate, large-batch production is achieved, the production efficiency is improved, and the production cost is reduced. And the requirements on yield and precision of the light-emitting diode display device in the batch production process can be met.

Description

Technical Field

[0001] An embodiment of the present disclosure relates to an evaporation assembly. Background Art

[0002] Organic Light-Emitting Diode (OLED) display devices are also called organic electro-laser display devices or organic light-emitting semiconductor display devices. OLED has many characteristics such as low driving voltage, active light emission, wide viewing angle, high efficiency, fast response speed, easy to achieve full-color large-area wall-mounted display and flexible display, and has become a hot spot for researchers in the display field.

[0003] OLED display devices usually include multiple film layers, such as anodes, cathodes, and light-emitting layers. When preparing OLED display devices, it is necessary to evaporate each film layer in the OLED display device onto the glass substrate to be evaporated through an evaporation process. For the evaporation of some of the film layers, a fine metal mask (Fine Metal MASK, FMM) is required, that is, the evaporation material is evaporated to the designed position through the through holes on the FMM to form a designed film layer pattern. For example, fine metal mask technology will directly affect the quality and manufacturing cost of OLED products. Usually, there is at least one mask pattern on the fine metal mask, and for mass production, the mask patterns on the fine metal mask are usually multiple and distributed in a matrix. When the fine metal mask is used for coating processing, the same number of thin film patterns can be formed on the glass substrate using these mask patterns, and then the glass substrate can be cut according to the number of thin film patterns to form multiple light-emitting diode display devices. Utility Model Content

[0004] At least one embodiment of the present disclosure provides an evaporation component and a preparation method thereof, the evaporation component comprising: a metal frame; a plurality of support mask plates mounted on the metal frame, a gap extending in a first direction between two adjacent support mask plates; a first metal bar extending in the first direction to be mounted on the metal frame, and the first metal bar is configured to block the gap. The evaporation component provided by the embodiment of the present disclosure can not only meet the coating requirements of large-size substrates, realize mass production, and improve production efficiency, but also meet the yield and precision requirements of light-emitting diode display devices in the process of mass production, and the service life of the light-emitting diode display devices finally formed is prolonged.

[0005] At least one embodiment of the present disclosure provides an evaporation component, which includes: a metal frame; a plurality of support mask plates mounted on the metal frame, wherein a gap extending in a first direction is provided between two adjacent support mask plates; and a first metal bar extending in the first direction to be mounted on the metal frame, and the first metal bar is configured to block the gap.

[0006] For example, the evaporation assembly provided by at least one embodiment of the present disclosure further includes a plurality of precision metal mask plates arranged on the plurality of the supporting mask plates, wherein the edges of the precision metal mask plates are serrated.

[0007] For example, in the evaporation assembly provided in at least one embodiment of the present disclosure, the direction perpendicular to the first direction is the second direction, and the width of the first metal strip in the second direction is greater than the width of the gap in the second direction.

[0008] For example, in the evaporation assembly provided in at least one embodiment of the present disclosure, the first metal strip is in contact with the two adjacent support mask plates, and the thickness of the portion of the support mask plate in contact with the first metal strip is smaller than the thickness of the portion not in contact with the first metal strip.

[0009] For example, in the evaporation assembly provided in at least one embodiment of the present disclosure, the position of the portion of the support mask plate that contacts the first metal strip close to the surface of the metal frame is higher than the position of the portion of the support mask plate that does not contact the first metal strip close to the surface of the metal frame.

[0010] For example, in the evaporation assembly provided in at least one embodiment of the present disclosure, the position of the portion of the support mask plate that contacts the first metal strip and is away from the surface of the metal frame is lower than the position of the portion of the support mask plate that does not contact the first metal strip and is away from the surface of the metal frame.

[0011] For example, in the evaporation assembly provided in at least one embodiment of the present disclosure, the number of the supporting mask plates is at least three, the gap includes a first gap and a second gap, and the width of the first gap in the second direction is different from the width of the second gap in the second direction.

[0012] For example, the evaporation assembly provided in at least one embodiment of the present disclosure further includes a second metal strip, wherein the second metal strip extends in the second direction to be mounted on the metal frame.

[0013] For example, in the evaporation assembly provided in at least one embodiment of the present disclosure, in a direction perpendicular to the bearing surface of the metal frame, the thickness of the first metal strip is greater than the thickness of the gap.

[0014] At least one embodiment of the present disclosure also provides a method for preparing an evaporation component, the method comprising: providing a metal frame; forming a first metal strip and a plurality of support mask plates on the metal frame, wherein a gap extending in a first direction is provided between two adjacent support mask plates, the first metal strip extends in the first direction to be mounted on the metal frame, and the first metal strip blocks the gap.

[0015] For example, the preparation method provided by at least one embodiment of the present disclosure further includes forming a plurality of precision metal mask plates on the plurality of support mask plates, wherein the edges of the precision metal mask plates are serrated.

[0016] For example, the preparation method provided by at least one embodiment of the present disclosure further includes forming a second metal strip, wherein the second metal strip extends in a second direction perpendicular to the first direction to be mounted on the metal frame.

[0017] For example, in the preparation method provided in at least one embodiment of the present disclosure, the first metal strip and the second metal strip are both formed on the metal frame by welding.

[0018] At least one embodiment of the present disclosure further provides an evaporation assembly, comprising: a metal frame; and a plurality of support mask plates mounted on the metal frame, wherein two adjacent support mask plates are connected by snapping.

[0019] For example, in the evaporation assembly provided in at least one embodiment of the present disclosure, the plurality of support mask plates include a first support mask plate and a second support mask plate that are adjacently arranged, and the first part of the first support mask plate and the second part of the second support mask plate are snap-connected, and the position of the first part close to the surface of the metal frame is higher than the position of the part of the first support mask plate that is not in contact with the second support mask plate that is close to the surface of the metal frame; the position of the second part that is away from the surface of the metal frame is lower than the position of the part of the second support mask plate that is not in contact with the first support mask plate that is away from the surface of the metal frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, but are not intended to limit the present disclosure.

[0021] Figure 1 It is a schematic diagram of the planar structure of a small to medium-sized evaporation component;

[0022] Figure 2A schematic diagram of a planar structure of an evaporation assembly provided in at least one embodiment of the present disclosure;

[0023] Figure 3 A schematic diagram of a planar structure of a plurality of support mask plates provided for at least one embodiment of the present disclosure;

[0024] Figure 4 A schematic diagram of a planar structure in which a first metal strip is arranged on a metal frame, provided in at least one embodiment of the present disclosure;

[0025] Figure 5 A schematic diagram of a planar structure of a precision metal mask provided for at least one embodiment of the present disclosure;

[0026] Figure 6 A schematic diagram of a partial cross-sectional structure of a first metal strip in contact with two adjacent support mask plates provided in at least one embodiment of the present disclosure;

[0027] Figure 7 A schematic diagram of a partial cross-sectional structure of a first metal strip in contact with two adjacent support mask plates provided in at least one embodiment of the present disclosure;

[0028] Figure 8 A schematic diagram of a partial cross-sectional structure of another first metal strip in contact with two adjacent support mask plates provided in at least one embodiment of the present disclosure;

[0029] Fig. 9 A schematic diagram of a planar structure in which a first metal strip and a second metal strip are arranged on a metal frame, provided in at least one embodiment of the present disclosure;

[0030] Fig.10 A flow chart of a method for preparing an evaporation assembly provided in at least one embodiment of the present disclosure;

[0031] Fig.11 A schematic diagram of the planar structure of another evaporation assembly provided in at least one embodiment of the present disclosure;

[0032] Fig.12 for Fig.11 A schematic diagram of a connection structure of two adjacent support mask plates in the evaporation assembly shown; and

[0033] Fig.13 for Fig.11 A schematic diagram of another connection structure of two adjacent supporting mask plates in an evaporation assembly is shown. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0035] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] Unless otherwise defined, the features such as "parallel", "perpendicular" and "same" used in the embodiments of the present invention include the situations of "parallel", "perpendicular", "same" in a strict sense, as well as the situations of "approximately parallel", "approximately perpendicular", "approximately the same", etc., which contain certain errors. For example, the above-mentioned "approximately" may mean that the difference of the compared objects is within 10% or 5% of the average value of the compared objects. When the number of a component or element is not specifically indicated in the following text of the embodiments of the present invention, it means that the component or element may be one or more, or may be understood as at least one. "At least one" refers to one or more, and "multiple" refers to at least two. The "same-layer arrangement" in the embodiments of the present invention refers to the relationship between multiple film layers formed by the same material after the same step (for example, a one-step patterning process). The "same layer" here does not always mean that the thickness of multiple film layers is the same or the height of multiple film layers in the cross-sectional view is the same.

[0037] At present, the production of small and medium-sized light-emitting diode display devices requires the use of an integrated evaporation assembly, which includes a metal frame, a whole plate etching material and a precision metal mask plate. For example, Figure 1 is a schematic diagram of the planar structure of a small or medium-sized evaporation component, such as Figure 1As shown, the evaporation assembly 01 includes a metal frame 03, a layer of full-plate etching material 02 formed on the metal frame 03, and a precision metal mask plate 04 formed on the full-plate etching material 02. The evaporation assembly 01 can be used to form various film layers of small and medium-sized organic light-emitting diode display devices by evaporation. Figure 1 When the shown integrated evaporation assembly for small and medium sizes is applied to a large-sized evaporation assembly, it is impossible to manufacture a light-emitting diode display device with a larger size due to the limitation of the width of the entire plate etching material.

[0038] Generally, the larger the size of the mask, the more display devices can be mass-produced after a complete set of process steps are completed when the mask is used to coat a large-sized glass substrate. However, the larger the size of the mask, the more difficult it is to meet the precision standards of the final display device, resulting in the precision and resolution of the display device produced and processed failing to meet the expected requirements, resulting in a high defect rate. On the contrary, in order to ensure the precision of the final display device, the size of the evaporation components used to form each film layer of the display device has to be reduced, so that the production efficiency of the corresponding display device will also decrease.

[0039] The inventors of the present disclosure noticed that a large-sized evaporation component can be produced based on small and medium-sized whole-plate etching materials by combining multiple evaporation components. However, in the process of combining multiple evaporation components, gaps will appear between adjacent evaporation components, resulting in the problem of deterioration of the quality of the evaporated film layer. Therefore, it can be considered to set metal strips in the gaps between adjacent evaporation components to fill the gaps, so that the quality of each film layer in the formed light-emitting diode display device can be guaranteed.

[0040] At least one embodiment of the present disclosure provides an evaporation component, which includes: a metal frame; a plurality of support mask plates mounted on the metal frame, wherein a gap extending in a first direction is provided between two adjacent support mask plates; a first metal bar extending in the first direction to be mounted on the metal frame, and the first metal bar is configured to block the gap, wherein the first metal bar blocks the gap between two adjacent support mask plates to form a large-sized evaporation component, thereby improving production efficiency while ensuring the accuracy of the prepared display device.

[0041] For example, Figure 2 A schematic diagram of a planar structure of an evaporation assembly provided in at least one embodiment of the present disclosure, Figure 3 A schematic diagram of a planar structure of multiple support mask plates provided in at least one embodiment of the present disclosure, combined with Figure 2 and Figure 3As shown, the evaporation assembly 100 includes: a metal frame 101, a support mask plate 102 and a first metal strip 103. A plurality of support mask plates 102 are mounted on the metal frame 101, and a gap 104 extending in the first direction X is provided between two adjacent support mask plates 102. The first metal strip 103 extends in the first direction X to be mounted on the metal frame 101, and the first metal strip 103 is configured to shield the gap 104, so that a complete large-sized evaporation assembly can be formed. When the large-sized evaporation assembly is used as a mask structure to form each film layer of an organic light-emitting diode display device, the production efficiency of the display device can be improved while ensuring the accuracy of the prepared organic light-emitting diode display device.

[0042] For example, the direction perpendicular to the first direction X is the second direction Y, and the plurality of support mask plates 102 are sequentially arranged in the second direction Y, that is, the plurality of support mask plates 102 can form a planar splicing structure, so that there is a gap 104 extending in the first direction X between adjacent support mask plates 102. For example, in one example, the first direction X is a horizontal direction, and the second direction Y is a vertical direction. Of course, the embodiments of the present disclosure are not limited thereto, and the first direction X and the second direction Y can also be other directions.

[0043] For example, despite Figure 3 Only three supporting mask plates 102 and two gaps 104 extending in the first direction X are shown, but the embodiments of the present disclosure are not limited thereto, and more supporting mask plates may be provided to form a larger evaporation assembly.

[0044] For example, the support mask plate 102 can support the precision metal mask plate mentioned later. Since the precision metal mask plate will sag under the action of its own gravity, especially for large-sized precision metal mask plates, due to their long length, they are more likely to sag. Supporting the precision metal mask plate by the support mask plate 102 can keep the precision metal mask plate horizontal, thereby improving its precision, and the first metal strip 103 can cover the gap formed by splicing the support mask plate 102. During the coating process, when there is a gap in the splicing, the gas-phase luminescent material can be evaporated onto the substrate through the gap, thereby causing product defects. Therefore, by covering each gap with the first metal strip 103, it can be ensured that during the coating process, the gas-phase luminescent material can and can only be evaporated onto the substrate through the precision metal mask plate, thereby ensuring reliable and effective coating in the process of forming the light-emitting diode display device.

[0045] For example, Figure 4 A schematic diagram of a planar structure of a first metal strip disposed on a metal frame is provided for at least one embodiment of the present disclosure, such as Figure 4As shown, the first metal strip 103 is formed on the metal frame 101 by welding. The first metal strip 103 is in the shape of a long strip and extends in the first direction X. Figure 2 and Figure 4 Only two first metal strips 103 are shown in the figure, but the embodiments of the present disclosure are not limited thereto, and the number of the first metal strips is limited according to the number of supporting mask plates.

[0046] For example, Figure 5 A schematic diagram of a planar structure of a precision metal mask provided in at least one embodiment of the present disclosure, such as Figure 5 As shown, the evaporation assembly 100 further includes a plurality of precision metal mask plates 105 disposed on a plurality of support mask plates 102 , and the edges of the precision metal mask plates 105 are serrated to facilitate placing the precision metal mask plates 105 on the support mask plates 102 .

[0047] For example, combined with Figure 2-4 The width of the first metal strip 103 in the second direction Y is greater than the width of the gap 104 in the second direction Y, so that the first metal strip 103 can fully cover the gap 104 to improve the accuracy of the ultimately formed light emitting diode display device.

[0048] For example, Figure 6 A schematic diagram of a partial cross-sectional structure of a first metal strip in contact with two adjacent support mask plates provided in at least one embodiment of the present disclosure, combined with Figure 2 and Figure 6 The first metal strip 103 is in contact with the two adjacent support mask plates 102, and the thickness of the contact portion of the first metal strip 103 and the two adjacent support mask plates 102 is equal to the thickness of the non-contact portion of the first metal strip 103 and the two adjacent support mask plates 102.

[0049] For example, Figure 7 A schematic diagram of a partial cross-sectional structure of a first metal strip in contact with two adjacent support mask plates provided in at least one embodiment of the present disclosure, combined with Figure 2 and Figure 7, the first metal strip 103 is in contact with the two adjacent supporting mask plates 102, and the thickness of the portion of the supporting mask plate 102 in contact with the first metal strip 103 is less than the thickness of the portion not in contact with the first metal strip 103, and the position of the portion of the supporting mask plate 102 in contact with the first metal strip 103 close to the surface of the metal frame 101 is higher than the position of the portion of the supporting mask plate 102 not in contact with the first metal strip 103 close to the surface of the metal frame 101, so that the overall thickness of the portion of the supporting mask plate 102 in contact with the first metal strip 103 can be reduced, thereby reducing the step difference between the portion of the supporting mask plate 102 in contact with the first metal strip 103 and the portion in contact with the first metal strip 103.

[0050] For example, Figure 8 A schematic diagram of a partial cross-sectional structure of another first metal strip in contact with two adjacent support mask plates provided in at least one embodiment of the present disclosure, combined with Figure 2 and Figure 8 , the first metal strip 103 is in contact with the two adjacent support mask plates 102, and the thickness of the portion of the support mask plate 102 in contact with the first metal strip 103 is less than the thickness of the portion not in contact with the first metal strip 103, and the position of the portion of the support mask plate 102 in contact with the first metal strip 103 close to the surface of the metal frame 101 is higher than the position of the portion of the support mask plate 102 not in contact with the first metal strip 103 close to the surface of the metal frame 101, and the portion of the support mask plate 102 in contact with the first metal strip 103 is far from the metal frame 101. 1 is located lower than the position of the surface of the portion of the support mask plate 102 that is not in contact with the first metal strip 103 and is away from the metal frame 101. In this way, the overall thickness of the portion of the support mask plate 102 that is in contact with the first metal strip 103 can be further reduced from the upper side to offset the height of the first metal strip 103 that may protrude toward the side away from the metal frame 101, thereby further reducing the step difference between the portion of the support mask plate 102 that is in contact with the first metal strip 103 and the portion that is in contact with the first metal strip 103, so that the surface of the entire evaporation component is smoother.

[0051] For example, in Figure 2 In the structure shown, there are three supporting mask plates 102, but the embodiments of the present disclosure are not limited thereto, and the number of supporting mask plates 102 can be more. Figure 2 and Figure 3The gap 104 includes a first gap 1041 and a second gap 1042, the width of the first gap 1041 in the second direction Y is different from the width of the second gap 1042 in the second direction Y, and the width of the first gap 1041 in the second direction Y is greater than the width of the second gap 1042 in the second direction Y, so that the size of the final evaporation component can be flexibly adjusted.

[0052] For example, when preparing a large-sized organic light-emitting diode display device, a large-sized substrate needs to be used. The larger the size of the substrate, the higher the production efficiency of the light-emitting diode display device. When a large-sized substrate is used, a corresponding large-sized support mask plate needs to be used. The larger the size of the support mask plate, the greater the probability of deformation due to environmental factors such as gravity and temperature. Therefore, the support mask plate, especially the support mask plate corresponding to the large-sized substrate, deforms due to its own gravity, resulting in a poor yield and reduced production efficiency of the final formed light-emitting diode display device, which is a problem that needs to be solved urgently. The inventor of the present disclosure noticed that a second metal strip extending in the second direction can be set on the metal frame to support the support mask plate in the second direction, thereby avoiding the problem of poor yield and reduced production efficiency due to the deformation of the support mask plate due to its own gravity.

[0053] For example, the evaporation assembly also includes a second metal strip, which extends in the second direction to be mounted on the metal frame, thereby supporting the support mask plate in the second direction, thereby avoiding the problem of poor yield and reduced production efficiency caused by the support mask plate deforming due to its own gravity. Fig. 9 A schematic diagram of a planar structure of a first metal strip and a second metal strip provided on a metal frame according to at least one embodiment of the present disclosure is shown in FIG. Fig. 9 As shown, the first metal strip 103 and the second metal strip 106 are formed on the metal frame 101 by welding. The first metal strip 103 is in the shape of a long strip and extends in the first direction X, and the second metal strip 106 is in the shape of a long strip and extends in the second direction Y. Fig. 9 Only two first metal strips 103 and two second metal strips 106 are shown, but the embodiments of the present disclosure are not limited thereto, and the number of the first metal strips and the second metal strips is limited according to the number of supporting mask plates.

[0054] For example, in Figure 2 In the structure shown, the thickness of the first metal strip 103 is greater than the thickness of the gap 104, thereby ensuring that the support mask plate has approximately the same rigidity at the position with the gap 104 and at the position without the gap, so as to achieve subsequent stable support for the precision metal mask plate.

[0055] At least one embodiment of the present disclosure also provides a method for preparing an evaporation component, the preparation method comprising: providing a metal frame; forming a first metal strip and a plurality of supporting mask plates on the metal frame, wherein a gap extending in a first direction is provided between two adjacent supporting mask plates, the first metal strip extends in the first direction to be mounted on the metal frame, and the first metal strip blocks the gap. The first metal strip blocks the gap between two adjacent supporting mask plates to form an evaporation component of large size, thereby improving production efficiency while ensuring the accuracy of the prepared display device.

[0056] For example, Fig.10 A flow chart of a method for preparing a vapor deposition component provided in at least one embodiment of the present disclosure, such as Fig.10 As shown, the preparation method comprises:

[0057] Step S101: providing a metal frame;

[0058] For example, the material of the metal frame may refer to conventional metal materials used for evaporation components, and the embodiments of the present disclosure are not limited to this.

[0059] Step S102: forming a first metal strip and a plurality of support mask plates on a metal frame, wherein a gap extending in a first direction is provided between two adjacent support mask plates, and the first metal strip extends in the first direction to be mounted on the metal frame, and the first metal strip shields the gap.

[0060] For example, the structure of the first metal strip and the plurality of support mask plates formed on the metal frame can be referred to in the above Figure 2 The relevant description will not be repeated here.

[0061] For example, in one example, the preparation method of the evaporation component also includes forming multiple precision metal mask plates on multiple supporting mask plates, and the edges of the precision metal mask plates are serrated, which can facilitate the placement of the precision metal mask plates on the supporting mask plates, thereby improving production efficiency and the yield of the ultimately formed light-emitting diode display device.

[0062] For example, in one example, the preparation method of the evaporation component also includes forming a second metal strip, which extends in a second direction perpendicular to the first direction to be mounted on a metal frame, thereby supporting the support mask plate in the second direction, thereby avoiding the problem of poor yield and reduced production efficiency due to deformation of the support mask plate due to its own gravity.

[0063] For example, in an embodiment of the present disclosure, the first metal bar and the second metal bar are both formed on the metal frame by welding, so that the production cost can be reduced as much as possible on the basis of ensuring that the first metal bar and the second metal bar are stably formed on the metal frame. However, the embodiment of the present disclosure is not limited to this, and other methods can be used to stably form the first metal bar and the second metal bar on the metal frame.

[0064] Another embodiment of the present disclosure further provides an evaporation assembly, for example, Fig.11 A schematic diagram of the planar structure of another evaporation assembly provided in at least one embodiment of the present disclosure, Fig.12 for Fig.11 A schematic diagram of a connection structure of two adjacent support mask plates in the evaporation assembly shown in FIG. Fig.11 and Fig.12 As shown, the evaporation component 200 includes: a metal frame 201; a plurality of support mask plates 202 mounted on the metal frame 201, wherein two adjacent support mask plates 202 are connected by snapping together. The evaporation component of this structure can maintain a flat state at the position where two adjacent support mask plates are connected while avoiding the formation of a gap, so as to improve the quality and production efficiency of the finally formed light-emitting diode display device.

[0065] For example, Fig.11 As shown, the plurality of support mask plates 202 include a first support mask plate 2021 and a second support mask plate 2022 that are adjacently arranged. Fig.11 and Fig.12 The first part 2021a of the first support mask plate 2021 and the second part 2022a of the second support mask plate 2022 are engaged and connected, and the position of the first part 2021a close to the surface of the metal frame 201 is higher than the position of the part of the first support mask plate 2021 that is not in contact with the second support mask plate 2022 that is close to the surface of the metal frame 201. The position of the second part 2022a away from the surface of the metal frame 201 is lower than the position of the part of the second support mask plate 2022 that is not in contact with the first support mask plate 2021 that is away from the surface of the metal frame 201, so that the first part 2021a of the first support mask plate 2021 and the second part 2022a of the second support mask plate 2022 after engagement can be flat on the surface away from the metal frame.

[0066] Fig.13 for Fig.11 Another schematic diagram of a connection structure of two adjacent support mask plates in the evaporation assembly shown in FIG. Fig.11 and Fig.13As shown, the first part 2021a of the first support mask plate 2021 and the second part 2022a of the second support mask plate 2022 are engaged and connected, and the position of the first part 2021a close to the surface of the metal frame 201 is higher than the position of the part of the first support mask plate 2021 that is not in contact with the second support mask plate 2022 close to the surface of the metal frame 201, and the position of the first part 2021a away from the surface of the metal frame 201 is lower than the position of the part of the first support mask plate 2021 that is not in contact with the second support mask plate 2022 close to the surface of the metal frame 201. The position of the second part 2022a away from the surface of the metal frame 201 is lower than the position of the part of the second support mask plate 2022 that is not in contact with the first support mask plate 2021 away from the surface of the metal frame 201, and the position of the second part 2022a close to the surface of the metal frame 201 is flush with the position of the part of the second support mask plate 2022 that is not in contact with the first support mask plate 2021 close to the surface of the metal frame 201. In this way, the surfaces of the first portion 2021a of the first supporting mask plate 2021 and the second portion 2022a of the second supporting mask plate 2022 that are engaged and close to the metal frame are flat.

[0067] The evaporation component and preparation method thereof provided in at least one embodiment of the present disclosure have at least the following beneficial technical effects: the evaporation component can not only meet the coating requirements of large-size substrates, realize mass production, and improve production efficiency, but also meet the yield and precision requirements of light-emitting diode display devices in the process of mass production, and the service life of the light-emitting diode display devices finally formed is prolonged.

[0068] There are a few points to note:

[0069] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0070] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is enlarged or reduced, that is, these drawings are not drawn according to the actual scale.

[0071] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0072] The above description is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A vapor deposition component, characterized in that: include: Metal frame; A plurality of support mask plates mounted on the metal frame, wherein a gap extending in a first direction is provided between two adjacent support mask plates; The first metal strip extends in the first direction to be mounted on the metal frame, and the first metal strip is configured to cover the gap.

2. The evaporation assembly according to claim 1, characterized in that: It also includes a plurality of precision metal mask plates arranged on the plurality of support mask plates, wherein the edges of the precision metal mask plates are serrated.

3. The evaporation assembly according to claim 1 or 2, characterized in that: A direction perpendicular to the first direction is a second direction, and a width of the first metal strip in the second direction is greater than a width of the gap in the second direction.

4. The evaporation assembly according to claim 3, characterized in that: The first metal strip is in contact with the two adjacent support mask plates, and a thickness of a portion of the support mask plate in contact with the first metal strip is smaller than a thickness of a portion of the support mask plate that is not in contact with the first metal strip.

5. The evaporation assembly according to claim 4, characterized in that: The position of the portion of the support mask plate that contacts the first metal strip and is close to the surface of the metal frame is higher than the position of the portion of the support mask plate that is not in contact with the first metal strip and is close to the surface of the metal frame.

6. The evaporation assembly according to claim 5, characterized in that: A portion of the support mask plate in contact with the first metal strip and away from the surface of the metal frame is located lower than a portion of the support mask plate not in contact with the first metal strip and away from the surface of the metal frame.

7. The evaporation assembly according to claim 3, characterized in that: The number of the supporting mask plates is at least three, the gaps include a first gap and a second gap, and a width of the first gap in the second direction is different from a width of the second gap in the second direction.

8. The evaporation assembly according to claim 3, characterized in that: A second metal bar is also included, wherein the second metal bar extends in the second direction to be mounted on the metal frame.

9. The evaporation assembly according to claim 1, characterized in that: In a direction perpendicular to the bearing surface of the metal frame, the thickness of the first metal strip is greater than the thickness of the gap.

10. A vapor deposition component, characterized in that: include: Metal frame; A plurality of support mask plates are mounted on the metal frame, wherein two adjacent support mask plates are connected by snapping.

11. The evaporation assembly according to claim 10, characterized in that: The multiple support mask plates include a first support mask plate and a second support mask plate that are adjacent to each other, and the first part of the first support mask plate and the second part of the second support mask plate are snap-connected, the position of the first part close to the surface of the metal frame is higher than the position of the part of the first support mask plate that is not in contact with the second support mask plate that is close to the surface of the metal frame; the position of the second part away from the surface of the metal frame is lower than the position of the part of the second support mask plate that is not in contact with the first support mask plate that is away from the surface of the metal frame.

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