PCB electroplating floating frame
By increasing the height and through-holes of the side plate of the PCB electroplating floating frame, the problem of large differences in copper thickness at the upper and lower ends of the plating parts is solved, the uniformity of copper thickness is achieved, and the line yield and etching quality are improved.
Patent Information
- Application Number
- CN202421352835.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-14
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-06-14
AI Technical Summary
The side plate height of the existing PCB electroplating floating frame is insufficient, resulting in a large difference in copper thickness at the upper and lower ends of the plated parts, affecting the user requirements of the line yield and line width and distance after etching.
Increase the height of the vertical plates on both sides of the floating frame to 250-280mm, and increase the number of through holes and rows on the vertical plate to make the current distribution more evenly, thereby ensuring the uniform copper thickness on the surface of the plating part.
By improving the floating frame structure, the uniformity of copper thickness at the upper and lower ends of the plating parts is significantly improved, the line yield is improved, and the scrap rate caused by uneven line etching is reduced.
Smart Images
Figure CN222648155U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board processing equipment, in particular to a PCB electroplating floating frame. Background Art
[0002] In the PCB manufacturing process, in order to meet the needs of different levels of conduction and subsequent hardware and other parts insertion, it is first necessary to drill holes on the substrate, and then deposit a layer of metal copper on the hole wall and surface of the substrate (including resin and glass fiber) through a chemical catalytic reduction method in the electroplating process to achieve a double-sided board. After electroplating, the electrical interconnection between the layers of the multi-layer board and the purpose of solderable components are achieved, and the copper thickness requirements of the hole wall and the line are met to ensure its excellent conductive performance.
[0003] The uniformity of copper thickness in the copper electroplating process has a great influence on the subsequent circuit etching process, which determines whether the line width and line spacing after circuit etching meet customer needs and whether it affects the functionality of the customer's parts. During electroplating, the plated metal is connected to the anode, the plated part is connected to the cathode, and the cathode and cathode are connected by an electrolyte solution of the plated metal ions. The plated part is fixed by an electroplating float and immersed in the electrolyte solution. In the prior art, a number of through holes are provided on the lower part of the side panels on both sides of the electroplating float to adjust the distribution of power lines. However, the height of the side panels of the float is about 15 cm, and its shielding area is insufficient. After the through holes of the side panels adjust the power lines, the copper thickness of the lower end of the plated part is too thick. The copper thickness of the upper and lower parts of the plated part is quite different, and there is a problem of poor uniformity of copper thickness, which affects the line yield and the user requirements for line width and line spacing after etching.
[0004] In view of this, it is necessary to provide a new floating frame structure to solve the above technical problems. Utility Model Content
[0005] The technical problem to be solved by the utility model is to provide a PCB electroplating floating frame, by increasing the height of the vertical plates on both sides of the floating frame and increasing the number of through holes on the vertical plates, the distribution of the electric power lines is adjusted, the current distribution is made more uniform, and thus the copper plating thickness of the circuit board is made uniform.
[0006] The technical solution of the utility model is as follows:
[0007] A PCB electroplating floating frame includes a first fixed plate and a second fixed plate arranged opposite to each other, a connecting beam connecting the first fixed plate and the second fixed plate, a first side plate and a second side plate distributed on both sides of the connecting beam, and a plurality of connecting blocks symmetrically distributed on both sides of the connecting beam for clamping and fixing plated parts, one end of the connecting block is connected to the first side plate / the second side plate, and the other end is connected to the connecting beam, the height of the first side plate and the second side plate is 250-280mm, 9-10 rows of through holes are arranged thereon, and two adjacent rows of through holes are staggered.
[0008] Furthermore, the through hole has a diameter of 8-12 mm.
[0009] Furthermore, the longitudinal spacing between two adjacent rows of through holes is 20-25 mm.
[0010] Furthermore, the lateral spacing between two adjacent through holes in each lateral row is 40-60 mm.
[0011] Furthermore, the connection blocks on both sides of the connection beam form a V shape.
[0012] Compared with the prior art, the PCB electroplating floating frame provided by the utility model has the following beneficial effects:
[0013] The PCB electroplating floating frame provided by the utility model increases the shielding area of the floating frame by increasing the height of the two side plates of the floating frame to 250-280mm; at the same time, the number and number of through holes on the side plates are increased, thereby adjusting the distribution of electric lines, so that the current passing through the upper end and the lower end of the plated part are roughly the same, thereby ensuring the uniformity of the current passing through the plated part and making the copper thickness on the surface of the plated part uniform. Therefore, the PCB electroplating floating frame provided by the utility model can greatly improve the problem of the extreme difference in copper thickness at the upper and lower ends of the plated part, can effectively avoid the scrap rate caused by uneven circuit etching, and improve the circuit yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0015] Figure 1 It is a structural schematic diagram of the PCB electroplating floating frame of the utility model;
[0016] Figure 2 yes Figure 1 A schematic diagram of a PCB electroplating floating frame from another angle is shown;
[0017] Figure 3 yes Figure 1 The structural schematic diagram of the first side plate / second side plate in the PCB electroplating floating frame is shown. DETAILED DESCRIPTION
[0018] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention and to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific implementation methods of the present invention are further described below.
[0019] It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as there is no conflict between them.
[0020] Please refer to Figure 1 , Figure 2 and Figure 3 ,in Figure 1 It is a structural schematic diagram of the PCB electroplating floating frame of the utility model; Figure 2 yes Figure 1 A schematic diagram of a PCB electroplating floating frame from another angle is shown; Figure 3 yes Figure 1 The schematic diagram of the structure of the first side plate / second side plate in the PCB electroplating floating frame shown. The PCB electroplating floating frame of the utility model comprises a first fixing plate 1 and a second fixing plate 2 arranged opposite to each other, a connecting beam 3 connecting the first fixing plate 1 and the second fixing plate 2, a first side plate 4 and a second side plate 5 distributed on both sides of the connecting beam 3, and a plurality of connecting blocks 6.
[0021] The first side plate 4 and the second side plate 5 are spaced at a certain distance from the connecting beam 3, and the distances are equal. The first side plate 4 and the second side plate 5 are provided with a plurality of through holes 8 for adjusting the distribution of the electric lines.
[0022] A plurality of connection blocks 6 are symmetrically distributed on both sides of the connection beam 3, one end of which is connected to the first side plate 4 / the second side plate 5, and the other end is connected to the connection beam 3. The connection block 6 is not only used to connect and fix the first side plate 4 and the second side plate 5, but also used to fix the plated part 20 so that it does not shake during the electroplating process. In this embodiment, the shape of the connection block 6 is triangular, so that a group of connection blocks on both sides of the connection beam form a V shape, and two adjacent groups of connection blocks form a receiving groove 7, and the bottom of the plated part 20 is vertically placed in the corresponding receiving groove 7 and clamped and fixed by the connection block 6.
[0023] In the present invention, the height of the first side plate 4 and the second side plate 5 is increased to 250-280 mm. Increasing the height increases the shielding area of the floating frame to improve the uniformity of current distribution. As the height of the first side plate 4 and the second side plate 5 increases, the number of through holes arranged thereon is correspondingly increased. The specific method is to increase the number of rows of through holes on the first side plate 4 and the second side plate 5 so that the through holes are evenly distributed along the height direction of the first side plate / the second side plate. In the present invention, 9-10 rows of through holes are arranged on the first side plate 4 / the second side plate 5, and two adjacent rows of through holes are staggered, so that under the condition of increasing the height of the first side plate / the second side plate, the fluidity of the electroplating solution in the electroplating tank is increased, thereby avoiding the problem of thin copper thickness caused by the increase in the shielding area; and the number of rows of through holes 8 is increased, so that the current passing through the upper end and the lower end of the plated part 20 is roughly the same, thereby ensuring the uniformity of the current passing through the plated part and making the copper thickness on the surface of the plated part uniform.
[0024] Preferably, in the present invention, the diameter of the through hole 8 is 8-12 mm, more preferably 10 mm; the longitudinal spacing between two adjacent rows of through holes is 20-25 mm, and the transverse spacing between two adjacent through holes in each transverse row is 40-60 mm.
[0025] The PCB electroplating floating frame provided by the utility model can greatly improve the problem of extreme difference in copper thickness at the upper and lower ends of the plated parts, can effectively avoid the scrap rate caused by uneven circuit etching, and improve the circuit yield.
[0026] The above is a detailed description of the embodiments of the present invention, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations made to these embodiments without departing from the principle and spirit of the present invention still fall within the scope of protection of the present invention.
Claims
1. A PCB electroplating floating frame, characterized in that: It includes a first fixed plate and a second fixed plate arranged opposite to each other, a connecting beam connecting the first fixed plate and the second fixed plate, a first side plate and a second side plate distributed on both sides of the connecting beam, and a plurality of connecting blocks symmetrically distributed on both sides of the connecting beam for clamping and fixing the plated parts, one end of the connecting block is connected to the first side plate or the second side plate, and the other end is connected to the connecting beam, the height of the first side plate and the second side plate is 250-280mm, 9-10 rows of through holes are arranged thereon, and two adjacent rows of through holes are staggered.
2. The PCB electroplating floating frame according to claim 1, characterized in that: The through hole has a diameter of 8-12 mm.
3. The PCB electroplating floating frame according to claim 1, characterized in that: The longitudinal spacing between two adjacent rows of through holes is 20-25 mm.
4. The PCB electroplating floating frame according to claim 1, characterized in that: The lateral spacing between two adjacent through holes in each horizontal row is 40-60 mm.
5. The PCB electroplating floating frame according to any one of claims 1 to 4, characterized in that: The connection blocks on both sides of the connection beam form a V shape.