Semiconductor device heat dissipation performance testing device

Abstract

A heat dissipation performance testing device for a semiconductor device relates to the technical field of testing devices and comprises a testing table, two clamping seats are arranged on the testing table in parallel, the two clamping seats are rotatably arranged by taking a horizontal line as a rotating shaft, the two clamping seats are respectively and slidably arranged along the horizontal direction, and the semiconductor device is clamped through an area between the two clamping seats. A mounting plate is vertically lifted above the semiconductor device, a plurality of temperature detection probes which vertically slide are uniformly distributed on the mounting plate in a matrix manner, and the lower end parts of the temperature detection probes abut against the top surface of the semiconductor device. According to the utility model, the problem that the surface heat dissipation performance test effect of the semiconductor device is affected because the heat dissipation performance test device in the prior art detects a certain surface of the semiconductor device and the distribution positions of elements in the semiconductor device are different and the detection of the positions of multiple points on the surface of the semiconductor device cannot be realized is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of testing devices, in particular to a device for testing the heat dissipation performance of a semiconductor device. Background Art

[0002] After the semiconductor device is manufactured, it needs to be placed on a test machine for testing. When testing the semiconductor device, the pins of the semiconductor device need to be connected to an external module. However, the device under test and the flat fixture need to be reconnected for each test. The connection between the wires and the pins of the device under test is inconvenient, making the device inefficient to use. At the same time, the flat fixture is only suitable for devices under test with one pin spacing, and has a narrow scope of application.

[0003] The prior art discloses a patent with a publication number of CN218298097U, which includes a temperature control platform, a vertical tube arranged on the top of the temperature control platform, and a test platform arranged on the top of the vertical tube. A plug is arranged inside the vertical tube, and two plugs are arranged. The insides of the two plugs are fixedly connected with contact springs. A socket is embedded on one side of the surface of the vertical tube, and the socket is electrically connected to the contact spring through a wire. By setting the plug, setting the contact spring inside the plug, embedding the socket on the surface of the vertical tube, and using a wire to complete the connection between the socket and the contact spring, the pin of the device under test can be aligned with the plug and inserted into the connection, and the device under test can be compressed by the compression strip. Compared with the prior art, the installation, connection and disassembly operations of the device under test are greatly simplified, making the test operation easier and helping to improve the test efficiency.

[0004] As the existing devices including the above patents are used, the shortcomings of the technology are gradually exposed, which are mainly manifested in the following aspects:

[0005] Existing heat dissipation performance testing devices all test a certain surface of a semiconductor device. Due to the different distribution positions of components in the semiconductor device, it is impossible to test multiple points on the surface of the semiconductor device, which affects the test effect of the heat dissipation performance of the semiconductor device surface.

[0006] In summary, the prior art obviously has inconveniences and defects in practical use, so it is necessary to improve it. Utility Model Content

[0007] In view of the defects in the prior art, the utility model solves the problem that the heat dissipation performance testing devices in the traditional technology all detect a certain surface of the semiconductor device. Due to the different distribution positions of the components in the semiconductor device, it is impossible to detect multiple points on the surface of the semiconductor device, which affects the effect of the surface heat dissipation performance test of the semiconductor device.

[0008] In order to solve the above problems, the utility model provides the following technical solutions:

[0009] A semiconductor device heat dissipation performance testing device comprises a test bench, wherein two holders are arranged side by side on the test bench, the two holders are arranged to rotate with a horizontal line as a rotation axis, the two holders are also arranged to slide in a horizontal direction respectively, and the semiconductor device is clamped by the area between the two holders,

[0010] A mounting plate is vertically lifted above the semiconductor device, and a plurality of vertically sliding temperature detection probes are evenly distributed on the mounting plate in a matrix, and the lower ends of the temperature detection probes are against the top surface of the semiconductor device.

[0011] As an optimized solution, the mounting plate is provided with a compression sleeve for vertical sliding corresponding to each of the temperature detection probes, the temperature detection probe is slidably inserted into the compression sleeve, a first compression spring is mounted on the temperature detection probe, a supporting protrusion is provided on the outer wall of the temperature detection probe, and the two ends of the first compression spring are respectively against the lower end of the compression sleeve and the supporting protrusion.

[0012] As an optimized solution, the mounting plate is provided with a sliding hole, the clamping sleeve is slidably inserted in the sliding hole, a mounting groove is horizontally provided on the hole wall of the sliding hole, a positioning ball is provided in the mounting groove, a spring that resists the positioning ball is provided in the mounting groove, a plurality of positioning ring grooves are provided in parallel from top to bottom on the outer wall of the clamping sleeve, a limiting ring is fixedly connected to the notch of the mounting groove, part of the outer wall of the positioning ball extends out of the limiting ring and resists the positioning ring groove.

[0013] As an optimized solution, a pressing handle is fixedly connected to the outer wall of the upper end of the compression sleeve.

[0014] As an optimized solution, a support frame is fixedly connected to the test bench, a temperature detector body is arranged on the support frame, and the temperature detection probe is connected to the temperature detector body via a wire.

[0015] As an optimized solution, the bottom surface of the semiconductor device is arranged downward, and a connecting terminal is inserted on the pin of the semiconductor device, and the connecting terminal is connected to the main body of the semiconductor tester through a wire.

[0016] As an optimized solution, a connecting frame is fixedly connected to the mounting plate, and the connecting frame is connected to the supporting frame via a cylinder.

[0017] As an optimized solution, a pin insertion slot is provided at the upper end of the connection terminal, and is connected to the pin of the semiconductor device through the pin insertion slot.

[0018] As an optimized solution, a side plate is fixedly connected to each of the cartridges on the test bench, and a rotating drum is horizontally rotatably provided on the side plate. A driving motor for driving the rotating drum to rotate is fixedly connected to the outer wall of one of the side plates, and a sliding column is inserted into the other end of the rotating drum along the axial sliding direction, and the outer end portion of the sliding column is fixedly connected to the back side of the cartridge.

[0019] As an optimized solution, a second compression spring is mounted on the slide column, and two ends of the second compression spring are respectively against the end of the rotating drum and the back side of the holder.

[0020] As an optimized solution, a sliding hole is opened in the axial direction on the cylinder wall of the rotating cylinder, and a sliding block constrained in the sliding hole is fixedly connected to the side wall of the sliding column.

[0021] As an optimized solution, V-shaped clamping grooves are provided on opposite end surfaces of the two clamping seats.

[0022] Compared with the prior art, the beneficial effects of the utility model are:

[0023] The semiconductor device is clamped and positioned by the clamping seat. The two clamping seats can be moved outward when the semiconductor device is fixed by setting the slide column and the rotating cylinder, so as to facilitate the quick clamping of the semiconductor device.

[0024] After the semiconductor device is clamped, the connecting end is connected to the pin of the semiconductor device, and the semiconductor device is subjected to performance testing and power supply by using the semiconductor tester body. The driving motor rotates to drive the semiconductor device to rotate, so that the top surface of the semiconductor device is set upward, and then the telescopic cylinder drives the mounting plate to move downward and close to the upper surface of the semiconductor device. The pressing sleeve is pressed down by using the pressing handle, and the detection end of the temperature detection probe is pressed against the top surface of the semiconductor device under the action of the first compression spring, so as to detect the semiconductor device during operation. Since a number of temperature detection probes are evenly distributed on the mounting plate, multi-point detection of the surface of the semiconductor device can be achieved, and the temperature detector body is used to measure the temperature of multiple positions of the semiconductor device, thereby improving the test effect of the heat dissipation performance of the surface of the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the specific implementation or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0026] Figure 1 It is a structural schematic diagram of the utility model;

[0027] Figure 2 It is a structural schematic diagram of the compression sleeve of the utility model.

[0028] In the figure: 1-test bench; 2-card holder; 3-semiconductor device; 4-connecting terminal; 5-semiconductor tester body; 6-side plate; 7-driving machine; 8-rotating drum; 9-sliding column; 10-mounting plate; 11-temperature detection probe; 12-pressing sleeve; 13-supporting protrusion; 14-first compression spring; 15-pressing handle; 16-mounting groove; 17-positioning ball; 18-spring; 19-positioning ring groove; 20-connecting frame; 21-cylinder; 22-temperature detector body; 23-support frame; 24-second compression spring; 25-sliding hole; 26-sliding block. DETAILED DESCRIPTION

[0029] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.

[0030] like Figure 1 and Figure 2 As shown, a semiconductor device heat dissipation performance test device includes a test bench 1, on which two chucks 2 are arranged in parallel, the two chucks 2 are arranged to rotate with a horizontal line as a rotation axis, and the two chucks 2 are also arranged to slide in a horizontal direction respectively, and a semiconductor device 3 is clamped by the area between the two chucks 2.

[0031] A mounting plate 10 is vertically raised and lowered above the semiconductor device 3 , and a plurality of vertically sliding temperature detection probes 11 are evenly distributed in a matrix on the mounting plate 10 , and the lower ends of the temperature detection probes 11 abut against the top surface of the semiconductor device 3 .

[0032] The mounting plate 10 is provided with a compression sleeve 12 for vertical sliding corresponding to each temperature detection probe 11. The temperature detection probe 11 is slidably inserted into the compression sleeve 12. A first compression spring 14 is mounted on the temperature detection probe. A supporting protrusion 13 is provided on the outer wall of the temperature detection probe 11. The two ends of the first compression spring 14 are respectively against the lower end of the compression sleeve 12 and the supporting protrusion 13.

[0033] The mounting plate 10 is provided with a sliding hole 25, and the compression sleeve 12 is slidably inserted into the sliding hole 25. A mounting groove 16 is horizontally provided on the hole wall of the sliding hole 25, and a positioning ball 17 is provided in the mounting groove 16. A spring 18 that abuts against the positioning ball 17 is provided in the mounting groove 16. A plurality of positioning ring grooves 19 are arranged in parallel from top to bottom on the outer wall of the compression sleeve 12. The notch of the mounting groove 16 is fixedly connected to a limiting ring, and part of the outer wall of the positioning ball 17 extends out of the limiting ring and abuts against the positioning ring groove 19.

[0034] A pressing handle 15 is fixedly connected to the outer wall of the upper end of the compression sleeve 12 .

[0035] A support frame 23 is fixedly connected to the test bench 1 , a temperature detector body 22 is arranged on the support frame 23 , and the temperature detection probe 11 is connected to the temperature detector body 22 via a wire.

[0036] The bottom surface of the semiconductor device 3 is arranged downward, and a connection terminal 4 is inserted into the pins of the semiconductor device 3 , and the connection terminal 4 is connected to a semiconductor tester body 5 through a wire.

[0037] A connecting frame 20 is fixedly connected to the mounting plate 10 , and the connecting frame 20 is connected to the supporting frame 23 via a cylinder 21 .

[0038] A pin insertion slot is formed at the upper end of the connection terminal 4 and is connected to the pin of the semiconductor device 3 through the pin insertion slot.

[0039] A side plate 6 is fixedly connected to each holder 2 on the test bench 1, and a rotating drum 8 is horizontally rotatably provided on the side plate 6. A driving machine 7 for driving the rotating drum 8 to rotate is fixedly connected to the outer wall of one of the side plates 6, and a sliding column 9 is inserted into the other end of the rotating drum 8 for axial sliding, and the outer end portion of the sliding column 9 is fixedly connected to the back side of the holder 2.

[0040] A second compression spring 24 is sleeved on the slide post 9 , and two ends of the second compression spring 24 abut against the end of the rotating drum 8 and the back surface of the cassette 2 respectively.

[0041] A sliding hole 25 is axially provided on the wall of the rotating drum 8 , and a sliding block 26 constrained in the sliding hole 25 is fixedly connected to the side wall of the sliding column 9 .

[0042] V-shaped clamping grooves are provided on opposite end surfaces of the two clamping seats 2 .

[0043] The working principle of this device is:

[0044] The semiconductor device 3 is clamped and positioned by the clamping seat 2. The slide column 9 and the rotating cylinder 8 are provided to move the two clamping seats 2 outward when the semiconductor device 3 is fixed, so as to facilitate the quick clamping of the semiconductor device 3.

[0045] After the semiconductor device 3 is clamped, the connecting terminal 4 is connected to the pin of the semiconductor device 3, and the semiconductor tester body 5 is used to perform performance testing and power supply on the semiconductor device 3. The driving machine 7 rotates to drive the semiconductor device 3 to rotate, so that the top surface of the semiconductor device 3 is set upward, and then the telescopic cylinder drives the mounting plate 10 to move downward and approach the upper surface of the semiconductor device 3. The pressing sleeve 12 is pressed down by the pressing handle 15, and the detection end of the temperature detection probe 11 is abutted against the top surface of the semiconductor device 3 under the action of the first compression spring 14, so as to detect the semiconductor device 3 during the working process. Since a plurality of temperature detection probes 11 are evenly distributed on the mounting plate 10, multi-point detection of the surface of the semiconductor device 3 can be achieved, and the temperature detector body 22 is used to measure the temperature of multiple positions of the semiconductor device 3, thereby improving the test effect of the heat dissipation performance of the surface of the semiconductor device 3.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model, and they should all be included in the scope of the claims and specification of the utility model.

Claims

1. A semiconductor device heat dissipation performance test device, characterized in that: The test bench (1) comprises two chucks (2) arranged in parallel on the test bench (1), the two chucks (2) being rotatably arranged with a horizontal line as a rotation axis, the two chucks (2) being also slidably arranged in a horizontal direction, and a semiconductor device (3) being clamped by an area between the two chucks (2), A mounting plate (10) is vertically raised and lowered above the semiconductor device (3), and a plurality of vertically sliding temperature detection probes (11) are evenly distributed on the mounting plate (10) in a matrix pattern, the lower ends of the temperature detection probes (11) being in contact with the top surface of the semiconductor device (3).

2. The semiconductor device heat dissipation performance testing device according to claim 1, characterized in that: The mounting plate (10) is provided with a compression sleeve (12) for vertical sliding corresponding to each of the temperature detection probes (11); the temperature detection probe (11) is slidably inserted into the compression sleeve (12); a first compression spring (14) is sleeved on the temperature detection probe; a supporting protrusion (13) is provided on the outer wall of the temperature detection probe (11); two ends of the first compression spring (14) respectively abut against the lower end of the compression sleeve (12) and the supporting protrusion (13).

3. The semiconductor device heat dissipation performance testing device according to claim 2, characterized in that: The mounting plate (10) is provided with a sliding hole (25), the compression sleeve (12) is slidably inserted into the sliding hole (25), a mounting groove (16) is horizontally provided on the hole wall of the sliding hole (25), a positioning ball (17) is provided in the mounting groove (16), a spring (18) abutting against the positioning ball (17) is provided in the mounting groove (16), a plurality of positioning ring grooves (19) are arranged in parallel from top to bottom on the outer wall of the compression sleeve (12), a limiting ring is fixedly connected to the notch of the mounting groove (16), a part of the outer wall of the positioning ball (17) protrudes from the limiting ring and abuts against the positioning ring groove (19).

4. The semiconductor device heat dissipation performance testing device according to claim 3, characterized in that: A support frame (23) is fixedly connected to the test bench (1), a temperature detector body (22) is arranged on the support frame (23), and the temperature detection probe (11) is connected to the temperature detector body (22) via a wire.

5. The semiconductor device heat dissipation performance testing device according to claim 4, characterized in that: The bottom surface of the semiconductor device (3) is arranged downward, and a connection terminal (4) is inserted into the pins of the semiconductor device (3), and the connection terminal (4) is connected to a semiconductor tester body (5) via a wire.

6. The semiconductor device heat dissipation performance testing device according to claim 5, characterized in that: A connecting frame (20) is fixedly connected to the mounting plate (10), and the connecting frame (20) is connected to the supporting frame (23) via a cylinder (21).

7. The semiconductor device heat dissipation performance testing device according to claim 6, characterized in that: The upper end of the connection terminal (4) is provided with a pin insertion slot, and is connected to the pin of the semiconductor device (3) through the pin insertion slot.

8. The semiconductor device heat dissipation performance testing device according to claim 7, characterized in that: The test bench (1) is fixedly connected to a side plate (6) corresponding to each of the holders (2), and a rotating drum (8) is provided on the side plate (6) for horizontal rotation. A driving machine (7) for driving the rotating drum (8) to rotate is fixedly connected to the outer wall of one of the side plates (6), and a sliding column (9) is inserted into the other end of the rotating drum (8) for axial sliding, and the outer end of the sliding column (9) is fixedly connected to the back side of the holder (2).

9. The semiconductor device heat dissipation performance testing device according to claim 8, characterized in that: The slide column (9) is sleeved with a second compression spring (24), and the two ends of the second compression spring (24) respectively abut against the end of the rotating drum (8) and the back surface of the holder (2).

10. The semiconductor device heat dissipation performance testing device according to claim 9, characterized in that: A sliding hole (25) is axially provided on the wall of the rotating cylinder (8), and a sliding block (26) constrained in the sliding hole (25) is fixedly connected to the side wall of the sliding column (9).

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