Novel structure of CPU radiator

Abstract

The utility model belongs to the technical field of computer accessories, particularly relates to a novel structure of a CPU (central processing unit) radiator, and aims to solve the problems that the conventional heat pipe radiator adopts a heat conduction mode to cool and radiate a CPU, the radiating efficiency is low, and certain dust is attached to the surface of the conventional heat pipe radiator in a long-term use process, so that the heat pipe radiator cannot be damaged. According to the technical scheme, the heat dissipation device comprises a bottom plate, a contact plate is fixedly installed at the bottom of the bottom plate, and a conduction column is fixedly installed at the top of the contact plate. When a CPU works, heat generated by the CPU can be stably output, so that cooling and heat dissipation can be conducted on the CPU, and the service life of the CPU is prolonged. And air can be blown to the heat dissipation fins by starting the multiple fans, so that heat conducted to the heat dissipation fins can be quickly blown away, it can be guaranteed that the heat dissipation fins have the continuous heat absorption capacity, and stable cooling and heat dissipation can be conducted on the CPU.

Description

Technical Field

[0001] The utility model relates to the technical field of computer accessories, in particular to a new structure of a CPU radiator. Background Art

[0002] The CPU will generate a lot of heat when working. If the heat is not dissipated in time, it will cause a crash. Therefore, a CPU cooler is installed inside to dissipate the CPU heat.

[0003] The CPU radiators currently used are divided into air-cooled radiators, heat pipe radiators and water-cooled radiators. However, in the design of the heat pipe radiator, it only uses heat conduction to cool the CPU, which has low heat dissipation efficiency. In addition, during long-term use of the heat pipe radiator, a certain amount of dust will adhere to its surface, which will affect the working efficiency of the radiator. Therefore, the present technical solution proposes a new structure of a CPU radiator to solve the above-mentioned problems. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings that the existing heat pipe radiator uses heat conduction to cool down and dissipate heat for the CPU, such heat dissipation efficiency is low, and a certain amount of dust will adhere to the surface of the heat pipe radiator during long-term use, which will affect the working efficiency of the radiator, and a new structure of the CPU radiator is proposed.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A novel structure of a CPU radiator includes a bottom plate, a contact plate is fixedly installed at the bottom of the bottom plate, a conductive column is fixedly installed on the top of the contact plate, the top of the conductive column extends to the top of the bottom plate and is fixedly installed with a heat distribution plate, and the heat distribution plate is fixedly installed on the top of the bottom plate. The novel structure of the CPU radiator also includes:

[0007] Multiple positioning frames are fixedly installed on the top of the heat distribution plate at equal intervals;

[0008] The heat dissipation mechanism is respectively mounted on the plurality of positioning frames and is used to dissipate the heat conducted by the CPU;

[0009] The clamping mechanism is installed on the top of the bottom plate, and the clamping mechanism is clamped with the heat dissipation mechanism respectively;

[0010] The air cooling mechanism is installed on one side of the clamping mechanism.

[0011] In a possible design, the heat dissipation mechanism includes multiple heat dissipation fins, and the multiple heat dissipation fins are respectively plugged and mounted in corresponding positioning frames. The same support tube is fixedly installed through the multiple heat dissipation fins. The support tube is provided in multiple numbers, and the multiple heat dissipation fins are all mounted with the mounting mechanism.

[0012] In a possible design, the clamping mechanism includes a fixing frame fixedly mounted on the top of the base plate, a plurality of air outlet holes are provided in a matrix on the inner wall on one side of the fixing frame, a plurality of ventilation holes are provided at equal intervals on the inner wall on the other side of the fixing frame, an air cooling mechanism is mounted on one side of the fixing frame, positioning components are installed on the top of both sides of the fixing frame, the tops of the two positioning components are connected to the same pressure plate, a plurality of limit frames are fixedly mounted at equal intervals on the bottom of the pressure plate, and the limit frames are clamped with corresponding heat sink fins.

[0013] In a possible design, the positioning assembly includes a positioning cover fixedly mounted on the top of one side of a fixing frame, two positioning plates are symmetrically fixedly mounted on the bottom of the pressure plate, the bottoms of the two positioning plates respectively extend into the corresponding positioning covers, a limiting protrusion is provided on the top inner wall of one side of the positioning cover, a positioning protrusion is provided on the bottom of one side of the positioning plate, and the positioning protrusion is clamped with the limiting protrusion.

[0014] In a possible design, the air cooling mechanism includes a fixed plate fixedly mounted on one side of a fixed frame, a plurality of flow holes are opened on the fixed plate at equal intervals, and a plurality of fans are fixedly mounted on one side of the fixed plate at equal intervals, and the plurality of fans correspond to the plurality of flow holes respectively.

[0015] In a possible design, a card mounting frame is fixedly mounted on the bottom of the base plate, and the contact plate is located in the card mounting frame.

[0016] In the present application, firstly, the bottom of the contact plate is coated with silicone grease, and then the bottom plate is installed on the computer motherboard, and the contact plate is closely contacted with the CPU through the coated silicone grease, and then a plurality of heat sink fins can be inserted into the corresponding positioning frames, and then the two positioning plates on the pressure plate are respectively inserted into the corresponding positioning covers, at this time, the positioning protrusions and the limiting protrusions are stably clamped together, so that the pressure plate can be stably limited, and at the same time, when the pressure plate is pushed downward, a plurality of limiting frames can be used to clamp the plurality of heat sink fins, so that the heat sink fins can be stably limited, so that the heat sink fins are tightly clamped with the corresponding positioning frames, so that the C The heat generated by the PU is output stably. When the CPU is working, the heat generated by the CPU can be dispersed and transmitted to multiple cooling fins through the contact plate, conduction column, heat distribution plate and multiple positioning frames. At this time, the heat generated by the CPU can be dissipated conveniently, so the stable operation of the CPU can be guaranteed. At the same time, multiple fans can be started to blow air into the fixed frame to accelerate the flow of air between each cooling fin, so as to assist the cooling fins in cooling and dissipating heat. In actual use, it can be ensured that the cooling fins have the ability to absorb heat continuously, so the CPU can be cooled and dissipated stably, so that the CPU can work stably.

[0017] Beneficial effects:

[0018] In the utility model, the novel structure of the CPU heat sink can, through the heat dissipation mechanism, after the contact plate contacts the CPU, the heat generated by the CPU can be dispersed and transported to multiple heat dissipation fins through the contact plate, the conduction column, the heat distribution plate and multiple positioning frames, so that the heat generated by the CPU can be conveniently dissipated, so that the stable operation of the CPU can be guaranteed;

[0019] In the utility model, the novel structure of the CPU heat sink can be clamped and matched with the corresponding heat sink fins after the pressure plate is clamped on the fixing frame through the clamping mechanism, so that the heat sink fins can be stably limited, so that the heat sink fins can be tightly clamped with the corresponding positioning frames, so that the heat generated by the CPU can be stably output;

[0020] In the utility model, the novel structure of the CPU radiator can work after multiple fans are powered on through the air cooling mechanism, so as to blow air into the fixing frame, so that the air between each heat dissipation fin can flow faster, so as to assist the heat dissipation fins in cooling and dissipating heat;

[0021] After the contact plate is stably in contact with the CPU, the utility model can stably output the heat generated by the CPU when the CPU is working, so as to cool and dissipate the heat of the CPU, and can start multiple fans to blow air to multiple cooling fins, so as to quickly dissipate the heat conducted to the cooling fins, so as to ensure that the cooling fins have the ability to absorb heat continuously, so as to cool and dissipate the heat of the CPU stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional schematic diagram of a new structure of a CPU radiator proposed by the utility model from a first perspective;

[0023] Figure 2 A three-dimensional schematic diagram of the second perspective structure of a new structure of a CPU radiator proposed by the utility model;

[0024] Figure 3 A three-dimensional schematic diagram of the cross-sectional structure of a new structure of a CPU radiator proposed by the utility model;

[0025] Figure 4 A three-dimensional schematic diagram of a new structure of a base plate and a plurality of heat dissipation fins connection structure of a CPU heat sink proposed by the utility model;

[0026] Figure 5 A three-dimensional schematic diagram of a connection structure of a base plate, a contact plate and a limit frame of a new structure of a CPU radiator proposed by the utility model;

[0027] Figure 6 A three-dimensional schematic diagram of a connection structure of multiple cooling fins and multiple supporting tubes of a new structure of a CPU radiator proposed by the utility model.

[0028] In the figure: 1, bottom plate; 2, heat distribution plate; 3, conduction column; 4, contact plate; 5, clamping frame; 6, positioning frame; 7, heat sink fin; 71, support tube; 8, fixing frame; 9, pressure plate; 10, positioning plate; 11, positioning cover; 12, limiting protrusion; 13, positioning protrusion; 14, fixing plate; 15, fan; 16, ventilation hole; 17, limiting frame. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0030] Example 1

[0031] Reference Figure 1-6A new structure includes a base plate 1, multiple positioning frames 6, a heat dissipation mechanism, a clamping mechanism and an air cooling mechanism. A contact plate 4 is fixedly installed at the bottom of the base plate 1, a conduction column 3 is fixedly installed on the top of the contact plate 4, the top of the conduction column 3 extends to the top of the base plate 1 and is fixedly installed with a heat distribution plate 2, the heat distribution plate 2 is fixedly installed on the top of the base plate 1, multiple positioning frames 6 are fixedly installed on the top of the heat distribution plate 2 at equal intervals, the heat dissipation mechanism is respectively clamped with the multiple positioning frames 6, the heat dissipation mechanism is used to dissipate the heat conducted by the CPU, the clamping mechanism is installed on the top of the base plate 1, the clamping mechanism is respectively clamped with the heat dissipation mechanism, and the air cooling mechanism is installed on one side of the clamping mechanism.

[0032] The heat dissipation mechanism includes a plurality of heat dissipation fins 7, and the plurality of heat dissipation fins 7 are respectively plugged and mounted in corresponding positioning frames 6. The same support tube 71 is fixedly installed through the plurality of heat dissipation fins 7. The support tube 71 is provided in plurality, and the plurality of heat dissipation fins 7 are all mounted with the mounting mechanism. After the contact plate 4 comes into contact with the CPU, the heat generated by the CPU can be dispersedly transported to the plurality of heat dissipation fins 7 through the contact plate 4, the conduction column 3, the heat distribution plate 2 and the plurality of positioning frames 6. At this time, the heat generated by the CPU can be conveniently dissipated, so the stable operation of the CPU can be guaranteed.

[0033] The mounting mechanism includes a fixing frame 8 fixedly mounted on the top of the base plate 1, a plurality of air outlet holes are provided in a matrix on the inner wall on one side of the fixing frame 8, a plurality of ventilation holes 16 are provided on the inner wall on the other side of the fixing frame 8 at equal intervals, an air cooling mechanism is mounted on one side of the fixing frame 8, positioning components are installed on the tops of both sides of the fixing frame 8, the tops of the two positioning components are connected to the same pressing plate 9, a plurality of limiting frames 17 are fixedly mounted at equal intervals on the bottom of the pressing plate 9, the limiting frames 17 are clamped with the corresponding heat dissipation fins 7, after the pressing plate 9 is clamped on the fixing frame 8, the plurality of limiting frames 17 can be clamped with the corresponding heat dissipation fins 7, so as to achieve stable limiting of the heat dissipation fins 7, so that the heat dissipation fins 7 can be tightly clamped with the corresponding positioning frames 6, so that the heat generated by the CPU can be stably output.

[0034] The air cooling mechanism includes a fixing plate 14 fixedly installed on one side of the fixing frame 8, a plurality of flow holes are opened on the fixing plate 14 at equal intervals, and a plurality of fans 15 are fixedly installed on one side of the fixing plate 14 at equal intervals, and the plurality of fans 15 correspond to the plurality of flow holes respectively. After the plurality of fans 15 are powered on, they work, so that air can be blown into the fixing frame 8, so that the air between the heat dissipation fins 7 flows faster, so as to assist the heat dissipation fins 7 in cooling down and dissipating heat.

[0035] The present application can be used in the field of computer accessories technology, and can also be used in other fields applicable to the present application.

[0036] Example 2

[0037] refer to Figure 2 and 3 , improved on the basis of embodiment 1: a new structure of a CPU radiator, which is applied to the technical field of computer accessories, the positioning component includes a positioning cover 11 fixedly installed on the top of one side of a fixing frame 8, two positioning plates 10 are symmetrically fixedly installed on the bottom of the pressing plate 9, and the bottoms of the two positioning plates 10 extend into the corresponding positioning cover 11 respectively, and a limiting protrusion 12 is arranged on the inner wall of the top of one side of the positioning cover 11, and a positioning protrusion 13 is arranged on the bottom of one side of the positioning plate 10. The positioning protrusion 13 and the limiting protrusion 12 are clamped together. After the positioning plate 10 is inserted into the corresponding positioning cover 11, the positioning protrusion 13 and the limiting protrusion 12 are stably clamped and matched, so that the pressing plate 9 can be stably limited, so that the multiple heat dissipation fins 7 can be stably limited. A clamping frame 5 is fixedly installed at the bottom of the bottom plate 1, and the contact plate 4 is located in the clamping frame 5. When the contact plate 4 is fitted and contacted with the CPU, the clamping frame 5 can be used to guide and limit, so that the contact plate 4 can be completely fitted and contacted with the CPU.

[0038] However, as is well known to those skilled in the art, the working principle and wiring method of the fan 15 are commonplace, and are conventional means or common knowledge, and will not be elaborated here. Those skilled in the art may make any optional selections according to their needs or convenience.

[0039] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A novel structure of a CPU heat sink, comprising a base plate (1), a contact plate (4) fixedly mounted on the bottom of the base plate (1), a conductive column (3) fixedly mounted on the top of the contact plate (4), the top of the conductive column (3) extending to the top of the base plate (1) and fixedly mounted with a heat distribution plate (2), the heat distribution plate (2) fixedly mounted on the top of the base plate (1), characterized in that: The new structure of the CPU cooler also includes: A plurality of positioning frames (6), wherein the plurality of positioning frames (6) are fixedly installed at equal intervals on the top of the heat distribution plate (2); A heat dissipation mechanism, the heat dissipation mechanism is respectively mounted on a plurality of positioning frames (6), and the heat dissipation mechanism is used to dissipate heat conducted from the CPU; A clamping mechanism, the clamping mechanism is mounted on the top of the bottom plate (1), and the clamping mechanism is clamped with the heat dissipation mechanism respectively; The air cooling mechanism is installed on one side of the clamping mechanism.

2. A novel structure of a CPU radiator according to claim 1, characterized in that: The heat dissipation mechanism comprises a plurality of heat dissipation fins (7), the plurality of heat dissipation fins (7) are respectively plugged and mounted in corresponding positioning frames (6), a same support tube (71) is fixedly mounted through the plurality of heat dissipation fins (7), a plurality of support tubes (71) are provided, and the plurality of heat dissipation fins (7) are all mounted in a mounting mechanism.

3. A novel structure of a CPU radiator according to claim 1, characterized in that: The clamping mechanism comprises a fixing frame (8) fixedly mounted on the top of the base plate (1), a plurality of air outlet holes being provided in a matrix on the inner wall of one side of the fixing frame (8), a plurality of ventilation holes (16) being provided at equal intervals on the inner wall of the other side of the fixing frame (8), an air cooling mechanism being mounted on one side of the fixing frame (8), positioning components being mounted on the tops of both sides of the fixing frame (8), the tops of the two positioning components being connected to the same pressing plate (9), a plurality of limiting frames (17) being fixedly mounted at equal intervals on the bottom of the pressing plate (9), the limiting frames (17) being clamped to the corresponding heat dissipation fins (7).

4. A novel structure of a CPU radiator according to claim 3, characterized in that: The positioning assembly comprises a positioning cover (11) fixedly mounted on the top of one side of the fixing frame (8); two positioning plates (10) are symmetrically fixedly mounted on the bottom of the pressing plate (9); the bottoms of the two positioning plates (10) respectively extend into the corresponding positioning covers (11); a limiting protrusion (12) is arranged on the inner wall of the top of one side of the positioning cover (11); a positioning protrusion (13) is arranged on the bottom of one side of the positioning plate (10); the positioning protrusion (13) is clamped with the limiting protrusion (12).

5. The novel structure of a CPU radiator according to claim 1, characterized in that: The air cooling mechanism comprises a fixed plate (14) fixedly mounted on one side of the fixed frame (8), a plurality of flow holes being provided on the fixed plate (14) at equal intervals, and a plurality of fans (15) being fixedly mounted on one side of the fixed plate (14) at equal intervals, the plurality of fans (15) corresponding to the plurality of flow holes respectively.

6. The novel structure of a CPU radiator according to claim 1, characterized in that: A card-mounting frame (5) is fixedly mounted on the bottom of the base plate (1), and the contact plate (4) is located inside the card-mounting frame (5).

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