Memory card

Abstract

The utility model discloses a memory card, which comprises a substrate, a memory device and a rigid layer, the memory device is fixedly arranged on the substrate, and the rigid layer is attached to a first surface of the substrate; wherein the rigid layer extends in the longitudinal direction of the first surface to the edges of the two opposite sides. Through the structure, the structural stability and reliability of the memory card are improved by utilizing the rigidity of the rigid layer, and the anti-falling and anti-deformation capabilities of the memory card are improved.

Description

Technical Field

[0001] The utility model is applied to the technical field of storage cards. Background Art

[0002] Memory cards are independent storage media used in mobile phones, digital cameras, portable computers, MP3s and other digital products. They are generally in the form of cards, so they are collectively referred to as "memory cards", also known as "digital memory cards", "digital storage cards", etc.

[0003] Current memory cards are monolithic designs that are molded in one go using a substrate and a special plastic packaging material.

[0004] However, this design cannot meet the memory card's requirements for anti-fall, anti-deformation and other properties. Utility Model Content

[0005] The utility model provides a memory card to solve the problem that the memory card cannot meet the requirements of anti-fall, anti-deformation and the like.

[0006] In order to solve the above technical problems, the utility model provides a memory card, comprising: a substrate, a storage device and a rigid layer, wherein the storage device is fixedly arranged on the substrate, and the rigid layer is arranged in contact with the first surface of the substrate; wherein the rigid layer extends along the longitudinal direction of the first surface to the opposite side edges.

[0007] The storage device includes a storage device and an interface connected to each other; the storage device is arranged in contact with the first surface of the substrate and is spaced apart from the rigid layer; the interface is arranged in contact with a side edge of the second surface of the substrate; and the second surface is the opposite surface of the first surface.

[0008] The storage device includes a controller, a storage unit and a resistor-capacitor device; the controller is connected to the storage unit, the interface and the resistor-capacitor device respectively, and the storage unit is also connected to the resistor-capacitor device.

[0009] Among them, the rigid layer includes a first transverse portion and two first longitudinal portions; the two first longitudinal portions are arranged at intervals and extend along the longitudinal direction on the first surface respectively until reaching the corresponding edges on the opposite sides; the first transverse portion extends along the transverse direction of the first surface, and the opposite ends of the first transverse portion are respectively connected to the two first longitudinal portions.

[0010] Among them, the rigid layer includes two second transverse portions and a second longitudinal portion; the two second transverse portions are spaced apart and extend along the transverse direction of the first surface respectively until reaching the corresponding edges on both sides; the second longitudinal portion extends along the longitudinal direction of the first surface, and the opposite ends of the second longitudinal portion are respectively connected to the two second transverse portions.

[0011] The rigid layer includes a third transverse portion and a third longitudinal portion; the third transverse portion extends along the transverse direction of the first surface, and the third longitudinal portion extends along the longitudinal direction of the first surface; the third transverse portion is vertically connected to the third longitudinal portion.

[0012] The rigid layer includes two fourth longitudinal portions; the two fourth longitudinal portions are arranged at an interval and extend along the longitudinal direction on the first surface respectively until reaching the corresponding edges on two opposite sides.

[0013] The memory card further includes a plastic packaging layer, which wraps the entire substrate and covers the storage device and the rigid layer.

[0014] The rigid layer is bonded and fixed to the first surface of the substrate via the bonding layer.

[0015] The rigid layer includes a metal layer, and the thickness of the rigid layer is in the range of 0.15-0.35 mm.

[0016] The beneficial effects of the utility model are as follows: Different from the prior art, the memory card of the utility model includes a substrate, a storage device and a rigid layer, the storage device is fixedly arranged on the substrate, the rigid layer is arranged in contact with the first surface of the substrate, and the rigid layer extends along the longitudinal direction of the first surface, thereby utilizing the rigidity of the rigid layer to improve the structural stability and reliability of the memory card, and improve the anti-fall and anti-deformation capabilities of the memory card. The arrangement of the rigid layer in the longitudinal direction of the first surface can also improve the longitudinal protection of the memory card by the rigid layer, reduce the deformation of the memory card in the longitudinal direction, and further improve the anti-fall and anti-deformation capabilities of the memory card. Among them, the covering arrangement of the rigid layer on the substrate can also provide the substrate with a waterproof and dustproof effect, further improving the reliability of the memory card. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a horizontal structural schematic diagram of the first embodiment of the memory card provided by the utility model;

[0018] Figure 2 yes Figure 1 A schematic diagram of the connection structure of the storage device in the embodiment;

[0019] Figure 3 It is a schematic diagram of the top view of the structure of the first embodiment of the memory card provided by the utility model;

[0020] Figure 4 It is a schematic diagram of the top view of the structure of the second embodiment of the memory card provided by the utility model;

[0021] Figure 5 It is a schematic diagram of the top view of the structure of the third embodiment of the memory card provided by the utility model;

[0022] Figure 6 It is a schematic diagram of the top view of the structure of the fourth embodiment of the memory card provided by the utility model;

[0023] Figure 7 is a schematic top view of the structure of the fifth embodiment of the memory card provided by the utility model;

[0024] Figure 8 is a schematic diagram of a top view of the structure of a sixth embodiment of a memory card provided by the utility model;

[0025] Fig. 9 It is a top view structural diagram of the seventh embodiment of the memory card provided by the utility model. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0029] See also Figure 1 , Figure 1 It is a schematic diagram of the horizontal structure of the first embodiment of the memory card provided by the utility model.

[0030] The memory card 100 of this embodiment includes: a substrate 110, a storage device 130, and a rigid layer 120. The substrate 110 may be a printed circuit board, and is used to realize the connection between the storage devices 130.

[0031] The storage device 130 is fixedly disposed on the substrate 110 ; the storage device 130 is used to implement the storage function of the memory card 100 .

[0032] The rigid layer 120 is disposed in contact with the first surface 111 of the substrate 110 . The rigid layer 120 is disposed in the longitudinal direction of the first surface 111 , and extends along the longitudinal direction of the first surface 111 to the opposite side edges.

[0033] The memory card 100 is generally in the shape of a rectangle with one corner missing, and its longitudinal direction is the direction in which the long side of the rectangle extends, while the transverse direction is the direction in which the short side of the rectangle extends.

[0034] In this embodiment, by arranging the rigid layer 120 in the longitudinal direction of the memory card 100, the rigidity of the rigid layer 120 is utilized to improve the structural stability and reliability of the memory card 100, and improve the drop resistance and deformation resistance of the memory card 100. Since the memory card 100 is in a rectangular shape, it will generally be subjected to more stress in the longitudinal direction. Therefore, arranging the rigid layer 120 in the longitudinal direction of the first surface 111 can improve the longitudinal protection of the rigid layer 120 on the memory card 100, reduce the occurrence of deformation of the memory card 100 in the longitudinal direction, and further improve the drop resistance and deformation resistance of the memory card 100.

[0035] The material of the rigid layer 120 includes but is not limited to metal, stone, hard plastic, glass cloth and other rigid materials.

[0036] Through the above structure, the memory card of this embodiment includes a substrate, a storage device and a rigid layer, the storage device is fixedly arranged on the substrate, the rigid layer is arranged in contact with the first surface of the substrate, and the rigid layer extends along the longitudinal direction of the first surface, so as to improve the structural stability and reliability of the memory card by utilizing the rigidity of the rigid layer, and improve the anti-fall and anti-deformation capabilities of the memory card. The rigid layer is arranged in the longitudinal direction of the first surface, which can also improve the longitudinal protection of the memory card by the rigid layer, reduce the deformation of the memory card in the longitudinal direction, and further improve the anti-fall and anti-deformation capabilities of the memory card. Among them, the covering arrangement of the rigid layer on the substrate can also provide the substrate with a waterproof and dustproof effect, further improving the reliability of the memory card.

[0037] In some embodiments, the storage device 130 includes a storage device 134 and an interface 133 connected to each other; the storage device 134 is a device in the storage device 130 specifically used for data storage, and the interface 133 is a connector in the storage device 130 that is connected to the outside. The interface 133 may include but is not limited to connectors such as gold fingers, pads, or pins.

[0038] The storage device 134 is disposed in contact with the first surface 111 of the substrate 110 and is spaced apart from the rigid layer 120 to avoid mutual influence.

[0039] The interface 133 is arranged in affixed relation with a side edge of the second surface 112 of the substrate 110; wherein the second surface 112 is the opposite surface of the first surface 111. The interface 133 is arranged on the second surface 112, that is, the second surface 112 bears the function of connecting the memory card 100 to the outside. Therefore, in this embodiment, the memory device 134 and the rigid layer 120 are arranged on the opposite first surface 111 to reduce the occurrence of situations where the memory device 134 and the rigid layer 120 are affected when the memory card 100 is connected to the outside.

[0040] Please read further Figure 2 , Figure 2 yes Figure 1 Schematic diagram of the connection structure of the storage device in the embodiment.

[0041] In some embodiments, the storage device 134 includes a controller 132 , a storage unit 131 and a resistor-capacitor device 135 ; the controller 132 is connected to the storage unit 131 , the interface 133 and the resistor-capacitor device 135 respectively, and the storage unit 131 is also connected to the resistor-capacitor device 135 .

[0042] The storage unit 131 may include but is not limited to one or more of a flash storage unit, a flash memory storage unit, an SRAM storage unit (static random access memory), a DRAM storage unit (dynamic random access memory), etc., and may be specifically determined based on the storage type of the storage card 100.

[0043] In other embodiments, the storage device 134 may further include other components, which may be specifically determined based on the storage type of the memory card 100 .

[0044] In some embodiments, the rigid layer 120 may include a metal layer, such as a copper layer, a silver layer, or an alloy layer.

[0045] By setting the rigid layer 120 as a metal layer, the rigidity of the metal layer can be used to improve the structural stability and reliability of the memory card 100, the heat dissipation efficiency of the memory card 100 can be improved by using the heat dissipation characteristics of the metal, and the signal anti-shielding effect of the memory card 100 can be improved by using the anti-shielding characteristics of the metal, thereby improving the stability and reliability of data storage.

[0046] In some embodiments, the rigid layer 120 is bonded and fixed to the first surface 111 of the substrate 110 via a bonding layer 121 .

[0047] The adhesive layer 121 may include, but is not limited to, glue or a solder layer in SMT (surface mount technology) mounting.

[0048] In some embodiments, the thickness of the rigid layer 120 is in the range of 0.15-0.35 mm, and specifically may include but is not limited to 0.15 mm, 0.20 mm, 0.22 mm, 0.25 mm, 0.28 mm, 0.30 mm, 0.34 mm or 0.35 mm, etc. The rigid layer 120 within this range can provide sufficient rigid support for the memory card 100, while avoiding being too thick to increase the volume of the memory card 100 and affect the miniaturization of the memory card 100.

[0049] In some embodiments, the memory card 100 further includes a plastic encapsulation layer 140 , which wraps around the entire substrate 110 and covers the storage device 130 and the rigid layer 120 .

[0050] The plastic packaging layer 140 may include one or more insulating materials such as epoxy resin, polyester resin (PET), polyimide, polyimide, polycarbonate (PC), bismaleimide triazine (BT), ceramic-based, etc.

[0051] By providing a plastic encapsulation layer 140 on the periphery of the substrate 110, the structural stability and reliability between the substrate 110, the storage device 130 and the rigid layer 120 can be improved by wrapping the plastic encapsulation layer 140, and a buffer can be provided on the periphery of the memory card 100 to reduce the external stress received by the internal substrate 110, the storage device 130 and the rigid layer 120, thereby further improving the structural stability of the memory card 100.

[0052] See also Figure 3 , Figure 3 It is a schematic diagram of the top view of the structure of the first embodiment of the memory card provided by the utility model. For the convenience of observing this embodiment, the plastic sealing layer is hidden.

[0053] The rigid layer 120 of this embodiment extends along the longitudinal direction Y of the first surface 111 to the edges on both sides. The rigid layer 120 can be arranged in the middle or edge of the first surface 111 in the transverse direction, but needs to extend along the longitudinal direction Y, so as to improve the longitudinal protection of the memory card 100. The storage device 134 is arranged at a distance from the rigid layer 120, but the specific position of the storage device 134 is not limited and can be arranged accordingly based on actual needs.

[0054] See also Figure 4 , Figure 4 It is a schematic diagram of the top structure of the second embodiment of the memory card provided by the utility model. For the convenience of observing this embodiment, the plastic sealing layer is hidden.

[0055] Except for the position of the rigid layer 220 , other structures and connections of this embodiment are the same as those of the above-mentioned embodiment and will not be described in detail.

[0056] The rigid layer 220 of this embodiment includes a first transverse portion 222 and two first longitudinal portions 221; the two first longitudinal portions 221 are arranged at intervals and extend along the longitudinal direction Y on the first surface 211 respectively until reaching the corresponding edges on the opposite sides; the first transverse portion 222 extends along the transverse direction X of the first surface 211, and the opposite ends of the first transverse portion 222 are respectively connected to the two first longitudinal portions 221. The first transverse portion 222 and the two first longitudinal portions 221 can be integrally formed.

[0057] In a specific embodiment, the opposite ends of the first transverse portion 222 may respectively correspond to the middle areas connecting the two first longitudinal portions 221; the opposite ends of the first transverse portion 222 may respectively correspond to the edge areas connecting the same side of the two first longitudinal portions 221; the opposite ends of the first transverse portion 222 may also respectively correspond to the edge areas connecting different sides of the two first longitudinal portions 221.

[0058] The structural arrangement of the rigid layer 220 can provide rigid protection for the memory card in both the longitudinal direction Y and the transverse direction X, thereby improving the drop and deformation resistance of the memory card.

[0059] See also Figure 5 , Figure 5 It is a schematic diagram of the top structure of the third embodiment of the memory card provided by the utility model. For the convenience of observing this embodiment, the plastic sealing layer is hidden.

[0060] Except for the position of the rigid layer 320 , other structures and connections of this embodiment are the same as those of the above-mentioned embodiment and will not be described in detail.

[0061] The rigid layer 320 includes two second transverse portions 322 and a second longitudinal portion 321; the two second transverse portions 322 are spaced apart and extend along the transverse direction X of the first surface 311 until reaching the corresponding edges on the opposite sides; the second longitudinal portion 321 extends along the longitudinal direction Y of the first surface 311, and the opposite ends of the second longitudinal portion 321 are respectively connected to the two second transverse portions 322. The second transverse portion 322 and the two second longitudinal portions 321 can be integrally formed.

[0062] The structural arrangement of the rigid layer 320 can provide rigid protection for the memory card in both the longitudinal direction Y and the transverse direction X, thereby improving the drop and deformation resistance of the memory card.

[0063] In this embodiment, the two opposite ends of the second longitudinal portion 321 respectively connect the middle areas of the two second transverse portions 322 . In other embodiments, the two opposite ends of the second transverse portion 322 may connect the edge areas of the two second longitudinal portions 321 .

[0064] See also Figure 6 , Figure 6 This is a schematic diagram of the top structure of the fourth embodiment of the memory card provided by the utility model. For the convenience of observing this embodiment, the plastic sealing layer is hidden.

[0065] This embodiment and Figure 4 The difference between the embodiments is that opposite ends of the second transverse portion 422 of the rigid layer 420 on the first surface 411 connect edge regions of the two second longitudinal portions 421. The second transverse portion 422 and the two second longitudinal portions 421 may be integrally formed.

[0066] In this embodiment, the opposite ends of the second transverse portion 422 connect the edge areas of the same side of the two second longitudinal portions 421 . In other embodiments, the opposite ends of the second transverse portion 422 can also connect the edge areas of different sides of the two second longitudinal portions 421 .

[0067] The structural arrangement of the rigid layer 420 can provide rigid protection for the memory card in both the longitudinal direction Y and the transverse direction X, thereby improving the drop and deformation resistance of the memory card.

[0068] See also Figure 7 , Figure 7 This is a schematic top view of the structure of the fifth embodiment of the memory card provided by the utility model. For the convenience of observing this embodiment, the plastic sealing layer is hidden.

[0069] Except for the position of the rigid layer 520 , other structures and connections of this embodiment are the same as those of the above-mentioned embodiment and will not be described in detail.

[0070] The rigid layer 520 includes at least one third transverse portion 522 and one third longitudinal portion 521; the third transverse portion 522 extends along the transverse direction X of the first surface 511, and the third longitudinal portion 521 extends along the longitudinal direction Y of the first surface 511; the third transverse portion 522 is vertically connected to the third longitudinal portion 511. The third transverse portion 522 and the third longitudinal portion 511 can be integrally formed.

[0071] The vertical connection location may be an edge or the middle of the third transverse portion 522 , or an edge or the middle of the third longitudinal portion 521 , which is not limited here.

[0072] The structural arrangement of the rigid layer 520 can provide rigid protection for the memory card in both the longitudinal direction Y and the transverse direction X, thereby improving the drop and deformation resistance of the memory card.

[0073] See also Figure 8 , Figure 8 This is a schematic diagram of the top structure of the sixth embodiment of the memory card provided by the utility model. For the convenience of observing this embodiment, the plastic sealing layer is hidden.

[0074] Except for the position of the rigid layer 620, other structures and connections of this embodiment are the same as those of the above-mentioned embodiment and will not be described in detail.

[0075] The rigid layer 620 includes two third transverse portions 622 and two third longitudinal portions 621; the third transverse portions 622 extend along the transverse direction X of the first surface 621, and the third longitudinal portions 621 extend along the longitudinal direction Y of the first surface 611; the opposite ends of one third transverse portion 622 are respectively vertically connected to the edges of the same side of one side of the two third longitudinal portions 611, and the opposite ends of the other third transverse portion 622 are respectively vertically connected to the edges of the same side of the other side of the two third longitudinal portions 611, forming a square ring structure. The third transverse portion 622 and the third longitudinal portion 611 can be integrally formed.

[0076] The structural arrangement of the rigid layer 620 can provide rigid protection for the memory card in both the longitudinal direction Y and the transverse direction X, thereby improving the drop and deformation resistance of the memory card.

[0077] See also Fig. 9 , Fig. 9 It is a schematic diagram of the top structure of the seventh embodiment of the memory card provided by the utility model. For the convenience of observing this embodiment, the plastic sealing layer is hidden.

[0078] Except for the position of the rigid layer 720, other structures and connections of this embodiment are the same as those of the above-mentioned embodiment and will not be described in detail.

[0079] The rigid layer (not marked in the figure) includes two fourth longitudinal portions 721 ; the two fourth longitudinal portions 721 are arranged at an interval and extend along the longitudinal direction Y on the first surface 711 until reaching the corresponding edges on two opposite sides.

[0080] The two fourth longitudinal portions 721 may be disposed on the edges of the substrate on both sides in the lateral direction, or may be disposed in the middle of the substrate in the lateral direction, and only need to be spaced apart from each other and the storage device 734 .

[0081] The structural arrangement of the rigid layer 720 can provide rigid protection for the memory card in the longitudinal direction Y, thereby improving the anti-fall and anti-deformation capabilities of the memory card.

[0082] The above are only implementation methods of the present utility model, and are not intended to limit the patent scope of the present utility model. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of the present utility model, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present utility model.

Claims

1. A memory card, characterized in that: The memory card comprises: substrate; A storage device, wherein the storage device is fixedly disposed on the substrate; A rigid layer, the rigid layer being bonded to the first surface of the substrate; Wherein, the rigid layer extends along the longitudinal direction of the first surface to the opposite side edges.

2. The memory card according to claim 1, wherein: The storage device includes storage devices and interfaces connected to each other; The storage device is disposed in contact with the first surface of the substrate and is spaced apart from the rigid layer; The interface is arranged to fit with a side edge of the second surface of the substrate; wherein the second surface is an opposite surface to the first surface.

3. The memory card according to claim 2, wherein: The storage device comprises a controller, a storage unit and a resistor and capacitor device; The controller is connected to the storage unit, the interface and the resistor-capacitor device respectively, and the storage unit is also connected to the resistor-capacitor device.

4. The memory card according to any one of claims 1 to 3, characterized in that: The rigid layer comprises a first transverse portion and two first longitudinal portions; The two first longitudinal portions are spaced apart from each other and extend along the longitudinal direction on the first surface respectively until reaching the edges of the corresponding two opposite sides; The first transverse portion extends along a transverse direction of the first surface, and opposite ends of the first transverse portion are respectively connected to two corresponding first longitudinal portions.

5. The memory card according to any one of claims 1 to 3, characterized in that: The rigid layer comprises two second transverse portions and a second longitudinal portion; The two second transverse portions are spaced apart from each other and extend along the transverse direction of the first surface respectively until reaching the edges of the corresponding two opposite sides; The second longitudinal portion extends along the longitudinal direction of the first surface, and opposite ends of the second longitudinal portion are respectively connected to two second transverse portions.

6. The memory card according to any one of claims 1 to 3, characterized in that: The rigid layer includes a third transverse portion and a third longitudinal portion; The third transverse portion extends along a transverse direction of the first surface, and the third longitudinal portion extends along a longitudinal direction of the first surface; The third transverse portion is vertically connected to the third longitudinal portion.

7. The memory card according to any one of claims 1 to 3, characterized in that: The rigid layer comprises two fourth longitudinal portions; The two fourth longitudinal portions are arranged at an interval and extend along the longitudinal direction on the first surface respectively until reaching the corresponding edges on the opposite sides.

8. The memory card according to claim 1, wherein: The memory card further comprises a plastic encapsulation layer, which encapsulates the entire substrate and covers the memory device and the rigid layer.

9. The memory card according to claim 1, wherein: The rigid layer is bonded and fixed to the first surface of the substrate via a bonding layer.

10. The memory card according to claim 1, wherein: The rigid layer comprises a metal layer, and the thickness of the rigid layer is in the range of 0.15-0.35 mm.

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