Clamping structure for semiconductor processing

Abstract

The utility model discloses a clamping structure for semiconductor processing, which relates to the technical field of semiconductor processing and comprises a working table, a vertical column is rotatably connected onto the working table, a bidirectional motor is mounted in the working table, and the bidirectional motor is in transmission connection with the vertical column. According to the utility model, through the cooperative arrangement of the placing box, the placing cavity, the clamping plate, the pushing assembly and the blanking assembly, the placing cavity is used for accommodating a semiconductor chip, and under the action of the pushing assembly, the clamping plate moves in the placing cavity to adjust an accommodating cavity body of the placing cavity, so that the clamping plate can be conveniently clamped; the semiconductor chip can be clamped and fixed in the placing cavity, the stability of the semiconductor chip in the processing process can be guaranteed, the semiconductor processing quality is improved, the processed semiconductor chip is pushed out of the placing cavity through the discharging assembly, and workers can take the processed semiconductor chip conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a clamping structure for semiconductor processing. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. They are not just silicon chips. Common ones also include gallium arsenide (gallium arsenide is toxic, so don't be curious to decompose some inferior circuit boards), germanium and other semiconductor materials. In order to meet the needs of mass production, the electrical properties of semiconductors must be predictable and stable, so the purity of dopants and the quality of semiconductor lattice structures must be strictly required.

[0003] In the Chinese utility model application number 202023107671.8, a clamping structure for semiconductor chip processing is disclosed. By setting a bottom frame and a "concave" card slot on a polygonal processing table, it can clamp and fix multiple groups of semiconductor chips at the same time, thereby improving the fixing efficiency of the semiconductor chips. Under the action of the rubber pad and the fastening spring, the chip clamping effect is realized to ensure the stability of the chip during processing.

[0004] However, there are still some problems in the above scheme. For example, when processing the chip in the clamped state, since the chip is fixed in the concave slot only by the supporting force of the fastening spring, the semiconductor chip in the processing state will shake, thereby affecting the processing quality of the semiconductor chip. To this end, we provide a clamping structure for semiconductor processing to solve the above problems. Utility Model Content

[0005] Technical issues solved

[0006] The purpose of the utility model is to make up for the deficiencies of the prior art and provide a clamping structure for semiconductor processing.

[0007] Technical Solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a clamping structure for semiconductor processing, comprising a workbench, a column rotatably connected to the workbench, a bidirectional motor installed in the workbench, and the bidirectional motor is transmission-connected to the column.

[0009] The column is provided with connecting blocks in a circular array, and a placement box is installed at the end of each connecting block away from the column, a placement cavity is provided in the placement box, a clamping plate is slidably connected in the placement cavity, and a pushing component for simultaneously pushing a plurality of clamping plates is provided on the column, and the pushing component includes a first electric push rod installed in the column, a first linkage block installed at the telescopic end of the first electric push rod, and a first slide groove provided on the column, the outer surface of the first linkage block passes through the first slide groove and extends to the outside of the column, and the first linkage block is slidably connected in the first slide groove, and a hinged rod in a circular array is hinged in the first linkage block.

[0010] The pushing assembly also includes a moving groove opened in the connecting block, a moving block slidably connected to the moving groove, a guide groove opened in the moving groove, and a guide block installed on the moving block. The end of the hinged rod away from the first linkage block is hinged on the moving block, and the end of the guide block away from the moving block is slidably connected to the guide groove. A push-pull rod is installed on the moving block, and the end of the push-pull rod away from the moving block passes through the placement box and is installed on the clamping plate.

[0011] The column is also provided with a material unloading component for ejecting the semiconductor from the placement cavity, the material unloading component includes a second slide groove opened on the column, a second electric push rod installed in the column, and a second linkage block installed at the telescopic end of the second electric push rod. The outer surface of the second linkage block passes through the second slide groove and extends to the outside of the column, and the second linkage block is slidably connected in the second slide groove. The second linkage block is equipped with a circular array of material unloading rods. A through hole is opened on the placement box, and the end of the material unloading rod away from the second linkage block passes through the through hole and extends into the placement cavity.

[0012] Beneficial effects:

[0013] Compared with the prior art, the clamping structure for semiconductor processing has the following beneficial effects:

[0014] The utility model uses the placement cavity to accommodate semiconductor chips through the coordinated arrangement of a placement box, a placement cavity, a clamping plate, a pushing component and a blanking component. Under the action of the pushing component, the clamping plate is moved inside the placement cavity, and the accommodating cavity body of the placement cavity is adjusted, so that the semiconductor chip can be clamped and fixed in the placement cavity, thereby ensuring the stability of the semiconductor chip during processing and improving the quality of semiconductor processing. The blanking component is also used to push the processed semiconductor chip out of the placement cavity, so that workers can take the processed semiconductor chip conveniently.

[0015] Other advantages, objectives and features of the present invention will be described in the following description to some extent, and will be apparent to those skilled in the art based on the following examination and study, or may be taught from the practice of the present invention to some extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of the utility model;

[0017] Figure 2 It is a three-dimensional diagram of the utility model;

[0018] Figure 3 It is a cross-sectional view of the utility model.

[0019] In the figure: 1. workbench; 2. column; 3. bidirectional motor; 4. connecting block; 5. placement box; 6. placement cavity; 7. clamping plate; 8. moving block; 9. push-pull rod; 10. moving groove; 11. guide groove; 12. guide block; 13. first electric push rod; 14. first linkage block; 15. first slide groove; 16. hinged rod; 17. second electric push rod; 18. second linkage block; 19. second slide groove; 20. unloading rod. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] like Figure 1-3 As shown, the utility model provides a technical solution: a clamping structure for semiconductor processing, including a workbench 1, a column 2 is rotatably connected to the workbench 1, a bidirectional motor 3 is installed in the workbench 1, the bidirectional motor 3 is transmission-connected to the column 2, there are many transmission methods between the column 2 and the bidirectional motor 3, gears can be used for transmission, belts and pulleys can be used for transmission, and the output shaft of the bidirectional motor 3 can drive the column 2 to rotate.

[0022] A connecting block 4 in a circular array is installed on the column 2, and a placement box 5 is installed at one end of each connecting block 4 away from the column 2. A placement cavity 6 is provided in the placement box 5, and a clamping plate 7 is slidably connected in the placement cavity 6. The clamping plate 7 can be made of rubber material and will not cause pressure damage to the semiconductor chip. A pushing component for simultaneously pushing multiple clamping plates 7 is provided on the column 2, and the pushing component includes a first electric push rod 13 installed in the column 2, a first linkage block 14 installed at the telescopic end of the first electric push rod 13, and a first slide groove 15 opened on the column 2. The outer surface of the first linkage block 14 passes through the first slide groove 15 and extends to the outside of the column 2, and the first linkage block 14 is slidably connected in the first slide groove 15. A hinged rod 16 in a circular array is hinged in the first linkage block 14. The first linkage block 14 is pushed to move by the telescopic end of the first electric push rod 13, so that the first linkage block 14 can slide in the first slide groove 15.

[0023] The pushing assembly also includes a moving groove 10 opened in the connecting block 4, a moving block 8 slidably connected to the moving groove 10, a guide groove 11 opened in the moving groove 10, and a guide block 12 installed on the moving block 8. The end of the hinged rod 16 away from the first linkage block 14 is hinged on the moving block 8, and the end of the guide block 12 away from the moving block 8 is slidably connected in the guide groove 11. A push-pull rod 9 is installed on the moving block 8. The end of the push-pull rod 9 away from the moving block 8 passes through the placement box 5 and is installed on the clamping plate 7. Under the action of the hinged rod 16, the moving block 8 can slide in the moving groove 10, so that the push-pull rod 9 pushes the clamping plate 7 to move in the placement cavity 6. Under the action of the guide block 12 and the guide groove 11, the stability of the moving block 8 sliding in the moving groove 10 can be guaranteed.

[0024] The column 2 is also provided with a blanking assembly for ejecting the semiconductor from the placement cavity 6. The blanking assembly includes a second slide groove 19 opened on the column 2, a second electric push rod 17 installed in the column 2, and a second linkage block 18 installed at the telescopic end of the second electric push rod 17. The outer surface of the second linkage block 18 passes through the second slide groove 19 and extends to the outside of the column 2, and the second linkage block 18 is slidably connected in the second slide groove 19. Blanking rods 20 in a circular array are installed on the second linkage block 18. A through hole is opened on the placement box 5. One end of the blanking rod 20 away from the second linkage block 18 passes through the through hole and extends into the placement cavity 6. The second linkage block 18 is driven to move by the telescopic end of the second electric push rod 17, so that the second linkage block 18 can slide on the second slide groove 19, and the blanking rod 20 can pass through the through hole and extend into the placement cavity 6, so that the semiconductor chip processed in the placement cavity 6 can be pushed out of the placement cavity 6.

[0025] Working principle: semiconductor chips are placed in each placement cavity 6 in sequence, and the first electric push rod 13 is started, so that the telescopic end of the first electric push rod 13 pushes the first linkage block 14 to move, so that the first linkage block 14 can slide in the first slide groove 15, and under the action of the hinge rod 16, the moving block 8 can slide in the moving groove 10, so that the push-pull rod 9 pushes the clamping plate 7 to move in the placement cavity 6, and under the action of the guide block 12 and the guide groove 11, the stability of the sliding of the moving block 8 in the moving groove 10 can be guaranteed, so that the clamping plate 7 moves inside the placement cavity 6, and the capacity of the placement cavity 6 is increased. The cavity body can be adjusted so that the semiconductor chip can be clamped and fixed in the placement cavity 6, which can ensure the stability of the semiconductor chip during processing and improve the quality of semiconductor processing. When unloading the processed semiconductor chip, the second electric push rod 17 is started, and the telescopic end of the second electric push rod 17 drives the second linkage block 18 to move, so that the second linkage block 18 can slide on the second slide groove 19, and the unloading rod 20 can pass through the through hole and extend into the placement cavity 6, so that the semiconductor chip processed in the placement cavity 6 can be pushed out of the placement cavity 6, which is convenient for workers to take the processed semiconductor chip.

[0026] It should be noted that, in this article, the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model; the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "fixed", "installed", "connected", and "connected" should be understood in a broad sense. For example, "installed" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a mechanical connection or an electrical connection; "connected" can be a direct connection, an indirect connection through an intermediate medium, or a connection between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A clamping structure for semiconductor processing, comprising a workbench (1), characterized in that: The workbench (1) is rotatably connected to a column (2), and the column (2) is equipped with connecting blocks (4) arranged in a circular array. A placement box (5) is installed at one end of each connecting block (4) away from the column (2). A placement cavity (6) is provided in the placement box (5), and a clamping plate (7) is slidably connected in the placement cavity (6). A pushing component for simultaneously pushing a plurality of clamping plates (7) is provided on the column (2), and a material removal component for ejecting a semiconductor from the placement cavity (6) is also provided on the column (2).

2. A semiconductor processing clamping structure according to claim 1, characterized in that: A bidirectional motor (3) is installed in the workbench (1), and the bidirectional motor (3) is drivingly connected to the column (2).

3. A semiconductor processing clamping structure according to claim 1, characterized in that: The pushing assembly comprises a first electric push rod (13) installed in the column (2), a first linkage block (14) installed at the telescopic end of the first electric push rod (13), and a first slide groove (15) opened on the column (2); the outer surface of the first linkage block (14) passes through the first slide groove (15) and extends to the outside of the column (2), and the first linkage block (14) is slidably connected in the first slide groove (15); and the first linkage block (14) is hinged with a circular array of hinged rods (16).

4. A semiconductor processing clamping structure according to claim 3, characterized in that: The pushing assembly further comprises a moving groove (10) provided in the connecting block (4), a moving block (8) slidably connected to the moving groove (10), a guide groove (11) provided in the moving groove (10), and a guide block (12) mounted on the moving block (8); one end of the hinged rod (16) away from the first linkage block (14) is hinged to the moving block (8), and one end of the guide block (12) away from the moving block (8) is slidably connected to the guide groove (11).

5. A semiconductor processing clamping structure according to claim 4, characterized in that: A push-pull rod (9) is installed on the moving block (8), and one end of the push-pull rod (9) away from the moving block (8) passes through the placement box (5) and is installed on the clamping plate (7).

6. The semiconductor processing clamping structure according to claim 1, characterized in that: The material discharge assembly comprises a second slide groove (19) provided on the column (2), a second electric push rod (17) installed in the column (2), and a second linkage block (18) installed at the telescopic end of the second electric push rod (17); the outer surface of the second linkage block (18) passes through the second slide groove (19) and extends to the outside of the column (2); the second linkage block (18) is slidably connected in the second slide groove (19); material discharge rods (20) arranged in a circular array are installed on the second linkage block (18); a through hole is provided on the placement box (5); one end of the material discharge rod (20) away from the second linkage block (18) passes through the through hole and extends into the placement cavity (6).

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