Double-current SIC-MOSFET packaging structure

Abstract

The utility model provides a double-current SIC-MOSFET packaging structure, which belongs to the technical field of chip packaging, and is characterized in that the double-current SIC-MOSFET packaging structure comprises a chip, the chip comprises a source electrode, a grid electrode and a drain electrode, a packaging structure is wrapped outside the chip, the packaging structure is used for protecting the chip, a pin is connected with the chip, and the pin is connected with the source electrode, the grid electrode and the drain electrode. The chip extends to the outside of the packaging structure, the pins are elastic connectors and comprise springs, and the springs are wrapped with supporting columns; by arranging the supporting columns, the problem that the springs cannot rebound after being compressed is solved; by arranging the packaging structure, the chip is prevented from being exposed; by arranging the pins, the chip can be conveniently contacted with an external circuit; according to the utility model, the problem that the elastic pins cannot rebound after being compressed can be avoided, the situation that the chip cannot be connected with an external circuit is avoided, and the service life of the chip is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip packaging, and in particular relates to a double current SIC-MOSFET packaging structure. Background Art

[0002] A double current SIC-MOSFET chip is a metal oxide semiconductor field effect transistor (MOSFET) based on silicon carbide (SiC) technology. It has excellent material properties, such as high breakdown field strength, low on-resistance and high temperature resistance. These characteristics enable SIC-MOSFET to operate stably in high voltage, high frequency and high temperature environments and provide excellent electrical performance.

[0003] Chip packaging is a process of laying out, pasting, fixing and connecting the chip on a frame, leading out the wiring terminals and fixing them by encapsulating with a plastic insulating medium to form an overall three-dimensional structure; during packaging, the use of elastic connectors for the wiring terminals has the following benefits: shock absorption and vibration absorption: elastic connectors have the function of absorbing shock and vibration between the motor and the load (here refers to the chip); improving connection reliability: since elastic connectors have certain elasticity and scalability, they can better adapt to small displacements or deformations between the chip and the circuit board; improving transmission efficiency: if a rigid connection is directly used between the motor and the load, it may lead to a decrease in transmission efficiency.

[0004] However, existing elastic connectors may not be able to rebound after being compressed during use, and the chip life is short. Utility Model Content

[0005] In view of this, the utility model provides a double current SIC-MOSFET packaging structure, which can avoid the problem that the elastic pin cannot rebound after being compressed, thereby extending the service life of the chip.

[0006] The utility model is achieved in this way:

[0007] The utility model provides a double current SIC-MOSFET packaging structure, which comprises a chip, wherein the chip comprises a source, a gate and a drain, the chip is wrapped with a packaging structure on the outside, the packaging structure is used to protect the chip, pins are connected to the chip, the chip is extended to the outside of the packaging structure, the pins are elastic connectors, comprising springs, and the springs are wrapped with support columns on the outside.

[0008] The technical effects of a double current SIC-MOSFET packaging structure provided by the utility model are as follows: chip protection: the packaging structure is directly wrapped around the outside of the chip, providing effective physical protection for the chip, preventing damage to the chip from external impact, moisture, dust and other environmental factors, and improving the stability and reliability of the chip.

[0009] Flexible connection: The pin design allows for greater flexibility in the connection between the chip and the package structure. Since a spring is used as part of the connector, it can handle certain mechanical vibrations and shocks, reducing damage to the chip connection caused by vibration or shock.

[0010] Easy installation and maintenance: The pins extend the chip outside the package structure, making it easier to connect the chip to other electronic components or circuit boards. In addition, if the chip needs to be replaced or repaired, it can be removed more easily.

[0011] Improve reliability: By using pins and packaging structure, this packaging structure can reduce the impact of factors such as vibration, shock, temperature changes, etc. on the performance of SIC-MOSFET to a certain extent, thereby improving its reliability.

[0012] On the basis of the above technical solution, a double current SIC-MOSFET packaging structure of the utility model can also be improved as follows:

[0013] One end of the support column is in contact with the chip, and the other end is fixedly connected to the packaging structure.

[0014] Furthermore, the support column is a hollow cylinder with equal upper and lower radii.

[0015] Furthermore, the radius of the support column is greater than the radius of the spring.

[0016] The beneficial effect of adopting the above-mentioned improvement scheme is: by setting the radius of the support column to be larger than the radius of the spring, the spring avoids contact with the support column during the expansion and contraction process and cannot be extended to the original length after compression.

[0017] Furthermore, the support column is a hollow cylinder with a large radius in the middle and small radius at both ends.

[0018] The beneficial effect of adopting the above-mentioned improvement scheme is: by setting the middle radius of the support column to be large and the radius at both ends to be small, the support column extends outward when the spring is compressed, avoiding contact between the middle of the support column and the spring.

[0019] Furthermore, the radii at both ends of the support column are equal to the radius of the spring.

[0020] Furthermore, the support column is a hollow cylinder with a small radius in the middle and large radius at both ends.

[0021] The beneficial effect of adopting the above-mentioned improvement scheme is: by setting the radius of the support column to be larger than the radius of the spring, it is avoided that adjacent support columns contact each other during the compression process of the spring.

[0022] Furthermore, the middle radius of the support column is equal to the spring radius.

[0023] Furthermore, the support column is made of rubber.

[0024] Furthermore, the spring is made of copper.

[0025] Compared with the prior art, the double current SIC-MOSFET packaging structure provided by the utility model has the following beneficial effects:

[0026] Good mechanical stability: By using an elastic connector (i.e., pin 3), the package structure can provide a certain buffer during mechanical vibration or impact, reduce the direct effect of external stress on the chip, thereby protecting the chip from damage and improving the mechanical stability of the package structure;

[0027] Excellent electrical performance: The spring design in the elastic connector ensures a good electrical connection between the pin and the chip, reduces contact resistance, and improves the current transmission efficiency. In addition, due to the elasticity of the spring, a stable electrical connection can be maintained even under temperature changes and mechanical stress;

[0028] Flexible pin design: The pin adopts elastic connector design, which can adapt to different installation positions and angles, improving the flexibility and adaptability of the packaging structure;

[0029] Protect the chip from external influences: The packaging structure tightly wraps the chip, which can effectively prevent the influence of external environmental factors such as dust and moisture on the chip, thereby improving the reliability of the chip;

[0030] Easy installation and maintenance: Due to the flexible connector design of the pins, the SIC-MOSFET can be easily installed on the circuit board and can also be easily removed from the circuit board if replacement or repair is required;

[0031] Improve the reliability of the package structure: By optimizing the design of the pins and package structure, the risk of connection failure or damage caused by vibration, impact and other factors is reduced, and the reliability of the package structure is improved;

[0032] Adapt to high current applications: Since the package structure is specially designed for double current SIC-MOSFET, it can meet the needs of high current applications such as power electronics, motor control and other fields;

[0033] Good durability: The support column is made of rubber material, which has excellent wear resistance and anti-aging performance, and can ensure that the pin maintains stable performance during long-term use;

[0034] Reduce manufacturing costs: By optimizing design and material selection, manufacturing costs can be reduced while ensuring performance, thereby improving product market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments of the utility model will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 A schematic diagram of a double current SIC-MOSFET package structure;

[0037] Figure 2 It is a schematic diagram of the internal structure of a double current SIC-MOSFET package;

[0038] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0039] 1. Chip; 2. Package structure; 3. Pins; 31. Support column. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the implementation mode of the present invention clearer, the technical solution in the implementation mode of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the implementation mode of the present invention.

[0041] Embodiment 1

[0042] like Figure 1 , Figure 2 As shown, a first embodiment of a double current SIC-MOSFET packaging structure provided by the utility model is shown. In this embodiment, a chip 1 is included. The chip 1 includes a source, a gate and a drain. The chip 1 is wrapped with a packaging structure 2 on the outside. The packaging structure 2 is used to protect the chip 1. The pin 3 is connected to the chip 1 to extend the chip 1 to the outside of the packaging structure 2. The pin 3 is an elastic connector including a spring. The spring wraps a support column 31 on the outside.

[0043] Among them, in the above technical solution, one end of the support column 31 is in contact with the chip, and the other end is fixedly connected to the packaging structure.

[0044] Furthermore, in the above technical solution, the support column 31 is a hollow cylinder with equal upper and lower radii.

[0045] Furthermore, in the above technical solution, the radius of the support column 31 is greater than the radius of the spring.

[0046] Furthermore, in the above technical solution, the material of the support column 31 is rubber.

[0047] Furthermore, in the above technical solution, the material of the spring is copper.

[0048] Embodiment 2

[0049] like Figure 1 , Figure 2 As shown, a second embodiment of a double current SIC-MOSFET packaging structure provided by the utility model is shown. In this embodiment, a chip 1 is included. The chip 1 includes a source, a gate and a drain. The chip 1 is wrapped with a packaging structure 2 on the outside. The packaging structure 2 is used to protect the chip 1. The pin 3 is connected to the chip 1 to extend the chip 1 to the outside of the packaging structure 2. The pin 3 is an elastic connector including a spring. The spring wraps a support column 31 on the outside.

[0050] Among them, in the above technical solution, one end of the support column 31 is in contact with the chip, and the other end is fixedly connected to the packaging structure.

[0051] Furthermore, in the above technical solution, the support column 31 is a hollow cylinder with a large radius in the middle and small radii at both ends.

[0052] Furthermore, in the above technical solution, the radii at both ends of the support column 31 are equal to the spring radius.

[0053] Furthermore, in the above technical solution, the material of the support column 31 is rubber.

[0054] Furthermore, in the above technical solution, the material of the spring is copper.

[0055] Embodiment 3

[0056] like Figure 1 , Figure 2 As shown, it is a third embodiment of a double current SIC-MOSFET packaging structure provided by the utility model. In this embodiment, it includes a chip 1, the chip 1 includes a source, a gate and a drain, the chip 1 is wrapped with a packaging structure 2 outside, the packaging structure 2 is used to protect the chip 1, the pin 3 connects the chip 1, and extends the chip 1 to the outside of the packaging structure 2. The pin 3 is an elastic connector, including a spring, and the spring wraps a support column 31 outside.

[0057] Among them, in the above technical solution, one end of the support column 31 is in contact with the chip, and the other end is fixedly connected to the packaging structure.

[0058] Furthermore, in the above technical solution, the support column 31 is a hollow cylinder with a small radius in the middle and large radii at both ends.

[0059] Furthermore, in the above technical solution, the middle radius of the support column 31 is equal to the spring radius.

[0060] Furthermore, in the above technical solution, the material of the support column 31 is rubber.

[0061] Furthermore, in the above technical solution, the material of the spring is copper.

[0062] Specifically, the principle of the utility model is:

[0063] Package structure protection: The chip (1) is the core component of the SIC-MOSFET, including the source, gate and drain. The package structure (2) is tightly wrapped around the chip (1). Its main function is to provide physical protection for the chip to prevent it from being damaged by the external environment, such as moisture, dust, mechanical shock, etc. At the same time, the package structure can also prevent electromagnetic interference to a certain extent, ensuring the stable operation of the chip;

[0064] Pin connection: The pin (3) serves as a bridge between the chip (1) and the package structure (2), and is responsible for transmitting the electrical signal on the chip to the external circuit. The pin (3) is designed as an elastic connector, including a spring and a support column (31). The spring has good elasticity and conductivity, and can establish a stable and reliable electrical connection between the chip and the external circuit;

[0065] Function of the support column: The support column (31) is an important component of the pin (3). It is shaped like a hollow cylinder with a large radius in the middle and small radius at both ends. The radius in the middle is equal to the radius of the spring. This design allows the support column to have a certain degree of elasticity while maintaining sufficient strength. One end of the support column contacts the chip, and the other end is fixedly connected to the packaging structure, which can provide support and buffer when the pin is subjected to external force, preventing the pin from breaking or deforming;

[0066] Advantages of elastic connectors: The design of the elastic connector (i.e. pin 3) enables the SIC-MOSFET to maintain a stable electrical connection when subjected to external forces such as vibration and impact. The elastic deformation of the spring can absorb part of the external force and prevent the pin from being displaced or broken between the chip or package structure due to external forces. In addition, the elastic connector can also provide a certain amount of thermal expansion compensation when the temperature changes, preventing the electrical connection from failing due to temperature changes;

[0067] Material selection: The support column (31) is made of rubber material, which has good elasticity and wear resistance, and can ensure that the pin maintains stable performance during long-term use. The spring is made of copper, which has good conductivity and elasticity, and can meet the requirements of SIC-MOSFET for electrical and mechanical properties.

[0068] When in use, the chip 1 is inserted into the external circuit, the pin 3 enters the socket, the spring is squeezed, and the support column 31 outside the spring supports the support column 31. When the spring stretches, the support column 31 provides elastic deformation force to drive the spring back to its original shape.

Claims

1. A double current SIC-MOSFET packaging structure, characterized in that: The invention comprises a chip (1), wherein the chip (1) comprises a source electrode, a gate electrode and a drain electrode; the chip (1) is externally wrapped with a packaging structure (2), wherein the packaging structure (2) is used to protect the chip (1); a pin (3) is connected to the chip (1) to extend the chip (1) to the outside of the packaging structure (2); the pin (3) is an elastic connector comprising a spring; the spring externally wraps a support column (31); one end of the support column (31) is in contact with the chip (1), and the other end is fixedly connected to the packaging structure.

2. A double current SIC-MOSFET packaging structure according to claim 1, characterized in that: The support column (31) is in the shape of a hollow cylinder with equal upper and lower radii.

3. A double current SIC-MOSFET packaging structure according to claim 2, characterized in that: The radius of the support column (31) is greater than the radius of the spring.

4. A double current SIC-MOSFET packaging structure according to claim 3, characterized in that: The support column (31) is in the shape of a hollow cylinder with a large radius in the middle and small radii at both ends.

5. A double current SIC-MOSFET packaging structure according to claim 4, characterized in that: The radii at both ends of the support column (31) are equal to the radius of the spring.

6. A double current SIC-MOSFET packaging structure according to claim 5, characterized in that: The support column (31) is in the shape of a hollow cylinder with a small radius in the middle and large radii at both ends.

7. A double current SIC-MOSFET packaging structure according to claim 6, characterized in that: The middle radius of the support column (31) is equal to the spring radius.

8. A double current SIC-MOSFET packaging structure according to claim 7, characterized in that: The material of the support column (31) is rubber.

9. A double current SIC-MOSFET packaging structure according to claim 8, characterized in that: The material of the spring is copper.

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