Reinforcing and pressing module

Abstract

The utility model discloses a reinforcing press-fit module. The reinforcing press-fit module comprises an FR4 copper-clad plate, an aluminum substrate, a transition bonding layer, an upper stacking layer and a lower stacking layer, the FR4 copper-clad plate is located above the aluminum substrate, and the transition bonding layer is arranged between the FR4 copper-clad plate and the aluminum substrate; a hollowed-out groove is formed in the aluminum substrate, and an open groove is formed in the transition bonding layer; the open groove and the hollow groove are communicated to form a through groove, the through groove is filled with filling colloid in a removable mode, the lower end face of the filling colloid is flush with the lower surface of the aluminum substrate, and the upper end face of the filling colloid is flush with the upper surface of the transition bonding layer. According to the utility model, collapse and abnormity of the suspension position of the FR4 copper-clad plate caused by hollowing of the aluminum substrate in the lamination process of the reinforcement lamination module can be improved, the quality defects of FR4 copper-clad plate surface hole rings, ink crack damage and circuit depression can be avoided, and the quality of a PCB (Printed Circuit Board) is improved.

Description

Technical Field

[0001] The utility model relates to a reinforcement pressing die set. Background Art

[0002] With the development of diversification, multifunctionality and high integration of electronic products in modern society, 5G circuit board aluminum substrate, as a low-alloy, high-plasticity alloy plate, has good thermal conductivity, insulation and machinability, and is widely used in electronic products.

[0003] When applied to electrical products, aluminum substrates can effectively reduce the temperature of electrical appliances during operation and have a good heat dissipation effect. However, in special environments and spaces, thinner FR4 copper-clad laminates and aluminum substrates are required to be combined so that the high heat generated by electrical components during operation can be dissipated through heat conduction, thereby effectively improving the efficiency of electrical appliances and, to a certain extent, extending the life of electrical products. In the process of processing and manufacturing PCBs in similar industries, double-sided PCBs need to be combined together by FR4 copper-clad laminates and aluminum-based substrates through press-fit reinforcement. The reinforced press-fit module composed of FR4 copper-clad laminates and aluminum substrates is prone to quality defects such as FR4 copper-clad laminates with holes and ink cracks, and circuit depressions due to high pressure. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the purpose of the utility model is to provide a reinforcement pressing module, which can avoid the quality defects of FR4 copper clad board hole rings, ink cracks and damage, and circuit depressions, and can improve the quality of PCB boards.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] A reinforcement pressing module group comprises an FR4 copper clad laminate, an aluminum substrate, a transition adhesive layer, an upper stacking layer and a lower stacking layer; the upper stacking layer is stacked on the FR4 copper clad laminate; the lower stacking layer is located below the aluminum substrate; the FR4 copper clad laminate is located above the aluminum substrate, and the transition adhesive layer is arranged between the FR4 copper clad laminate and the aluminum substrate; a hollow groove is arranged on the aluminum substrate, the lower end of the hollow groove passes through the lower surface of the aluminum substrate, and the upper end of the hollow groove passes through the upper surface of the aluminum substrate; a slot is arranged on the transition adhesive layer, the upper end of the slot passes through the upper surface of the transition adhesive layer, and the lower end of the slot passes through the lower surface of the transition adhesive layer; the slot is connected with the hollow groove to form a through groove, and a filling colloid is removably filled in the through groove, the lower end surface of the filling colloid is flush with the lower surface of the aluminum substrate, and the upper end surface of the filling colloid is flush with the upper surface of the transition adhesive layer.

[0007] The projection of the groove on the upper surface of the aluminum substrate is located in the area where the hollow groove is located.

[0008] The cross sections of the hollow grooves and the slots are both rectangular.

[0009] The distance between each side of the slot and the corresponding side of the hollow slot is 0.15 mm.

[0010] The FR4 copper clad plate, the transition adhesive layer and the aluminum substrate are fixed together by means of fusion and riveting.

[0011] A first circuit is arranged at the upper end of the FR4 copper clad board, and a second circuit is arranged at the lower end of the FR4 copper clad board.

[0012] The FR4 copper clad board comprises an upper copper layer, a lower copper layer and an insulating layer; the upper copper layer is located above the lower copper layer, and the insulating layer is arranged between the upper copper layer and the lower copper layer.

[0013] The first circuit is formed on an upper copper layer, and the second circuit is formed on a lower copper layer.

[0014] The upper stacking layer includes an upper release film and an upper steel plate, and the upper steel plate and the upper release film are arranged in sequence along a direction close to the FR4 copper clad laminate.

[0015] The lower stacking layer includes a lower release film and a lower steel plate, and the lower steel plate and the lower release film are arranged in sequence along a direction close to the aluminum substrate.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] The utility model provides a reinforcement pressing module, which adopts FR4 copper clad board, aluminum substrate, transition adhesive layer, upper stacking layer and lower stacking layer, and reasonably arranges the aluminum substrate, transition adhesive layer and filling colloid, uses the filling colloid to fill the through groove in a removable manner, and makes the lower end surface of the filling colloid flush with the lower surface of the aluminum substrate, and the upper end surface of the filling colloid is flush with the upper surface of the transition adhesive layer, which can improve the abnormal collapse of the suspended position of the FR4 copper clad board caused by the hollowing of the aluminum substrate during the pressing process of the reinforcement pressing module, and can avoid the quality defects of FR4 copper clad board hole rings and ink cracks and damage, and circuit depression, thereby improving the quality of PCB boards; moreover, it has a simple structure and is easy to manufacture, which can effectively reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Among them, 10, FR4 copper clad laminate; 11, upper copper layer; 12, lower copper layer; 13, insulating layer; 14, hollow groove; 20, aluminum substrate; 21, hollow groove; 30, transition adhesive layer; 31, slotting; 40, upper stacking layer; 41, upper release film; 42, upper steel plate; 50, lower stacking layer; 51, lower release film; 52, lower steel plate; 60, filling colloid. DETAILED DESCRIPTION

[0020] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0021] like Figure 1 As shown, a reinforcement press-fitting module comprises a FR4 copper-clad laminate 10, an aluminum substrate 20, a transition adhesive layer 30, an upper stacking layer 40 and a lower stacking layer 50; the upper stacking layer 40 is stacked on the FR4 copper-clad laminate 10; the lower stacking layer 50 is located below the aluminum substrate 20; the FR4 copper-clad laminate 10 is located above the aluminum substrate 20, and the transition adhesive layer 30 is arranged between the FR4 copper-clad laminate 10 and the aluminum substrate 20; the aluminum substrate 20 is provided with a hollow groove 21, and the lower end of the hollow groove 21 passes through the lower surface of the aluminum substrate 20. The upper end of the hollow groove 21 passes through the upper surface of the aluminum substrate 20, and the transition adhesive layer 30 is provided with a groove 31, the upper end of the groove 31 passes through the upper surface of the transition adhesive layer 30, and the lower end of the groove 31 passes through the lower surface of the transition adhesive layer 30; the groove 31 is connected with the hollow groove 21 to form a through groove, and the through groove is filled with a filling colloid 60 in a removable manner, the lower end surface of the filling colloid 60 is flush with the lower surface of the aluminum substrate 20, and the upper end surface of the filling colloid 60 is flush with the upper surface of the transition adhesive layer 30.

[0022] The utility model provides a reinforcement pressing module, which adopts FR4 copper clad board 10, aluminum substrate 20, transition adhesive layer 30, upper stacking layer 40 and lower stacking layer 50, and reasonably arranges aluminum substrate 20, transition adhesive layer 30 and filling colloid 60, uses filling colloid 60 to fill the through groove in a removable manner, and makes the lower end surface of filling colloid 60 flush with the lower surface of aluminum substrate 20, and the upper end surface of filling colloid 60 is flush with the upper surface of transition adhesive layer 30, which can improve the abnormal collapse of the suspended position of FR4 copper clad board 10 caused by hollowing out of aluminum substrate 20 during the pressing process of reinforcement pressing module, and can avoid the quality defects of hole rings, ink cracks and damage, and circuit depression on FR4 copper clad board 10, thereby improving the quality of PCB board; moreover, it has a simple structure and is easy to manufacture, which can effectively reduce the cost.

[0023] The projection of the slot 31 on the upper surface of the aluminum substrate 20 is located in the area where the hollow groove 21 is located. In this embodiment, the cross-sections of the hollow groove 21 and the slot 31 are both rectangular. The distance between each side of the slot 31 and the corresponding side of the hollow groove 21 is 0.15 mm. Specifically, the transition adhesive layer 30 is a semi-cured sheet. By adopting the above-mentioned setting, it is convenient to cooperate with the filling colloid 60, avoiding excessive glue overflow during the subsequent pressing process, resulting in glue overflow, and at the same time, it can avoid the problem of insufficient glue filling, voids, delamination, etc. at the connection between the aluminum substrate 20 and the FR4 copper clad board 10 due to insufficient colloid.

[0024] Of course, in addition to this, the shapes of the hollow groove 21 and the slot 31 can also be set according to actual needs, but the cross-sections of the hollow groove 21 and the slot 31 are set to be rectangular, and the distance between each side of the slot 31 and the corresponding side of the hollow groove 21 is set to 0.15mm. This is the most preferred embodiment of the utility model, which can be convenient for cooperation with the filling colloid 60, avoiding excessive overflow of glue during subsequent pressing, and at the same time avoiding problems such as insufficient glue filling, voids, and delamination at the connection between the aluminum substrate 20 and the FR4 copper clad board 10 due to insufficient colloid.

[0025] Preferably, the filling colloid 60 is blue glue to facilitate filling and subsequent removal.

[0026] The FR4 copper clad board 10 is provided with a hollowed-out groove 14 , the hollowed-out groove 21 is opposite to the hollowed-out groove 14 , and the projection of the hollowed-out groove 14 on the upper surface of the aluminum substrate 20 is located in the area where the hollowed-out groove 21 is located.

[0027] The FR4 copper clad laminate 10, the transition adhesive layer 30 and the aluminum substrate 20 are fixed together by fusion and riveting. Of course, in addition to this, the FR4 copper clad laminate 10, the transition adhesive layer 30 and the aluminum substrate 20 can also be pre-fixed together by other existing methods, but fixing the FR4 copper clad laminate 10, the transition adhesive layer 30 and the aluminum substrate 20 together by fusion and riveting is the most preferred embodiment of the utility model, which is convenient for processing.

[0028] Specifically, a first circuit is disposed at the upper end of the FR4 copper clad board 10, and a second circuit is disposed at the lower end of the FR4 copper clad board 10. The FR4 copper clad board 10 includes an upper copper layer 11, a lower copper layer 12 and an insulating layer 13; the upper copper layer 11 is located above the lower copper layer 12, and the insulating layer 13 is disposed between the upper copper layer 11 and the lower copper layer 12. The first circuit is formed on the upper copper layer 11, and the second circuit is formed on the lower copper layer 12. By adopting the above arrangement, the manufacturing cost can be reduced.

[0029] The upper stacking layer 40 includes an upper release film 41 and an upper steel plate 42, and the upper steel plate 42 and the upper release film 41 are sequentially arranged along a direction close to the FR4 copper clad laminate 10. The lower stacking layer 50 includes a lower release film 51 and a lower steel plate 52, and the lower steel plate 52 and the lower release film 51 are sequentially arranged along a direction close to the aluminum substrate 20.

[0030] Of course, in addition to this, the upper stacking layer 40 and the lower stacking layer 50 can also adopt other materials according to usage requirements, but the upper stacking layer 40 adopts the upper release film 41 and the upper steel plate 42, and the lower stacking layer 50 adopts the lower release film 51 and the lower steel plate 52, which is the most preferred embodiment of the present invention, which can improve the lamination effect and reduce the cost.

[0031] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A reinforcement pressing die set, characterized in that: It includes an FR4 copper clad laminate, an aluminum substrate, a transition adhesive layer, an upper stacking layer and a lower stacking layer; the upper stacking layer is stacked on the FR4 copper clad laminate; the lower stacking layer is located below the aluminum substrate; the FR4 copper clad laminate is located above the aluminum substrate, and the transition adhesive layer is arranged between the FR4 copper clad laminate and the aluminum substrate; a hollow groove is arranged on the aluminum substrate, the lower end of the hollow groove passes through the lower surface of the aluminum substrate, and the upper end of the hollow groove passes through the upper surface of the aluminum substrate; a groove is arranged on the transition adhesive layer, the upper end of the groove passes through the upper surface of the transition adhesive layer, and the lower end of the groove passes through the lower surface of the transition adhesive layer; the groove is connected with the hollow groove to form a through groove, and a filling colloid is filled in the through groove in a removable manner, the lower end surface of the filling colloid is flush with the lower surface of the aluminum substrate, and the upper end surface of the filling colloid is flush with the upper surface of the transition adhesive layer.

2. The reinforcing pressing die set according to claim 1, characterized in that: The projection of the groove on the upper surface of the aluminum substrate is located in the area where the hollow groove is located.

3. The reinforcing pressing die set according to claim 2, characterized in that: The cross sections of the hollow grooves and the slots are both rectangular.

4. The reinforcing pressing die set according to claim 3, characterized in that: The distance between each side of the slot and the corresponding side of the hollow slot is 0.15 mm.

5. The reinforcing pressing die set according to claim 1, characterized in that: The FR4 copper clad plate, the transition adhesive layer and the aluminum substrate are fixed together by means of fusion and riveting.

6. The reinforcing pressing die set according to claim 1, characterized in that: A first circuit is arranged at the upper end of the FR4 copper clad board, and a second circuit is arranged at the lower end of the FR4 copper clad board.

7. The reinforcing pressing die set according to claim 6, characterized in that: The FR4 copper clad board comprises an upper copper layer, a lower copper layer and an insulating layer; the upper copper layer is located above the lower copper layer, and the insulating layer is arranged between the upper copper layer and the lower copper layer.

8. The reinforcing pressing die set according to claim 7, characterized in that: The first circuit is formed on an upper copper layer, and the second circuit is formed on a lower copper layer.

9. The reinforcing pressing die set according to claim 1, characterized in that: The upper stacking layer includes an upper release film and an upper steel plate, and the upper steel plate and the upper release film are arranged in sequence along a direction close to the FR4 copper clad laminate.

10. The reinforcing pressing die set according to claim 1, characterized in that: The lower stacking layer includes a lower release film and a lower steel plate, and the lower steel plate and the lower release film are arranged in sequence along a direction close to the aluminum substrate.

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