Circuit board and electronic equipment

Abstract

The utility model discloses a circuit board and electronic equipment, and the circuit board comprises a carrier which is provided with a plurality of layers of substrates which are arranged in a stacked manner, the carrier comprises a bent part and a non-bent part, and at least one layer of substrate in the plurality of layers of substrates is provided with a circuit; wherein in the bending part, a gap is formed between two adjacent layers of substrates in the multiple layers of substrates, and at least one substrate in the two layers of substrates corresponding to the gap is provided with a texture pattern on the surface facing the gap.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and more particularly to a circuit board and an electronic device having the circuit board. Background Art

[0002] Circuit boards are an indispensable basic component in the field of electronic technology. They not only provide physical support for electronic components, but also realize the electrical connection between electronic components.

[0003] At present, based on whether the circuit board can be bent, the circuit board can be divided into a non-bendable rigid circuit board and a bendable flexible circuit board. Among them, the flexible circuit board can be used in a bendable device or a device structure that requires a bent circuit board for electrical connection.

[0004] In order to improve the space utilization rate and circuit integration density of the circuit board, the circuit board currently adopts a stacked structure with multiple layers of circuits stacked. For flexible circuit boards, the structure of multiple layers of circuits stacked will affect its bending elasticity. Utility Model Content

[0005] In view of this, the present application provides a circuit board and an electronic device having the circuit board, and the scheme is as follows:

[0006] A first aspect of the present application provides a circuit board, comprising:

[0007] A carrier, wherein the carrier has a multi-layer substrate stacked in layers, the carrier includes a bending portion and a non-bending portion, and at least one layer of the multi-layer substrate is provided with a circuit;

[0008] in,

[0009] At the bending portion, there is a gap between two adjacent layers of the multi-layer substrate, and at least one of the two layers of substrate corresponding to the gap has a texture pattern on a surface facing the gap.

[0010] Optionally, in the above circuit board, the texture pattern is used to isolate two layers of substrate corresponding to the gap.

[0011] Optionally, in the above circuit board, the texture pattern includes a graphic ink layer disposed on the surface of the substrate.

[0012] Optionally, in the above circuit board, if the substrate has an ink layer, both opposite side surfaces of the substrate in the thickness direction of the circuit board have the ink layer.

[0013] Optionally, in the above circuit board, the texture pattern includes a plurality of elastic support columns arranged on the surface of the substrate.

[0014] Optionally, in the above circuit board, at the bending portion, the lengths of different substrates between two adjacent non-bending portions are the same.

[0015] Optionally, in the above circuit board, the carrier has N layers of substrates stacked in sequence, and the N layers of substrates are sequentially from the first substrate to the Nth substrate in the stacking direction, and N is a positive integer greater than 1;

[0016] At the bending portion, the lengths of the first substrate to the Nth substrate increase or decrease sequentially.

[0017] A second aspect of the present application provides an electronic device, including:

[0018] first ontology;

[0019] Second entity;

[0020] The rotary connection device is located between the first body and the second body and has a receiving cavity;

[0021] A circuit board is located in the rotating connection device and electrically connects the first body and the second body; the circuit board has a bending portion located in the accommodating cavity, and the bending portion includes a multi-layer substrate stacked in a stacked manner; there is a gap between two adjacent layers of substrates; at least one of the two layers of substrates corresponding to the gap has a texture pattern on the surface facing the gap.

[0022] Optionally, in the above electronic device, the rotating connection device comprises: a rotating shaft decorative cover having a receiving cavity; a rotating shaft assembly that rotatably connects the first body and the second body, and is located on a side of the rotating shaft decorative cover having the receiving cavity;

[0023] Wherein, the circuit board is located between the rotating shaft assembly and the rotating shaft decorative cover;

[0024] If the first body and the second body are in an unfolded state based on the rotation connection device, the shaft assembly is flattened and located outside the accommodating cavity; the bent portion is located at the bottom of the accommodating cavity;

[0025] If the first body and the second body are in a closed state based on the rotating connection device, the shaft assembly is bent and at least partially located in the accommodating cavity; the bent portion is bent based on the shaft assembly and covers the surface of the shaft assembly.

[0026] Optionally, in the above-mentioned electronic device, the circuit board has N layers of substrates stacked in sequence, and the N layers of substrates are sequentially from the 1st substrate to the Nth substrate in the stacking direction, and N is a positive integer greater than 1; in the bending portion, the lengths of the 1st substrate to the Nth substrate increase sequentially; and the Nth substrate is arranged close to the rotating shaft assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0028] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0029] Figure 1 is a cross-sectional view of a flexible circuit board;

[0030] Figure 2 is a cross-sectional view of another flexible circuit board;

[0031] Figure 3 A cross-sectional view of a circuit board provided in an embodiment of the present application;

[0032] Figure 4 A cross-sectional view of another circuit board provided in an embodiment of the present application;

[0033] Figure 5 A top view of an ink layer provided in an embodiment of the present application;

[0034] Figure 6 A top view of another ink layer provided in an embodiment of the present application;

[0035] Figure 7 A top view of another ink layer provided in an embodiment of the present application;

[0036] Figure 8 A top view of another ink layer provided in an embodiment of the present application;

[0037] Fig. 9 A cross-sectional view of another circuit board provided in an embodiment of the present application;

[0038] Fig.10 A cross-sectional view of another circuit board provided in an embodiment of the present application;

[0039] Fig.11 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0040] Fig.12It is a partial enlarged view of the two bodies of the electronic device when they are in a bent state;

[0041] Fig.13 This is a partial enlarged view of the two bodies of the electronic device when they are in a flattened state.

[0042] Reference numerals:

[0043] 10-carrier; 11-substrate; 12-glue layer; 13-bending portion; 14-non-bending portion; 15-gap; 111-texture pattern; 16-first body; 17-second body; 18-rotating connection device; 181-accommodating cavity; 19-circuit board; 20-shaft decorative cover; 21-shaft assembly; 22-middle frame; 23-flexible display screen. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments of the present application. It is known to those skilled in the art that with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0045] Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application. The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0046] refer to Figure 1 , Figure 1 The cross-sectional view of a flexible circuit board includes a plurality of layers of sequentially stacked flexible substrates 11, the substrates having circuits. Two adjacent layers of substrates 11 are bonded and fixed by a curved adhesive layer 12.

[0047] It should be noted that, in the embodiment of the present application, the cross sections of the circuit board cross-sectional view are all parallel to the thickness direction of the flexible circuit board, and the stacking direction of the substrate 11 in the circuit board is the thickness direction of the circuit board.

[0048] Figure 1 The flexible circuit board shown is a stacked structure formed by a multi-layer substrate 11. The multi-layer substrate 11 can have lines for transmitting signals, which can accommodate more lines in an area with limited width of the circuit board, and can improve the space utilization rate and circuit integration density of the circuit board. However, due to the significant increase in the thickness of the flexible circuit board, its bendability will be greatly affected.

[0049] In order to improve the bending properties of flexible circuit boards with a laminated structure, one approach is to develop new highly flexible materials to prepare substrates 11 and adhesive layers 12 that are easier to bend. This approach has limited improvement in the bending properties of flexible circuit boards, and the development cycle of new materials is long and the cost is high.

[0050] In another way, you can Figure 2 As shown, the structure of the flexible circuit board is improved to improve the bending characteristics of the flexible circuit board with a stacked structure.

[0051] refer to Figure 2 , Figure 2 FIG. 1 is a cross-sectional view of another flexible circuit board, which includes a bending portion 13 and a non-bending portion 14. In the non-bending portion 14, two adjacent layers of substrates 11 are bonded and fixed by an adhesive layer 12. The adhesive layer 12 is only located in the non-bending portion 13, and there is no adhesive layer 12 between the substrates 11 in the area corresponding to the bending portion 13, so as to form a gap 15 between the two adjacent layers of substrates 11.

[0052] Relative to Figure 1 As shown, Figure 2 The flexible circuit board shown can improve the bendability of the flexible circuit board. Moreover, based on the gap 15 between the substrates 11, during the bending process of the flexible circuit board, the thickness of the gap 15 can be compressed as the substrate 11 bends and deforms, so that the bending portion 13 has a smaller thickness.

[0053] Figure 2 Although the flexible circuit board shown can improve the bending properties of the flexible circuit board, when the flexible circuit board is used in a foldable electronic device that needs to be bent repeatedly, due to heat pressing and electrostatic adsorption during the preparation process, the flexible material used to prepare the substrate 11 is prone to adhesion problems at the bending portion 13, thereby causing the bending portion 13 to harden, reducing the bending service life of the flexible circuit board, and the bending service life may not even exceed 1,000 times.

[0054] In order to solve the above problem, an embodiment of the present application provides a circuit board, which includes:

[0055] A carrier, wherein the carrier has a multi-layer substrate stacked in layers, the carrier includes a bending portion and a non-bending portion, and at least one layer of the multi-layer substrate is provided with a circuit;

[0056] in,

[0057] At the bending portion, there is a gap between two adjacent layers of the multi-layer substrate, and at least one of the two layers of substrate corresponding to the gap has a texture pattern on a surface facing the gap.

[0058] Based on the above description, it can be known that the circuit board provided in the embodiment of the present application has a gap between adjacent substrates in the bending portion, and at least one of the two layers of substrates corresponding to the gap has a texture pattern on the surface facing the gap. The two layers of substrates can be isolated based on the texture pattern to prevent adhesion problems between adjacent substrates in the bending portion.

[0059] It should be noted that the circuit boards provided in the embodiments of the present application are all bendable flexible circuit boards, which can be used in bendable electronic devices, or in scenarios where non-bendable electronic devices require circuit boards to be bent and connected. The embodiments of the present application do not limit the application scenarios of the circuit boards.

[0060] The above is the core inventive concept of the technical solution of the present application. In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0061] refer to Figure 3 As shown, Figure 3 A cross-sectional view of a circuit board provided in an embodiment of the present application, wherein the circuit board includes:

[0062] A carrier 10, the carrier 10 has a stacked multi-layer substrate 11, the carrier 10 includes a bending portion 13 and a non-bending portion 14, and at least one layer of the multi-layer substrate 11 is provided with a circuit;

[0063] In the bending portion 13 , a gap 15 is provided between two adjacent layers of the multi-layer substrates 11 , and at least one of the two layers of substrates 11 corresponding to the gap 15 has a texture pattern 111 on a surface facing the gap 15 .

[0064] Optionally, the substrate 11 may be a flexible copper clad laminate (FCCL). FCCL is a composite material consisting of a flexible insulating base film (such as a polyimide film or a polyester film) and a metal foil (usually a copper foil). This structure not only provides good electrical performance, but also has excellent mechanical flexibility, enabling it to be used in complex space conditions.

[0065] In the circuit board provided in the embodiment of the present application, there is a gap 15 between two adjacent layers of substrates 11 of the bending portion 13, and the gap 15 is an air gap. Based on the gap 15 between the substrates 11, the thickness of the bending portion 13 of the circuit board can be reduced when the circuit board is bent, and the bendability of the bending portion 13 can also be improved. In addition, based on the texture pattern 111 on the surface of the substrate 11 on the side facing the gap 15, the adhesion problem between the two adjacent layers of substrates 11 can be prevented, so as to improve the service life of the circuit board and allow the circuit board to be bent repeatedly more times.

[0066] Optionally, in the non-bending portion 14, two adjacent layers of substrates 11 are bonded and fixed by an adhesive layer 12. In the embodiment of the present application, the texture pattern 111 is used to isolate the two layers of substrates 11 corresponding to the gap 15. Therefore, in the bending portion 13, the adjacent two layers of substrates 11 can be isolated by the texture pattern 111 located on the surface of the substrate 11 to prevent adhesion problems between the substrates 11.

[0067] Based on the isolation effect of the texture pattern 111 , the two adjacent substrates 11 can have no adhesion at the bending portion 13 . When the circuit board is bent along the bending portion 13 , the two adjacent substrates 11 can be in contact so as to be separable based on the texture pattern 111 .

[0068] In the bending portion 13, among the two substrates 11 corresponding to each gap 15, at least one substrate 11 has a texture pattern 111 on the surface facing the gap 15. Figure 3 As shown, of the two substrates 11 corresponding to each gap 15, one of the substrates 11 is provided with a texture pattern 111 on the surface facing the gap 15. Thus, of the two substrates 11 corresponding to each gap 15, only one substrate 11 is required to be provided with a texture pattern 111 on the surface facing the gap 15, so as to reduce the number of texture patterns 111 provided.

[0069] Assuming that the carrier 10 includes N layers of substrates 11, N-1 gaps 15 are formed correspondingly, where N is a positive integer greater than 1. Each gap 15 requires at least one layer of texture pattern 111 to isolate the corresponding two adjacent layers of substrates 11, so the circuit board needs to have at least N-1 layers of texture pattern 111 at the bending portion 13.

[0070] For a circuit board with N layers of substrates 11, the circuit board may be provided with N-1 layers of texture patterns 111, so that the isolation between any two adjacent layers of substrates 11 can be achieved with a minimum number of texture patterns 111. Figure 3 As shown, each layer of texture pattern 111 is located on the upper surface of the substrate 11. In other embodiments, each layer of texture pattern 111 can also be located on the lower surface of the substrate 11, or a portion of the texture pattern 111 is located on the upper surface of the substrate 11, and another portion of the texture pattern 111 is located on the lower surface of the substrate 11.

[0071] In other embodiments, the two substrates 11 corresponding to each gap 15 may be provided with texture patterns 111 on surfaces facing the gap 15 , so that the two adjacent substrates 11 can achieve better isolation effect at the bending portion 13 .

[0072] For a substrate 11 having a texture pattern 111, in order to make the two opposite layers of the substrate 11 have a more consistent stress distribution, the substrate 11 is provided with texture patterns 111 on both sides opposite to each other in the thickness direction of the circuit board, and the texture patterns 111 on both sides of the same substrate 11 are the same.

[0073] refer to Figure 4 , Figure 4 A cross-sectional view of another circuit board provided in an embodiment of the present application, in which a carrier 10 is provided, and the N layers of substrates 11 in the carrier 10 are set to be the 1st substrate to the Nth substrate in the stacking direction, and the 2nd substrate to the N-1th substrate have texture patterns on both sides of the surfaces opposite to each other in the stacking direction. Under the premise of satisfying the requirement of isolation between the two adjacent layers of substrates 11 of the bending portion 13, the layout of the texture pattern 111 on the surface of the substrate 11 can be set based on the requirements, and is not limited to Figure 3 or Figure 4 The method shown.

[0074] In one implementation of the embodiment of the present application, the texture pattern 111 includes a graphic ink layer disposed on the surface of the substrate 11. In the bending portion, for two layers of substrates 11 facing the same gap 15, at least one layer of the substrate 11 has an ink layer on the surface facing the gap to form the texture pattern 111 on the surface of the substrate 11. The ink layer of the desired graphic structure can be formed by a silk screen process. The thickness of the ink layer does not exceed 100 μm, such as 10 μm, which is relatively thin and does not affect the bending characteristics.

[0075] The ink material forming the ink layer contains an antistatic agent, so that the ink layer has antistatic properties. The antistatic agent can be a traditional chemical antistatic agent or a metamaterial with antistatic properties, such as nanosilver.

[0076] In the embodiment of the present application, an ink layer with antistatic properties is used as the texture pattern 111. At the same time, since the ink material can maintain stable properties under the temperature process conditions of hot pressing, the circuit board is based on the ink layer, which can effectively prevent adhesion problems between the substrates 11 caused by hot pressing and static electricity.

[0077] For two layers of substrates 11 facing each other in the same gap 15, if the substrate 11 has an ink layer as the texture pattern 111, one of the substrates 11 can be provided with an ink layer on a surface facing the gap 15; or, in order to achieve a better isolation effect between the two layers of substrates 11, the two layers of substrates 11 can also be provided with an ink layer on a surface facing the gap 15.

[0078] If the substrate 11 has an ink layer, the substrate 11 has ink layers on both sides of the substrate 11 in the thickness direction of the circuit board. In this way, the substrate 11 can have symmetrically arranged ink layers on both sides of the substrate 11, so that the substrate 11 can have a more consistent stress distribution.

[0079] If the texture pattern 111 is an ink layer disposed on the surface of the substrate, the graphic structure of the ink layer can be as follows: Figure 5-Figure 8 Either way shown.

[0080] refer to Figure 5 , Figure 5 1 is a top view of an ink layer provided in an embodiment of the present application. In this method, the ink layer as the texture pattern 111 includes a plurality of ink lines arranged in parallel. The extending direction of the ink lines ( Figure 5 The longitudinal direction of the circuit board is the direction of the line between the bending portion 13 and the non-bending portion 14.

[0081] refer to Figure 6 , Figure 6 This is a top view of another ink layer provided in an embodiment of the present application. In this method, the ink layer as a texture pattern 111 includes a plurality of ink lines arranged in parallel. Figure 5 The difference between the two methods is that the direction of extension of the ink line ( Figure 6 The middle longitudinal direction is the width direction of the circuit board.

[0082] refer to Figure 7 , Figure 7 1 is a top view of another ink layer provided in an embodiment of the present application. In this method, the ink layer as the texture pattern 111 is a grid pattern, and the grid pattern is formed by the intersection of the first ink line and the second ink line. The extension direction of the first ink line ( Figure 7 The horizontal direction is the length direction of the circuit board, and the extension direction of the second ink line ( Figure 7 The middle longitudinal direction is the width direction of the circuit board.

[0083] refer to Figure 8 , Figure 8 A top view of another ink layer provided in an embodiment of the present application, in which the ink layer serving as the texture pattern 111 is a grid pattern, and the grid pattern is formed by the intersection of a third ink line and a fourth ink line, and the third ink line and the fourth ink line respectively have an angle with the width direction of the circuit board and respectively have an angle with the length direction of the circuit board.

[0084] refer to Fig. 9 As shown, Fig. 9A cross-sectional view of another circuit board provided in an embodiment of the present application, in which the texture pattern 111 includes a plurality of elastic support columns arranged on the surface of the substrate. In the bending portion 13, for two layers of substrates 11 facing the same gap 15, at least one layer of the substrate 11 has a plurality of elastic support columns on the surface facing the gap 15, so as to form the texture pattern 111 on the surface of the substrate 11.

[0085] On the same substrate 11 , a plurality of elastic support columns on the same side surface are distributed in a matrix on the surface. The elastic support columns may be colloid protrusions formed by dispensing glue, or the elastic support columns may be protrusion structures integrally formed with the substrate 11 .

[0086] In the length direction of the circuit board, there are a plurality of non-bending portions 14 distributed sequentially in the circuit board, and a bending portion 13 is provided between two adjacent non-bending portions 14 .

[0087] In one implementation of the present application, in the bending portion 13, the lengths of different substrates 11 between two adjacent non-bending portions 14 are the same or approximately the same, so that the bending portion 13 can have relatively consistent bending capabilities on both sides opposite to each other in the thickness direction of the circuit board.

[0088] like Figure 2-Figure 4 as well as Fig. 9 In any of the methods, the lengths of the bending portions 13 of the substrates 11 of each layer are approximately the same, so when the circuit board is bent upward or downward, the bending capabilities in the two bending directions are consistent.

[0089] refer to Fig.10 , Fig.10 A cross-sectional view of another circuit board provided in an embodiment of the present application, based on any of the above implementations, Fig.10 In the circuit board shown, the carrier 10 has N layers of substrates 11 stacked in sequence, and the N layers of substrates 11 are sequentially from the first substrate to the Nth substrate in the stacking direction, where N is a positive integer greater than 1; in the bending portion 13, the lengths of the first substrate to the Nth substrate increase or decrease in sequence. In this manner, the layers of substrates 11 in the same bending portion 13 can be gradually changed in the stacking direction, so that the bending portion 13 can be bent toward one side more easily.

[0090] by Fig.10 Taking the illustrated method as an example, since the lengths of the substrates 11 of each layer decrease from top to bottom in the same bending portion 13 , the circuit board can be bent downward more easily.

[0091] Based on the circuit board provided in the above embodiment, another embodiment of the present application further provides an electronic device, which can be Fig.11 shown.

[0092] refer to Fig.11 , Fig.11 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application, combined with Fig.11 And the circuit board figure provided in the above embodiment, the electronic device shown includes:

[0093] First ontology 16;

[0094] Second body 17;

[0095] A rotating connection device 18, the rotating connection device 18 is located between the first body 16 and the second body 17, and the rotating connection device 18 has a receiving cavity 181;

[0096] The circuit board 19 provided in any implementation manner in the circuit board embodiments, the circuit board 19 is located in the rotating connection device 18, and the circuit board 19 is electrically connected to the first body 16 and the second body 17; the circuit board 19 has a bending portion 13 located in the accommodating cavity 181, and the bending portion 13 includes a multi-layer substrate 11 stacked in layers; there is a gap 15 between two adjacent layers of substrates 11; at least one of the two layers of substrates 11 corresponding to the gap 15 has a texture pattern 111 on the surface facing the gap 15.

[0097] The electronic device uses the circuit board 19 provided in the above embodiment to connect the first body 16 and the second body 17, and places the bending portion 13 of the circuit board 19 in the accommodating cavity 181 of the rotating connection device 18. When the first body 16 and the second body 17 of the electronic device are bent based on the rotating connection device 18, the bending portion 13 located in the accommodating cavity 181 can bend along with the bending of the electronic device. Since the adjacent substrates 11 in the bending portion 13 are isolated based on the texture pattern 111, the adjacent substrates 11 in the bending portion 13 can be effectively prevented from sticking together during the bending process of the electronic device.

[0098] Furthermore, the circuit board 19 used in the electronic device has a multi-layer substrate 11, which allows the circuits to be stacked in the thickness direction of the electronic device. When the width of the electronic device is constant, more circuits can be arranged.

[0099] refer to Fig.12 and Fig.13 , Fig.12 This is a partial enlarged view of the two bodies of the electronic device in a bent state. Fig.13 This is a partial enlarged view of the two bodies of the electronic device when they are in a flattened state. Fig.12 and Fig.13 All of them are cross-sectional views of the electronic device in the area including the rotating connection device 18 , and the cross-sectional views are perpendicular to the thickness direction of the electronic device and perpendicular to the thickness direction of the circuit board 19 .

[0100] like Fig.12 and Fig.13As shown, the rotating connection device 18 includes: a rotating shaft decorative cover 20 having an accommodating cavity 181; a rotating shaft assembly 21 that rotatably connects the first body 16 and the second body, and the rotating shaft assembly 21 is located on one side of the rotating shaft decorative cover 20 having the accommodating cavity 181;

[0101] The circuit board 19 is located between the shaft assembly 21 and the shaft decorative cover 20;

[0102] If the first body 16 and the second body 17 are in an unfolded state based on the rotating connection device 18 , the shaft assembly 21 is flattened and located outside the accommodating cavity 181 ; the bent portion 13 is freely laid on the bottom of the accommodating cavity 181 .

[0103] If the first body 16 and the second body 17 are in a closed state based on the rotation connection device 18, the shaft assembly 21 is bent and at least part of the shaft assembly 21 is located in the accommodating cavity 181. The bending portion 13 is bent based on the shaft assembly 21 and covers the surface of the shaft assembly 21.

[0104] The electronic device is a display device, and has a flexible display screen 23. The first body 16 and the second body 17 respectively have a middle frame 22, and the flexible display screen 23 is fixed on the middle frames 22 of the two bodies. The flexible display screen can be an OLED display screen.

[0105] Optionally, as described above, the circuit board 19 has N layers of substrates 11 stacked in sequence, and the N layers of substrates 11 are sequentially from the 1st substrate to the Nth substrate in the stacking direction, and N is a positive integer greater than 1; in the bending portion 13, the lengths of the 1st substrate to the Nth substrate increase sequentially; the Nth substrate is arranged close to the hinge assembly 21, so that the bending portion 13 is more easily bent toward the hinge assembly 21.

[0106] In this specification, each embodiment is described in a progressive, parallel, or progressive and parallel manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0107] It should be noted that in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification identify the same structure. In addition, for the sake of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It is also understood that when an element such as a layer, film, region, or substrate is referred to as "on" another element, the element may be directly on the other element or there may be an intermediate element. In addition, "on" refers to positioning an element on or below another element, but does not essentially refer to positioning on the upper side of another element according to the direction of gravity.

[0108] The terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0109] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the article or device including the above elements.

[0110] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit board, characterized in that: include A carrier, wherein the carrier has a stacked multi-layer substrate, the carrier includes a bending portion and a non-bending portion, and at least one layer of the multi-layer substrate is provided with a circuit; in, At the bending portion, a gap is provided between two adjacent layers of the multi-layer substrate, and at least one of the two layers of the substrate corresponding to the gap has a texture pattern on a surface facing the gap.

2. The circuit board according to claim 1, characterized in that: The texture pattern is used to isolate the two layers of the substrate corresponding to the gap.

3. The circuit board according to claim 1, characterized in that: The texture pattern includes a graphic ink layer disposed on the surface of the substrate.

4. The circuit board according to claim 3, characterized in that: If the substrate has the ink layer, both opposite surfaces of the substrate in the thickness direction of the circuit board have the ink layer.

5. The circuit board according to claim 1, characterized in that: The texture pattern includes a plurality of elastic support columns arranged on the surface of the substrate.

6. The circuit board according to claim 1, characterized in that: In the bending portion, the lengths of different substrates between two adjacent non-bending portions are the same.

7. The circuit board according to claim 1, characterized in that: The carrier has N layers of substrates stacked in sequence, and the N layers of substrates are sequentially from the first substrate to the Nth substrate in the stacking direction, and N is a positive integer greater than 1; At the bending portion, the lengths of the first substrate to the Nth substrate increase or decrease sequentially.

8. An electronic device, characterized in that: include: first ontology; Second entity; A rotating connection device, located between the first body and the second body, and having a receiving cavity; A circuit board, the circuit board is located in the rotating connection device, electrically connecting the first body and the second body; the circuit board has a bending portion located in the accommodating cavity, the bending portion includes a multi-layer substrate stacked together; there is a gap between two adjacent layers of the substrates; at least one of the two layers of the substrates corresponding to the gap has a texture pattern on the surface facing the gap.

9. The electronic device according to claim 8, characterized in that: The rotary connection device comprises: a rotating shaft decorative cover having the accommodating cavity; a rotating shaft assembly rotatably connecting the first body and the second body, located on one side of the rotating shaft decorative cover having the accommodating cavity; Wherein, the circuit board is located between the rotating shaft assembly and the rotating shaft decorative cover; If the first body and the second body are in an unfolded state based on the rotating connection device, the shaft assembly is flattened and located outside the accommodating cavity; the bent portion is located at the bottom of the accommodating cavity; If the first body and the second body are in a closed state based on the rotating connection device, the shaft assembly is bent and at least partially located in the accommodating cavity; the bending portion is covered on the surface of the shaft assembly based on the bending of the shaft assembly.

10. The electronic device according to claim 9, characterized in that: The circuit board has N layers of substrates stacked in sequence, and the N layers of substrates are sequentially from the 1st substrate to the Nth substrate in the stacking direction, and N is a positive integer greater than 1; in the bending portion, the lengths of the 1st substrate to the Nth substrate increase sequentially; and the Nth substrate is arranged close to the rotating shaft assembly.

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