Water-cooling heat dissipation structure and electronic equipment

Abstract

The utility model provides a water-cooling heat dissipation structure and electronic equipment, and relates to the technical field of electronic equipment. The water-cooling heat dissipation structure comprises a first plate body, the first plate body is used for being in contact with a heating source so as to absorb heat generated by the heating source, and the first plate body is provided with a groove body structure which is formed in a sunken mode in the thickness direction; the second plate body covers the groove body structure, and a closed space is formed by the second plate body and the groove body structure; the microchannel structure and the flow guide structure are sequentially arranged in the closed space in a stacked mode, the microchannel structure forms a first flow path on the bottom wall of the groove body structure, and the flow guide structure forms a second flow path in the closed space; the second plate body is further provided with a liquid inlet and a liquid outlet, the flow guide structure is communicated with the liquid inlet, the micro-channel structure is communicated with the liquid outlet, and the flowing parameter of the liquid heat dissipation medium flowing through the second flow path is different from the flowing parameter of the liquid heat dissipation medium flowing through the first flow path.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a water cooling and heat dissipation structure and electronic equipment. Background Art

[0002] At present, the thermal resistance of water-cooled radiators for CPU heat dissipation is already very small, gradually approaching the heat dissipation bottleneck, and further improving the heat dissipation performance presents huge technical challenges. However, the continuous increase in CPU power consumption has put higher and higher requirements on the performance of radiators. To bring out the extreme performance of extreme CPUs, the performance of radiators needs to be further improved. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a water-cooling heat dissipation structure and an electronic device, which mainly provide the following technical solutions:

[0004] A first aspect of the present application provides a water-cooled heat dissipation structure, the water-cooled heat dissipation structure comprising: a first plate body, used to contact a heat source to absorb heat generated by the heat source, the first plate body having a groove body structure formed by being recessed along a thickness direction;

[0005] A second plate body, covering the trough structure, and forming a closed space with the trough structure;

[0006] A microchannel structure and a flow guide structure are sequentially stacked in the enclosed space, wherein the microchannel structure forms a first flow path on the bottom wall of the trough structure, and the flow guide structure forms a second flow path in the enclosed space;

[0007] Among them, the second plate body is also provided with a liquid inlet and a liquid outlet, the guide structure is connected to the liquid inlet, and the microchannel structure is connected to the liquid outlet, so as to utilize the liquid heat dissipation medium flowing through the second flow path and the first flow path to take away the heat absorbed by the first plate body, and the flow parameters of the liquid heat dissipation medium flowing through the second flow path are different from the flow parameters of the liquid heat dissipation medium flowing through the first flow path.

[0008] In some modified implementations of the first aspect of the present application, the flow guiding structure includes:

[0009] A third plate body is provided with a liquid inlet hole group connected to the liquid inlet, and two liquid outlet holes arranged on opposite sides of the liquid inlet hole group in a first direction, wherein the first direction is an extension direction of the first flow path;

[0010] The third plate body is formed with two grooves on opposite sides of the liquid inlet hole group, the two liquid outlet holes are respectively arranged in the two grooves, and the extending direction of the grooves is perpendicular to the first direction;

[0011] The liquid inlet hole group, a portion of the first flow path, the liquid outlet hole and the groove form the second flow path.

[0012] In some modified implementations of the first aspect of the present application, the liquid inlet hole group includes:

[0013] A first liquid inlet hole;

[0014] Two second liquid inlet holes are arranged at opposite ends of the first liquid inlet hole and connected thereto along a second direction, wherein the second direction is perpendicular to the first direction;

[0015] Wherein, at least a portion of the width of the first liquid inlet hole in the first direction is greater than that of the second liquid inlet hole.

[0016] In some modified implementations of the first aspect of the present application, the widths of the two opposite ends of the first liquid inlet hole gradually decrease toward the direction approaching the second liquid inlet hole;

[0017] and / or,

[0018] The two liquid outlet holes are arranged on opposite sides of the first liquid inlet hole.

[0019] In some modified implementations of the first aspect of the present application, a projection of an area where the liquid inlet hole group, the liquid outlet hole and the groove are arranged on the third plate body on the first plate body coincides with a contact area between the first plate body and the target heat source;

[0020] and / or,

[0021] The outer surface of the groove bottom of the groove is in contact with or spaced apart from the micro-channel structure by a first height.

[0022] In some modified embodiments of the first aspect of the present application, a third flow path is formed between the microchannel structure and the groove wall of the groove body structure, and the liquid heat dissipation medium flowing out of the first flow path and the second flow path flows to the liquid outlet through the third flow path to flow out through the liquid outlet.

[0023] In some modified implementations of the first aspect of the present application, the tank structure includes: a first tank and a second tank disposed at the bottom of the first tank, the microchannel structure is partially embedded in the second tank, and a portion of the first tank located at the periphery of the second tank forms the third flow path;

[0024] and / or,

[0025] The flow rate of the liquid heat dissipation medium flowing through the second flow path is greater than the flow rate of the liquid heat dissipation medium flowing through the third flow path.

[0026] In some modified implementations of the first aspect of the present application, an avoidance gap is further provided at one end of the third plate body close to the liquid outlet, and the avoidance gap enables the liquid outlet to be connected to a third flow path formed between the microchannel structure and the groove wall of the groove body structure;

[0027] and / or,

[0028] The sizes of the two liquid outlet holes and the first liquid inlet hole in the second direction are adapted to each other.

[0029] In some modified implementations of the first aspect of the present application, the following further includes:

[0030] a first pump body connected to the liquid inlet for conveying liquid heat dissipation medium to the first flow path and the second flow path;

[0031] and / or,

[0032] A second pump body is connected to the liquid outlet to recover the liquid heat dissipation medium.

[0033] A second aspect of the present application provides an electronic device, which includes: a heat source; and the above-mentioned water-cooling heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0035] Figure 1 The structural diagram of the water cooling heat dissipation structure provided in the embodiment of the present application is schematically shown;

[0036] Figure 2 The schematic diagram of the structure of the water cooling heat dissipation structure provided in the embodiment of the present application is schematically shown from another angle;

[0037] Figure 3 The cross-sectional structure diagram of the water cooling heat dissipation structure provided in the embodiment of the present application is schematically shown;

[0038] Figure 4 The schematic diagram of the structure in the enclosed space of the water cooling and heat dissipation structure provided in the embodiment of the present application is schematically shown;

[0039] Figure 5 The structural schematic diagram of the flow guide structure of the water cooling heat dissipation structure provided in the embodiment of the present application is schematically shown;

[0040] Figure 6A schematic structural diagram of another angle of the guide structure of the water-cooling heat dissipation structure provided in an embodiment of the present application is schematically shown;

[0041] Figure 7 The schematic diagram of the structure of the microchannel structure of the water cooling heat dissipation structure provided in the embodiment of the present application is schematically shown;

[0042] Description of Figure Numbers:

[0043] The first plate body 1, the slot structure 101, the first slot body 1011, the second slot body 1012, the positioning slot 102, the mounting slot 103, the third flow path 102, the first surface 1a, the second surface 1b, the second plate body 2, the liquid inlet 201, the liquid outlet 202, the microchannel structure 3, the third plate body 4, the liquid inlet hole group 401, the first liquid inlet hole 401a, the second liquid inlet hole 401b, the liquid outlet hole 402, the groove 403, the positioning edge 404, the positioning end 405, the avoidance gap 406, the heat source 5, the target heat source 501, the first direction x, the second direction y. DETAILED DESCRIPTION

[0044] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0045] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0046] Embodiment 1

[0047] Reference Figure 1 -Attached Figure 4, Embodiment 1 of the present application proposes a water-cooled heat dissipation structure, which includes: a first plate body 1, which is used to contact with a heat source 5 to absorb the heat generated by the heat source 5, and the first plate body 1 has a groove body structure 101 formed by being recessed along the thickness direction; a second plate body 2, which covers the groove body structure 101 and forms a closed space with the groove body structure 101; and a microchannel structure 3 and a guide structure which are stacked in the closed space, and the microchannel structure 3 is formed on the bottom wall of the groove body structure 101. There is a first flow path, and the guide structure forms a second flow path in the confined space; wherein, the second plate body 2 is also provided with a liquid inlet 201 and a liquid outlet 202, the guide structure is connected with the liquid inlet 201, and the microchannel structure 3 is connected with the liquid outlet 202, so as to utilize the liquid heat dissipation medium flowing through the second flow path and the first flow path to take away the heat absorbed by the first plate body 1, and the flow parameters of the liquid heat dissipation medium flowing through the second flow path are different from the flow parameters of the liquid heat dissipation medium flowing through the first flow path.

[0048] Specifically, the water-cooled heat dissipation structure provided in this embodiment can be used to dissipate heat from a heat source 5 inside an electronic device such as a desktop computer or a laptop computer. The heat source 5 here may refer to a device that generates heat during operation inside the electronic device or multiple closely located devices, such as a central processing unit (CPU), a graphics processing unit GPU, a tensor processing unit (TPU), a neural network processor NPU (Neural Network Processing Unit), a deep learning processor DPU (Deep learning Processing Unit), memory, storage, a power module, etc., or may also refer to the highest temperature area of ​​a certain heat-generating device inside the electronic device, such as the middle area of ​​the central processing unit. The water-cooled heat dissipation structure specifically includes: a first plate body 1, a second plate body 2, a microchannel structure 3 and a flow guide structure, wherein the first surface 1a of the first plate body 1 is directly in contact with the heat source 5 or is in contact with the heat source 5 through a heat conductor, and can absorb the heat generated by the heat source 5 during operation through contact. Of course, the first surface 1a is not only in contact with the heat source 5, but also in contact with other heat-generating parts adjacent to the heat source 5, and the heat source 5 is the position with the highest temperature; the second surface 1b of the first plate body 1 opposite to the first surface 1a has a groove structure 101 formed by a depression along its thickness direction; in order to improve the thermal conductivity of the first plate body 1, it can be made of a metal material with excellent thermal conductivity, such as copper, but not limited to this; the first surface 1a of the first plate body 1 can be a plane, or can also be set to a special-shaped surface that follows the shape of the heat source 5 to ensure sufficient contact. The size of the second plate body 2 can be slightly larger than the slot structure 101 so as to cover the opening of the slot structure 101. The second plate body 2 and the slot structure 101 form a closed space, and a liquid inlet 201 and a liquid outlet 202 are also provided on the second plate body 2, wherein the liquid inlet 201 can be located in the middle of the second plate body 2, and the liquid outlet 202 is spaced apart from the liquid inlet 201 in the second direction y; in order to improve the positioning effect of the second plate body 2 and the first plate body 1, an installation groove 103 adapted to the second plate body 2 can be provided on the second surface 1b of the first plate body 1, and the slot structure 101 can be formed by further deepening the slot body in the installation groove 103.The microchannel structure 3 and the guide structure are arranged in a confined space and are stacked in sequence at the bottom of the groove of the groove structure 101. The surfaces of the microchannel structure 3 and the guide structure that are away from each other are respectively in contact with the bottom of the groove of the groove structure 101 and the inner side of the second plate body 2; the microchannel structure 3 forms a first flow path extending along the first direction x, the number of the first flow paths can be multiple, and they are connected to the liquid outlet 202, and the arrangement direction of the multiple second flow paths can be the above-mentioned second direction y, and the second direction y is perpendicular to the first direction x and the thickness direction of the first plate body 1; the guide structure forms a second flow path in the confined space, and the second flow path can be formed independently of the guide structure, or can also be set to be formed by the guide structure and part of the first flow path, and the second flow path is connected to the liquid inlet 201. With this design, the liquid heat dissipation medium flowing in from the liquid inlet 201 can flow through the second flow path and the first flow path successively, and can take away the heat absorbed by the first plate body 1 during the flow process.

[0049] Since the temperatures of various parts of the heat source 5 may be different, for example: when the heat source 5 is two or more heat-generating devices, the heat source 5 includes a central processing unit, a graphics processing unit and a tensor processor that are located in close proximity, and the different heat levels of each device result in different temperatures; and when the heat source 5 is one device, taking the heat source 5 as a central processing unit as an example, the temperatures of various parts of the central processing unit are also different. Based on the difference in temperature of various parts of the heat source 5, the heat absorbed by various parts of the first surface 1a of the first plate body 1 is also different. The position and trajectory of the first flow path and the second flow path can be set according to the heat distribution of the first surface 1a, and the flow parameters of the liquid heat dissipation medium flowing through the second flow path are set to be different from the flow parameters of the liquid heat dissipation medium flowing through the first flow path. The flow parameters here can specifically be flow velocity and / or flow rate; for example: the position and trajectory of the second flow path can be set to correspond to the area of ​​the heat source 5 with higher temperature and greater heat dissipation demand, and the flow velocity and flow rate of the liquid heat dissipation medium flowing through the second flow path are set to be higher than the flow velocity and flow rate of the liquid heat dissipation medium flowing through the first flow path, respectively, so as to enhance the local heat exchange efficiency of the water-cooled heat dissipation structure corresponding to the heat source 5, thereby improving the heat dissipation capacity of the water-cooled heat dissipation structure.

[0050] For further information, see Attachment Figure 4 -Attached Figure 6In a specific implementation, the guide structure includes: a third plate body 4, which is provided with a liquid inlet hole group 401 connected to the liquid inlet port 201, and two liquid outlet holes 402 arranged on opposite sides of the liquid inlet hole group 401 in a first direction x, and the first direction x is the extension direction of the first flow path; the third plate body 4 is formed with two grooves 403 on opposite sides of the liquid inlet hole group 401, and the two liquid outlet holes 402 are respectively arranged in the two grooves 403, and the extension direction of the groove 403 is perpendicular to the first direction x; the liquid inlet hole group 401, part of the first flow path, the liquid outlet hole 402 and the groove 403 form the second flow path.

[0051] Specifically, in order to form a second flow path and to achieve a difference between the flow parameters of the liquid heat dissipation medium flowing through the second flow path and the flow parameters of the liquid heat dissipation medium flowing through the first flow path, in the technical solution adopted in the present application, the flow guide structure specifically includes a third plate body 4, and the third plate body 4 can be made of but not limited to a plastic material, and needs to be tightly fitted with the second plate body 2; the third plate body 4 is provided with a liquid inlet hole group 401 connected to the liquid inlet 201, and the surface of the third plate body 4 facing away from the microchannel structure 3 is provided with grooves 403 on both sides of the liquid inlet hole group 401 along the first direction x, and the two grooves 403 extend respectively along the second direction y, and the bottoms of the two grooves 403 are respectively penetrated by liquid outlet holes 402. With this design, the liquid heat dissipation medium flows from the liquid inlet 201 through the liquid inlet hole group 401 into the microchannel structure 3, and the liquid heat dissipation medium in the microchannel structure 3 The liquid heat dissipation medium can flow in both directions along the first direction x, and can also flow along the thickness direction of the first plate body 1. Part of the liquid heat dissipation medium enters the groove 403 from the liquid outlet hole 402 during the flow, and flows from the groove 403 to the liquid outlet 202, so that the liquid inlet hole group 401, part of the first flow path, the liquid outlet hole 402 and the groove 403 can form a second flow path from the liquid inlet 201 to the liquid outlet 202. The liquid heat dissipation medium that has not entered the liquid outlet hole 402 continues to flow to the liquid outlet 202 through the microchannel structure 3, that is, the part of the heat dissipation medium only flows along the first flow path formed by the microchannel structure 3 to the liquid outlet 202. Compared with the first flow path formed only by the microchannel structure 3, the liquid heat dissipation medium flowing through the second flow path can reduce the flow resistance and increase the flow rate of liquid heat dissipation in the second flow path because part of the path does not pass through the microchannel structure 3, thereby improving the heat exchange efficiency of the water-cooled heat dissipation structure.

[0052] For further information, see Attachment Figure 4 -Attached Figure 6In a specific implementation, the liquid inlet hole group 401 includes: a first liquid inlet hole 401a; two second liquid inlet holes 401b arranged at opposite ends of the first liquid inlet hole 401a and connected thereto, the two second liquid inlet holes 401b are arranged on opposite sides of the first liquid inlet hole 401a along a second direction y, and the second direction y is perpendicular to the first direction x; wherein at least a portion of the width of the first liquid inlet hole 401a in the first direction x is greater than that of the second liquid inlet hole 401b.

[0053] Specifically, in order to further achieve efficient heat dissipation of the heat source, in the technical solution adopted in the present application, the liquid inlet hole group 401 is composed of a first liquid inlet hole 401a and two second liquid inlet holes 401b. The two second liquid inlet holes 401b are arranged on opposite sides of the first liquid inlet hole 401a along the second direction y, and are connected to the first liquid inlet hole 401a. The first liquid inlet hole 401a and the two second liquid inlet holes 401b can be respectively configured to be long strips extending along the second direction y; further, the position of the first liquid inlet hole 401a can be set to correspond to the area of ​​the heat source 5, and the width of at least part of the first liquid inlet hole 401a in the first direction x is set to be greater than the width of the second liquid inlet hole 401b in this direction. Such a setting can increase the flow rate and flow velocity of the liquid heat dissipation medium at the first liquid inlet hole 401a, thereby enhancing the heat exchange efficiency of the area, and concentratingly and efficiently reducing the temperature of the higher temperature area of ​​the heat source 5, thereby solving the heat dissipation capacity with higher power consumption requirements.

[0054] For further information, see Attachment Figure 5 and attached Figure 6 On the basis of the above-mentioned setting that the first liquid inlet hole 401a and the second liquid inlet hole 401b have a width difference in the first direction x, in order to reduce the resistance of the first liquid inlet hole 401a and the second liquid inlet hole 401b to the liquid heat dissipation medium at the connection position, in a specific implementation, the widths of the opposite ends of the first liquid inlet hole 401a gradually decrease in the direction close to the second liquid inlet hole 401b until they are equal to the width of the second liquid inlet hole 401b. In this way, the connection between the first liquid inlet hole 401a and the second liquid inlet hole 401b can be smoother, which is beneficial to reducing the flow resistance. More preferably, a smooth transition can be set at the connection between the first liquid inlet hole 401a and the second liquid inlet hole 401b.

[0055] For further information, see Attachment Figure 4 -Attached Figure 6On the basis of the above-mentioned arrangement of the first liquid inlet hole 401a and the second liquid inlet hole 401b with a width difference in the first direction x, the two liquid outlet holes 402 are arranged on opposite sides of the first liquid inlet hole 401a, and by setting the positions of the two liquid outlet holes 402 to correspond to the position of the first liquid inlet hole 401a, the flow rate and flow velocity of the liquid heat dissipation medium at the position of the first liquid inlet hole 401a can be further improved, thereby greatly improving the heat exchange efficiency of the area; wherein, the lengths of the two liquid outlet holes 402 and the first liquid inlet hole 401a in the second direction y are adapted, or, the lengths of the two liquid outlet holes 402 in the second direction y can also be greater than the length of the first liquid inlet hole 401a, which is not specifically limited here. Of course, such a design method can also be combined with a solution in which the widths of the opposite ends of the first liquid inlet hole 401a gradually decrease in the direction close to the second liquid inlet hole 401b.

[0056] For further information, see Attachment Figure 3 , the part of the heat source 5 with the highest temperature has the greatest heat dissipation demand. For example, when the heat source 5 is two or more heat generating devices, the heat source 5 includes a CPU, a GPU and a tensor processor located in close proximity, and the CPU may be the part with the highest temperature and the greatest heat dissipation demand. When the heat source 5 is one device, taking the heat source 5 as the CPU as an example, the temperatures of the various parts of the CPU are also different, and the temperature and heat dissipation demand of the central part are the greatest. The part of the heat source 5 with the highest temperature and the greatest heat dissipation demand is set as the target heat source 501. In order to achieve efficient heat dissipation of the corresponding area of ​​the target heat source 501, in a specific implementation, the projection of the setting area of ​​the liquid inlet hole group 401, the liquid outlet hole 402 and the groove 403 on the third plate body 4 on the first plate body 1 coincides with the contact area between the first plate body 1 and the target heat source 501, so that the arrangement area of ​​the second flow path can be highly coincident with the area where the target heat source 501 of the heat source 5 is located, so that the liquid heat dissipation medium flowing through the second flow path can efficiently take away the heat of the corresponding area of ​​the heat source 5 of the first plate body 1.

[0057] Furthermore, the outer surface of the bottom of the groove 403, that is, the surface facing the microchannel, can be spaced apart from the microchannel structure 3 by a first height, so as to provide a larger flow space for the liquid heat dissipation medium; or the outer surface of the bottom of the groove 403 can also be arranged to contact the microchannel structure 3, such as the attached Figure 3As shown, this can limit the flow of liquid heat dissipation medium at positions other than the liquid outlet hole 402 between the third plate body 4 and the microchannel, and can guide the liquid heat dissipation medium to flow more concentratedly along the first flow path and the second flow path to the liquid outlet 202. In this case, the third plate body 4 can be made of a material with a certain elasticity, such as a plastic material. Such a design can be designed in the thickness direction so that after the second plate body 2 is installed, the second plate body 2 applies a certain degree of extrusion force to the third plate body 4, so that the third plate body 4 is in close contact with the second plate body 2 and the microchannel structure 3, respectively, and further limit the flow path of the liquid heat dissipation medium. Such a design can allow more liquid heat dissipation medium to enter the groove 403 through the liquid outlet hole 402, which is beneficial to improve the heat dissipation capacity of the second flow path. Of course, the above-mentioned design method of the groove bottom of the groove 403 can also be combined with a solution in which the second flow path overlaps with the contact area of ​​the first plate body 1 and the target heat source 501.

[0058] For further information, see Attachment Figure 4 and attached Figure 7 In a specific implementation, a third flow path 102 is formed between the microchannel structure 3 and the groove wall of the groove body structure 101, and the liquid heat dissipation medium flowing out of the first flow path and the second flow path flows to the liquid outlet 202 through the third flow path 102 to be connected so as to flow out through the liquid outlet 202.

[0059] Specifically, in order to achieve the connection between the microchannel structure 3 and the liquid outlet 202, in the technical solution adopted by the present application, a third flow path 102 is formed between the periphery of the microchannel structure 3 and the groove wall of the groove structure 101, and the outlet of the microchannel structure 3 and the two grooves 403 can be connected with the liquid outlet 202 through the third flow path 102. To facilitate the positioning of the microchannel structure 3, the groove structure 101 may include: a first groove body 1011 and a second groove body 1012 arranged at the groove bottom of the first groove body 1011, the microchannel structure 3 is partially embedded in the second groove body 1012 in the thickness direction, and the portion of the first groove body 1011 located at the periphery of the second groove body 1012 forms the third flow path 102.

[0060] Specifically, since the heat dissipation demand of the area passed by the second flow path is greater, the flow rate of the liquid heat dissipation medium flowing through the second flow path can be set greater than the flow rate of the liquid heat dissipation medium flowing through the third flow path, thereby further increasing the heat absorbed by the liquid heat dissipation medium flowing through the second flow path.

[0061] Among them, in order to facilitate the liquid heat dissipation medium flowing along the groove 403 and toward the side of the liquid outlet 202 to flow directly to the liquid outlet 202, the third plate body 4 can be arranged to partially overlap with the position of the liquid outlet in the thickness direction, and an avoidance gap 406 can be arranged at one end of the third plate body 4 close to the liquid outlet 202. The avoidance gap 406 is connected to the two grooves 403 respectively, and the liquid outlet 202 can be connected to the third flow path 102 formed between the microchannel structure 3 and the groove wall of the groove body structure 101. In this way, part of the liquid heat dissipation medium along the first flow path, the second flow path and merging into the third flow path 102 and part of the liquid heat dissipation medium flowing only along the second flow path can eventually flow out through the liquid outlet.

[0062] Specifically, in order to facilitate the positioning of the third plate body 4 and the microchannel structure 3, in the technical solution adopted by the present application, positioning edges 404 extending toward the bottom of the second slot body 1012 are respectively arranged on the opposite sides of the third plate body 4 along the second direction y, and the two positioning edges 404 are perpendicular to the bottom of the second slot body 1012 and are respectively arranged on the opposite sides of the microchannel structure 3 in the second direction y, and the second slot body 1012 has an extension portion corresponding to the positioning portion so that the positioning portion is embedded in the second slot body 1012; further, in order to facilitate the installation and positioning of the third plate body 4, The groove wall corresponding to the extension part on one side can be set as an inclined wall surface, while the groove wall corresponding to the extension part on the other side can be set to be perpendicular to the groove bottom, and the extension part is respectively provided with mutual positioning grooves 102 on both sides along the first direction x, and the corresponding positioning edges 404 on one side are provided at both ends with positioning ends 405 corresponding to and adapted to the positioning groove 102. In this way, the setting of the inclined wall surface can guide and enable the third plate body 4 to be conveniently installed on the microchannel structure 3, and the third plate body 4 can be accurately and reliably positioned through the cooperation of the positioning end 405 and the positioning groove 102.

[0063] Furthermore, in a specific implementation, the water-cooled heat dissipation structure provided in this embodiment also includes: a first pump body (not shown in the figure) connected to the liquid inlet 201 to transport liquid heat dissipation medium to the first flow path and the second flow path; and / or, a second pump body (not shown in the figure) connected to the liquid outlet 202 to recover the liquid heat dissipation medium; the arrangement of the first pump body and the second pump body is conducive to increasing the flow rate of the liquid heat dissipation medium circulating between the liquid inlet 201 and the liquid outlet 202 through the first flow path and the second flow path, thereby helping to improve the heat dissipation efficiency and effect; in addition, the water-cooled heat dissipation structure may also include a controller and a control valve corresponding to each pump body to control the flow rate, flow rate, etc. of each pump body to meet the heat dissipation capacity requirements of the water-cooled heat dissipation structure.

[0064] Embodiment 2

[0065] Reference Figure 1 -Attached Figure 3Embodiment 1 of the present application provides an electronic device, which includes: a heat source 5; and the above-mentioned water-cooling heat dissipation structure.

[0066] Specifically, the electronic device provided in this embodiment can be but not limited to desktop computers, laptop computers and other devices, the heat source 5 can be but not limited to the central processing unit inside the electronic device, and the above-mentioned water-cooled heat dissipation structure is also arranged inside the electronic device, which can be used to efficiently dissipate the heat source 5 and the heat-generating parts adjacent to the heat source 5, and meet the efficient heat dissipation requirements of the heat source 5 with a higher temperature.

[0067] It should be noted that in the description of this specification, the terms "upper", "lower", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application; the terms "connect", "install", "fixed", etc. should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0068] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0069] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A water cooling heat dissipation structure, characterized in that: include: A first plate body, used for contacting with a heat source to absorb heat generated by the heat source, the first plate body having a groove structure formed by being recessed along a thickness direction; A second plate body, covering the trough structure, and forming a closed space with the trough structure; A microchannel structure and a flow guide structure are sequentially stacked in the enclosed space, wherein the microchannel structure forms a first flow path on the bottom wall of the trough structure, and the flow guide structure forms a second flow path in the enclosed space; Among them, the second plate body is also provided with a liquid inlet and a liquid outlet, the guide structure is connected to the liquid inlet, and the microchannel structure is connected to the liquid outlet, so as to utilize the liquid heat dissipation medium flowing through the second flow path and the first flow path to take away the heat absorbed by the first plate body, and the flow parameters of the liquid heat dissipation medium flowing through the second flow path are different from the flow parameters of the liquid heat dissipation medium flowing through the first flow path.

2. The water cooling heat dissipation structure according to claim 1, characterized in that: The flow guiding structure comprises: A third plate body is provided with a liquid inlet hole group connected to the liquid inlet, and two liquid outlet holes arranged on opposite sides of the liquid inlet hole group in a first direction, wherein the first direction is an extension direction of the first flow path; The third plate body is formed with two grooves on opposite sides of the liquid inlet hole group, the two liquid outlet holes are respectively arranged in the two grooves, and the extending direction of the grooves is perpendicular to the first direction; The liquid inlet hole group, a portion of the first flow path, the liquid outlet hole and the groove form the second flow path.

3. The water cooling heat dissipation structure according to claim 2, characterized in that: The liquid inlet hole group comprises: A first liquid inlet hole; Two second liquid inlet holes are arranged at opposite ends of the first liquid inlet hole and connected thereto along a second direction, wherein the second direction is perpendicular to the first direction; Wherein, at least a portion of the width of the first liquid inlet hole in the first direction is greater than that of the second liquid inlet hole.

4. The water cooling heat dissipation structure according to claim 3, characterized in that: The widths of the two opposite ends of the first liquid inlet hole gradually decrease toward the direction approaching the second liquid inlet hole; and / or, The two liquid outlet holes are arranged on opposite sides of the first liquid inlet hole.

5. The water cooling heat dissipation structure according to claim 2, characterized in that: The projection of the arrangement area of ​​the liquid inlet hole group, the liquid outlet hole and the groove on the third plate on the first plate coincides with the contact area between the first plate and the target heat source; and / or, The outer surface of the groove bottom of the groove is in contact with or spaced apart from the micro-channel structure by a first height.

6. The water cooling heat dissipation structure according to claim 2, characterized in that: A third flow path is formed between the microchannel structure and the groove wall of the groove body structure, and the liquid heat dissipation medium flowing out of the first flow path and the second flow path flows to the liquid outlet through the third flow path to flow out through the liquid outlet.

7. The water cooling structure according to claim 6, characterized in that: The tank structure comprises: a first tank and a second tank disposed at the bottom of the first tank, the microchannel structure is partially embedded in the second tank, and a portion of the first tank located at the periphery of the second tank forms the third flow path; and / or, The flow rate of the liquid heat dissipation medium flowing through the second flow path is greater than the flow rate of the liquid heat dissipation medium flowing through the third flow path.

8. The water cooling heat dissipation structure according to claim 3, characterized in that: The third plate body is further provided with an avoidance gap at one end close to the liquid outlet, and the avoidance gap enables the liquid outlet to be connected to a third flow path formed between the microchannel structure and the groove wall of the groove body structure; and / or, The sizes of the two liquid outlet holes and the first liquid inlet hole in the second direction are adapted to each other.

9. The water cooling and heat dissipation structure according to claim 1, characterized in that: Also includes: a first pump body connected to the liquid inlet for conveying liquid heat dissipation medium to the first flow path and the second flow path; and / or, A second pump body is connected to the liquid outlet to recover the liquid heat dissipation medium.

10. An electronic device, characterized in that: include: Heat source; A water cooling heat dissipation structure as described in any one of claims 1 to 9.

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