Liquid medicine stirring tank for electrocoppering

Abstract

The utility model discloses an electrocoppering liquid medicine stirring tank which comprises a stirring tank body, a first hanging rod is fixed to the inner wall of one side of the top of the stirring tank body, a second hanging rod is fixed to the inner wall of the other side of the top of the stirring tank body, the inner wall of one side of the bottom of the stirring tank body is communicated with a liquid discharging pipe, and an arc-shaped shell is arranged on the inner wall of the bottom of the stirring tank body. A stirring assembly is arranged on the inner wall of the middle of the stirring tank and comprises a supporting block welded in the width direction of the stirring tank, a rotating shaft is rotationally connected to the supporting block, and stirring blades distributed at equal intervals are welded to the outer wall of the rotating shaft; in the process of stirring to promote the flowing of the electroplating liquid, the backflow pipe is arranged at the top of the stirring tank in order to avoid the influence of the countercurrent of the solution on the uniform distribution of copper ions, so that the electroplating liquid can smoothly flow, the gathering of the copper ions like a plated part is accelerated, and the subsequent plating effect can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a solution stirring tank for copper electroplating. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. Electroplating can prevent metal oxidation (such as rust), improve wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance aesthetics. The outer layer of many coins is also electroplated. Electroplating is widely used in the electronics industry to deposit conductive metals used in printed circuit boards, connectors and semiconductor interconnects. In the traditional electroplating process, copper electroplating is often performed on the workpiece, but there are still some problems in the existing electroplating copper process:

[0003] The plating solution is not uniform. Since the copper ions in the plating solution are continuously consumed during the electroplating process, the copper ions around the plated parts gradually decrease as the electroplating time increases. As a result, the plating effect will gradually decrease during the subsequent plating process. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and provides a solution stirring tank for copper electroplating.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A solution stirring tank for electroplating copper comprises a stirring tank, a first hanging rod is fixed to an inner wall on one side of the top of the stirring tank, a second hanging rod is fixed to an inner wall on the other side of the top of the stirring tank, a discharge pipe is connected to an inner wall on one side of the bottom of the stirring tank, an arc-shaped shell is provided on the inner wall at the bottom of the stirring tank, and a stirring assembly is provided on the middle inner wall of the stirring tank, the stirring assembly comprises a support block welded along the width direction of the stirring tank, and a rotating shaft is rotatably connected to the support block, stirring blades distributed at equal distances are welded to the outer wall of the rotating shaft, and a protective top shell is provided above the stirring blades.

[0007] As a further solution of the utility model: a positioning groove is opened at the center of the top of the mixing tank, and a support rod is clamped and installed inside the positioning groove, and a storage frame is hung on the support rod.

[0008] As a further solution of the utility model: a first helical gear is arranged on the outer wall of one end of the rotating shaft, and the first helical gear is meshed and driven with a second helical gear.

[0009] As a further solution of the utility model: a connecting shaft is connected to the axis center of one side of the second bevel gear, and a driving motor is connected to the outer wall of the connecting shaft.

[0010] As a further solution of the utility model: a rectangular notch is opened on the inner wall of one side of the stirring tank, and a reflux pipe is arranged on the outer wall of the rectangular notch.

[0011] As a further solution of the utility model: a rectangular filter box is inserted into the inner wall of one end of the return pipe, and a filter screen is arranged inside the rectangular filter box.

[0012] As a further solution of the utility model: the size of the stirring blade is adapted to the distance between the arc-shaped shell and the protective top shell.

[0013] As a further solution of the utility model: a sedimentation groove is provided on the stirring tank below the first hanging rod, and a circular through groove is provided through the center of the sedimentation groove, and a cylindrical sedimentation shell is welded to the outer wall of the bottom of the circular through groove.

[0014] As a further solution of the utility model: the inner wall of the cylindrical sedimentation shell is rotatably provided with a rotating blade, and the bottom of the rotating blade is connected to a servo motor through a coupling, and the inner wall on one side of the bottom of the cylindrical sedimentation shell is connected to a sewage pipe.

[0015] Compared with the prior art, the utility model provides a solution stirring tank for copper electroplating, which has the following beneficial effects:

[0016] 1. A solution stirring tank for copper electroplating, by arranging a continuously rotating stirring blade at the lower middle part of the stirring tank, so that during the electroplating process, the electroplating solution can be effectively stirred to accelerate the movement of internal copper ions, so that during the electroplating process, the copper ions in the electroplating solution are evenly distributed, which can improve the subsequent plating effect.

[0017] 2. A solution stirring tank for copper electroplating. In the process of stirring to promote the flow of the electroplating solution, in order to avoid the backflow of the solution affecting the uniform distribution of copper ions, a reflux pipe is set on the top of the stirring tank, which can allow the electroplating solution to flow smoothly, accelerate the aggregation of copper ions to the plated parts, and improve the subsequent plating effect.

[0018] 3. The electroplating copper solution stirring tank of this design sets a cylindrical sedimentation shell in the middle of the sedimentation groove, and uses a servo motor to drive the rotating blades to slowly drive the sediment to rotate, thereby using centrifugal force to accelerate the aggregation and sedimentation of the sediment, and quickly discharge it from the side drain pipe. The sediment can be quickly discharged, thereby effectively maintaining the ion concentration inside the electroplating solution and reducing the interference of the sediment.

[0019] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1This is a bottom view of the overall structure of a solution stirring tank for electroplating copper proposed by the utility model;

[0021] Figure 2 This is a top view of the overall structure of a solution stirring tank for copper electroplating proposed by the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of a first-viewing angle of a solution stirring tank for electroplating copper proposed by the utility model;

[0023] Figure 4 The utility model discloses a schematic diagram of the internal structure of a stirring tank of a solution stirring tank for copper electroplating.

[0024] In the figure: 1, stirring tank; 2, first hanging rod; 3, second hanging rod; 4, sedimentation groove; 5, drain pipe; 6, positioning groove; 7, support rod; 8, storage frame; 9, arc-shaped shell; 10, support block; 11, rotating shaft; 12, stirring blade; 13, protective top shell; 14, first bevel gear; 15, second bevel gear; 16, connecting shaft; 17, driving motor; 18, reflux pipe; 19, circular through groove; 20, cylindrical sedimentation shell; 21, rotating blade; 22, drain pipe; 23, servo motor. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0026] Embodiment 1:

[0027] A solution stirring tank for copper electroplating. This embodiment is based on the problem of uneven ion distribution in the existing electroplating process. In order to achieve uniformity of the plating layer, Figure 1-4 As shown, it includes a stirring tank 1, a first hanging rod 2 is fixed to the inner wall of one side of the top of the stirring tank 1, and a second hanging rod 3 is fixed to the inner wall of the other side of the top of the stirring tank 1, a precipitation groove 4 is opened on the stirring tank 1 below the first hanging rod 2, and a circular through groove 19 is penetrated at the center of the precipitation groove 4, a cylindrical precipitation shell 20 is welded to the outer wall of the bottom of the circular through groove 19, and a drain pipe 5 is connected to the inner wall of one side of the bottom of the stirring tank 1, an arc-shaped shell 9 is arranged on the inner wall of the bottom of the stirring tank 1, and a stirring assembly is arranged on the inner wall of the middle part of the stirring tank 1, the stirring assembly includes a support block 10 welded along the width direction of the stirring tank 1, and a rotating shaft 11 is clamped on the support block 10, and stirring blades 12 distributed at equal distances are welded on the outer wall of the rotating shaft 11, and a protective top shell 13 is arranged above the stirring blades 12;

[0028] By arranging a continuously rotating stirring blade 12 at the lower middle part of the stirring tank 1, the plating solution can be effectively stirred during the electroplating process, thereby accelerating the movement of internal copper ions, so that the copper ions in the plating solution are evenly distributed during the electroplating process, thereby improving the subsequent plating effect.

[0029] A positioning groove 6 is provided at the center of the top of the mixing tank 1, and a support rod 7 is mounted inside the positioning groove 6, and a storage frame 8 is hung on the support rod 7. A first bevel gear 14 is provided on the outer wall of one end of the rotating shaft 11, and the first bevel gear 14 is meshed and driven with a second bevel gear 15;

[0030] A connecting shaft 16 is connected to the axis center of one side of the second bevel gear 15 , and a driving motor 17 is connected to the outer wall of the connecting shaft 16 .

[0031] A rectangular notch is formed on one inner wall of the stirring tank 1, and a reflux pipe 18 is disposed on the outer wall of the rectangular notch;

[0032] In the process of stirring to promote the flow of the electroplating solution, in order to avoid the backflow of the solution affecting the uniform distribution of copper ions, a reflux pipe 18 is set on the top of the stirring tank 1, which can allow the electroplating solution to flow smoothly, accelerate the aggregation of copper ions to the plated parts, and improve the subsequent plating effect.

[0033] When this embodiment is used, the stirring tank is first assembled, and then the support rod 7 is placed at the top position of the stirring tank 1, and the storage frame 8 is hung under the support rod 7, the electroplating solution is poured into the stirring tank 1, and then the electrodes are plugged into the first hanging rod 2 and the second hanging rod 3, and the workpiece to be electroplated is placed in the storage frame 8. After completion, the electroplating process is carried out. In order to make the copper ions more evenly distributed during the electroplating process, the drive motor 17 is started. The drive motor 17 drives the rotating shaft 11 at the bottom to rotate, and drives the stirring blade 12 to rotate continuously, so that the electroplating solution continues to flow, which promotes a more even distribution of copper ions. The reflux pipe 18 arranged in the middle can better allow the copper ions to flow back to the surroundings of the electroplated workpiece, thereby improving the plating effect.

[0034] Embodiment 2:

[0035] A solution stirring tank for copper electroplating, such as Figure 1-4 As shown, this embodiment makes the following supplements on the basis of Embodiment 1: a rectangular filter box is inserted into the inner wall of one end of the return pipe 18, and a filter net is arranged inside the rectangular filter box. A rectangular filter box is inserted into the inner wall of one end of the return pipe 18, and a filter net is arranged inside the rectangular filter box.

[0036] The inner wall of the cylindrical sedimentation shell 20 is rotatably provided with a rotating blade 21 , and the bottom of the rotating blade 21 is connected to a servo motor 23 through a coupling. The inner wall of one side of the bottom of the cylindrical sedimentation shell 20 is connected to a sewage pipe 22 .

[0037] By setting a cylindrical sedimentation shell 20 in the middle of the sedimentation groove 4, the servo motor 23 is used to drive the rotating blade 21 to slowly drive the sediment to rotate, so as to utilize the centrifugal force to accelerate the aggregation and sedimentation of the sediment, and quickly discharge it from the side drain pipe 22. The sediment can be quickly discharged, thereby effectively maintaining the ion concentration inside the electroplating solution and reducing the interference of the sediment.

[0038] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A solution stirring tank for copper electroplating, comprising a stirring tank (1), characterized in that: A first hanging rod (2) is fixed to an inner wall on one side of the top of the stirring tank (1), and a second hanging rod (3) is fixed to an inner wall on the other side of the top of the stirring tank (1); a liquid discharge pipe (5) is connected to an inner wall on one side of the bottom of the stirring tank (1); an arc-shaped shell (9) is provided on the inner wall on the bottom of the stirring tank (1), and a stirring assembly is provided on the inner wall in the middle of the stirring tank (1); the stirring assembly comprises a support block (10) welded along the width direction of the stirring tank (1), and a rotating shaft (11) is rotatably connected to the support block (10); stirring blades (12) distributed at equal distances are welded to the outer wall of the rotating shaft (11), and a protective top shell (13) is provided above the stirring blades (12).

2. The electroplating copper solution stirring tank according to claim 1, characterized in that: A positioning groove (6) is provided at the center of the top of the mixing tank (1), and a support rod (7) is mounted in the positioning groove (6) in a clamped manner, and a storage frame (8) is hung on the support rod (7).

3. The electroplating copper solution stirring tank according to claim 1, characterized in that: A first bevel gear (14) is provided on an outer wall of one end of the rotating shaft (11), and the first bevel gear (14) is meshed and driven with a second bevel gear (15).

4. The electroplating copper solution stirring tank according to claim 3, characterized in that: A connecting shaft (16) is connected to the axis of one side of the second bevel gear (15), and a driving motor (17) is connected to the outer wall of the connecting shaft (16).

5. The electroplating copper solution stirring tank according to claim 1, characterized in that: A rectangular notch is provided on the inner wall of one side of the stirring tank (1), and a reflux pipe (18) is provided on the outer wall of the rectangular notch.

6. The electroplating copper solution stirring tank according to claim 5, characterized in that: A rectangular filter box is inserted into the inner wall of one end of the return pipe (18), and a filter screen is arranged inside the rectangular filter box.

7. The electroplating copper solution stirring tank according to claim 1, characterized in that: The size of the stirring blade (12) is adapted to the distance between the arc-shaped housing (9) and the protective top housing (13).

8. The electroplating copper solution stirring tank according to claim 1, characterized in that: A sedimentation groove (4) is provided on the stirring tank (1) below the first hanging rod (2), and a circular through groove (19) is provided through the center of the sedimentation groove (4), and a cylindrical sedimentation shell (20) is welded to the outer wall of the bottom of the circular through groove (19).

9. The electroplating copper solution stirring tank according to claim 8, characterized in that: The inner wall of the cylindrical sedimentation shell (20) is rotatably provided with a rotating blade (21), and the bottom of the rotating blade (21) is connected to a servo motor (23) via a coupling, and the inner wall on one side of the bottom of the cylindrical sedimentation shell (20) is connected to a sewage discharge pipe (22).

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