Silicon wafer reinspection feeding device
By designing a silicon wafer re-inspection and loading device, the automatic loading of silicon wafer stacks is achieved by using blowing, material collection and handling mechanisms, which solves the problem that existing equipment cannot be loaded directly and improves the re-inspection efficiency.
Patent Information
- Application Number
- CN202420888108.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-26
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-04-26
AI Technical Summary
Existing silicon wafer sorting equipment cannot directly load the silicon wafer stack, which affects the efficiency of silicon wafer re-checking.
A silicon wafer re-inspection and feeding device is designed, including a discharge mechanism, a lifting mechanism, a blowing mechanism, a material withdrawing mechanism and a handling mechanism. The silicon wafer on the top of the silicon wafer stack is separated by a blowing mechanism, and the material picks up the topmost silicon wafer and transports it to the sorting equipment through the handling mechanism.
Automatic loading of silicon wafer stacks is realized, re-inspected efficiency is improved, and the problem that existing equipment cannot be loaded directly.
Smart Images
Figure CN222659297U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer sorting, in particular to a silicon wafer re-inspection feeding device. Background Art
[0002] As an important industrial raw material, silicon wafers are widely used in the production of solar cells, circuit boards and other products. In order to ensure the quality of products made from silicon wafers, silicon wafers need to be inspected and sorted, and according to the sorting menu, silicon wafers are automatically sorted into different boxes according to quality grade requirements.
[0003] During the silicon wafer sorting process, it is often necessary to re-inspect the sorted silicon wafer stacks. However, existing silicon wafer sorting equipment can only load silicon wafers through flower baskets, and cannot directly load silicon wafer stacks, which affects the efficiency of silicon wafer re-inspection.
[0004] Based on the above technical problems, the present application proposes a silicon wafer re-inspection and loading device. Utility Model Content
[0005] The purpose of the utility model is to provide a silicon wafer re-inspection feeding device to solve the technical problems mentioned in the background technology. The purpose of the utility model is achieved through the following technical solutions:
[0006] A silicon wafer re-inspection loading device comprises a discharge mechanism, a lifting mechanism, an air blowing mechanism, a material picking mechanism and a conveying mechanism, wherein the discharge mechanism is used for placing a silicon wafer stack; the lifting mechanism is arranged at the bottom of the discharge mechanism, and is used for pushing the silicon wafer stack to move reciprocally up and down along the discharge mechanism; the air blowing mechanism is located at the top of the discharge mechanism, and is used for separating the silicon wafer at the top of the silicon wafer stack; the material picking mechanism is arranged above the discharge mechanism, and is used for picking up the silicon wafer at the top of the silicon wafer stack; and the conveying mechanism is used for conveying the silicon wafer picked up by the material picking mechanism to a sorting device.
[0007] Furthermore, the material discharge mechanism includes a material discharge platform, on which a first channel running through from top to bottom is opened; a material frame is installed on the material discharge platform, the material frame includes a bottom plate and a side plate, the bottom plate and the side plate form a box body with an upper opening, the side plate is a hollow structure, and a second channel is opened on the bottom plate, and the second channel matches the first channel.
[0008] Furthermore, the material discharge platform is a rectangular structure, the first channel is located at one end of the material discharge platform, two guide rails are symmetrically installed on both sides of the first channel, the guide rails are arranged parallel to the long sides of the material discharge platform, and the material frame is installed on the two guide rails through sliders; a limiting block is fixed at one end of the guide rail close to the first channel, and a locking mechanism is installed on one side of the guide rail, which is used to fix the material frame.
[0009] Furthermore, the locking mechanism includes a rotating cylinder and a locking block, wherein the locking block is fixed on a rotating shaft of the rotating cylinder, and the rotating cylinder rotates to drive the locking block to abut against or separate from the material frame.
[0010] Furthermore, the lifting mechanism includes a lifting drive and a lifting plate. The lifting drive is fixed to the lower end of the discharge platform through a lifting bracket. The lifting plate matches the first channel. The lifting plate is connected to the lifting drive. The lifting drive drives the lifting plate to move up and down along the vertical projection of the first channel.
[0011] Furthermore, the blowing mechanism includes a connecting bracket, both ends of the connecting bracket are respectively installed with wind knives, and the middle part of the connecting bracket is installed with a position sensor.
[0012] Furthermore, the material picking mechanism includes a material picking platform, a material picking motor is installed on the upper side of the material picking platform, and an eccentric wheel is fixed to the output shaft of the material picking motor; a guide rod is vertically installed on the lower side of the material picking platform, and there are at least two guide rods, and a floating plate is slidably installed on the guide rod, and the floating plate is connected to the eccentric wheel through a connecting rod, and a suction cup is installed on the lower side of the floating plate.
[0013] Furthermore, a material taking sensor is installed on one side of the suction cup.
[0014] Furthermore, the transport mechanism includes a belt conveyor line, which includes at least two conveyor belts. The feeding end of the belt conveyor line is located above the discharge mechanism, and the discharging end of the belt conveyor line is located above the feeding streamline of the sorting equipment. A negative pressure adsorption block is arranged on the belt conveyor line, and the negative pressure adsorption block is arranged parallel to the conveying direction of the belt conveyor line.
[0015] The technical solution provided in the embodiments of the present application has at least the following technical effects or advantages:
[0016] The top silicon wafer of the silicon wafer stack in the unloading mechanism is separated by the air blowing mechanism, picked up by the material taking mechanism and transported to the sorting equipment via the transporting mechanism, thus realizing the automatic loading of the silicon wafer stack and improving the re-inspection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The drawings in the specification, which constitute a part of the present application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.
[0018] Figure 1 This is a schematic diagram of the structure of the feeding device in the embodiment of the present application;
[0019] Figure 2 This is a schematic diagram of the discharge mechanism and lifting structure of the embodiment of the present application;
[0020] Figure 3 for Figure 2A partial enlarged view of
[0021] Figure 4 This is a structural schematic diagram of the discharge mechanism and the lifting structure from another perspective of the embodiment of the present application;
[0022] Figure 5 for Figure 4 A partial enlarged view of
[0023] Figure 6 This is a schematic diagram of the structure of the blowing mechanism of the embodiment of the present application;
[0024] Figure 7 This is a schematic diagram of the structure of the material taking mechanism of the embodiment of the present application;
[0025] Figure 8 This is a schematic diagram of the structure of the material taking mechanism and the transporting mechanism of the embodiment of the present application.
[0026] The following are marked: 1. material discharge mechanism; 11. material discharge platform; 111. first channel; 12. guide rail; 13. slider; 14. material frame; 141. bottom plate; 1411. second channel; 1412. handle; 142. side plate; 15. limit block; 16. locking mechanism; 161. rotary cylinder; 162. locking block; 2. lifting mechanism; 21. lifting drive member; 22. lifting plate; 23. lifting bracket; 2 4. Lifting column; 3. Air blowing mechanism; 31. Air blowing bracket; 32. Connecting bracket; 33. Air knife; 34. Position sensor; 4. Material picking mechanism; 41. Material picking platform; 42. Material picking motor; 43. Eccentric wheel; 44. Floating plate; 45. Guide rod; 46. Suction cup; 47. Connecting rod; 48. Material picking sensor; 5. Transport mechanism; 51. Belt conveyor line; 52. Negative pressure adsorption block; 53. Tray; 6. Wafer stack. DETAILED DESCRIPTION
[0027] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the drawings and specific implementation methods of the specification. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0028] like Figure 1A silicon wafer re-inspection and loading device shown includes a discharge mechanism 1, a lifting mechanism 2, a blowing mechanism 3, a picking mechanism 4 and a conveying mechanism 5. The discharge mechanism 1 is used to place a silicon wafer stack 6. The lifting mechanism 2 is installed at the bottom of the discharge mechanism 1, and is used to push the silicon wafer stack 6 to move up and down along the discharge mechanism 1. The blowing mechanism 3 is installed at the top of the discharge mechanism 1, and is used to blow and separate the silicon wafers at the top of the silicon wafer stack 6. The picking mechanism 4 is installed above the discharge mechanism 1, and is used to pick up the silicon wafer at the top of the silicon wafer stack 6. The conveying mechanism 5 is used to transport the silicon wafers picked up by the picking mechanism 4 to the sorting equipment.
[0029] When in use, the blowing mechanism 3 blows air to the top of the silicon wafer stack 6 to blow and separate the silicon wafers on the top of the silicon wafer stack 6 in the unloading mechanism 1; the picking mechanism 4 picks up the top silicon wafer and transports it to the sorting equipment via the transport mechanism 5, thereby realizing automatic loading of the silicon wafer stack 6; the lifting mechanism 2 pushes the silicon wafer stack 6 to lift up, thereby realizing height compensation of the silicon wafer stack 6.
[0030] like Figure 2-5 As shown, the material discharging mechanism 1 includes a material discharging platform 11, which is a rectangular plate, and a first channel 111 is opened at one end of the material discharging platform 11 and runs through it from top to bottom. Two guide rails 12 are symmetrically installed on both sides of the first channel 111, and the guide rails 12 are distributed parallel to the long sides of the material discharging platform 11. A material frame 14 is installed between the two guide rails 12 through a slider 13.
[0031] like Figure 2-Figure 4 As shown, the material frame 14 includes a bottom plate 141 and a side plate 142. The bottom plate 141 is a rectangular plate, and a second channel 1411 is opened in the middle of the bottom plate 141. The side plates 142 are vertical rods, and eight side plates 142 are symmetrically distributed around the bottom plate 141 to form a material frame 14 with an upper opening. A silicone pad is applied on the inner side of the side plate 142 to avoid damage to the silicon wafer. A handle 1412 is fixed on one side of the bottom plate 141, and sliders 13 are fixed on the four corners of the lower end of the bottom plate 141. The slider 13 is movably connected to the guide rail 12, and the material frame 14 can be pushed to move back and forth along the guide rail 12 through the handle 1412.
[0032] like Figure 2 , Figure 3 As shown, a limiting block 15 is fixed to one end of the guide rail 12 close to the first channel 111 , and when the slider 13 abuts against the limiting block 15 , the second channel 1411 overlaps with the first channel 111 in the vertical direction.
[0033] like Figure 4 , Figure 5As shown, a locking mechanism 16 is installed on one side of the guide rail 12, and the locking mechanism 16 includes a rotating cylinder 161 and a locking block 162. The rotating cylinder 161 is fixed to the edge of the material discharging platform 11, and the locking block 162 is fixed to the rotating shaft of the rotating cylinder 161. When the rotating cylinder 161 drives the locking block 162 to rotate and abut against the material frame 14, the locking mechanism 16 realizes the locking and fixing of the material frame 14. When the rotating cylinder 161 drives the locking block 162 to rotate and separate from the material frame 14, the locking mechanism 16 realizes the unlocking and separation of the material frame 14.
[0034] When in use, the material frame 14 is moved to the side away from the first channel 111, and the silicon wafer stack 6 to be re-inspected is added to the material frame 14, and then the material frame 14 is pushed to the side close to the first channel 111 by the handle 1412. When the material frame 14 abuts against the limit block 15, the locking mechanism 16 is actuated to lock and fix the material frame 14. After the silicon wafer stack 6 in the material frame 14 is picked up, the locking mechanism 16 is actuated to unlock and separate the material frame 14, and the material frame 14 is pulled out by the handle 1412 to add the silicon wafer stack 6 again, and the above actions are repeated to discharge the silicon wafer stack 6. Preferably, a buffer (not shown) is also installed at one end of the material discharge platform 11 close to the limit block 15, which is used to reduce the impact between the material frame 14 and the limit block 15 to prevent the silicon wafer from being damaged by force.
[0035] like Figure 1-4 As shown, the lifting mechanism 2 includes a lifting drive 21 and a lifting plate 22. The lifting drive 21 is a lead screw linear module, which is vertically installed at the lower end of the material discharge platform 11 through a lifting bracket 23. A lifting column 24 is installed on the lead screw nut of the lead screw linear module. The lifting column 24 is vertically arranged and located in the vertical projection of the first channel 111. The lifting plate 22 is installed at the top of the lifting column 24. When the lifting plate 22 is at the lowest point, the upper surface of the lifting plate 22 is lower than the lower surface of the bottom plate 141 of the material frame 14 to avoid affecting the advancement or extraction of the material frame 14.
[0036] When loading or extracting the material frame 14, the lifting plate 22 is at the lowest point to avoid collision with the material frame 14. In the working stage, the lifting drive 21 drives the lifting plate 22 to rise through the lifting column 24, so that the silicon wafer stack 6 gradually rises as the silicon wafers decrease. Preferably, a silicone pad is laid on the top of the lifting plate 22 to avoid damage to the silicon wafers.
[0037] like Figure 1 , Figure 5 , Figure 6As shown, two blowing mechanisms 3 are symmetrically installed on the discharge platform 11 through blowing brackets 31, and the blowing mechanisms 3 are respectively located on both sides of the first channel 111. The blowing mechanism includes a connecting bracket 32, and the connecting bracket 32 is connected to the blowing bracket 31 through a connecting rod. The connecting bracket 32 is a long strip structure, and the connecting bracket 32 is installed horizontally. Wind knives 33 are symmetrically installed at both ends of the connecting bracket 32, and the air outlets of the wind knives 33 are vertically arranged. When in use, the four wind knives 33 blow air to the top of the silicon wafer stack 6 from both sides, so that the silicon wafers at the top of the silicon wafer stack 6 float and separate, and avoid adhesion between silicon wafers and picking up multiple wafers when taking materials. A position sensor 34 is installed in the middle of the connecting bracket 32. The position sensor 34 is a photoelectric switch, which is used to detect the highest point of the silicon wafer stack 6 to prevent the silicon wafer stack 6 from being pushed out of the material frame 14.
[0038] like Figure 1 , Figure 7 As shown, the material-retrieving mechanism 4 includes a material-retrieving platform 41, and a material-retrieving motor 42 is installed on the upper side of the material-retrieving platform 41, and an eccentric wheel 43 is fixed to the output shaft of the material-retrieving motor 42 through a coupling. Two guide rods 45 are vertically installed on the lower side of the material-retrieving platform 42, and a floating plate 44 is slidably installed on the guide rod 45 through a linear bearing, and the upper end of the floating plate 44 is connected to the eccentric wheel 43 through a connecting rod 47, and the upper end of the connecting rod 47 is hinged to the eccentric wheel 43, and the lower end of the connecting rod 47 is hinged to the upper end of the floating plate 44. When the material-retrieving motor 42 rotates, the floating plate 44 is driven to reciprocate up and down along the guide rod 45 through the eccentric wheel 43 and the connecting rod 47.
[0039] A suction cup 46 is installed on the lower side of the floating plate 44. The suction cup 46 is a Bernoulli suction cup for sucking the topmost silicon wafer of the silicon wafer stack 6. Preferably, a material pickup sensor 48 is installed on one side of the suction cup 46. The material pickup sensor 48 is a proximity switch for identifying whether a silicon wafer is picked up.
[0040] like Figure 1 , Figure 8 As shown, the transport mechanism 5 includes a belt conveyor line 51, the feeding end of the belt conveyor line 51 is located above the discharge mechanism 1, and the discharging end of the belt conveyor line 51 is located above the feeding streamline of the sorting device. The belt conveyor line 51 includes four synchronously running conveyor belts, and the four conveyor belts are symmetrically installed on both sides of the material picking mechanism 4. A group of negative pressure adsorption blocks 52 are installed on the lower side of the belt conveyor line 51, and the negative pressure adsorption blocks 52 are distributed along the conveying direction of the belt conveyor line 51, and the lowest point of the negative pressure adsorption blocks 52 is higher than the lowest point of the conveyor belt. The structure and principle of the transport mechanism 5 are both existing technologies and will not be repeated here.
[0041] Preferably, a tray 53 is installed in the middle section of the belt conveyor line 51 to receive silicon wafers that fall during the conveying process to reduce the damage of the silicon wafers.
[0042] When in use, the material taking motor 42 rotates through the eccentric wheel 43 and the connecting rod 47 to drive the floating plate 44 to move up and down along the guide rod 45. When the floating plate 44 is at the lowest point, the suction cup 46 sucks the silicon wafer at the top of the silicon wafer stack 6. When the floating plate 44 is at the highest point, the silicon wafer is sucked by the negative pressure suction block 52 of the conveying mechanism 5 and the suction cup 46 breaks the vacuum, so that the silicon wafer is transferred to the conveying mechanism 5 and transported to the sorting device by the belt conveyor line 51.
[0043] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present utility model: the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.
[0044] It should be noted that the use of terms such as "first" and "second" to limit components is only to facilitate the distinction between corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.
[0045] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A silicon wafer re-inspection feeding device, characterized in that: include: A material discharging mechanism, the material discharging mechanism is used to place the silicon wafer stack; A lifting mechanism, the lifting mechanism is arranged at the bottom of the discharge mechanism, and the lifting mechanism is used to push the silicon wafer stack to move up and down along the discharge mechanism; A blowing mechanism, the blowing mechanism is located on the top of the discharging mechanism, and the blowing mechanism is used to separate the silicon wafer at the top of the silicon wafer stack; A material taking mechanism, the material taking mechanism is arranged above the material discharging mechanism, and the material taking mechanism is used to pick up the top silicon wafer of the silicon wafer stack; A transport mechanism is used to transport the silicon wafers picked up by the material taking mechanism to the sorting equipment.
2. The silicon wafer re-inspection feeding device according to claim 1, characterized in that: The material discharge mechanism includes a material discharge platform, and a first channel running through the material discharge platform from top to bottom is opened on the material discharge platform; a material frame is installed on the material discharge platform, and the material frame includes a bottom plate and a side plate, and the bottom plate and the side plate form a box body with an upper opening, and the side plate is a hollow structure, and a second channel is opened on the bottom plate, and the second channel matches the first channel.
3. The silicon wafer re-inspection feeding device according to claim 2, characterized in that: The material discharge platform is a rectangular structure, the first channel is located at one end of the material discharge platform, two guide rails are symmetrically installed on both sides of the first channel, the guide rails are arranged parallel to the long sides of the material discharge platform, and the material frame is installed on the two guide rails through sliders; a limiting block is fixed at one end of the guide rail close to the first channel, and a locking mechanism is installed on one side of the guide rail, and the locking mechanism is used to fix the material frame.
4. The silicon wafer re-inspection feeding device according to claim 3, characterized in that: The locking mechanism comprises a rotary cylinder and a locking block, wherein the locking block is fixed on a rotary shaft of the rotary cylinder, and the rotary cylinder rotates to drive the locking block to abut against or separate from the material frame.
5. The silicon wafer re-inspection feeding device according to claim 2, characterized in that: The lifting mechanism includes a lifting drive and a lifting plate. The lifting drive is fixed to the lower end of the discharge platform through a lifting bracket. The lifting plate matches the first channel. The lifting plate is connected to the lifting drive. The lifting drive drives the lifting plate to move up and down along the vertical projection of the first channel.
6. The silicon wafer re-inspection feeding device according to claim 1, characterized in that: The blowing mechanism comprises a connecting bracket, both ends of the connecting bracket are respectively provided with wind knives, and a position sensor is installed in the middle of the connecting bracket.
7. The silicon wafer re-inspection feeding device according to claim 1, characterized in that: The material picking mechanism includes a material picking platform, a material picking motor is installed on the upper side of the material picking platform, and an eccentric wheel is fixed to the output shaft of the material picking motor; a guide rod is vertically installed on the lower side of the material picking platform, and there are at least two guide rods, a floating plate is slidably installed on the guide rod, and the floating plate is connected to the eccentric wheel through a connecting rod, and a suction cup is installed on the lower side of the floating plate.
8. The silicon wafer re-inspection feeding device according to claim 7, characterized in that: A material taking sensor is installed on one side of the suction cup.
9. The silicon wafer re-inspection feeding device according to claim 1, characterized in that: The transport mechanism includes a belt conveyor line, which includes at least two conveyor belts. The feeding end of the belt conveyor line is located above the discharge mechanism, and the discharging end of the belt conveyor line is located above the feeding flow line of the sorting equipment. A negative pressure adsorption block is arranged on the belt conveyor line, and the negative pressure adsorption block is arranged parallel to the conveying direction of the belt conveyor line.