Semiconductor sputtering ring piece knurling processing device

Abstract

The utility model provides a semiconductor sputtering ring piece knurling processing device. The knurling device comprises a plug pin, a tool handle and a tool bit, wherein the tool handle and the tool bit are fixedly connected. A first knurling tool bit and a second knurling tool bit which are of a V-shaped structure are fixedly arranged at the end, away from the tool handle, of the tool bit. The first knurling tool bit and the second knurling tool bit respectively and independently comprise a groove and a knurling wheel embedded in the groove; and the bolt is used for fixing the knurl wheel. The utility model provides a semiconductor sputtering ring piece knurling processing device. The knurling device can standardize patterns, reduce pattern connection conditions, reduce the R angle flanging probability, improve the qualified rate of semiconductors and reduce the abnormal rate.

Description

Technical Field

[0001] The utility model belongs to the technical field of mechanical processing in the semiconductor manufacturing industry, and in particular relates to a semiconductor sputtering ring knurling processing device. Background Art

[0002] Sputtering is a type of physical vapor deposition (PVD) thin film preparation. Its main principle is to bombard the target surface with charged particles, transfer energy and momentum, and make the target atoms escape from the surface and deposit on the substrate material. Since charged particles are used to obtain metal, alloy or dielectric films by sputtering, they are usually used to manufacture thin film integrated circuits, chip lead devices and semiconductor devices.

[0003] During the sputtering process, since the escape direction of the target atoms is uncertain, it will lead to uneven film on the substrate surface and poor coverage of the bottom and side walls of the contact holes or through holes on the substrate surface. Therefore, some ring products, such as magnetron sputtering rings, are usually used together with the target.

[0004] During the use of the magnetron sputtering ring, a uniform knurling pattern is required to be formed on the surface of the ring body. Since the annular workpiece is very thin, the workpiece naturally becomes an ellipse after mechanical processing. At this time, when a conventional rigid knurling cutter is used for processing, the surface of the annular workpiece will have a phenomenon that the pattern is deep in some areas and shallow in some areas, and it is impossible to achieve uniformity. In order to solve the above problems, elastic knurling cutters have appeared in the prior art. CN 101574766A discloses a method and a tool for flexible knurling of the surface of a magnetron sputtering ring body, which specifically discloses an elastic knurling cutter. The elastic knurling cutter includes a handle, a shank and a roller, the roller is mounted on the outer end of the shank, and the handle and the shank are elastically connected.

[0005] However, when knurling an annular workpiece, since the annular workpiece is elliptical during processing, the ring body has a large circumferential runout relative to the axis, and the roller center of the knurling cutter needs to be in the same straight line with the center of the annular workpiece to ensure that the processed pattern is consistent and the depth is uniform. The elastic knurling cutter disclosed in the above patent application document only relies on elastic connection. During the knurling operation, the roller center deviates from the center of the annular workpiece, and the surface of the annular workpiece still has the problem of uneven knurling pattern depth.

[0006] Whether the pattern is standard or not greatly affects the effect on the customer when they participate in sputtering. At present, the knurling angle is adjusted by the experience of the processing personnel and cannot be standardized. Utility Model Content

[0007] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a semiconductor sputtering ring knurling processing device. The knurling processing device can standardize the pattern, reduce the situation of pattern connection, reduce the probability of R corner flanging, improve the qualified rate of semiconductors, and reduce the abnormal rate.

[0008] To achieve this purpose, the utility model adopts the following technical solutions:

[0009] The utility model provides a semiconductor sputtering ring knurling processing device, characterized in that the knurling processing device comprises a latch and a tool handle and a tool head which are fixedly connected;

[0010] A first knurled cutter head and a second knurled cutter head in a V-shaped structure are fixedly provided at one end of the cutter head away from the cutter handle; the first knurled cutter head and the second knurled cutter head independently include a groove and a knurled wheel embedded in the groove;

[0011] The latch is used to fix the knurling wheel.

[0012] The utility model can standardize patterns by fixing the knurling cutter, reduce the situation of pattern connection, reduce the probability of R corner flanging, improve the qualified rate of semiconductors, and reduce the abnormality rate.

[0013] It is worth noting that the semiconductor sputtering ring knurling processing device described in the utility model can be applied to semiconductors with curvature, such as ring semiconductors, R angles, etc.

[0014] As a preferred technical solution of the utility model, the first knurled cutter head and the second knurled cutter head are respectively and independently provided with a pin hole penetrating the groove.

[0015] As a preferred technical solution of the utility model, the pin hole is used for installing the pin.

[0016] Preferably, the radius of the pin hole is 9-10 mm, for example, 9 mm, 9.2 mm, 9.4 mm, 9.6 mm, 9.8 mm or 10 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0017] In the utility model, the latch hole is arranged on the side of the first knurling cutter head and the second knurling cutter head, and a groove is provided through it; when the latch is installed inside the latch hole, the knurling wheel is fixed;

[0018] In addition, the latch hole and the latch are used in conjunction with each other.

[0019] As a preferred technical solution of the present invention, the angle between the first knurled cutter head and the second knurled cutter head is 30-35°, for example, it can be 30°, 31°, 32°, 33°, 34° or 35°, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0020] It is worth noting that the angle described in the present invention is the acute angle θ between the first knurling cutter head and the second knurling cutter head.Figure 1 shown.

[0021] As a preferred technical solution of the present invention, the width of the first knurled cutter head and the second knurled cutter head are both 35 to 37 mm, for example, 35 mm, 35.4 mm, 35.8 mm, 36.2 mm, 36.6 mm or 37 mm, but are not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0022] Preferably, the lengths of the first knurled cutter head and the second knurled cutter head are both 92-94 mm, for example, 92 mm, 92.4 mm, 92.8 mm, 93.2 mm, 93.6 mm or 94 mm, but are not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0023] As a preferred technical solution of the present invention, the diameter of the knurling wheel is 44 to 46 mm, for example, it can be 44 mm, 44.4 mm, 44.8 mm, 45.2 mm, 45.6 mm or 46 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0024] Preferably, the thickness of the knurling wheel is 17-19 mm, for example, 17 mm, 17.4 mm, 17.8 mm, 18.2 mm, 18.6 mm or 19 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0025] As a preferred technical solution of the present invention, the width of the groove is 0.4 to 0.6 mm larger than the thickness of the knurling wheel, for example, it can be 0.4 mm, 0.44 mm, 0.48 mm, 0.52 mm, 0.56 mm or 0.6 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0026] Preferably, the depth of the groove is 10-11 mm, for example, 10 mm, 10.2 mm, 10.4 mm, 10.6 mm, 10.8 mm or 11 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0027] As a preferred technical solution of the present invention, the length of the shank is 215 to 220 mm, for example, it can be 215 mm, 216 mm, 217 mm, 218 mm, 219 mm or 220 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0028] As a preferred technical solution of the utility model, at least two positioning holes are provided at one end of the cutter head close to the handle, for example, 2, 3, 4, 5 or 6 positioning holes, but are not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0029] As a preferred technical solution of the utility model, the positioning hole is used to fix the tool handle and the tool head.

[0030] Preferably, the radius of the positioning hole is 2.8-3.5 mm, for example, it can be 2.8 mm, 2.9 mm, 3.0 mm, 3.1 mm, 3.2 mm, 3.3 mm, 3.4 mm or 3.5 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0031] The utility model realizes the fixation of the knife handle and the knife head through the welding process and the positioning hole, and the positioning hole is used for setting the installation threaded nail.

[0032] The system refers to an equipment system, a device system or a production device.

[0033] Compared with the prior art, the beneficial effects of the utility model are:

[0034] (1) The semiconductor sputtering ring knurling processing device provided by the utility model has a simple structure, is easy to process, and is more suitable for industrial applications;

[0035] (2) The knurling processing device provided by the utility model can standardize the patterns, reduce the situation of pattern connection, reduce the probability of R corner flanging, improve the qualified rate of semiconductors, and reduce the abnormality rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the structure of a semiconductor sputtering ring knurling processing device provided in Example 1 of the utility model;

[0037] Figure 2 A schematic diagram of the structure of the first knurling tool head and the second knurling tool head provided in Example 1 of the utility model;

[0038] Figure 3 It is a left side view of the semiconductor sputtering ring knurling processing device provided in Example 1 of the utility model;

[0039] Among them: 1 is the handle, 2 is the first knurled cutter head, 3 is the second knurled cutter head, 4 is the groove, 5 is the knurled wheel, 6 is the positioning hole, and 7 is the pin hole. DETAILED DESCRIPTION

[0040] It should be understood that, in the description of the present invention, the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0041] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "disposed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0042] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0043] Example 1

[0044] This embodiment provides a Figure 1 The semiconductor sputtering ring knurling processing device shown in the figure, the left side view of the semiconductor sputtering ring knurling processing device is as shown in Figure 3 As shown, the knurling processing device includes a latch and a tool handle 1 and a tool head that are fixedly connected;

[0045] The end of the blade head away from the blade handle 1 is fixedly provided with a V-shaped structure such as Figure 2 The first knurling cutter head 2 and the second knurling cutter head 3 are shown; the first knurling cutter head 2 and the second knurling cutter head 3 each independently include a groove 4 and a knurling wheel 5 embedded in the groove;

[0046] The latch is used to fix the knurling wheel 5.

[0047] The first knurling cutter head 2 and the second knurling cutter head 3 are respectively and independently provided with a pin hole 7 penetrating the groove 4; the pin hole 7 is used to install a pin; the radius of the pin hole 7 is 9.24 mm;

[0048] The angle between the first knurling cutter head 2 and the second knurling cutter head 3 is 35°; the width of the first knurling cutter head 2 and the second knurling cutter head 3 are both 36.95 mm, and the length is both 93.74 mm;

[0049] The knurling wheel 5 has a diameter of 45.83 mm and a thickness of 18.19 mm;

[0050] The width of the groove 4 is 0.42 mm greater than the thickness of the knurling wheel 5; the depth of the groove 4 is 10.91 mm;

[0051] The length of the handle 1 is 218.19 mm;

[0052] Six positioning holes 6 are arranged at one end of the cutter head close to the handle 1 ; the positioning holes 6 are used to fix the handle 1 and the cutter head; the radius of the positioning holes 6 is 3.06 mm.

[0053] Example 2

[0054] This embodiment provides a semiconductor sputtering ring knurling processing device, the knurling processing device includes a latch and a tool handle 1 and a tool head that are fixedly connected;

[0055] A first knurling cutter head 2 and a second knurling cutter head 3 in a V-shaped structure are fixedly provided at one end of the cutter head away from the cutter handle 1; the first knurling cutter head 2 and the second knurling cutter head 3 independently include a groove 4 and a knurling wheel 5 embedded in the groove;

[0056] The latch is used to fix the knurling wheel 5.

[0057] The first knurling cutter head 2 and the second knurling cutter head 3 are respectively and independently provided with a pin hole 7 penetrating the groove 4; the pin hole 7 is used to install a pin; the radius of the pin hole 7 is 9 mm;

[0058] The included angle between the first knurling cutter head 2 and the second knurling cutter head 3 is 30°; the width of the first knurling cutter head 2 and the second knurling cutter head 3 are both 35 mm, and the length are both 92 mm;

[0059] The knurling wheel 5 has a diameter of 44 mm and a thickness of 17 mm;

[0060] The width of the groove 4 is 0.4 mm greater than the thickness of the knurling wheel 5; the depth of the groove 4 is 10 mm;

[0061] The length of the shank 1 is 215 mm;

[0062] Five positioning holes 6 are arranged at one end of the cutter head close to the handle 1 ; the positioning holes 6 are used to fix the handle 1 and the cutter head; the radius of the positioning holes 6 is 3.5 mm.

[0063] Example 3

[0064] This embodiment provides a semiconductor sputtering ring knurling processing device, the knurling processing device includes a latch and a tool handle 1 and a tool head that are fixedly connected;

[0065] A first knurling cutter head 2 and a second knurling cutter head 3 in a V-shaped structure are fixedly provided at one end of the cutter head away from the cutter handle 1; the first knurling cutter head 2 and the second knurling cutter head 3 independently include a groove 4 and a knurling wheel 5 embedded in the groove;

[0066] The latch is used to fix the knurling wheel 5.

[0067] The first knurling cutter head 2 and the second knurling cutter head 3 are respectively and independently provided with a pin hole 7 penetrating the groove 4; the pin hole 7 is used to install a pin; the radius of the pin hole 7 is 10 mm;

[0068] The included angle between the first knurling cutter head 2 and the second knurling cutter head 3 is 32°; the width of the first knurling cutter head 2 and the second knurling cutter head 3 are both 37 mm, and the length are both 94 mm;

[0069] The knurling wheel 5 has a diameter of 46 mm and a thickness of 19 mm;

[0070] The width of the groove 4 is 0.6 mm greater than the thickness of the knurling wheel 5; the depth of the groove 4 is 11 mm;

[0071] The length of the handle 1 is 220 mm;

[0072] Eight positioning holes 6 are provided at one end of the cutter head close to the handle 1 ; the positioning holes 6 are used to fix the handle 1 and the cutter head; the radius of the positioning holes 6 is 2.8 mm.

[0073] A comprehensive analysis of Examples 1-3 shows that the knurling processing device provided by the utility model can standardize patterns, reduce the situation of pattern connection, reduce the probability of R-angle flanging, improve the qualified rate of semiconductors, and reduce the abnormality rate.

[0074] Example 4

[0075] This embodiment provides a semiconductor sputtering ring knurling processing device, and the semiconductor sputtering ring knurling processing device is different from the embodiment 1 only in that:

[0076] In this embodiment, the included angle between the first knurling tool head and the second knurling tool head is adjusted to 40°.

[0077] Example 5

[0078] This embodiment provides a semiconductor sputtering ring knurling processing device, and the semiconductor sputtering ring knurling processing device is different from the embodiment 1 only in that:

[0079] In this embodiment, the included angle between the first knurling tool head and the second knurling tool head is adjusted to 20°.

[0080] Compared with Example 1, the only difference between Example 4-5 is the difference in the angle between the first knurling cutter head and the second knurling cutter head. The knurling processing device provided in Example 4-5 cannot achieve standardization of the pattern. Compared with Example 1, the probability of pattern connection and R-angle flanging is increased.

[0081] Example 6

[0082] This embodiment provides a semiconductor sputtering ring knurling processing device, and the semiconductor sputtering ring knurling processing device is different from the embodiment 1 only in that:

[0083] In this embodiment, the depth of the groove is adjusted to 8 mm.

[0084] Example 7

[0085] This embodiment provides a semiconductor sputtering ring knurling processing device, and the semiconductor sputtering ring knurling processing device is different from the embodiment 1 only in that:

[0086] In this embodiment, the depth of the groove is adjusted to 12 mm.

[0087] Compared with Example 1, the difference between Examples 6-7 lies only in the adjustment of the groove depth. The change in the groove depth of the knurling device provided in Examples 6-7 will affect the height of the knurling tool protruding from the tool head, thereby affecting the smoothness of the knurling device during use. Compared with Example 1, the probability of pattern connection and R-angle flanging has increased, and the semiconductor qualification rate cannot be improved.

[0088] Example 8

[0089] This embodiment provides a semiconductor sputtering ring knurling processing device, and the semiconductor sputtering ring knurling processing device is different from the embodiment 1 only in that:

[0090] In this embodiment, the positioning holes are omitted.

[0091] Compared with Example 1, after the positioning hole is omitted, the fixation of the tool handle and the tool head is not firm, which makes the knurling processing path easily deviate during use, resulting in a decrease in the semiconductor qualification rate.

[0092] In summary, the semiconductor sputtering ring knurling processing device provided by the utility model can standardize the patterns, reduce the situation of pattern connection, reduce the probability of R corner flanging, improve the qualified rate of semiconductors, and reduce the abnormality rate.

[0093] The applicant declares that the above is only a specific implementation method of the present utility model, but the protection scope of the present utility model is not limited thereto. The technicians in the relevant technical field should understand that any changes or substitutions that can be easily thought of by the technicians in the relevant technical field within the technical scope disclosed in the present utility model fall within the protection scope and disclosure scope of the present utility model.

Claims

1. A semiconductor sputtering ring knurling processing device, characterized in that: The knurling processing device includes a latch and a tool handle and a tool head that are fixedly connected; A first knurled cutter head and a second knurled cutter head in a V-shaped structure are fixedly provided at one end of the cutter head away from the cutter handle; the first knurled cutter head and the second knurled cutter head independently include a groove and a knurled wheel embedded in the groove; The latch is used to fix the knurling wheel.

2. The semiconductor sputtering ring knurling processing device according to claim 1, characterized in that: The first knurled cutter head and the second knurled cutter head are respectively and independently provided with a pin hole penetrating the groove.

3. The semiconductor sputtering ring knurling processing device according to claim 2, characterized in that: The latch hole is used to install the latch; The radius of the pin hole is 9-10 mm.

4. The semiconductor sputtering ring knurling processing device according to claim 1, characterized in that: The included angle between the first knurling tool head and the second knurling tool head is 30-35°.

5. The semiconductor sputtering ring knurling processing device according to claim 1, characterized in that: The widths of the first knurling cutter head and the second knurling cutter head are both 35-37 mm; The lengths of the first knurling tool head and the second knurling tool head are both 92-94 mm.

6. The semiconductor sputtering ring knurling processing device according to claim 1, characterized in that: The diameter of the knurling wheel is 44-46 mm; The thickness of the knurling wheel is 17-19 mm.

7. The semiconductor sputtering ring knurling processing device according to claim 1, characterized in that: The width of the groove is 0.4 to 0.6 mm greater than the thickness of the knurling wheel; The depth of the groove is 10-11 mm.

8. The semiconductor sputtering ring knurling processing device according to claim 1, characterized in that: The length of the knife handle is 215-220 mm.

9. The semiconductor sputtering ring knurling processing device according to claim 1, characterized in that: At least two positioning holes are arranged at one end of the knife head close to the knife handle.

10. The semiconductor sputtering ring knurling processing device according to claim 9, characterized in that: The positioning hole is used to fix the knife handle and the knife head; The radius of the positioning hole is 2.8-3.5 mm.

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