Part processing device for silicon-based chip etching equipment

Abstract

The utility model discloses a part processing device for silicon-based chip etching equipment, and relates to the technical field of plate cutting, the part processing device comprises a containing assembly for containing cut plates, the containing assembly comprises a containing frame, the right side of the containing frame is fixedly connected with an inclined frame, and the bottom of the inclined frame is fixedly connected with supporting legs; the top of the containing assembly is fixedly connected with a cutting assembly for cutting plates, the cutting assembly comprises a fixing plate, the fixing plate is fixedly connected to the left end of the top of the containing frame, a plurality of battens are horizontally, evenly and fixedly connected between the fixing plate and the inclined frame, and a plurality of cutting wheels are fixedly connected between the ends, close to the fixing plate, of the battens in a penetrating mode. A limiting plate is horizontally and fixedly connected to the right end of the top of the inclined frame and located above the cutting wheel. The problem of pollution in the cutting process of Teflon plates for machining parts of chip etching equipment is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of plate cutting, in particular to a parts processing device for silicon-based chip etching equipment. Background Art

[0002] In the production process of silicon-based chips, the parts of the etching equipment are often exposed to strong corrosive liquids that can corrode most materials. In order to prevent this corrosion, these parts are usually made of polytetrafluoroethylene (PTFE), also known as Teflon, as the main material. Teflon is an ideal choice due to its excellent chemical corrosion resistance, which can effectively extend the service life of equipment parts and maintain the high quality standards of chip production.

[0003] Teflon mainly appears in the form of sheets on the market, and its processing, especially cutting, faces a series of environmental and health challenges. A large amount of difficult-to-degrade Teflon powder will be produced during the processing, posing a long-term pollution risk to the environment. At the same time, the high temperature during cutting will also cause Teflon to decompose and release harmful gases. These gases are harmful to the human body, especially the lungs, and may cause a series of symptoms, collectively known as "Teflon flu", which includes headaches, fever and cold symptoms. Therefore, although Teflon plays an indispensable role in the production of silicon-based chips, there are certain health and environmental risks in its processing. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a parts processing device for silicon-based chip etching equipment, which solves the above-mentioned problem.

[0005] In order to achieve the above-mentioned purpose, the utility model proposes a parts processing device for silicon-based chip etching equipment.

[0006] As a further solution of the utility model:

[0007] A parts processing device for silicon-based chip etching equipment includes a receiving assembly for receiving cut plates, the receiving assembly includes a receiving frame, an inclined frame is fixedly connected to the right side of the receiving frame, and a supporting leg is fixedly connected to the bottom of the inclined frame;

[0008] A cutting assembly for cutting the plate is fixedly connected to the top of the receiving assembly, and the cutting assembly includes a fixed plate, which is fixedly connected to the top left end of the receiving frame, and a plurality of strips are evenly fixedly connected horizontally between the fixed plate and the inclined frame, and a plurality of cutting wheels are fixedly connected between the strips at one end of the strip close to the fixed plate, and a limit plate is fixedly connected horizontally to the top right end of the inclined frame, and the limit plate is located above the cutting wheel;

[0009] The left side of the cutting assembly is fixedly connected with a pushing assembly for pushing the plate to be cut. The pushing assembly includes a fixed frame, a cylinder is fixedly installed inside the fixed frame, and a push plate is fixedly connected to the output end of the cylinder;

[0010] A filter assembly for filtering impurities generated by cutting the Teflon sheet is fixedly connected to the top right end of the limiting plate;

[0011] The top of the fixed plate is fixedly connected with a material storage component for storing a plurality of plates at one time.

[0012] Furthermore, the material storage assembly includes a material storage frame, which is fixedly connected to the top of the fixed plate, and the lower ends of the left and right side walls of the material storage frame are provided with rectangular grooves for cooperating with the push plate and the cutting wheel; the material storage frame is fixedly connected to a second revolving door, and a handle is fixedly connected to the top of the second revolving door.

[0013] Furthermore, the filter assembly includes a filter frame, the filter frame is fixedly connected to the top of the fixed plate; the air pump is fixedly connected to the side wall of the filter frame, the air inlet pipe of the air pump is fixedly connected to the inside of the inclined frame, and the air outlet pipe of the air pump is fixedly connected to the upper end of the side wall of the filter frame;

[0014] The inner wall of the filter frame cavity is horizontally fixed with a porous plate to separate the upper and lower layers of the filter frame. The lower end of the filter frame is a water tank, and an activated carbon adsorption layer is fixedly placed in the upper cavity of the filter frame.

[0015] The air outlet pipe of the air pump passes through the side wall of the filter frame and is fixedly connected with an air injection pipe, the lower end of the air injection pipe is inserted in the water tank, and the top of the filter frame is fixedly connected with an air outlet for discharging filtered gas.

[0016] Furthermore, a first rotating door is fixedly connected to the side wall of the receiving frame for facilitating the removal of the cut materials.

[0017] Furthermore, an arc-shaped groove is formed at the bottom of the limiting plate to cooperate with the cutting wheel, and the upper end of the cutting wheel is located in the arc-shaped groove.

[0018] Furthermore, the bottom of the push plate fits the fixed plate.

[0019] Furthermore, a spray head for spraying water mist to moisten the Teflon powder is fixedly connected to the inner wall of the receiving frame.

[0020] Compared with the prior art, the beneficial effects of the utility model are:

[0021] 1. Open the second rotary door, place the stacked plates horizontally on the top of the storage frame located on the fixed plate, then close the second rotary door, start the motor to rotate the cutting wheel, and then start the cylinder to push the push plate to the bottom of the stacked Teflon plates. The friction of the Teflon plates is extremely small, so that the bottom Teflon plates slide into between the limit plate and the strip plate and are cut by the cutting wheel. When the Teflon plates are cut into strips, they fall from the top of the strip plate into the inclined frame, and then slide from the inclined frame into the receiving frame. This process is repeated until all the plates in the storage frame are cut. The utility model is conducive to automatic cutting and collection of plates without manual labor throughout the process.

[0022] 2. During the cutting process, a large amount of hydrofluoric acid gas, perfluoroisobutylene gas and Teflon powder are generated in the Teflon sheet. At this time, the air pump is started, so that the harmful substances are extracted into the gas injection pipe along with the gas. The gas passes through the water tank, the hydrofluoric acid is absorbed by the water, the gas passes upward through the activated carbon, the perfluoroisobutylene is adsorbed by the activated carbon, and finally the filtered gas is discharged through the outlet. The utility model avoids the direct discharge of harmful gases into the air, which is harmful to the health of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional diagram of the utility model;

[0024] Figure 2 It is a cross-sectional view of the utility model along the front and rear symmetric planes.

[0025] In the figure: 1. receiving assembly; 11. receiving frame; 12. inclined frame; 13. first rotating door; 14. supporting leg; 2. filtering assembly; 21. air pump; 22. air injection pipe; 23. water tank; 24. porous plate; 25. air outlet; 26. filtering frame; 3. material storage assembly; 31. material storage frame; 32. second rotating door; 33. handle; 4. pushing assembly; 41. fixed frame; 42. cylinder; 43. push plate; 5. cutting assembly; 51. fixed plate; 52. cutting wheel; 53. strip plate; 54. limit plate. DETAILED DESCRIPTION

[0026] The technical solution of the utility model will be described clearly and completely in conjunction with the embodiments below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] like Figure 1-2As shown, a component processing device for silicon-based chip etching equipment includes a receiving assembly 1 for receiving cut plates, the receiving assembly 1 includes a receiving frame 11, a slanted frame 12 is fixedly connected to the right side of the receiving frame 11, and a supporting leg 14 is fixedly connected to the bottom of the slanted frame 12;

[0028] A cutting assembly 5 for cutting the plate is fixedly connected to the top of the receiving assembly 1. The cutting assembly 5 includes a fixed plate 51, which is fixedly connected to the top left end of the receiving frame 11. A plurality of strips 53 are evenly fixedly connected horizontally between the fixed plate 51 and the inclined frame 12. A plurality of cutting wheels 52 are fixedly connected between the strips 53 at one end of the strips 53 close to the fixed plate 51. A limit plate 54 is fixedly connected horizontally to the top right end of the inclined frame 12. The limit plate 54 is located above the cutting wheel 52.

[0029] The left side of the cutting assembly 5 is fixedly connected with a pushing assembly 4 for pushing the plate to be cut. The pushing assembly 4 includes a fixed frame 41. A cylinder 42 is fixedly installed inside the fixed frame 41. A push plate 43 is fixedly connected to the output end of the cylinder 42.

[0030] A filter assembly 2 for filtering impurities generated by cutting the Teflon sheet is fixedly connected to the top right end of the limiting plate 54;

[0031] The top of the fixed plate 51 is fixedly connected with a material storage assembly 3 for storing a plurality of plates at one time.

[0032] The material storage assembly 3 includes a material storage frame 31, which is fixedly connected to the top of the fixed plate 51. The lower ends of the left and right side walls of the material storage frame 31 cooperate with the push plate 43 and the cutting wheel 52 to penetrate and open rectangular grooves; the material storage frame 31 is fixedly connected to the second revolving door 32, and the top of the second revolving door 32 is fixedly connected to the handle 33.

[0033] The filter assembly 2 includes a filter frame 26, which is fixedly connected to the top of the fixed plate 51; the air pump 21 is fixedly connected to the side wall of the filter frame 26, the air inlet pipe of the air pump 21 is fixedly connected to the inside of the inclined frame 12, and the air outlet pipe of the air pump 21 is fixedly connected to the upper end of the side wall of the filter frame 26;

[0034] The inner wall of the filter frame 26 cavity is horizontally fixedly connected with a porous plate 24 to divide the filter frame 26 into two layers, the lower end of the filter frame 26 is a water tank 23, and the upper end of the filter frame 26 is fixed with an activated carbon adsorption layer;

[0035] The air outlet pipe of the air pump 21 passes through the side wall of the filter frame 26 and is fixedly connected to the air injection pipe 22. The lower end of the air injection pipe 22 is inserted into the water tank 23. The top of the filter frame 26 is fixedly connected to an air outlet 25 for discharging filtered gas.

[0036] A first rotating door 13 is fixedly connected to the side wall of the receiving frame 11 for facilitating the removal of the cut materials.

[0037] The bottom of the limiting plate 54 is provided with an arc-shaped groove to cooperate with the cutting wheel 52 , and the upper end of the cutting wheel 52 is located in the arc-shaped groove.

[0038] The bottom of the push plate 43 is in contact with the fixing plate 51 .

[0039] The inner wall of the receiving frame 11 is fixedly connected with a spray head for spraying water mist to wet the Teflon powder.

[0040] Working principle:

[0041] In actual use, first open the second rotary door 32, place the stacked plates horizontally on the top of the fixed plate 51 of the storage frame 31, then close the second rotary door 32, start the motor to rotate the cutting wheel 52, and then start the cylinder 42 to push the push plate 43 to the bottom of the stacked Teflon plates. The friction of the Teflon plates is very small, so that the bottom Teflon plates slide into between the limit plate 54 and the strip plate 53 and are cut by the cutting wheel 52. When the Teflon plates are cut into strips, they fall from the top of the strip plate 53 into the inclined frame 12, and then slide from the inclined frame 12 into the receiving frame 11. Repeat this process until all the plates in the storage frame 31 are cut. The utility model is conducive to automatic cutting and collection of plates without manual labor throughout the process.

[0042] During the cutting process of the Teflon sheet, a large amount of hydrofluoric acid gas, perfluoroisobutylene gas and Teflon powder are generated. At this time, the air pump 21 is started, so that the harmful substances are extracted into the gas injection pipe 22 along with the gas. The gas passes through the water tank 23, the hydrofluoric acid is absorbed by the water, the gas passes upward through the activated carbon, the perfluoroisobutylene is adsorbed by the activated carbon, and finally the filtered gas is discharged through the gas outlet 25. The utility model avoids the direct discharge of harmful gases into the air, thereby causing harm to the health of the staff;

[0043] The push plate 43 is in close contact with the fixed plate 51, so that the Teflon powder on the top of the fixed plate 51 is pushed toward the receiving frame 11 by the push plate 43;

[0044] The upper end of the cutting wheel 52 is located in the arc-shaped groove formed by the limiting plate 54, so that the cutting wheel 52 can completely cut the soft Teflon sheet, avoiding the situation of incomplete cutting.

[0045] The water mist sprayed by the spray head humidifies the Teflon powder, so that the Teflon powder adheres to the inner wall of the receiving frame 11. The properties of Teflon are extremely stable and will not be damaged by the water mist.

[0046] The above embodiments are only used to illustrate the technical method of the utility model rather than to limit it. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical method of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the utility model.

Claims

1. A parts processing device for silicon-based chip etching equipment, characterized in that: The invention comprises a receiving assembly (1) for receiving cut plates, wherein the receiving assembly (1) comprises a receiving frame (11), a slanted frame (12) is fixedly connected to the right side of the receiving frame (11), and a supporting leg (14) is fixedly connected to the bottom of the slanted frame (12); A cutting assembly (5) for cutting a plate is fixedly connected to the top of the receiving assembly (1), the cutting assembly (5) comprising a fixing plate (51), the fixing plate (51) being fixedly connected to the top left end of the receiving frame (11), a plurality of strips (53) being fixedly connected horizontally and evenly between the fixing plate (51) and the inclined frame (12), a plurality of cutting wheels (52) being fixedly connected between the strips (53) at one end of the strips (53) close to the fixing plate (51), and a limiting plate (54) being fixedly connected horizontally to the top right end of the inclined frame (12), the limiting plate (54) being located above the cutting wheel (52); The left side of the cutting component (5) is fixedly connected to a pushing component (4) for pushing the plate for cutting. The pushing component (4) comprises a fixing frame (41). A cylinder (42) is fixedly installed inside the fixing frame (41). A pushing plate (43) is fixedly connected to the output end of the cylinder (42). A filter assembly (2) for filtering impurities generated by cutting the Teflon sheet is fixedly connected to the top right end of the limiting plate (54); A material storage assembly (3) for storing a plurality of plates at one time is fixedly connected to the top of the fixed plate (51).

2. A component processing device for silicon-based chip etching equipment according to claim 1, characterized in that: The material storage assembly (3) comprises a material storage frame (31), which is fixedly connected to the top of a fixed plate (51), and rectangular grooves are formed through the lower ends of the left and right side walls of the material storage frame (31) to cooperate with a push plate (43) and a cutting wheel (52); the material storage frame (31) is fixedly connected to a second rotating door (32), and a handle (33) is fixedly connected to the top of the second rotating door (32).

3. The component processing device for silicon-based chip etching equipment according to claim 2, characterized in that: The filter assembly (2) comprises a filter frame (26), the filter frame (26) is fixedly connected to the top of the fixed plate (51); the air pump (21) is fixedly connected to the side wall of the filter frame (26), the air inlet pipe of the air pump (21) is fixedly connected to the inside of the inclined frame (12), and the air outlet pipe of the air pump (21) is fixedly connected to the upper end of the side wall of the filter frame (26); A porous plate (24) is horizontally fixedly connected to the inner wall of the filter frame (26) cavity to divide the filter frame (26) into two layers, the lower end of the filter frame (26) is a water tank (23), and an activated carbon adsorption layer is fixedly placed in the upper end cavity of the filter frame (26); The air outlet pipe of the air pump (21) passes through the side wall of the filter frame (26) and is fixedly connected to the air injection pipe (22), the lower end of the air injection pipe (22) is inserted into the water tank (23), and the top of the filter frame (26) is fixedly connected to an air outlet (25) for discharging filtered gas.

4. The component processing device for silicon-based chip etching equipment according to claim 3, characterized in that: A first rotating door (13) is fixedly connected to the side wall of the receiving frame (11) for facilitating the removal of cut materials.

5. The component processing device for silicon-based chip etching equipment according to claim 4, characterized in that: The bottom of the limiting plate (54) is provided with an arc-shaped groove in cooperation with the cutting wheel (52), and the upper end of the cutting wheel (52) is located in the arc-shaped groove.

6. The component processing device for silicon-based chip etching equipment according to claim 5, characterized in that: The bottom of the push plate (43) is in contact with the fixing plate (51).

7. The component processing device for silicon-based chip etching equipment according to claim 6, characterized in that: The inner wall of the receiving frame (11) is fixedly connected with a spray head for spraying water mist to moisten the Teflon powder.

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