Micro-focus radiation source colloid potting mold

Abstract

The utility model provides a micro-focus X-ray source colloid potting mold, belongs to the technical field of micro-focus X-ray sources, and solves the technical problems that the surface of an existing potting X-ray tube is rough, bubbles exist in colloid, and the coaxiality and run-out tolerance of the colloid are large. A micro-focus radiation source colloid encapsulation mold comprises a base and a transmitting end conical mold arranged on the base, a pair of combined molds are arranged on the transmitting end conical mold, the two combined molds are combined to form a cylindrical structure, the interiors of the two combined molds are subjected to highlight treatment, a filament socket threaded hole is formed in the base, and the filament socket threaded hole is connected with the transmitting end conical mold. The filament socket is in threaded connection with a pair of filament socket fixing blocks, and the filament socket is arranged between the two filament socket fixing blocks. The mold has the advantages that the molding surface of the mold is subjected to highlight treatment, various positioning structures are arranged, the problem of poor centering property after glue molding is solved, and bubbles in the mold are discharged during glue filling.

Description

Technical Field

[0001] The utility model belongs to the technical field of micro-focus X-ray sources, and relates to a colloid encapsulation mold, in particular to a micro-focus ray source colloid encapsulation mold. Background Art

[0002] At present, X-ray tubes are used as X-ray output sources. The X-rays they produce can be used for non-destructive testing of the inside of objects and are widely used in various fields such as medical treatment, security inspection, and industrial flaw detection. X-ray tubes generate electrons from the cathode, which are accelerated to high speed by the high-voltage electric field at both ends of the cathode and anode and then hit the anode target surface, generating X-rays through the toughened radiation mechanism. The external high voltage outputs a stable high-voltage electric field between the cathode and the anode through a high-voltage power supply. The vacuum packaging of the external shell provides a high vacuum environment, so that the electron impact event can continue to run stably, and finally obtain a continuous and stable output of X-rays. X-ray tubes usually use insulating glue as an insulating material to encapsulate the ray source.

[0003] The prior art potting mold has a rough surface due to the lack of fine processing inside, which makes the surface creepage of the potted X-ray tube prone to occur under high-voltage environment. The rough surface will also increase the degassing rate of the colloid in a vacuum environment, and there will be bubbles inside the colloid, which seriously affects the insulation performance of the colloid. In addition, the potting mold has poor centering, which makes the coaxiality and runout tolerance of the colloid after molding large, and the consistency is poor. Utility Model Content

[0004] The purpose of the utility model is to address the above-mentioned problems in the existing technology and propose a micro-focus radiation source colloid encapsulation mold. The technical problem to be solved by the utility model is: how to achieve high-gloss treatment on the molding surface of the mold, and set up a variety of positioning structures to solve the problem of poor centering after colloid molding, and to discharge the bubbles in the mold during glue pouring.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A micro-focus radiation source colloid encapsulation mold comprises a base and an emitting end conical mold arranged on the base, a pair of combined molds are arranged on the emitting end conical mold, the two combined molds are combined into a cylindrical structure, the interiors of the two combined molds are subjected to high light treatment, a filament socket threaded hole is opened on the base, a pair of filament socket fixing blocks are threadedly connected to the filament socket, and a filament socket is arranged between the two filament socket fixing blocks.

[0007] The working principle of the utility model is that the internal molding surface of the combined mold can be subjected to high-gloss treatment, so as to increase the smoothness of the molded colloid and avoid the formation of a parting line, and the two combined molds can be quickly disassembled and assembled, so that the molded colloid can be conveniently taken out while completing the potting and molding work.

[0008] An oxygen-free copper sealing gasket is fixed between the emission end conical mold and the filament socket fixing block, and the surface of the oxygen-free copper sealing gasket is smooth.

[0009] With the above structure, an oxygen-free copper sealing gasket can be fixed between the emitting end conical mold and the filament socket fixing block. The gasket has a relatively smooth surface and is also a sealing material with excellent sealing performance. It can effectively prevent glue leakage and ensure the smoothness of the bottom surface of the colloid during molding.

[0010] The base is provided with a plurality of second positioning holes, and the bottom of the conical mold of the transmitting end is fixed with a plurality of second positioning pins, which are engaged with the corresponding second positioning holes by plugging.

[0011] With the above structure, multiple positioning pins 2 fixed at the bottom of the conical mold at the transmitting end can be plugged into multiple positioning holes 2 opened on the base, so that the centering can be ensured during installation and the structural strength and installation stability after installation can be improved.

[0012] A through hole passing through the filament socket is provided between the two filament socket fixing blocks, a filament socket fixing hole is provided on the base, and the filament socket is threadedly connected with the filament socket fixing hole by reversely installing screws.

[0013] By adopting the above structure, the filament socket can be fixed to the filament socket fixing hole by reversely installing the screws, thereby realizing the detachable fixing capability of the filament socket and stabilizing the fixing state of the filament socket.

[0014] A middle ring is fixed on the top of the launch end conical mold, a second positioning groove is provided at the bottom of the middle ring, the second positioning groove is limitedly matched with the top of the launch end conical mold, and an exhaust gap is provided on the top of the middle ring to allow gas and water to seep out.

[0015] By adopting the above structure, the exhaust gap can allow air and water and other liquids with low viscosity to pass through, and there will be no leakage of liquid glue with high viscosity. The exhaust gap can be realized to discharge the bubbles in the mold during glue pouring, avoiding the problem of large bubbles inside the colloid after molding.

[0016] The mating surfaces of the two combined molds are each provided with a plurality of mutually matching mounting threaded holes, and the mating surfaces of the two combined molds are each provided with a plurality of mutually matching mounting through holes, the mating surfaces of the two combined molds are each provided with a positioning hole one, and the mating surfaces of the two combined molds are each fixed with a positioning pin one that is plug-matched with the corresponding positioning hole one, the multiple mounting through holes are matched into a group in pairs according to the position, and a bolt is connected to the inner thread of each group of mounting threaded holes, and the multiple mounting through holes are matched into a group in pairs according to the position, and a pin is inserted into each group of mounting through holes.

[0017] By adopting the above structure, the pre-assembly can be completed by the buckle fit between the positioning hole 1 and the positioning pin 1 between the two combined molds, and then the structural stability can be improved by inserting the pins into each group of installation through holes. Finally, each group of installation threaded holes is connected by bolt threads to achieve the overall installation and fixation of the two combined molds.

[0018] A positioning groove one is provided on the top of the two combined molds, a nut fixing block is fixed on the positioning groove one, a glue injection hole is provided on the nut fixing block, a glue overflow space is provided in the nut fixing block, and a pre-embedded nut threaded hole is provided at the bottom of the nut fixing block, and a colloid pre-embedded nut is threadedly connected to the pre-embedded nut threaded hole.

[0019] With the above structure, liquid glue can slowly flow into the installed potting mold from the glue injection hole. When the liquid glue reaches the bottom of the nut fixing block, glue injection continues until the glue covers half of the overflow glue space. Since the liquid glue will shrink in volume during the curing process, it is necessary to replenish glue in time. The liquid glue retained in the overflow glue space can be used to replenish the potting mold in time.

[0020] Compared with the prior art, the micro-focus ray source colloid encapsulation mold has the following advantages:

[0021] 1. The two combined molds can be quickly disassembled and assembled, so that the molded colloid can be taken out conveniently while the potting and molding work is completed.

[0022] 2. An exhaust gap is designed to solve the problem of bubbles remaining in the mold during the glue pouring process, and then bubbles remain inside the molded colloid, and glue leakage is not likely to occur.

[0023] 3. The interior of the two combined molds is treated with high gloss to ensure a better surface finish for the colloid after molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the utility model.

[0025] Figure 2 It is a schematic diagram of the structure after a single combined mold in the utility model is disassembled.

[0026] Figure 3 It is a three-dimensional structural cross-sectional schematic diagram of the utility model.

[0027] Figure 4 It is a schematic cross-sectional view of the structure of the mid-plane of the utility model.

[0028] In the figure, 1. base; 2. emitting end conical mold; 3. combined mold; 4. threaded hole of filament socket; 5. fixing block of filament socket; 6. filament socket; 7. oxygen-free copper sealing gasket; 8. positioning hole two; 9. positioning pin two; 10. fixing hole of filament socket; 11. middle ring; 12. positioning groove two; 13. exhaust gap; 14. mounting threaded hole; 15. mounting through hole; 16. positioning hole one; 17. positioning pin one; 18. positioning groove one; 19. nut fixing block; 20. glue injection hole; 21. overflow glue space; 22. threaded hole for embedded nut; 23. colloid embedded nut. DETAILED DESCRIPTION

[0029] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0030] like Figure 1-Figure 4 As shown, a micro-focus radiation source colloid encapsulation mold includes a base 1, an emitting end conical mold 2 arranged on the base 1, a pair of combined molds 3 are arranged on the emitting end conical mold 2, the two combined molds 3 are combined into a cylindrical structure, the interiors of the two combined molds 3 are subjected to high light treatment, a filament socket threaded hole 4 is opened on the base 1, a pair of filament socket fixing blocks 5 are threadedly connected to the filament socket 6, and a filament socket 6 is arranged between the two filament socket fixing blocks 5.

[0031] The internal molding surface of the combined mold 3 can be subjected to a high-gloss treatment to increase the smoothness of the molded colloid and avoid the formation of a parting line. In addition, the two combined molds 3 can be quickly disassembled and assembled, so that the molded colloid can be easily removed while the potting and molding work is completed.

[0032] An oxygen-free copper sealing gasket 7 is fixed between the emitting end conical mold 2 and the filament socket fixing block 5, and the surface of the oxygen-free copper sealing gasket 7 is smooth.

[0033] With the above structure, an oxygen-free copper sealing gasket 7 can be fixed between the emitting end conical mold 2 and the filament socket fixing block 5. The gasket has a relatively smooth surface and is also a sealing material with excellent sealing performance. It can effectively prevent glue leakage and ensure the smoothness of the bottom surface of the colloid during molding.

[0034] A plurality of positioning holes 8 are formed on the base 1 , and a plurality of positioning pins 9 are fixed to the bottom of the emitting end conical mold 2 . The plurality of positioning pins 9 are engaged with the corresponding positioning holes 8 in a buckle manner.

[0035] With the above structure, multiple positioning pins 29 fixed at the bottom of the transmitting end conical mold 2 can be plugged into multiple positioning holes 28 opened on the base 1, which can ensure centering during installation and improve the structural strength and installation stability after installation.

[0036] A through hole passing through the filament socket 6 is provided between the two filament socket fixing blocks 5 , a filament socket fixing hole 10 is provided on the base 1 , and the filament socket 6 is threadedly connected to the filament socket fixing hole 10 by reversely installing screws.

[0037] With the above structure, the filament socket 6 can be fixed to the filament socket fixing hole 10 by reversely installing the screws, thereby realizing the detachable fixing capability of the filament socket 6 and stabilizing the fixing state of the filament socket 6.

[0038] An intermediate ring 11 is fixed on the top of the launch end conical mold 2, and a second positioning groove 12 is provided at the bottom of the intermediate ring 11. The second positioning groove 12 is limitedly matched with the top of the launch end conical mold 2, and an exhaust gap 13 is provided on the top of the intermediate ring 11 to allow gas and water to seep out.

[0039] By adopting the above structure, the exhaust gap 13 can allow air and liquids with low viscosity such as water to pass through, and there will be no leakage of liquid glue with high viscosity. The exhaust gap 13 can be implemented to discharge the bubbles in the mold when pouring the glue, avoiding the problem of large bubbles inside the colloid after molding.

[0040] The mating surfaces of the two combined molds 3 are each provided with a plurality of mutually matching mounting threaded holes 14, and the mating surfaces of the two combined molds 3 are each provided with a plurality of mutually matching mounting through holes 15, and the mating surfaces of the two combined molds 3 are each provided with a positioning hole 16, and the mating surfaces of the two combined molds 3 are each fixed with a positioning pin 17 that is plug-fitted with the corresponding positioning hole 16, and the plurality of mounting through holes 15 are matched into a group in pairs according to the position, and each group of mounting threaded holes 14 is threadedly connected with a bolt, and the plurality of mounting through holes 15 are matched into a group in pairs according to the position, and a pin is inserted into each group of mounting through holes 15.

[0041] By adopting the above structure, the pre-assembly can be completed by the buckle fit between the positioning hole 16 and the positioning pin 17 between the two combined molds 3, and then the structural stability can be improved by inserting the pin into each group of mounting through holes 15. Finally, each group of mounting threaded holes 14 is connected by bolt threads to achieve the overall installation and fixation of the two combined molds 3.

[0042] A positioning groove 18 is provided at the top of the two combined molds 3, a nut fixing block 19 is fixed on the positioning groove 18, a glue injection hole 20 is provided on the nut fixing block 19, a glue overflow space 21 is provided in the nut fixing block 19, and a pre-embedded nut threaded hole 22 is provided at the bottom of the nut fixing block 19, and a colloid pre-embedded nut 23 is threadedly connected to the pre-embedded nut threaded hole 22.

[0043] By adopting the above structure, liquid glue can slowly flow into the installed potting mold from the glue injection hole 20. When the liquid glue reaches the bottom of the nut fixing block 19, the glue injection continues until the glue covers half of the overflow glue space 21. Since the liquid glue will shrink in volume during the curing process, it is necessary to replenish the glue in time. The liquid glue retained in the overflow glue space 21 can be used to replenish the potting mold in time.

[0044] The working principle of the utility model is as follows: first, the filament socket 6 is fixed to the filament socket fixing hole 10 by reversely installing the screws to complete the fixation of the filament socket 6 and the base 1, and then the fixing stability of the filament socket 6 is further improved by the filament socket 6 fixing seat, at this time, multiple positioning pins 2 9 fixed at the bottom of the emitting end conical mold 2 are buckled with multiple positioning holes 2 8 opened on the base 1 to complete the fixation between the emitting end conical mold 2 and the base 1, and the pre-assembly is completed by the buckle cooperation between the positioning hole 16 and the positioning pin 17 between the two combined molds 3, and then by each Insert a pin into the group installation through hole 15 to improve the structural stability, and finally connect each group of installation threaded holes 14 by bolt threads to achieve the overall installation and fixation of the two combined molds 3. At this point, the mold assembly is completed, and the liquid glue can be slowly flowed into the installed potting mold from the injection hole 20. When the liquid glue reaches the bottom of the nut fixing block 19, continue to inject glue until the glue covers half of the overflow glue space 21. Since the liquid glue will shrink in volume during the curing process, it is necessary to replenish the glue in time. The liquid glue retained in the overflow glue space 21 can be replenished in time into the potting mold.

[0045] In summary, by subjecting the internal molding surface of the combined mold 3 to high-gloss treatment, the smoothness of the molded colloid can be increased and the formation of a parting line can be avoided. In addition, the two combined molds 3 can be quickly disassembled and assembled, so that the molded colloid can be easily removed while completing the potting and molding work.

[0046] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A micro-focus radiation source colloid encapsulation mold, comprising a base (1) and an emission end conical mold (2) arranged on the base (1), characterized in that: A pair of combined molds (3) are arranged on the emitter end conical mold (2), the two combined molds (3) are combined into a cylindrical structure, the interior of the two combined molds (3) is subjected to high-gloss treatment, a filament socket threaded hole (4) is opened on the base (1), a pair of filament socket fixing blocks (5) are threadedly connected to the filament socket (6), and a filament socket (6) is arranged between the two filament socket fixing blocks (5).

2. The micro-focus radiation source colloid encapsulation mold according to claim 1, characterized in that: An oxygen-free copper sealing gasket (7) is fixed between the emission end conical mold (2) and the filament socket fixing block (5), and the surface of the oxygen-free copper sealing gasket (7) is smooth.

3. The micro-focus radiation source colloid encapsulation mold according to claim 1, characterized in that: The base (1) is provided with a plurality of second positioning holes (8), and the bottom of the transmitting end conical mold (2) is fixed with a plurality of second positioning pins (9), and the plurality of second positioning pins (9) are engaged with the corresponding second positioning holes (8) by plugging.

4. The micro-focus radiation source colloid encapsulation mold according to claim 1, characterized in that: A through hole for passing the filament socket (6) is provided between the two filament socket fixing blocks (5), a filament socket fixing hole (10) is provided on the base (1), and the filament socket (6) is threadedly connected to the filament socket fixing hole (10) by reversely installing screws.

5. The micro-focus radiation source colloid encapsulation mold according to claim 1, characterized in that: An intermediate circular ring (11) is fixed on the top of the launch end conical mold (2), a second positioning groove (12) is provided at the bottom of the intermediate circular ring (11), the second positioning groove (12) is limitedly matched with the top of the launch end conical mold (2), and an exhaust gap (13) is provided on the top of the intermediate circular ring (11) to allow gas and water to seep out.

6. The micro-focus radiation source colloid encapsulation mold according to claim 1, characterized in that: The mating surfaces of the two combined molds (3) are each provided with a plurality of mutually matching mounting threaded holes (14), and the mating surfaces of the two combined molds (3) are each provided with a plurality of mutually matching mounting through holes (15). The mating surfaces of the two combined molds (3) are each provided with a positioning hole (16). The mating surfaces of the two combined molds (3) are each fixed with a positioning pin (17) that is plug-matched with the corresponding positioning hole (16). The plurality of mounting through holes (15) are matched in pairs to form a group according to their positions, and a bolt is connected to the inner thread of each group of mounting threaded holes (14). The plurality of mounting through holes (15) are matched in pairs to form a group according to their positions, and a plug pin is inserted into each group of mounting through holes (15).

7. The micro-focus radiation source colloid encapsulation mold according to claim 1, characterized in that: A positioning groove (18) is formed on the top of the two combined molds (3), a nut fixing block (19) is fixed on the positioning groove (18), a glue injection hole (20) is formed on the nut fixing block (19), a glue overflow space (21) is formed in the nut fixing block (19), and a pre-embedded nut threaded hole (22) is formed on the bottom of the nut fixing block (19), and a colloid pre-embedded nut (23) is threadedly connected to the pre-embedded nut threaded hole (22).

Images