Thermal management unit and energy service station

Abstract

The utility model discloses a heat management unit and an energy service station, and belongs to the technical field of management. The heat management unit comprises a heat pump device, a cooling device and a connecting device, the heat pump device comprises a heat pump loop, the heat pump loop is suitable for being communicated with energy storage equipment and is provided with a first coupling interface, the cooling device comprises a cooling loop, the cooling loop is suitable for being communicated with charging equipment and is provided with a second coupling interface, and the connecting device is connected with the cooling loop. The connecting device is detachably connected between the first coupling interface and the second coupling interface. According to the heat management unit disclosed by the embodiment of the utility model, the detachable connecting device is arranged between the heat pump device and the cooling device, so that heat exchange media between the heat pump loop and the cooling loop can conveniently flow and exchange heat, the energy consumption of the heat management unit is reduced, and modular manufacturing and use of the heat pump device and the cooling device are also facilitated; therefore, the manufacturing and using cost of the heat management unit is reduced, and the product competitiveness is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of energy management, and in particular to a thermal management unit and an energy service station with the thermal management unit. Background Art

[0002] In related technologies, with the continuous development of energy utilization, integrated energy service stations for storage, charging and swapping are also emerging. Each device in the energy service station requires corresponding heat dissipation measures to maintain its stable operation. Existing swap stations have special thermal management units for swap stations, energy storage stations have special thermal management units for energy storage, charging piles have special heat dissipation systems, and chargers also have special liquid cooling modules. The thermal management units of multiple devices are managed independently, resulting in high total cost and high energy consumption of energy service stations. Utility Model Content

[0003] The utility model aims to solve at least one of the above technical problems in the prior art to a certain extent. To this end, the utility model proposes a thermal management unit, which can reduce the energy consumption of the thermal management unit and reduce the manufacturing and use costs of the thermal management unit.

[0004] The utility model also proposes an energy service station with the thermal management unit.

[0005] According to the thermal management unit of the first aspect of the utility model, the embodiment includes: a heat pump device, a cooling device and a connecting device, the heat pump device includes: a heat pump circuit, the heat pump circuit is suitable for connecting with an energy storage device, the heat pump circuit has a first coupling interface, the first coupling interface includes a first inlet and a first outlet, the cooling device includes a cooling circuit, the cooling circuit is suitable for connecting with a charging device, the cooling circuit has a second coupling interface, the second coupling interface includes a second inlet and a second outlet, and the connecting device is detachably connected between the first coupling interface and the second coupling interface to facilitate the first inlet to connect with the second outlet, and the first outlet to connect with the second inlet.

[0006] According to the thermal management unit of the embodiment of the utility model, a detachable connecting device is provided between the heat pump device and the cooling device to facilitate the mutual flow and heat exchange of the heat exchange medium between the heat pump circuit and the cooling circuit, thereby reducing the energy consumption of the thermal management unit and facilitating the modular manufacturing and use of the heat pump device and the cooling device, thereby helping to reduce the manufacturing and use costs of the thermal management unit and enhance product competitiveness.

[0007] According to some embodiments of the utility model, the heat pump device also includes: a first casing and a first baffle, the first casing having a first installation space and a first connecting hole connected to the first installation space, the heat pump circuit is installed in the first installation space, the first coupling interface is arranged opposite to the first connecting hole, and the first baffle has a first closed state closing the first connecting hole and a first open state opening the first connecting hole; the cooling device also includes: a second casing and a second baffle, the second casing having a second installation space and a second connecting hole connected to the second installation space, the cooling circuit is installed in the second installation space, the second coupling interface is arranged opposite to the second connecting hole, and the second baffle has a second closed state closing the second connecting hole and a second open state opening the second connecting hole.

[0008] According to some embodiments of the present invention, the first connecting hole and the second connecting hole are arranged opposite to each other.

[0009] According to some embodiments of the present invention, the first housing has a first ventilation hole communicating with the first installation space, and the second housing has a second ventilation hole communicating with the second installation space.

[0010] According to some embodiments of the present invention, the first housing has a first air outlet connected to the first installation space, and a first fan is installed at the first air outlet; the second housing has a second air outlet connected to the second installation space, and a second fan is installed at the second air outlet.

[0011] According to some embodiments of the utility model, the first casing has a first inspection hole connected to the first installation space, and the heat pump device also includes: a first inspection plate, the first inspection plate has a third closed state closing the first inspection hole and a third open state opening the first inspection hole; the second casing has a second inspection hole connected to the second installation space, and the cooling device also includes: a second inspection plate, the second inspection plate has a fourth closed state closing the second inspection hole and a fourth open state opening the second inspection hole.

[0012] According to some embodiments of the utility model, the heat pump circuit is provided with a heat pump heat exchanger, which is arranged between the first inlet and the first outlet; the cooling circuit is provided with a first proportional valve, a second proportional valve and a radiator, the first proportional valve having a first valve inlet, a second valve inlet and a first valve outlet, the second proportional valve having a third valve inlet, a second valve outlet and a third valve outlet, the first valve inlet is connected to one end of the radiator, the second valve inlet is connected to the second inlet, the first valve outlet is suitable for being connected to the third valve inlet through the charging device, the second valve outlet is connected to the second outlet, and the third valve outlet is connected to the other end of the radiator.

[0013] According to some embodiments of the present invention, there are multiple heat pump devices and / or cooling devices.

[0014] The energy service station according to the embodiment of the second aspect of the utility model includes: an energy storage device, a charging device and the thermal management unit described in the above embodiment.

[0015] According to the energy service station of the embodiment of the utility model, a detachable connecting device is provided between the heat pump device and the cooling device in the thermal management component to facilitate the mutual flow and heat exchange of the heat exchange medium between the heat pump circuit and the cooling circuit, thereby reducing the energy consumption of the thermal management unit and facilitating the modular manufacturing and use of the heat pump device and the cooling device, thereby helping to reduce the manufacturing and use costs of the thermal management unit and enhance product competitiveness.

[0016] According to some embodiments of the present utility model, the energy storage device includes: a battery swap station and / or an energy storage station, and the charging device includes: a charger and / or a charging pile.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of a thermal management unit according to an embodiment of the utility model Figure 1 ;

[0019] Figure 2 Schematic diagram of a thermal management unit according to an embodiment of the utility model Figure 2 ;

[0020] Figure 3 is a schematic diagram of a heat pump device according to an embodiment of the utility model;

[0021] Figure 4 is a schematic diagram of a first baffle of a heat pump device according to an embodiment of the utility model being in a first closed state;

[0022] Figure 5 is a schematic diagram of a first baffle of a heat pump device according to an embodiment of the utility model being in a first open state;

[0023] Figure 6 is a schematic diagram of a cooling device according to an embodiment of the utility model;

[0024] Figure 7 is a schematic diagram of a second baffle of a cooling device according to an embodiment of the utility model being in a second closed state;

[0025] Figure 8 is a schematic diagram of a second baffle of a cooling device according to an embodiment of the utility model being in a second open state;

[0026] Fig. 9 It is a schematic diagram of a heat pump circuit, a cooling circuit, an energy storage device and a charging device according to an embodiment of the utility model.

[0027] Reference numerals:

[0028] Thermal management unit 1,

[0029] Heat pump device 10, heat pump circuit 11, first coupling interface 111, first inlet 1111, first outlet 1112, heat pump heat exchanger 112, first water pump 113, water tank 114, first housing 12, first installation space 121, first connecting hole 122, first medium inlet 123, first medium outlet 124, first ventilation hole 125, first air outlet 126, first inspection hole 127, first baffle 13, first fan 14, first inspection plate 15,

[0030] Cooling device 20, cooling circuit 21, second coupling interface 211, second inlet 2111, second outlet 2112,

[0031] first proportional valve 212, first valve inlet 2121, second valve inlet 2122, first valve outlet 2123, second proportional valve 213, third valve inlet 2131, second valve outlet 2132, third valve outlet 2133, radiator 214, second water pump 215, expansion kettle 216,

[0032] second housing 22, second installation space 221, second connecting hole 222, third medium inlet 223, third medium outlet 224, second ventilation hole 225, second air outlet 226, second inspection hole 227, second baffle 23, second fan 24, second inspection plate 25,

[0033] Connecting device 30,

[0034] Energy storage device 2, charging device 3. DETAILED DESCRIPTION

[0035] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0037] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] Combine the following Figure 1-Figure 9 The thermal management unit 1 and the energy service station according to the embodiment of the utility model are described in detail. The thermal management unit 1 can be applied to the energy service station.

[0039] According to the thermal management unit 1 of the first embodiment of the utility model, Figure 1 , Figure 2 and Fig. 9 As shown, the thermal management unit 1 includes: a heat pump device 10, a cooling device 20 and a connecting device 30. The heat pump device 10 includes: a heat pump circuit 11, the heat pump circuit 11 is suitable for communicating with the energy storage device 2, the heat pump circuit 11 has a first coupling interface 111, the first coupling interface 111 includes a first inlet 1111 and a first outlet 1112, the cooling device 20 includes a cooling circuit 21, the cooling circuit 21 is suitable for communicating with the charging device 3, the cooling circuit 21 has a second coupling interface 211, the second coupling interface 211 includes a second inlet 2111 and a second outlet 2112, and the connecting device 30 is detachably connected between the first coupling interface 111 and the second coupling interface 211, so as to facilitate the communication between the first inlet 1111 and the second outlet 2112, and the first outlet 1112 and the second inlet 2111.

[0040] It should be noted that in the relevant technologies, with the continuous development of energy utilization, energy service stations integrating storage, charging and swapping are also emerging. Each device in the energy service station requires corresponding heat dissipation measures to maintain its stable operation. The existing swap stations have special thermal management units, energy storage stations have special energy storage thermal management units, charging piles have special heat dissipation systems, and chargers also have special liquid cooling modules. The thermal management units of multiple devices are managed independently, resulting in high total cost and high energy consumption of energy service stations.

[0041] Based on this, the embodiment of the utility model proposes a thermal management unit 1, including: a heat pump device 10, a cooling device 20 and a connecting device 30. The heat pump device 10 includes a heat pump circuit 11. The heat pump in the heat pump device 10 can adjust the temperature of the heat exchange medium in the heat pump circuit 11 to achieve a cooling effect or a heating effect. The heat pump circuit 11 can be connected to the energy storage device 2. In other words, the energy storage device 2 can be connected to the heat pump circuit 11. The heat pump circuit 11 can exchange heat with the energy storage device 2 through the heat exchange medium flowing therein, so that the temperature of the energy storage device 2 is maintained in a suitable range, and the cooling effect or the heating effect of the energy storage device 2 is achieved. The heat pump circuit 11 has a first coupling interface 111, and the first coupling interface 111 includes a first inlet 1111 and a first outlet 1112. The heat pump circuit 11 is connected to other circuits through the first coupling interface 111, such as: the cooling circuit 21, another heat pump circuit 11, etc.

[0042] The cooling device 20 includes a cooling circuit 21. The cooling circuit 21 may be provided with a radiator 214. The radiator 214 may be used to cool the heat exchange medium in the cooling circuit 21 to achieve the effect of dry cooling and heat dissipation. The cooling circuit 21 may be connected to the charging device 3. In other words, the charging device 3 may be connected to the cooling circuit 21. The charging device 3 may be cooled by exchanging heat with the heat exchange medium in the cooling circuit 21 to achieve cooling of the charging device 3. The cooling circuit 21 has a second coupling interface 211. The second coupling interface 211 includes a second inlet 2111 and a second outlet 2112. The cooling circuit 21 is connected to other circuits, such as the heat pump circuit 11, another cooling circuit 21, etc., through the second coupling interface 211.

[0043] The connecting device 30 can connect the heat pump device 10 and the cooling device 20. The connecting device 30 can be a plastic hose, a rubber hose, etc. The connecting device 30 is detachably connected between the first coupling interface 111 and the second coupling interface 211. When the connecting device 30 is removed from the first coupling interface 111 and the second coupling interface 211, the heat pump circuit 11 and the cooling circuit 21 are disconnected, and the heat pump device 10 and the cooling device 20 can work independently. When the connecting device 30 is connected between the first coupling interface 111 and the second coupling interface 211, the connecting device 30 can connect the heat pump circuit 11 and the cooling circuit 21, that is, the connecting device 30 connects the first inlet 1111 and the second outlet 2112, and connects the first outlet 1112 and the second inlet 2111, so that the heat exchange medium between the heat pump circuit 11 and the cooling circuit 21 flows and exchanges heat with each other, thereby reducing the energy consumption of the thermal management unit 1.

[0044] For example, the energy storage device 2 connected to the heat pump circuit 11 needs to be heated, and the charging device 3 connected to the cooling circuit 21 needs to be cooled. The high-temperature heat exchange medium in the charging device 3 can flow into the cooling circuit 21, and the heat pump circuit 11 is connected to the cooling circuit 21. The high-temperature heat exchange medium in the cooling circuit 21 can flow to the heat pump circuit 11. Further, the high-temperature heat exchange medium can flow from the cooling circuit 21 into the heat pump circuit 11 through the second outlet 2112 and the first inlet 1111, and the high-temperature heat exchange medium flows through the energy storage device 2. The high-temperature heat exchange medium exchanges heat with the energy storage device 2, so that the energy storage device 2 achieves a heating effect. The high-temperature heat exchange medium is cooled and becomes a low-temperature heat exchange medium. The low-temperature heat exchange medium flows back to the cooling circuit 21. Further, the low-temperature heat exchange medium can enter the cooling circuit 21 through the first outlet 1112 and the second inlet 2112. The low-temperature heat exchange medium flows to the charging device 3 in the cooling circuit. The low-temperature heat exchange medium exchanges heat with the charging device 3, so that the charging device 3 achieves a cooling effect. By connecting the heat pump circuit 11 with the cooling circuit 21 , both heating of the energy storage device 2 and cooling of the charging device 3 are achieved. The heat exchange medium between the heat pump circuit 11 and the cooling circuit 21 flows and exchanges heat with each other, thereby reducing the energy consumption of the thermal management unit 1 .

[0045] It is understandable that a detachable connecting device 30 is provided between the heat pump device 10 and the cooling device 20, so that the heat pump device 10 and the cooling device 20 can be used in combination or independently. When the connecting device 30 is connected between the heat pump device 10 and the cooling device 20, the heat pump device 10 and the cooling device 20 are used in conjunction with each other. When the connecting device 30 is removed from between the heat pump device 10 and the cooling device 20, the heat pump device 10 can be used independently after the first coupling interface 111 is blocked, and the cooling device 20 can be used independently after the second coupling interface 211 is blocked.

[0046] According to the thermal management unit 1 of the embodiment of the utility model, a detachable connecting device 30 is provided between the heat pump device 10 and the cooling device 20 to facilitate the mutual flow and heat exchange of the heat exchange medium between the heat pump circuit 11 and the cooling circuit 21, thereby reducing the energy consumption of the thermal management unit 1 and facilitating the modular manufacturing and use of the heat pump device 10 and the cooling device 20, thereby helping to reduce the manufacturing and use costs of the thermal management unit 1 and enhance product competitiveness.

[0047] In some embodiments of the present invention, Figure 3-Figure 8 As shown, the heat pump device 10 may also include: a first shell 12 and a first baffle 13, the first shell 12 has a first installation space 121 and a first connecting hole 122 connected to the first installation space 121, the heat pump circuit 11 is installed in the first installation space 121, the first coupling interface 111 is arranged opposite to the first connecting hole 122, and the first baffle 13 has a first closed state that closes the first connecting hole 122 and a first open state that opens the first connecting hole 122; the cooling device 20 may also include: a second shell 22 and a second baffle 23, the second shell 22 has a second installation space 221 and a second connecting hole 222 connected to the second installation space 221, the cooling circuit 21 is installed in the second installation space 221, the second coupling interface 211 is arranged opposite to the second connecting hole 222, and the second baffle 23 has a second closed state that closes the second connecting hole 222 and a second open state that opens the second connecting hole 222.

[0048] The first housing 12 of the heat pump device 10 defines a first installation space 121, the heat pump circuit 11 is installed in the first installation space 121, the first housing 12 has a first connecting hole 122 connected to the first installation space 121, and the first coupling interface 111 is arranged opposite to the first connecting hole. The first baffle 13 is detachably arranged on the first connecting hole 122. When the first baffle 13 closes the first connecting hole 122, the first baffle 13 is in a first closed state. At this time, the heat pump device 10 is used alone, and the heat pump device 10 can play a dust-proof role by providing the first baffle 13. When the first baffle 13 opens the first connecting hole 122, the baffle 13 is in a first open state. At this time, the heat pump device 10 can be used in conjunction with other devices. The first connecting hole 122 is opened to avoid blocking the first coupling interface 111, which is convenient for the connection device 30 to connect the heat pump device 10 to other devices. In addition, the first baffle 13 can be connected to the first housing 12 by means of sliding connection, hinge connection, etc., so that the first baffle 13 can move relative to the first housing 12, thereby enabling the first baffle 13 to open or close the first communication hole 122.

[0049] The cooling device 20 may further include a second housing 22 and a second baffle 23. The second housing 22 defines a second installation space 221. The cooling circuit 21 is installed in the second installation space 221. The second housing 22 has a second connecting hole 222 connected to the second installation space 221. The second coupling interface 211 is arranged opposite to the second connecting hole 222. The second baffle 23 is detachably arranged on the second connecting hole 222. When the second baffle 23 closes the second connecting hole 222, the second baffle 23 is in a second closed state. At this time, the cooling device 20 is used alone. The cooling device 20 can play a dust-proof role by providing the second baffle 23. When the second baffle 23 opens the second connecting hole 222, the second baffle 23 is in a second open state. At this time, the cooling device 20 can be used in conjunction with other devices. The second connecting hole 222 is opened to avoid blocking the second coupling interface 211, which facilitates the connection of the connecting device 30 to realize the connection of the cooling device 20 with other devices. In addition, the second baffle 23 can be connected to the second housing 22 by means of sliding connection, hinge connection, etc., so that the second baffle 23 is movable relative to the second housing 22, thereby enabling the second baffle 23 to open or close the second connecting hole 222.

[0050] The first housing 12 may also be provided with a first medium inlet 123 and a first medium outlet 124, and the energy storage device 2 may be provided with a second medium inlet and a second medium outlet. The first medium inlet 123 and the first medium outlet 124 are both connected to the heat pump circuit 11, the second medium inlet is connected to the first medium outlet 124, the second medium inlet is connected to the heat pump circuit 11 through the first medium outlet 124, the second medium outlet is connected to the first medium inlet 123, and the second medium outlet is connected to the heat pump circuit 11 through the first medium inlet 123, so that the energy storage device 2 is connected to the heat pump circuit 11, the heat exchange medium in the energy storage device 2 can flow into the heat pump circuit 11 through the second medium inlet and the first medium outlet 124, and after the heat exchange medium is cooled or heated in the heat pump circuit 11, it flows back to the energy storage device 2 through the first medium outlet 124 and the second medium inlet, so that the heat pump device 10 achieves a cooling effect or a heating effect on the energy storage device 2.

[0051] The second housing 22 may also be provided with a third medium inlet 223 and a third medium outlet 224, and the charging device 3 may be provided with a fourth medium inlet and a fourth medium outlet. The third medium inlet 223 and the third medium outlet 224 are both connected to the cooling circuit 21, the fourth medium inlet is connected to the third medium outlet 224, the fourth medium inlet is connected to the cooling circuit 21 through the third medium outlet 224, the fourth medium outlet is connected to the third medium inlet 223, and the fourth medium outlet is connected to the cooling circuit 21 through the third medium inlet 223, so that the charging device 3 is connected to the cooling circuit 21, the heat exchange medium in the charging device 3 can flow into the cooling circuit 21 through the fourth medium outlet and the third medium inlet 223, and after the heat exchange medium is cooled in the cooling circuit 21, it flows into the charging device 3 through the third medium outlet 224 and the fourth medium inlet, so that the cooling effect of the cooling device 20 on the charging device 3 is achieved.

[0052] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the first communicating hole 122 and the second communicating hole 222 are arranged opposite to each other.

[0053] When the heat pump device 10 and the cooling device 20 are used together, the connecting device 30 connects the heat pump circuit 11 and the cooling circuit 21, and the connecting device 30 is connected between the first coupling interface 111 and the second coupling interface 211. The first coupling interface 111 is arranged opposite to the first connecting hole 122, the second coupling interface 211 is arranged opposite to the second connecting hole 222, and the first connecting hole 122 and the second connecting hole 222 are also arranged opposite to each other. The connecting device 30 can be inserted through the first connecting hole 122 and the second connecting hole 222, and the connecting device 30 can be arranged between the first connecting hole 122 and the second connecting hole 222. By arranging the first connecting hole 122 and the second connecting hole 222 opposite to each other, the structure of the thermal management unit 1 can be made more compact, the space occupied by the thermal management unit 1 can be reduced, and the cost of the thermal management unit 1 can be saved.

[0054] In addition, the heat pump device 10 and the cooling device 20 can be attached to each other, so that the first connecting hole 122 and the second connecting hole 222 are arranged opposite to each other and connected, so that the structure of the thermal management unit 1 is more compact and the space occupied by the thermal management unit 1 is reduced. The heat pump device 10 and the cooling device 20 can also be spaced apart from each other, the first connecting hole 122 and the second connecting hole 222 are arranged opposite to each other and spaced apart, and the heat pump device 10 and the cooling device 20 have a gap, which is conducive to improving the heat dissipation effect of the heat pump device 10 and the cooling device 20.

[0055] In some embodiments of the present invention, Figure 3 and Figure 6As shown, the first housing 12 has a first ventilation hole 125 communicating with the first installation space 121 , and the second housing 22 has a second ventilation hole 225 communicating with the second installation space 221 .

[0056] The first housing 12 has a first ventilation hole 125 connected to the first installation space 121. There may be multiple first ventilation holes 125, and the multiple first ventilation holes 125 are arranged on the side wall of the first housing 12. The multiple first ventilation holes 125 are spaced apart from each other. Ventilation can be conducted into the first installation space 121 through the first ventilation holes 125. Wind can perform heat exchange cooling on the heat pump circuit 11 in the first installation space 121. The provision of the first ventilation holes 125 can further improve the cooling effect of the heat pump circuit 11, which is beneficial to improving the cooling efficiency of the heat pump device 10.

[0057] The second housing 22 has a second ventilation hole 225 connected to the second installation space 221. There may be multiple second ventilation holes 225, and the multiple second ventilation holes 225 are arranged on the side wall of the second housing 22. The multiple second ventilation holes 225 are spaced apart from each other. Ventilation can be conducted into the second installation space 221 through the second ventilation holes 225. The wind can perform heat exchange cooling on the cooling circuit 21 in the second installation space 221. The provision of the second ventilation holes 225 can further improve the cooling effect of the cooling circuit 21, which is beneficial to improving the cooling efficiency of the cooling device 20.

[0058] In some embodiments of the present invention, Figure 3 and Figure 6 As shown, the first housing 12 has a first air outlet 126 connected to the first installation space 121, and the first fan 14 is installed at the first air outlet 126; the second housing 22 has a second air outlet 226 connected to the second installation space 221, and the second fan 24 is installed at the second air outlet 226.

[0059] The first housing 12 has a first air outlet 126 connected to the first installation space 121. When the first fan 14 is working, air enters the first installation space 121 from the first ventilation hole 125, and the air entering the first installation space 121 can be discharged from the first air outlet 126, thereby taking away the heat of the first installation space 121. The first air outlet 126 can be arranged at the top of the first housing 12, and the setting height of the first air outlet 126 is higher than the setting height of the first ventilation hole 125, so that the air can be more easily discharged from the first air outlet 126. After the air exchanges heat in the first installation space 121, the temperature rises, the volume expands, and the density decreases. The air is easily discharged from the top of the first housing 12. The first fan 14 is installed at the first air outlet 126. The first fan 14 can speed up the flow rate of the air in the first installation space 121, which is conducive to improving the heat exchange efficiency of the air and further improving the cooling efficiency of the heat pump device 10.

[0060] The second housing 22 has a second air outlet 226 connected to the second installation space 221. When the second fan 24 is working, air enters the second installation space 221 from the second ventilation hole 225, and the air entering the second installation space 221 can be discharged from the second air outlet 226, thereby taking away the heat in the second installation space 221. The second air outlet 226 can be arranged at the top of the second fan 24, and the setting height of the second air outlet 226 is higher than the setting height of the second ventilation hole 225, so that the air can be more easily discharged from the second air outlet 226. After the air exchanges heat in the second installation space 221, the temperature rises, the volume expands, and the density decreases. The air is easily discharged from the top of the second housing 22. The second fan 24 is installed at the second air outlet 226. The second fan 24 can speed up the flow rate of the air in the second installation space 221, which is conducive to improving the heat exchange efficiency of the air and further improving the cooling efficiency of the cooling device 20.

[0061] In some embodiments of the present invention, Figure 3 and Figure 6 As shown, the first housing 12 has a first inspection hole 127 connected to the first installation space 121, and the heat pump device 10 may also include: a first inspection panel 15, the first inspection panel 15 has a third closed state for closing the first inspection hole 127 and a third open state for opening the first inspection hole 127; the second housing 22 has a second inspection hole 227 connected to the second installation space 221, and the cooling device 20 may also include: a second inspection panel 25, the second inspection panel 25 has a fourth closed state for closing the second inspection hole 227 and a fourth open state for opening the second inspection hole 227.

[0062] The first housing 12 has a first inspection hole 127 connected to the first installation space 121. The first inspection hole 127 can be arranged on the side wall of the first housing 12. The first inspection hole 127 and the first ventilation hole 125 are separated from each other. A maintenance worker can inspect faults in the first installation space 121 through the first inspection hole 127. The heat pump device 10 can also include a first inspection panel 15. The first inspection panel 15 can be connected to the first housing 12 by means of sliding connection, hinge, etc., so that the first inspection panel 15 is movable relative to the first housing 12, thereby realizing that the first inspection panel 15 opens or closes the first inspection hole 127. The first inspection panel 15 can also be detachably arranged on the first housing 12. The first inspection panel 15 can cooperate with the first inspection hole 127. The first inspection panel 15 can close the first inspection hole 127, so that the first inspection panel 15 is in the third closed state of closing the first inspection hole 127. The first inspection panel can open the first inspection hole 127, so that the first inspection panel 15 is in the third open state of opening the first inspection hole 127. When the maintenance worker inspects the fault in the first installation space 121, the first inspection panel 15 is in the third open state. When the heat pump device 10 does not need to be inspected, the first inspection panel 15 is in the third closed state.

[0063] The second housing 22 has a second inspection hole 227 connected to the second installation space 221. The second inspection hole 227 can be arranged on the side wall of the second housing 22. The second inspection hole 227 and the second ventilation hole 225 are separated from each other. A maintenance worker can inspect faults in the second installation space 221 through the second inspection hole 227. The cooling device 20 can also include a second inspection plate 25. The second inspection plate 25 can be connected to the second housing 22 by sliding connection, hinge, etc., so that the second inspection plate 25 is movable relative to the second housing 22, thereby realizing that the second inspection plate 25 opens or closes the second inspection hole 227. The second inspection plate 25 can also be detachably arranged on the second housing 22. The second inspection panel 25 can cooperate with the second inspection hole 227. The second inspection panel 25 can close the second inspection hole 227, so that the second inspection panel 25 is in the fourth closed state of closing the second inspection hole 227. The second inspection panel 25 can open the second inspection hole 227, so that the second inspection panel 25 is in the fourth open state of opening the second inspection hole 227. When the maintenance worker inspects the fault in the second installation space 221, the second inspection panel 25 is in the fourth open state. When the heat pump device 10 does not need to be inspected, the second inspection panel 25 is in the fourth closed state.

[0064] In some embodiments of the present invention, Fig. 9 As shown, the heat pump circuit 11 is provided with a heat pump heat exchanger 112, and the heat pump heat exchanger 112 is arranged between the first inlet 1111 and the first outlet 1112; the cooling circuit 21 is provided with a first proportional valve 212, a second proportional valve 213 and a radiator 214, the first proportional valve 212 has a first valve inlet 2121, a second valve inlet 2122 and a first valve outlet 2123, the second proportional valve 213 has a third valve inlet 2131, a second valve outlet 2132 and a third valve outlet 2133, the first valve inlet 2121 is connected to one end of the radiator 214, the second valve inlet 2122 is connected to the second inlet 2111, the first valve outlet 2123 is suitable for being connected to the third valve inlet 2131 through the charging device 3, the second valve outlet 2132 is connected to the second outlet 2112, and the third valve outlet 2133 is connected to the other end of the radiator 214.

[0065] Among them, the heat pump circuit 11 is provided with a heat pump heat exchanger 112, and the heat pump heat exchanger 112 can realize heat exchange of the heat exchange medium. The heat pump heat exchanger 112 is arranged between the first inlet 1111 and the first outlet 1112. The second medium outlet of the energy storage device 2 can be connected with the first inlet 1111, and the second medium inlet of the energy storage device 2 can be connected with the first outlet 1112. When the heat exchange medium in the energy storage device 2 enters the heat pump circuit 11 from the second medium outlet and the first inlet 1111, the heat exchange medium flows through the heat pump heat exchanger 112, and the heat pump heat exchanger 112 cools or heats the heat exchange medium. The heat exchange medium that completes the heat exchange flows back to the energy storage device 2 from the first outlet 1112 and the second medium inlet.

[0066] The cooling circuit 21 is provided with a first proportional valve 212, a second proportional valve 213 and a radiator 214. The radiator 214 can cool the heat exchange medium in the cooling circuit 21. The first proportional valve 212 has a first valve inlet 2121, a second valve inlet 2122 and a first valve outlet 2123. The second proportional valve 213 has a third valve inlet 2131, a second valve outlet 2132 and a third valve outlet 2133. The first valve inlet 2121 is connected to one end of the radiator 214, and the first valve outlet 2123 is connected to the fourth medium inlet on the charging device 3. The heat exchange medium cooled by the radiator 214 can flow back to the charging device 3 through the first valve inlet 2121 and the first valve outlet 2123. The first valve outlet 2123 is suitable for communicating with the third valve inlet 2133 through the charging device 3, the third valve inlet 2133 can be communicated with the fourth medium outlet of the charging device 3, the third valve outlet 2133 is connected to the other end of the radiator 214, the heat exchange medium in the charging device 3 can flow into the cooling circuit 21 through the fourth medium outlet and the third valve inlet 2131, the heat exchange medium flows to the radiator 214 through the third valve outlet 2131, and exchanges heat with the radiator 214, and after completing the heat exchange, the heat exchange medium flows back to the charging device 3 through the first valve inlet 2121 and the first valve outlet 2123.

[0067] As an example, when both the energy storage device 2 and the charging device 3 are refrigerated, the second valve inlet 2122 is closed, the first valve inlet 2121 is connected to the first valve outlet 2123, the second valve outlet 2132 is closed, the third valve inlet 2131 is connected to the third valve outlet 2133, the heat pump circuit 11 is disconnected from the cooling circuit 21, and the heat pump device 10 and the cooling device 20 work independently. A first water pump 113 and a water tank 114 are provided on the heat pump circuit 11, and the heat exchange medium in the energy storage device 2 can be pumped out by the first water pump 113. The heat pump in the heat pump device 10 can adjust the temperature of the heat exchange medium in the heat pump circuit 11. The cooled heat exchange medium flows through the water tank 114 and then returns to the energy storage device 2. The low-temperature heat exchange medium exchanges heat with the energy storage device 2 to achieve a refrigeration effect on the energy storage device 2. The cooling circuit 21 is provided with a second water pump 215 and an expansion kettle 216. The high-temperature heat exchange medium in the charging device 3 flows into the cooling circuit 21, is cooled by the radiator 214, and flows through the expansion kettle 216. The second water pump 215 circulates the cooled heat exchange medium back to the charging device 3, and the low-temperature heat exchange medium exchanges heat with the charging device 3 to achieve a cooling effect on the charging device 3.

[0068] As another example, when the energy storage device 2 needs to be heated and the charging device 3 needs to be cooled, the first valve inlet 2121, the second valve inlet 2122 and the first valve outlet 2123 are connected, the third valve outlet 2133, the second valve outlet 2132 and the third valve inlet 2131 are connected, the heat pump circuit 11 is connected with the cooling circuit 21, and the heat pump device 10 and the cooling device 20 work in coordination. The high-temperature heat exchange medium in the charging device 3 flows out, the high-temperature heat exchange medium flows through the second proportional valve 213 through the third valve inlet 2131, and a part of the high-temperature heat exchange medium flows into the cooling circuit 21 through the third valve outlet 2133. The high-temperature heat exchange medium is cooled by the radiator 214 and flows through the expansion kettle 216. The second water pump 215 circulates the cooled heat exchange medium back to the charging device 3, and the low-temperature heat exchange medium exchanges heat with the charging device 3 to achieve a cooling effect on the charging device 3.

[0069] Another part of the high-temperature heat exchange medium flows through the water tank 114 and enters the heat pump circuit 11 through the second valve outlet 2132, the second outlet 2112 and the first inlet 1111. The high-temperature heat exchange medium exchanges heat with the energy storage device 2 to achieve a heating effect on the energy storage device 2. The temperature of the high-temperature heat exchange medium decreases. A part of the cooled heat exchange medium flows back to the cooling circuit 21 through the first outlet 1112, the second inlet 2111, the second valve inlet 2122 and the first valve outlet 2123. The second water pump 215 circulates the cooled heat exchange medium back to the charging device 3. The low-temperature heat exchange medium exchanges heat with the charging device 3 to achieve a cooling effect on the charging device 3. Another part of the cooled heat exchange medium still flows in the heat pump circuit 11. Whether the heat pump in the heat pump device 10 is started is determined based on the temperature of the heat exchange medium, thereby completing the circulation of the heat exchange medium in the heat pump circuit 11 and the cooling circuit, realizing the utilization of the thermal energy in the charging device 3 and improving the energy utilization rate.

[0070] In some embodiments of the present invention, there are multiple heat pump devices 10 and / or cooling devices 20.

[0071] The number of heat pump devices 10 can be multiple, or the number of cooling devices 20 can be multiple, or the number of heat pumps and the number of cooling devices 20 can both be multiple. When multiple heat pump devices 10 are provided in the thermal management unit 1, multiple heat pump devices 10 can be connected in parallel, and multiple heat pump circuits 11 can be connected through corresponding first inlets 1111 and corresponding first outlets 1112. When multiple cooling devices 20 are provided in the thermal management unit 1, multiple cooling devices 20 can be connected in parallel, and multiple cooling devices 20 can be connected through corresponding second inlets 2111 and corresponding second outlets 2112. According to different working requirements, different numbers of heat pump devices 10 and / or cooling devices 20 can be set in the heat pipe assembly to realize the expandable and independent use of the heat pump device 10 and the cooling device 20 in the thermal management unit 1.

[0072] The energy service station according to the second embodiment of the utility model includes: an energy storage device 2, a charging device 3 and the thermal management unit 1 in the above embodiment.

[0073] The energy service station according to the embodiment of the utility model includes an energy storage device 2, a charging device 3 and the thermal management unit 1 in the above embodiment. A detachable connecting device 30 is provided between the heat pump device 10 and the cooling device 20 in the thermal management component 1 to facilitate the mutual flow and heat exchange of the heat exchange medium between the heat pump circuit 11 and the cooling circuit 21, thereby reducing the energy consumption of the thermal management unit 1 and facilitating the modular manufacturing and use of the heat pump device 10 and the cooling device 20, thereby reducing the manufacturing and use costs of the thermal management unit 1 and improving product competitiveness.

[0074] In some embodiments of the present invention, the energy storage device 2 includes: a battery swap station and / or an energy storage station, and the charging device 3 includes: a charger and / or a charging pile.

[0075] The energy storage device 2 may include a battery swap station, or the energy storage device 2 may include an energy storage station, or the energy storage device 2 may include a battery swap station and an energy storage station. The charging device 3 may include a charger, or the charging device 3 may include a charging pile, or the charging device 3 may include a charger and a charging pile. There may be multiple energy storage devices 2, and there may be multiple charging devices 3. According to different working requirements, the thermal management unit 1 may be connected to different numbers of energy storage devices 2 and charging devices 3 to meet the needs of users.

[0076] Other structures and operations of the thermal management unit 1 and the energy service station according to the embodiment of the utility model are well-known technologies well known to those skilled in the art, so they will not be described in detail here.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0078] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A thermal management unit, characterized in that: include: A heat pump device (10), the heat pump device (10) comprising: a heat pump circuit (11), the heat pump circuit (11) being suitable for communicating with an energy storage device (2), the heat pump circuit (11) having a first coupling interface (111), the first coupling interface (111) comprising a first inlet (1111) and a first outlet (1112); A cooling device (20), the cooling device (20) comprising a cooling circuit (21), the cooling circuit (21) being adapted to communicate with a charging device (3), the cooling circuit (21) having a second coupling interface (211), the second coupling interface (211) comprising a second inlet (2111) and a second outlet (2112); A connecting device (30) is detachably connected between the first coupling interface (111) and the second coupling interface (211) so as to facilitate communication between the first inlet (1111) and the second outlet (2112), and between the first outlet (1112) and the second inlet (2111).

2. The thermal management unit according to claim 1, characterized in that: The heat pump device (10) further comprises: a first housing (12) and a first baffle (13); the first housing (12) has a first installation space (121) and a first communication hole (122) communicating with the first installation space (121); the heat pump circuit (11) is installed in the first installation space (121); the first coupling interface (111) is arranged opposite to the first communication hole (122); the first baffle (13) has a first closed state for closing the first communication hole (122) and a first open state for opening the first communication hole (122); The cooling device (20) further comprises: a second housing (22) and a second baffle (23); the second housing (22) has a second installation space (221) and a second connecting hole (222) connecting the second installation space (221); the cooling circuit (21) is installed in the second installation space (221); the second coupling interface (211) is arranged opposite to the second connecting hole (222); the second baffle (23) has a second closed state for closing the second connecting hole (222) and a second open state for opening the second connecting hole (222).

3. The thermal management unit according to claim 2, characterized in that: The first connecting hole (122) and the second connecting hole (222) are arranged opposite to each other.

4. The thermal management unit according to claim 2, characterized in that: The first housing (12) has a first ventilation hole (125) communicating with the first installation space (121), and the second housing (22) has a second ventilation hole (225) communicating with the second installation space (221).

5. The thermal management unit according to claim 4, characterized in that: The first housing (12) has a first air outlet (126) connected to the first installation space (121), and a first fan (14) is installed at the first air outlet (126); The second housing (22) has a second air outlet (226) communicating with the second installation space (221), and a second fan (24) is installed at the second air outlet (226).

6. The thermal management unit according to claim 2, characterized in that: The first housing (12) has a first inspection hole (127) communicating with the first installation space (121), and the heat pump device (10) further comprises: a first inspection plate (15), the first inspection plate (15) having a third closed state for closing the first inspection hole (127) and a third open state for opening the first inspection hole (127); The second housing (22) has a second inspection hole (227) connected to the second installation space (221), and the cooling device (20) further includes: a second inspection plate (25), the second inspection plate (25) having a fourth closed state for closing the second inspection hole (227) and a fourth open state for opening the second inspection hole (227).

7. The thermal management unit according to any one of claims 1 to 6, characterized in that: The heat pump circuit (11) is provided with a heat pump heat exchanger (112), and the heat pump heat exchanger (112) is arranged between the first inlet (1111) and the first outlet (1112); The cooling circuit (21) is provided with a first proportional valve (212), a second proportional valve (213) and a radiator (214); the first proportional valve (212) has a first valve inlet, a second valve inlet and a first valve outlet; the second proportional valve (213) has a third valve inlet, a second valve outlet and a third valve outlet; the first valve inlet is connected to one end of the radiator (214); the second valve inlet is connected to the second inlet (2111); the first valve outlet is suitable for connecting to the third valve inlet through the charging device (3); the second valve outlet is connected to the second outlet (2112); and the third valve outlet is connected to the other end of the radiator (214).

8. The thermal management unit according to claim 1, characterized in that: The heat pump device (10) and / or the cooling device (20) are provided in plural numbers.

9. An energy service station, characterized in that: include: An energy storage device (2), a charging device (3), and a thermal management unit according to any one of claims 1 to 8.

10. The energy service station according to claim 9, characterized in that: The energy storage device (2) includes: a battery swap station and / or an energy storage station, and the charging device (3) includes: a charger and / or a charging pile.

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